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DE60107020D1 - Silikonzusammensetzung und elektrisch leitfähige Silikonklebstoff - Google Patents

Silikonzusammensetzung und elektrisch leitfähige Silikonklebstoff

Info

Publication number
DE60107020D1
DE60107020D1 DE60107020T DE60107020T DE60107020D1 DE 60107020 D1 DE60107020 D1 DE 60107020D1 DE 60107020 T DE60107020 T DE 60107020T DE 60107020 T DE60107020 T DE 60107020T DE 60107020 D1 DE60107020 D1 DE 60107020D1
Authority
DE
Germany
Prior art keywords
electrically conductive
silicone
adhesive
composition
silicone composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107020T
Other languages
English (en)
Other versions
DE60107020T2 (de
Inventor
Don Lee Kleyer
Michael Andrew Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE60107020D1 publication Critical patent/DE60107020D1/de
Application granted granted Critical
Publication of DE60107020T2 publication Critical patent/DE60107020T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/34—Oxygen-containing compounds, including ammonium and metal salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60107020T 2000-07-20 2001-07-05 Silikonzusammensetzung und elektrisch leitfähige Silikonklebstoff Expired - Lifetime DE60107020T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US620179 2000-07-20
US09/620,179 US6361716B1 (en) 2000-07-20 2000-07-20 Silicone composition and electrically conductive silicone adhesive formed therefrom

Publications (2)

Publication Number Publication Date
DE60107020D1 true DE60107020D1 (de) 2004-12-16
DE60107020T2 DE60107020T2 (de) 2005-12-01

Family

ID=24484909

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107020T Expired - Lifetime DE60107020T2 (de) 2000-07-20 2001-07-05 Silikonzusammensetzung und elektrisch leitfähige Silikonklebstoff

Country Status (6)

Country Link
US (1) US6361716B1 (de)
EP (1) EP1176181B1 (de)
JP (2) JP5629417B2 (de)
KR (1) KR100794884B1 (de)
DE (1) DE60107020T2 (de)
TW (1) TW548324B (de)

