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DE60105725D1 - Wellenleiterkopplung - Google Patents

Wellenleiterkopplung

Info

Publication number
DE60105725D1
DE60105725D1 DE60105725T DE60105725T DE60105725D1 DE 60105725 D1 DE60105725 D1 DE 60105725D1 DE 60105725 T DE60105725 T DE 60105725T DE 60105725 T DE60105725 T DE 60105725T DE 60105725 D1 DE60105725 D1 DE 60105725D1
Authority
DE
Germany
Prior art keywords
waveguide coupling
waveguide
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60105725T
Other languages
English (en)
Other versions
DE60105725T2 (de
Inventor
Tsutomu Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE60105725D1 publication Critical patent/DE60105725D1/de
Publication of DE60105725T2 publication Critical patent/DE60105725T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/042—Hollow waveguide joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
DE60105725T 2000-10-06 2001-09-26 Wellenleiterkopplung Expired - Lifetime DE60105725T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000307422 2000-10-06
JP2000307422 2000-10-06
JP2001220496 2001-07-19
JP2001220496A JP3617633B2 (ja) 2000-10-06 2001-07-19 導波管接続部

Publications (2)

Publication Number Publication Date
DE60105725D1 true DE60105725D1 (de) 2004-10-28
DE60105725T2 DE60105725T2 (de) 2005-10-06

Family

ID=26601671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60105725T Expired - Lifetime DE60105725T2 (de) 2000-10-06 2001-09-26 Wellenleiterkopplung

Country Status (4)

Country Link
US (5) US20020044033A1 (de)
EP (1) EP1195839B1 (de)
JP (1) JP3617633B2 (de)
DE (1) DE60105725T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617633B2 (ja) * 2000-10-06 2005-02-09 三菱電機株式会社 導波管接続部
JP4602139B2 (ja) * 2005-03-30 2010-12-22 三菱電機株式会社 高周波回路基板
JP4584193B2 (ja) * 2006-06-15 2010-11-17 三菱電機株式会社 導波管の接続構造
JP4833026B2 (ja) 2006-10-31 2011-12-07 三菱電機株式会社 導波管の接続構造
JP4786579B2 (ja) * 2007-03-29 2011-10-05 三菱電機株式会社 高周波モジュール
JP5179570B2 (ja) 2008-03-31 2013-04-10 京セラ株式会社 高周波モジュールおよびその製造方法ならびに該高周波モジュールを備えた送信器、受信器、送受信器およびレーダ装置
WO2009123233A1 (ja) 2008-03-31 2009-10-08 京セラ株式会社 高周波モジュールおよびその製造方法ならびに該高周波モジュールを備えた送信器、受信器、送受信器およびレーダ装置
JP5007281B2 (ja) * 2008-07-11 2012-08-22 東光株式会社 誘電体導波管スロットアンテナ
CN102144289B (zh) * 2008-09-05 2015-08-05 三菱电机株式会社 高频电路封装件及传感器模块
US9136576B2 (en) * 2009-04-28 2015-09-15 Mitsubishi Electric Corporation Connecting structure for a waveguide converter having a first waveguide substrate and a second converter substrate that are fixed to each other
TWM371979U (en) * 2009-08-06 2010-01-01 Microelectronics Tech Inc Wave guide and assembly of wave guide and pcb
JP2014204349A (ja) * 2013-04-08 2014-10-27 三菱電機株式会社 導波管構造
KR20150125262A (ko) * 2014-04-30 2015-11-09 주식회사 만도 다층 기판 및 다층 기판의 제조 방법
JP6643714B2 (ja) * 2016-03-10 2020-02-12 富士通株式会社 電子装置及び電子機器
JP2019047141A (ja) 2016-03-29 2019-03-22 日本電産エレシス株式会社 マイクロ波ｉｃ導波路装置モジュール、レーダ装置およびレーダシステム
JP6861588B2 (ja) 2017-07-07 2021-04-21 株式会社フジクラ 伝送線路
US10680305B2 (en) * 2018-02-08 2020-06-09 Aptiv Technologies Limited Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers
US11196146B2 (en) * 2019-05-14 2021-12-07 Texas Instruments Incorporated Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
DE102020101293A1 (de) 2020-01-21 2021-07-22 Infineon Technologies Ag Hochfrequenz-vorrichtung mit halbleitervorrichtung und wellenleiter-bauteil
GB2594935A (en) * 2020-05-06 2021-11-17 Blighter Surveillance Systems Ltd Modular high frequency device
EP4016620A1 (de) 2020-12-16 2022-06-22 Nxp B.V. Package mit einem ic-chip und einem wellenleiter-anreger
US11682814B2 (en) * 2021-06-16 2023-06-20 Raytheon Company RF waveguide housing including a metal-diamond composite-base having a waveguide opening formed therein covered by a slab
US11963291B2 (en) 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
JP7738803B2 (ja) * 2023-06-13 2025-09-12 三菱電機株式会社 導波管の接続構造

