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DE60117895D1 - Polyimide-Silikonharz, dieses Harz enthaltende Lösung und Polyimide-Silikonharz-Film - Google Patents

Polyimide-Silikonharz, dieses Harz enthaltende Lösung und Polyimide-Silikonharz-Film

Info

Publication number
DE60117895D1
DE60117895D1 DE60117895T DE60117895T DE60117895D1 DE 60117895 D1 DE60117895 D1 DE 60117895D1 DE 60117895 T DE60117895 T DE 60117895T DE 60117895 T DE60117895 T DE 60117895T DE 60117895 D1 DE60117895 D1 DE 60117895D1
Authority
DE
Germany
Prior art keywords
polyimide silicone
silicone resin
resin
containing solution
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117895T
Other languages
English (en)
Other versions
DE60117895T2 (de
Inventor
Michihiro Sugo
Hideto Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60117895D1 publication Critical patent/DE60117895D1/de
Publication of DE60117895T2 publication Critical patent/DE60117895T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
DE60117895T 2000-06-29 2001-06-26 Polyimide-Silikonharz, dieses Harz enthaltende Lösung und Polyimide-Silikonharz-Film Expired - Lifetime DE60117895T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000196843 2000-06-29
JP2000196843A JP2002012667A (ja) 2000-06-29 2000-06-29 ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜

Publications (2)

Publication Number Publication Date
DE60117895D1 true DE60117895D1 (de) 2006-05-11
DE60117895T2 DE60117895T2 (de) 2006-10-19

Family

ID=18695275

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117895T Expired - Lifetime DE60117895T2 (de) 2000-06-29 2001-06-26 Polyimide-Silikonharz, dieses Harz enthaltende Lösung und Polyimide-Silikonharz-Film

Country Status (5)

Country Link
US (1) US6703133B2 (de)
EP (1) EP1167423B1 (de)
JP (1) JP2002012667A (de)
KR (1) KR100787342B1 (de)
DE (1) DE60117895T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
JP2004099638A (ja) * 2002-09-04 2004-04-02 Shin Etsu Chem Co Ltd イミドシリコーン樹脂およびその製造方法
JP2004296933A (ja) * 2003-03-27 2004-10-21 Nippon Chemicon Corp 電解コンデンサ
JP2004296931A (ja) * 2003-03-27 2004-10-21 Nippon Chemicon Corp 固体電解コンデンサとその製造方法
JP3952194B2 (ja) * 2003-06-02 2007-08-01 信越化学工業株式会社 シロキサン共重合体及びその製造方法並びにそれを用いた熱硬化性樹脂組成物
TWI321975B (en) 2003-06-27 2010-03-11 Ajinomoto Kk Resin composition and adhesive film for multi-layered printed wiring board
JP4372065B2 (ja) 2004-09-09 2009-11-25 信越化学工業株式会社 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
US8889250B2 (en) * 2004-10-14 2014-11-18 Kaneka Corporation Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them
JP2006182854A (ja) * 2004-12-27 2006-07-13 Toyobo Co Ltd ポリイミドシリコーン樹脂及びその前駆体
JP4967547B2 (ja) * 2006-09-06 2012-07-04 株式会社カネカ 光学部品用フッ素化ポリイミド、およびそれを用いた光導波路
TWI437938B (zh) 2007-03-01 2014-05-11 Ajinomoto Kk A method of manufacturing a circuit board, a subsequent thin film to which a metal film is attached, and a circuit board
CN101442887B (zh) 2007-11-22 2013-03-20 味之素株式会社 多层印刷线路板的制造方法及多层印刷线路板
JP2009231790A (ja) 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
JP5891693B2 (ja) * 2011-10-05 2016-03-23 Jsr株式会社 基板の製造方法および基板
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
WO2017145874A1 (ja) 2016-02-24 2017-08-31 日産自動車株式会社 リチウムイオン二次電池用電極及びその製造方法
EP3866179A4 (de) 2018-10-10 2022-08-17 Ajinomoto Co., Inc. Magnetische paste
JPWO2022224473A1 (de) 2021-04-21 2022-10-27
KR20240090200A (ko) 2021-10-19 2024-06-21 아지노모토 가부시키가이샤 수지 조성물
JP7619247B2 (ja) 2021-11-25 2025-01-22 味の素株式会社 樹脂シート
JP7743800B2 (ja) 2022-02-24 2025-09-25 味の素株式会社 樹脂組成物
WO2023181742A1 (ja) 2022-03-22 2023-09-28 味の素株式会社 磁性基板の製造方法
TW202423683A (zh) 2022-09-02 2024-06-16 日商味之素股份有限公司 磁性基板的製造方法及磁性基板
JP7758002B2 (ja) 2023-03-06 2025-10-22 味の素株式会社 樹脂組成物
JP2024125720A (ja) 2023-03-06 2024-09-19 味の素株式会社 樹脂組成物
WO2025004806A1 (ja) 2023-06-26 2025-01-02 株式会社レゾナック 配線基板
JP7768212B2 (ja) 2023-12-07 2025-11-12 味の素株式会社 樹脂組成物
TW202534124A (zh) 2024-01-12 2025-09-01 日商味之素股份有限公司 樹脂組成物
JP2026000241A (ja) 2024-06-17 2026-01-05 味の素株式会社 樹脂組成物及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US4690997A (en) * 1984-01-26 1987-09-01 General Electric Company Flame retardant wire coating compositions
US4808686A (en) * 1987-06-18 1989-02-28 General Electric Company Silicone-polyimides, and method for making
JP2536620B2 (ja) * 1989-05-31 1996-09-18 信越化学工業株式会社 ポリイミド樹脂の製造方法
JP2730652B2 (ja) * 1991-03-26 1998-03-25 宇部興産株式会社 保護塗膜被覆配線部材及びその製法
JP3147166B2 (ja) * 1991-06-11 2001-03-19 宇部興産株式会社 ポリイミドシロキサン
JP2885295B2 (ja) * 1991-11-22 1999-04-19 信越化学工業株式会社 シロキサン類の精製方法
JPH06329803A (ja) * 1993-05-24 1994-11-29 Shin Etsu Chem Co Ltd 電気接点障害のないシリコーン製品
JP3136942B2 (ja) * 1994-03-18 2001-02-19 宇部興産株式会社 ポリイミドシロキサンの組成物
US5693735A (en) 1995-07-12 1997-12-02 Shin-Etsu Chemical Co., Ltd. Trimethylsiloxy group-containing polysiloxane and a process for producing the same
JPH09118825A (ja) 1995-10-24 1997-05-06 Shin Etsu Chem Co Ltd ポリイミド樹脂組成物
JP2865197B2 (ja) * 1996-07-19 1999-03-08 宇部興産株式会社 フレキシブル配線板

Also Published As

Publication number Publication date
EP1167423B1 (de) 2006-03-15
JP2002012667A (ja) 2002-01-15
KR20020002306A (ko) 2002-01-09
US6703133B2 (en) 2004-03-09
EP1167423A3 (de) 2003-12-17
US20020016408A1 (en) 2002-02-07
DE60117895T2 (de) 2006-10-19
EP1167423A2 (de) 2002-01-02
KR100787342B1 (ko) 2007-12-18

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