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US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
JP2002265786A (ja) * 2001-03-09 2002-09-18 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物、および半導体装置の製造方法
US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
US7645262B2 (en) * 2002-04-11 2010-01-12 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
US7211103B2 (en) * 2002-04-11 2007-05-01 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
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JP2004031203A (ja) * 2002-06-27 2004-01-29 Shin Etsu Polymer Co Ltd 導電接点素子及び電気コネクタ
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JP4568472B2 (ja) * 2002-11-29 2010-10-27 東レ・ダウコーニング株式会社 銀粉末の製造方法および硬化性シリコーン組成物
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KR101175948B1 (ko) * 2004-10-28 2012-08-23 다우 코닝 코포레이션 전도성 경화성 조성물
EP1833918B1 (de) 2004-12-23 2011-09-28 Dow Corning Corporation Vernetzbare saccharid-siloxan-zusammensetzungen und daraus gebildete netzwerke, überzüge und artikel
WO2006073696A1 (en) 2005-01-04 2006-07-13 Dow Corning Corporation Siloxanes and silanes cured by organoborane amine complexes
US7928174B2 (en) * 2005-01-04 2011-04-19 Dow Corning Corporation Organosilicon functional boron amine catalyst complexes and curable compositions made therefrom
WO2006127883A2 (en) * 2005-05-23 2006-11-30 Dow Corning Corporation Personal care compositions comprising saccharide-siloxane copolymers
JP5172666B2 (ja) * 2005-05-23 2013-03-27 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含む表面処理組成物
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
WO2007040794A1 (en) * 2005-09-21 2007-04-12 Dow Corning Corporation Ambient lithographic method using organoborane amine complexes
US20070173602A1 (en) * 2006-01-25 2007-07-26 Brinkman Larry F Encapsulated Michael addition catalyst
KR101460980B1 (ko) * 2006-05-23 2014-11-13 다우 코닝 코포레이션 활성제를 전달하기 위한 신규한 실리콘막 형성제
KR101395711B1 (ko) * 2006-06-20 2014-05-16 다우 코닝 코포레이션 경화성 유기규소 조성물
WO2008021524A2 (en) * 2006-08-18 2008-02-21 Second Sight Medical Products, Inc. Package for an implantable neural stimulation device
TW200833752A (en) * 2006-10-23 2008-08-16 Lord Corp Highly filled polymer materials
KR101547343B1 (ko) * 2007-02-20 2015-08-28 다우 코닝 코포레이션 수소결합 폴리오가노실록세인을 기반으로 하는 충전물 처리제
DE102007013609A1 (de) 2007-03-21 2008-09-25 Wacker Chemie Ag Siloxyfunktionelle Aromaten als Co-Katalysatoren in der Übergangsmetall-katalysierten Hydrosilylierung
US9220169B2 (en) * 2007-06-21 2015-12-22 Second Sight Medical Products, Inc. Biocompatible electroplated interconnection electronics package suitable for implantation
AU2007355605B2 (en) 2007-06-25 2012-04-26 Second Sight Medical Products, Inc. Method for providing hermetic electrical feedthrough
EP2343341B1 (de) * 2008-10-23 2014-08-27 Mie University Polyorganosiloxanzusammensetzung und härteprodukt daraus
US20100213415A1 (en) * 2009-02-26 2010-08-26 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
JP5997155B2 (ja) 2010-08-23 2016-09-28 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 水性環境で安定している糖シロキサン並びにそのような糖シロキサンの調製及び使用方法
CN103068886A (zh) * 2010-08-23 2013-04-24 道康宁公司 磷硅氧烷树脂以及包含磷硅氧烷树脂的可固化有机硅组合物、自立式膜和层合物
KR101222502B1 (ko) 2011-01-12 2013-01-29 정우화인 주식회사 충전제 분산과 결합에 유리한 실리콘-에폭시-비닐 수지 및 그의 제조 방법
CN104968751B (zh) * 2013-02-11 2017-04-19 道康宁公司 包含簇合官能化聚有机硅氧烷和有机硅反应性稀释剂的可固化有机硅组合物
JP6408491B2 (ja) * 2013-02-11 2018-10-17 ダウ シリコーンズ コーポレーション 熱伝導性熱ラジカル硬化性シリコーン組成物を形成するためのｉｎｓｉｔｕ法
EP2954025B1 (de) * 2013-02-11 2019-12-11 Dow Silicones Corporation Verfahren zur herstellung von thermisch leitenden/ thermisch radikalen härtbaren silikonzusammensetzungen
KR102424027B1 (ko) 2014-10-13 2022-07-25 애버리 데니슨 코포레이션 용접 가능한 방진성 실리콘 접착제
US10329424B2 (en) * 2014-12-25 2019-06-25 Polymatech Japan Co., Ltd. Silicone composition
JP6673322B2 (ja) * 2017-12-20 2020-03-25 住友ベークライト株式会社 導電性ペーストおよび伸縮性配線基板
CN109777345B (zh) * 2018-12-30 2021-08-20 苏州桐力光电股份有限公司 一种可自愈合双组份加成型导热硅凝胶及其制备方法
CN112323169A (zh) * 2020-10-21 2021-02-05 广州市双雄化纤有限公司 一种再生防静电涤纶短纤生产工艺
CN116507678A (zh) * 2020-12-23 2023-07-28 陶氏环球技术有限责任公司 有机硅组合物
JP2022143344A (ja) * 2021-03-17 2022-10-03 信越化学工業株式会社 導電性シリコーン組成物、導電性シリコーン硬化物及び積層体
CN113338050A (zh) * 2021-06-07 2021-09-03 深圳先进电子材料国际创新研究院 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途
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Also Published As

Publication number Publication date
JP2002088337A (ja) 2002-03-27
KR20020009447A (ko) 2002-02-01
TW548324B (en) 2003-08-21
KR100794884B1 (ko) 2008-01-14
EP1176181B1 (de) 2004-11-10
EP1176181A3 (de) 2003-01-29
JP5629417B2 (ja) 2014-11-19
EP1176181A2 (de) 2002-01-30
US6361716B1 (en) 2002-03-26
JP2014065915A (ja) 2014-04-17
DE60107020T2 (de) 2005-12-01

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