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4562416A (en) * 1984-05-31 1985-12-31 Sanders Associates, Inc. Transition from stripline to waveguide
JPS6062702A (ja) 1984-07-26 1985-04-10 Matsushita Electric Ind Co Ltd マイクロストリツプ線路
US4716386A (en) * 1986-06-10 1987-12-29 Canadian Marconi Company Waveguide to stripline transition
JPH06204701A (ja) * 1992-11-10 1994-07-22 Sony Corp 偏分波器及び導波管−マイクロストリップライン変換装置
JP3052656B2 (ja) 1993-04-19 2000-06-19 三菱電機株式会社 導波管接続部材
US5471181A (en) * 1994-03-08 1995-11-28 Hughes Missile Systems Company Interconnection between layers of striplines or microstrip through cavity backed slot
US5552752A (en) * 1995-06-02 1996-09-03 Hughes Aircraft Company Microwave vertical interconnect through circuit with compressible conductor
US5668509A (en) * 1996-03-25 1997-09-16 Hughes Electronics Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
JP3580680B2 (ja) 1997-09-30 2004-10-27 京セラ株式会社 高周波用パッケージおよびその接続構造
US5929728A (en) * 1997-06-25 1999-07-27 Hewlett-Packard Company Imbedded waveguide structures for a microwave circuit package
JPH11136009A (ja) 1997-10-31 1999-05-21 Kyocera Corp 高周波用フレキシブル線路
US6515562B1 (en) * 1998-04-23 2003-02-04 Kyocera Corporation Connection structure for overlapping dielectric waveguide lines
JP3732952B2 (ja) 1998-05-28 2006-01-11 京セラ株式会社 高周波伝送線路の接続方法
US6005458A (en) * 1998-05-29 1999-12-21 Motorola, Inc. High density connector and method therefor
JP3522138B2 (ja) 1998-12-24 2004-04-26 京セラ株式会社 誘電体導波管線路と方形導波管との接続構造
FR2789232A1 (fr) * 1999-01-28 2000-08-04 Cit Alcatel Module de circuit hyperfrequence et son dispositif de connexion a un autre module
JP3410041B2 (ja) 1999-03-15 2003-05-26 太陽誘電株式会社 ハイブリッドモジュール
JP3763361B2 (ja) 2000-10-06 2006-04-05 三菱電機株式会社 導波管接続部
JP3617633B2 (ja) * 2000-10-06 2005-02-09 三菱電機株式会社 導波管接続部

Also Published As

Publication number Publication date
US7190243B2 (en) 2007-03-13
US20050190021A1 (en) 2005-09-01
US7084723B2 (en) 2006-08-01
US20070085636A1 (en) 2007-04-19
EP1195839B1 (de) 2004-09-22
EP1195839A1 (de) 2002-04-10
US7538642B2 (en) 2009-05-26
US7705697B2 (en) 2010-04-27
US20020044033A1 (en) 2002-04-18
DE60105725T2 (de) 2005-10-06
JP3617633B2 (ja) 2005-02-09
JP2002185203A (ja) 2002-06-28
US20060097828A1 (en) 2006-05-11
US20070085635A1 (en) 2007-04-19

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Legal Events

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