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DE60117669D1 - Weichlot, Oberflächenbehandlungsverfahren von Leiterplatten und Verfahren zum Montieren eines elektronischen Bauteils - Google Patents

Weichlot, Oberflächenbehandlungsverfahren von Leiterplatten und Verfahren zum Montieren eines elektronischen Bauteils

Info

Publication number
DE60117669D1
DE60117669D1 DE60117669T DE60117669T DE60117669D1 DE 60117669 D1 DE60117669 D1 DE 60117669D1 DE 60117669 T DE60117669 T DE 60117669T DE 60117669 T DE60117669 T DE 60117669T DE 60117669 D1 DE60117669 D1 DE 60117669D1
Authority
DE
Germany
Prior art keywords
methods
mounting
printed circuit
electronic component
surface treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117669T
Other languages
English (en)
Other versions
DE60117669T2 (de
Inventor
Toshihide Ito
Shiro Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Circuit Solutions Inc
Original Assignee
NEC Toppan Circuit Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Toppan Circuit Solutions Inc filed Critical NEC Toppan Circuit Solutions Inc
Application granted granted Critical
Publication of DE60117669D1 publication Critical patent/DE60117669D1/de
Publication of DE60117669T2 publication Critical patent/DE60117669T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60117669T 2000-12-11 2001-12-10 Weichlot, Oberflächenbehandlungsverfahren von Leiterplatten und Verfahren zum Montieren eines elektronischen Bauteils Expired - Lifetime DE60117669T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000375960 2000-12-11
JP2000375960 2000-12-11
JP2001034319A JP3599101B2 (ja) 2000-12-11 2001-02-09 はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP2001034319 2001-02-09

Publications (2)

Publication Number Publication Date
DE60117669D1 true DE60117669D1 (de) 2006-05-04
DE60117669T2 DE60117669T2 (de) 2006-11-23

Family

ID=26605596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117669T Expired - Lifetime DE60117669T2 (de) 2000-12-11 2001-12-10 Weichlot, Oberflächenbehandlungsverfahren von Leiterplatten und Verfahren zum Montieren eines elektronischen Bauteils

Country Status (6)

Country Link
US (1) US6702176B2 (de)
EP (1) EP1213089B1 (de)
JP (1) JP3599101B2 (de)
KR (1) KR100468213B1 (de)
DE (1) DE60117669T2 (de)
TW (1) TW527438B (de)

