DE60117212D1 - Imidazol-Phosphorsäure-Salze als Beschleuniger für die Härtung von einkomponentigen Epoxidharzzusammensetzungen mit Dicyandiamid - Google Patents
Imidazol-Phosphorsäure-Salze als Beschleuniger für die Härtung von einkomponentigen Epoxidharzzusammensetzungen mit DicyandiamidInfo
- Publication number
- DE60117212D1 DE60117212D1 DE60117212T DE60117212T DE60117212D1 DE 60117212 D1 DE60117212 D1 DE 60117212D1 DE 60117212 T DE60117212 T DE 60117212T DE 60117212 T DE60117212 T DE 60117212T DE 60117212 D1 DE60117212 D1 DE 60117212D1
- Authority
- DE
- Germany
- Prior art keywords
- dicyandiamide
- epoxy resin
- imidazole
- accelerators
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 title abstract 3
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- LPXDNEQTGPFOPF-UHFFFAOYSA-N hydron;1h-imidazol-1-ium;phosphate Chemical class C1=CNC=N1.OP(O)(O)=O LPXDNEQTGPFOPF-UHFFFAOYSA-N 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
- C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
- C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
- C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
- C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
- C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US703311 | 1991-05-20 | ||
| US09/703,311 US6441064B1 (en) | 2000-11-01 | 2000-11-01 | Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60117212D1 true DE60117212D1 (de) | 2006-04-20 |
| DE60117212T2 DE60117212T2 (de) | 2006-07-27 |
Family
ID=24824881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60117212T Expired - Lifetime DE60117212T2 (de) | 2000-11-01 | 2001-10-30 | Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6441064B1 (de) |
| EP (1) | EP1203782B1 (de) |
| JP (2) | JP3509799B2 (de) |
| CN (1) | CN1258560C (de) |
| AT (1) | ATE317867T1 (de) |
| DE (1) | DE60117212T2 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050026811A1 (en) * | 2003-05-20 | 2005-02-03 | Mjalli Adnan M. M. | Rage antagonists as agents to reverse amyloidosis and diseases associated therewith |
| US20060194064A1 (en) * | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
| EP2324830A1 (de) * | 2002-03-05 | 2011-05-25 | TransTech Pharma Inc. | Verfahren zur Herstellung von einem monozylische Azolderivat das die Interaktion von Liganden mit Rage hemmt |
| US20070102674A1 (en) * | 2003-07-11 | 2007-05-10 | Ube Industries, Ltd. | Acid-base mixture and ion conductor comprising the same |
| WO2011025040A1 (ja) * | 2009-08-31 | 2011-03-03 | 日本合成化学工業株式会社 | エポキシ樹脂用硬化剤 |
| WO2011041198A1 (en) | 2009-09-30 | 2011-04-07 | Transtech Pharma, Inc. | Substituted imidazole derivatives for treatment of alzheimers disease |
| JP6030028B2 (ja) * | 2013-07-11 | 2016-11-24 | 株式会社Adeka | 新規化合物、熱硬化剤及びエポキシ樹脂組成物 |
| US9546243B2 (en) * | 2013-07-17 | 2017-01-17 | Air Products And Chemicals, Inc. | Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions |
| JP6161464B2 (ja) * | 2013-08-08 | 2017-07-12 | 株式会社Adeka | 一液型硬化性樹脂組成物 |
| JP2019524967A (ja) | 2016-08-15 | 2019-09-05 | エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ | エポキシ樹脂系用のイミダゾール塩添加剤を含有する酸無水物エポキシ硬化剤 |
| US11286336B2 (en) | 2016-12-12 | 2022-03-29 | Evonik Operations Gmbh | Low temperature anhydride epoxy cured systems |
| WO2019039230A1 (ja) | 2017-08-22 | 2019-02-28 | サンスター技研株式会社 | 硬化性組成物 |
| DE102018121012A1 (de) * | 2018-08-28 | 2020-03-05 | Alzchem Trostberg Gmbh | Verfahren zur Herstellung eines Druckgasbehälters |
| KR102197406B1 (ko) * | 2019-12-05 | 2020-12-31 | 주식회사 제일화성 | 친환경 바이오매스 기반의 아이소소바이드 에폭시를 활용한 고체상 에폭시 수지의 제조 방법 |
| KR102197405B1 (ko) * | 2019-12-05 | 2020-12-31 | 주식회사 제일화성 | 친환경 바이오매스 기반의 아이소소바이드 에폭시 원료를 이용한 고체상 에폭시 수지의 제조 방법 |
| CN116478344A (zh) * | 2022-01-17 | 2023-07-25 | 万华化学集团股份有限公司 | 一种水性单组份环氧乳液及其制备方法 |
| CN120988566B (zh) * | 2025-10-27 | 2025-12-30 | 广东百慕新材料技术工程有限公司 | 一种薄涂水性石墨烯改性苯氧浸涂涂料及其制备方法与应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3356645A (en) * | 1964-04-20 | 1967-12-05 | Shell Oil Co | Process for curing epoxy resins with a salt of an imidazole and compositions thereof |
| NL130329C (de) | 1964-04-20 | |||
| US3329652A (en) | 1965-02-15 | 1967-07-04 | Shell Oil Co | Process for curing polyepoxides with anhydrides and activators therefor |
| US3632427A (en) | 1970-05-15 | 1972-01-04 | Air Prod & Chem | Epoxy resin and imidazole alkyl acid phosphate fiber treatment |
| US3631150A (en) | 1970-05-20 | 1971-12-28 | Dexter Corp | Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide |
| US3755253A (en) | 1971-09-24 | 1973-08-28 | Shell Oil Co | Catalization of diaminodiphenylsulfone cure of polyepoxides with an imidazole compound or a salt thereof |
| JPS5883023A (ja) | 1981-11-11 | 1983-05-18 | Taoka Chem Co Ltd | 硬化性組成物 |
| JPS5920371A (ja) | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
| DE3624177A1 (de) | 1986-07-17 | 1988-01-21 | Huels Chemische Werke Ag | Pulverlacke, deren herstellung und verwendung |
| JPH0253777A (ja) | 1988-08-18 | 1990-02-22 | Shikoku Chem Corp | １−ベンジルイミダゾール化合物の合成方法 |
| CA2151834A1 (en) | 1992-12-21 | 1994-07-07 | Alliedsignal Inc. | Solvent free epoxy resin compositions |
| US5508328A (en) * | 1994-11-17 | 1996-04-16 | Alliedsignal Inc. | Curing epoxy resins using dicy, imidazole and acid |
-
2000
- 2000-11-01 US US09/703,311 patent/US6441064B1/en not_active Expired - Lifetime
-
2001
- 2001-10-30 AT AT01125886T patent/ATE317867T1/de not_active IP Right Cessation
- 2001-10-30 EP EP01125886A patent/EP1203782B1/de not_active Expired - Lifetime
- 2001-10-30 DE DE60117212T patent/DE60117212T2/de not_active Expired - Lifetime
- 2001-10-31 JP JP2001333608A patent/JP3509799B2/ja not_active Expired - Fee Related
- 2001-11-01 CN CNB011372583A patent/CN1258560C/zh not_active Expired - Fee Related
-
2003
- 2003-09-24 JP JP2003331270A patent/JP2004010618A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP3509799B2 (ja) | 2004-03-22 |
| EP1203782B1 (de) | 2006-02-15 |
| DE60117212T2 (de) | 2006-07-27 |
| JP2004010618A (ja) | 2004-01-15 |
| CN1258560C (zh) | 2006-06-07 |
| ATE317867T1 (de) | 2006-03-15 |
| EP1203782A1 (de) | 2002-05-08 |
| US6441064B1 (en) | 2002-08-27 |
| JP2002161127A (ja) | 2002-06-04 |
| CN1351092A (zh) | 2002-05-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |