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DE60117458D1 - Integrierter Druckwandler - Google Patents

Integrierter Druckwandler

Info

Publication number
DE60117458D1
DE60117458D1 DE60117458T DE60117458T DE60117458D1 DE 60117458 D1 DE60117458 D1 DE 60117458D1 DE 60117458 T DE60117458 T DE 60117458T DE 60117458 T DE60117458 T DE 60117458T DE 60117458 D1 DE60117458 D1 DE 60117458D1
Authority
DE
Germany
Prior art keywords
pressure transducer
integrated pressure
integrated
transducer
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117458T
Other languages
English (en)
Other versions
DE60117458T2 (de
Inventor
Markus Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of DE60117458D1 publication Critical patent/DE60117458D1/de
Publication of DE60117458T2 publication Critical patent/DE60117458T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE60117458T 2000-09-12 2001-09-12 Integrierter Druckwandler Expired - Lifetime DE60117458T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/660,218 US6521965B1 (en) 2000-09-12 2000-09-12 Integrated pressure sensor
US660218 2000-09-12

Publications (2)

Publication Number Publication Date
DE60117458D1 true DE60117458D1 (de) 2006-04-27
DE60117458T2 DE60117458T2 (de) 2006-10-12

Family

ID=24648619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117458T Expired - Lifetime DE60117458T2 (de) 2000-09-12 2001-09-12 Integrierter Druckwandler

Country Status (3)

Country Link
US (1) US6521965B1 (de)
EP (1) EP1193486B1 (de)
DE (1) DE60117458T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531331B1 (en) * 2002-07-16 2003-03-11 Sandia Corporation Monolithic integration of a MOSFET with a MEMS device
US7514283B2 (en) * 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
US8912174B2 (en) * 2003-04-16 2014-12-16 Mylan Pharmaceuticals Inc. Formulations and methods for treating rhinosinusitis
US6936491B2 (en) 2003-06-04 2005-08-30 Robert Bosch Gmbh Method of fabricating microelectromechanical systems and devices having trench isolated contacts
US7075160B2 (en) 2003-06-04 2006-07-11 Robert Bosch Gmbh Microelectromechanical systems and devices having thin film encapsulated mechanical structures
US6952041B2 (en) * 2003-07-25 2005-10-04 Robert Bosch Gmbh Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
US7068125B2 (en) 2004-03-04 2006-06-27 Robert Bosch Gmbh Temperature controlled MEMS resonator and method for controlling resonator frequency
US7102467B2 (en) * 2004-04-28 2006-09-05 Robert Bosch Gmbh Method for adjusting the frequency of a MEMS resonator
US8154092B2 (en) 2004-08-09 2012-04-10 Case Western Reserve University Silicon carbide MEMS structures and methods of forming the same
US20070020794A1 (en) * 2005-07-22 2007-01-25 Debar Michael J Method of strengthening a microscale chamber formed over a sacrificial layer
TWI289879B (en) * 2005-09-30 2007-11-11 Touch Micro System Tech Method of fabricating pressure sensor
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
JP4739164B2 (ja) * 2006-10-20 2011-08-03 三菱電機株式会社 車両用エンジンの吸入空気圧力測定用の半導体感歪センサ
US7875484B2 (en) * 2006-11-20 2011-01-25 Alces Technology, Inc. Monolithic IC and MEMS microfabrication process
ITTO20090616A1 (it) * 2009-08-05 2011-02-06 St Microelectronics Srl Procedimento di fabbricazione di dispositivi mems dotati di cavita' sepolte e dispositivo mems cosi' ottenuto
CN104969049B (zh) 2012-10-02 2018-04-27 罗伯特·博世有限公司 电容式压力传感器和方法
US9557238B2 (en) * 2014-07-25 2017-01-31 Ams International Ag Pressure sensor with geter embedded in membrane
CN105651450B (zh) * 2014-11-14 2018-07-06 中芯国际集成电路制造(上海)有限公司 压力传感器及其形成方法
CN105036059B (zh) * 2015-06-24 2017-01-25 上海芯赫科技有限公司 一种电容式mems传感器的加工方法及传感器结构
FR3108462B1 (fr) * 2020-03-23 2022-08-26 Commissariat Energie Atomique Microphone microelectromecanique a encombrement reduit
IT202100022505A1 (it) 2021-08-30 2023-03-02 St Microelectronics Srl Procedimento di fabbricazione di un sensore di pressione capacitivo e sensore di pressione capacitivo

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343064A (en) * 1988-03-18 1994-08-30 Spangler Leland J Fully integrated single-crystal silicon-on-insulator process, sensors and circuits
US5177661A (en) * 1989-01-13 1993-01-05 Kopin Corporation SOI diaphgram sensor
US5316619A (en) * 1993-02-05 1994-05-31 Ford Motor Company Capacitive surface micromachine absolute pressure sensor and method for processing
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US5963788A (en) * 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
WO1998023935A1 (de) * 1996-11-28 1998-06-04 Siemens Aktiengesellschaft Verfahren zur herstellung von mikromechanischen sensoren
US6167761B1 (en) * 1998-03-31 2001-01-02 Hitachi, Ltd. And Hitachi Car Engineering Co., Ltd. Capacitance type pressure sensor with capacitive elements actuated by a diaphragm
US6174820B1 (en) * 1999-02-16 2001-01-16 Sandia Corporation Use of silicon oxynitride as a sacrificial material for microelectromechanical devices

Also Published As

Publication number Publication date
US6521965B1 (en) 2003-02-18
EP1193486A1 (de) 2002-04-03
EP1193486B1 (de) 2006-03-01
DE60117458T2 (de) 2006-10-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition