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DE60044293D1 - Dynamisch ausbalancierte mikroelektromechanische vorrichtungen - Google Patents

Dynamisch ausbalancierte mikroelektromechanische vorrichtungen

Info

Publication number
DE60044293D1
DE60044293D1 DE60044293T DE60044293T DE60044293D1 DE 60044293 D1 DE60044293 D1 DE 60044293D1 DE 60044293 T DE60044293 T DE 60044293T DE 60044293 T DE60044293 T DE 60044293T DE 60044293 D1 DE60044293 D1 DE 60044293D1
Authority
DE
Germany
Prior art keywords
tuning fork
dynamically balanced
microelectromechanical devices
balancing
microfabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60044293T
Other languages
English (en)
Inventor
Marc S Weinberg
Kaplesh Kumar
Thomas A King
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Charles Stark Draper Laboratory Inc
Original Assignee
Charles Stark Draper Laboratory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Charles Stark Draper Laboratory Inc filed Critical Charles Stark Draper Laboratory Inc
Application granted granted Critical
Publication of DE60044293D1 publication Critical patent/DE60044293D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
DE60044293T 1999-03-25 2000-03-23 Dynamisch ausbalancierte mikroelektromechanische vorrichtungen Expired - Lifetime DE60044293D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12620599P 1999-03-25 1999-03-25
PCT/US2000/007756 WO2000057194A1 (en) 1999-03-25 2000-03-23 Dynamically balanced microelectromechanical devices

Publications (1)

Publication Number Publication Date
DE60044293D1 true DE60044293D1 (de) 2010-06-10

Family

ID=22423563

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60044293T Expired - Lifetime DE60044293D1 (de) 1999-03-25 2000-03-23 Dynamisch ausbalancierte mikroelektromechanische vorrichtungen

Country Status (8)

Country Link
US (1) US6571630B1 (de)
EP (1) EP1173773B1 (de)
JP (1) JP5123447B2 (de)
AT (1) ATE466288T1 (de)
DE (1) DE60044293D1 (de)
HK (1) HK1045372B (de)
TW (1) TW425479B (de)
WO (1) WO2000057194A1 (de)

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US6854315B2 (en) 2002-04-22 2005-02-15 Northrop Grumman Corporation Quadrature compensation technique for vibrating gyroscopes
US6718823B2 (en) * 2002-04-30 2004-04-13 Honeywell International Inc. Pulse width modulation drive signal for a MEMS gyroscope
EP1549458B1 (de) * 2002-09-24 2006-06-07 Hasselblad A/S Vorrichtung zur zweidimensionalen verschiebung
US6823733B2 (en) * 2002-11-04 2004-11-30 Matsushita Electric Industrial Co., Ltd. Z-axis vibration gyroscope
US6978673B2 (en) * 2003-02-07 2005-12-27 Honeywell International, Inc. Methods and systems for simultaneously fabricating multi-frequency MEMS devices
US9318350B2 (en) 2003-04-15 2016-04-19 General Dynamics Advanced Information Systems, Inc. Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components
US7302848B2 (en) 2005-03-10 2007-12-04 The Charles Stark Draper Laboratory, Inc. Force compensated comb drive
US20070163346A1 (en) * 2006-01-18 2007-07-19 Honeywell International Inc. Frequency shifting of rotational harmonics in mems devices
US7290435B2 (en) * 2006-02-06 2007-11-06 Invensense Inc. Method and apparatus for electronic cancellation of quadrature error
JP2008194729A (ja) * 2007-02-13 2008-08-28 Fujitsu Ltd 小型デバイスの製造方法、レーザ加工方法及びレーザ加工装置
RU2346239C1 (ru) * 2007-07-17 2009-02-10 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт "Электроприбор" Способ определения коэффициентов перекрестных жесткости и демпфирования подвеса микромеханического гироскопа и микромеханический гироскоп, в котором реализован данный способ
FI119895B (fi) 2007-10-05 2009-04-30 Vti Technologies Oy Värähtelevä mikromekaaninen kulmanopeusanturi
EP2098822B8 (de) * 2008-03-05 2015-08-12 Colibrys S.A. Schwingungsgyroskop mit reduzierten Quadratursignalen
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
CN102119318B (zh) * 2008-08-18 2013-10-30 株式会社日立制作所 微机电系统
WO2010138717A1 (en) * 2009-05-27 2010-12-02 King Abdullah University Of Science And Technology Mems mass spring damper systems using an out-of-plane suspension scheme
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
JP6010968B2 (ja) * 2012-03-29 2016-10-19 セイコーエプソン株式会社 振動デバイス及び振動デバイスの製造方法
JP5963567B2 (ja) * 2012-06-26 2016-08-03 日立オートモティブシステムズ株式会社 慣性センサ
US9316665B2 (en) 2013-04-22 2016-04-19 Freescale Semicondcutor, Inc. Estimation of sidewall skew angles of a structure
CN103697909B (zh) * 2013-12-13 2016-06-01 上海交通大学 导轨滑块型圆盘式微机械固体波动陀螺封装装置及方法
SE537998C2 (sv) 2014-05-09 2016-02-02 Per-Axel Uhlin Vibrationssensor av magnetisk typ
US10514259B2 (en) 2016-08-31 2019-12-24 Analog Devices, Inc. Quad proof mass MEMS gyroscope with outer couplers and related methods
JP6819216B2 (ja) 2016-10-26 2021-01-27 セイコーエプソン株式会社 ジャイロセンサー、ジャイロセンサーの製造方法、電子機器および移動体
US10697774B2 (en) 2016-12-19 2020-06-30 Analog Devices, Inc. Balanced runners synchronizing motion of masses in micromachined devices
US10415968B2 (en) 2016-12-19 2019-09-17 Analog Devices, Inc. Synchronized mass gyroscope
US10627235B2 (en) 2016-12-19 2020-04-21 Analog Devices, Inc. Flexural couplers for microelectromechanical systems (MEMS) devices
JP2018185188A (ja) 2017-04-25 2018-11-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、物理量センサーデバイス、電子機器および移動体
JP6984342B2 (ja) * 2017-11-22 2021-12-17 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、慣性計測ユニット、携帯型電子機器、電子機器、および移動体
JP2019132690A (ja) 2018-01-31 2019-08-08 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、移動体および物理量センサーの出力信号調整方法
US10948294B2 (en) 2018-04-05 2021-03-16 Analog Devices, Inc. MEMS gyroscopes with in-line springs and related systems and methods
JP7192437B2 (ja) 2018-11-28 2022-12-20 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7225817B2 (ja) 2019-01-17 2023-02-21 セイコーエプソン株式会社 角速度センサー、慣性計測装置、電子機器および移動体
JP7188311B2 (ja) 2019-07-31 2022-12-13 セイコーエプソン株式会社 ジャイロセンサー、電子機器、及び移動体
US11193771B1 (en) 2020-06-05 2021-12-07 Analog Devices, Inc. 3-axis gyroscope with rotational vibration rejection
EP4162282A4 (de) 2020-06-08 2024-11-13 Analog Devices, Inc. Antriebs- und erfassungsspannungsentlastungsvorrichtung
CN115812153A (zh) 2020-06-08 2023-03-17 美国亚德诺半导体公司 应力释放mems陀螺仪
US11698257B2 (en) 2020-08-24 2023-07-11 Analog Devices, Inc. Isotropic attenuated motion gyroscope
CN114689088B (zh) * 2022-06-02 2022-08-02 中国人民解放军国防科技大学 一种用于振动陀螺不平衡质量检测的弹性支撑电极结构

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Also Published As

Publication number Publication date
HK1045372A1 (en) 2002-11-22
JP5123447B2 (ja) 2013-01-23
EP1173773A4 (de) 2006-05-17
EP1173773A1 (de) 2002-01-23
JP2002540406A (ja) 2002-11-26
WO2000057194A1 (en) 2000-09-28
ATE466288T1 (de) 2010-05-15
TW425479B (en) 2001-03-11
HK1045372B (en) 2010-11-05
US6571630B1 (en) 2003-06-03
EP1173773B1 (de) 2010-04-28

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