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US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US7029542B2 (en) * 2002-07-09 2006-04-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US7172726B2 (en) 2002-10-15 2007-02-06 Senju Metal Industry Co., Ltd. Lead-free solder
US20040112474A1 (en) * 2002-10-17 2004-06-17 Rikiya Kato Lead-free solder ball
JP3724486B2 (ja) * 2002-10-17 2005-12-07 千住金属工業株式会社 鉛フリーはんだボール用合金とはんだボール
EP1918064A1 (de) * 2003-10-16 2008-05-07 Senju Metal Industry Co., Ltd. Bleifreies Lot
JP5182258B2 (ja) * 2003-12-01 2013-04-17 千住金属工業株式会社 はんだ合金と電子機器用モジュール部品
TW200529963A (en) * 2004-02-04 2005-09-16 Senju Metal Industry Co Solder alloy for preventing Fe erosion and method for preventing Fe erosion
JP4577888B2 (ja) * 2004-02-04 2010-11-10 千住金属工業株式会社 Ｆｅ喰われ防止用はんだ合金とＦｅ喰われ防止方法
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
US7335269B2 (en) 2005-03-30 2008-02-26 Aoki Laboratories Ltd. Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)
JP4428448B2 (ja) 2005-06-03 2010-03-10 千住金属工業株式会社 鉛フリーはんだ合金
JP2007038228A (ja) * 2005-07-29 2007-02-15 Nihon Almit Co Ltd はんだ合金
US8641964B2 (en) 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
WO2007023288A2 (en) * 2005-08-24 2007-03-01 Fry's Metals Inc. Solder alloy
WO2007081775A2 (en) * 2006-01-10 2007-07-19 Illinois Tool Works Inc. Lead-free solder with low copper dissolution
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
KR100887357B1 (ko) * 2006-02-14 2009-03-06 주식회사 에코조인 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판
KR100887358B1 (ko) * 2006-02-14 2009-03-06 주식회사 에코조인 희석용 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
WO2007102589A1 (ja) * 2006-03-09 2007-09-13 Nippon Steel Materials Co., Ltd. 鉛フリーハンダ合金、ハンダボール及び電子部材と、自動車搭載電子部材用鉛フリーハンダ合金、ハンダボール及び電子部材
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
US8562906B2 (en) 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
JP4076182B2 (ja) * 2006-07-27 2008-04-16 トピー工業株式会社 無鉛はんだ合金
JP5080946B2 (ja) * 2007-01-11 2012-11-21 株式会社日本フィラーメタルズ マニュアルソルダリング用無鉛はんだ合金
WO2008084603A1 (ja) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha マニュアルソルダリング用無鉛はんだ合金
JP4683015B2 (ja) * 2007-07-04 2011-05-11 セイコーエプソン株式会社 鉛フリーはんだ合金
KR101265449B1 (ko) * 2007-07-13 2013-05-16 센주긴조쿠고교 가부시키가이샤 차재 실장용 무납 땜납과 차재 전자 회로
KR100975654B1 (ko) * 2008-02-26 2010-08-17 한국과학기술원 Ｃｏ가 첨가된 Ｓｎ-3.5Ａｇ 솔더와 Ｎｉ-Ｐ 하부금속층간의 접합 신뢰성이 향상된 솔더 접합 구조
DE202009019184U1 (de) * 2009-08-29 2017-11-14 Umicore Ag & Co. Kg Lotlegierung
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
WO2012131861A1 (ja) 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
CN104602862B (zh) * 2012-06-30 2017-05-17 千住金属工业株式会社 无铅焊料球
JP6165294B2 (ja) * 2016-04-25 2017-07-19 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
JP6082952B1 (ja) * 2016-07-04 2017-02-22 株式会社弘輝 はんだ合金、ヤニ入りはんだ
CN107127473A (zh) * 2017-06-16 2017-09-05 东莞市锡达焊锡制品有限公司 一种镀镍无铅锡线
JP6389553B2 (ja) * 2017-09-15 2018-09-12 株式会社日本スペリア社 アルミニウム用はんだ及びはんだ継手
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
US11732330B2 (en) 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520403A (en) * 1978-07-20 1980-02-13 Seiko Epson Corp Soldering material of armor part for portable watch
JPH0234295A (ja) 1988-07-19 1990-02-05 Jw Harris Co Inc ソルダーコンポジション及びその使用方法
JP2667692B2 (ja) 1988-12-29 1997-10-27 株式会社徳力本店 低融点Ａｇはんだ
JPH04333391A (ja) 1991-05-09 1992-11-20 Sumitomo Metal Mining Co Ltd 鉛合金ろう材
JPH06269983A (ja) * 1993-03-18 1994-09-27 Tokuriki Honten Co Ltd Ａｇ系はんだ
JP2677760B2 (ja) * 1993-11-09 1997-11-17 松下電器産業 株式会社 はんだ
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
JP3299091B2 (ja) 1995-09-29 2002-07-08 千住金属工業株式会社 鉛フリーはんだ合金
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
JPH09326554A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
JP3693762B2 (ja) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ 無鉛はんだ
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3296289B2 (ja) 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JP3684811B2 (ja) * 1998-01-28 2005-08-17 株式会社村田製作所 半田および半田付け物品
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
US6109506A (en) * 1998-12-23 2000-08-29 Ford Global Technologies, Inc. Method of enhancing a joined metal assembly

Also Published As

Publication number Publication date
EP1213089A1 (de) 2002-06-12
EP1213089B1 (de) 2006-03-08
DE60117669T2 (de) 2006-11-23
JP2002246742A (ja) 2002-08-30
US6702176B2 (en) 2004-03-09
KR20020046192A (ko) 2002-06-20
US20020117539A1 (en) 2002-08-29
TW527438B (en) 2003-04-11
JP3599101B2 (ja) 2004-12-08
KR100468213B1 (ko) 2005-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition