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DE60122236D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number
DE60122236D1
DE60122236D1 DE60122236T DE60122236T DE60122236D1 DE 60122236 D1 DE60122236 D1 DE 60122236D1 DE 60122236 T DE60122236 T DE 60122236T DE 60122236 T DE60122236 T DE 60122236T DE 60122236 D1 DE60122236 D1 DE 60122236D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60122236T
Other languages
English (en)
Other versions
DE60122236T2 (de
Inventor
Robert R Jackson
Tetsuji Togawa
Satoshi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60122236D1 publication Critical patent/DE60122236D1/de
Application granted granted Critical
Publication of DE60122236T2 publication Critical patent/DE60122236T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60122236T 2000-05-23 2001-05-22 Poliervorrichtung Expired - Fee Related DE60122236T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/576,717 US6358126B1 (en) 2000-05-23 2000-05-23 Polishing apparatus
US576717 2000-05-23

Publications (2)

Publication Number Publication Date
DE60122236D1 true DE60122236D1 (de) 2006-09-28
DE60122236T2 DE60122236T2 (de) 2007-08-23

Family

ID=24305673

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60122236T Expired - Fee Related DE60122236T2 (de) 2000-05-23 2001-05-22 Poliervorrichtung

Country Status (7)

Country Link
US (1) US6358126B1 (de)
EP (1) EP1157782B1 (de)
JP (1) JP4183398B2 (de)
KR (1) KR100726013B1 (de)
DE (1) DE60122236T2 (de)
SG (1) SG99901A1 (de)
TW (1) TW506879B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
TW472636U (en) * 2001-04-03 2002-01-11 Nanya Technology Corp Improvement for chemical mechanical polishing machine
JP3888620B2 (ja) * 2002-01-22 2007-03-07 東京エレクトロン株式会社 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置
KR100470230B1 (ko) * 2002-02-08 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
DE10326472B4 (de) * 2003-06-12 2006-03-09 Hilti Ag Verbindungselement zum Verbinden eines Handgriffs mit einem Gehäuseteil und einem Getriebegehäuse eines Elektrohandgeräts
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
JP4642532B2 (ja) * 2005-04-01 2011-03-02 不二越機械工業株式会社 研磨装置
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
JP2007201417A (ja) * 2005-12-28 2007-08-09 Tokyo Electron Ltd 熱処理用ボート及び縦型熱処理装置
US7536233B1 (en) * 2006-01-30 2009-05-19 Advanced Micro Devices, Inc. Method and apparatus for adjusting processing speeds based on work-in-process levels
JP4926528B2 (ja) * 2006-04-19 2012-05-09 昭和電工株式会社 湿式研磨装置
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
CN114473847B (zh) * 2021-12-29 2023-04-25 华海清科股份有限公司 一种旋转式晶圆交互系统
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944119A (en) 1988-06-20 1990-07-31 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US5549502A (en) * 1992-12-04 1996-08-27 Fujikoshi Machinery Corp. Polishing apparatus
US5649854A (en) 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
JPH11204468A (ja) 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置
WO1999046084A1 (en) * 1998-03-09 1999-09-16 Ebara Corporation Polishing apparatus
JP3897507B2 (ja) * 1999-03-05 2007-03-28 株式会社荏原製作所 ポリッシング装置
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
EP1080840A3 (de) * 1999-08-30 2004-01-02 Mitsubishi Materials Corporation Polierverfahren und Vorrichtung und Verfahren zum Abrichten eines Polierkissen

Also Published As

Publication number Publication date
EP1157782B1 (de) 2006-08-16
EP1157782A2 (de) 2001-11-28
EP1157782A3 (de) 2004-01-14
DE60122236T2 (de) 2007-08-23
TW506879B (en) 2002-10-21
JP4183398B2 (ja) 2008-11-19
KR20010107672A (ko) 2001-12-07
SG99901A1 (en) 2003-11-27
KR100726013B1 (ko) 2007-06-08
JP2002009021A (ja) 2002-01-11
US6358126B1 (en) 2002-03-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee