DE60035605T8 - Bauteilbestuckungsverfahren und -einrichtung - Google Patents

Bauteilbestuckungsverfahren und -einrichtung Download PDF

Info

Publication number: DE60035605T8
Authority: DE; Germany
Prior art keywords: component processing; component; processing
Prior art date: 1999-09-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

DE60035605T

Other languages

English (en)

Other versions

DE60035605D1 (de

DE60035605T2 (de

Inventor

Yasuhiro Kofu-shi MAENISHI

Takahiro Kofu-shi INOUE

Ikuo Kofu-shi YOSHIDA

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-09-27

Filing date

2000-09-26

Publication date

2008-06-05

2000-09-26 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

2007-08-30 Publication of DE60035605D1 publication Critical patent/DE60035605D1/de

2008-02-21 Application granted granted Critical

2008-02-21 Publication of DE60035605T2 publication Critical patent/DE60035605T2/de

2008-06-05 Publication of DE60035605T8 publication Critical patent/DE60035605T8/de

Status Active legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Supply And Installment Of Electrical Components (AREA)

DE60035605T 1999-09-27 2000-09-26 Bauteilbestuckungsverfahren und -einrichtung Active DE60035605T8 (de)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
JP27311199		1999-09-27
JP27311199		1999-09-27
JP2000288806		2000-09-22
JP2000288806		2000-09-22
PCT/JP2000/006598 WO2001024598A1 (en)	1999-09-27	2000-09-26	Component mounting method and component mounting apparatus

Publications (3)

Publication Number	Publication Date
DE60035605D1 DE60035605D1 (de)	2007-08-30
DE60035605T2 DE60035605T2 (de)	2008-02-21
DE60035605T8 true DE60035605T8 (de)	2008-06-05

Family

ID=26550519

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
DE60039547T Expired - Lifetime DE60039547D1 (de)	1999-09-27	2000-09-26	Bestückungsverfahren und Bestückungsvorrichtung
DE60035605T Active DE60035605T8 (de)	1999-09-27	2000-09-26	Bauteilbestuckungsverfahren und -einrichtung

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
DE60039547T Expired - Lifetime DE60039547D1 (de)	1999-09-27	2000-09-26	Bestückungsverfahren und Bestückungsvorrichtung

Country Status (5)

Country	Link
US (1)	US6842974B1 (de)
EP (2)	EP1227711B9 (de)
JP (1)	JP3996768B2 (de)
DE (2)	DE60039547D1 (de)
WO (1)	WO2001024598A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2003017900A (ja) *	2001-07-04	2003-01-17	Sanyo Electric Co Ltd	電子部品装着装置におけるパターンプログラム最適化方法及び最適化装置
JP2003017895A (ja) *	2001-07-04	2003-01-17	Sanyo Electric Co Ltd	電子部品装着装置
US7043820B2 (en) *	2001-07-27	2006-05-16	Fuji Machine Mfg. Co., Ltd.	Electric-component mounting system
JP4116851B2 (ja) *	2002-09-19	2008-07-09	富士通株式会社	電子部品の処理方法及び電子部品用治具
US7272887B2 (en) *	2003-08-04	2007-09-25	Assembleon N.V.	Component placement device and method
CN1846223B (zh) *	2003-09-01	2012-09-05	松下电器产业株式会社	元件装配顺序的优化方法和元件装配顺序的优化设备
US8156642B2 (en) *	2007-04-03	2012-04-17	Panasonic Corporation	Component mounting method
JP4518114B2 (ja) *	2007-07-25	2010-08-04	Ｔｄｋ株式会社	電子部品内蔵基板及びその製造方法
JP4518113B2 (ja) *	2007-07-25	2010-08-04	Ｔｄｋ株式会社	電子部品内蔵基板及びその製造方法
EP2324690A1 (de) *	2008-09-01	2011-05-25	Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO	Pick/place-kopfbaugruppe
KR101639667B1 (ko)	2010-08-10	2016-07-14	한화테크윈 주식회사	부품 실장기
CN102686037A (zh) *	2011-03-18	2012-09-19	北京博瑞精电科技有限公司	一种双头led灯条贴片机
TW201320254A (zh) *	2011-11-15	2013-05-16	華新麗華股份有限公司	固晶裝置及固晶方法
JP6043873B2 (ja) *	2013-07-09	2016-12-14	富士機械製造株式会社	電子部品の割り当て方法および電子部品実装システム
JP6691039B2 (ja) *	2014-04-24	2020-04-28	株式会社Ｆｕｊｉ	最適化プログラム、および装着作業システム
JP6314319B2 (ja) *	2014-11-05	2018-04-25	パナソニックＩｐマネジメント株式会社	電子部品実装システム
US11140801B2 (en) *	2014-11-11	2021-10-05	Fuji Corporation	Data input and control devices of an electronic component mounting machine
CN107615909B (zh) *	2015-05-29	2020-02-21	株式会社富士	计算机可读存储介质及安装作业机
CN108353535B (zh) *	2015-11-13	2020-05-08	雅马哈发动机株式会社	表面安装机
US11272649B2 (en)	2018-10-12	2022-03-08	Panasonic Corporation Of North America	Electronic component mounting system with cross line communication
US12213257B2 (en) *	2020-02-07	2025-01-28	Fuji Corporation	Suction position adjustment device
EP4132249B1 (de) *	2020-03-23	2024-12-18	Fuji Corporation	Verwaltungsvorrichtung, montagesystem und verwaltungsverfahren
US11612089B2 (en) *	2020-12-07	2023-03-21	Assembleon B.V.	Component placement systems and methods of operating the same
CN116095980B (zh) *	2022-11-08	2023-08-22	哈尔滨工业大学	一种基于最大二分配的贴片机吸嘴分配方法

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Publication number	Priority date	Publication date	Assignee	Title
US3337941A (en) *	1965-05-27	1967-08-29	Ibm	Recycle control circuit for a chip positioning machine
NL8103574A (nl) *	1981-07-29	1983-02-16	Philips Nv	Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
EP0144717B1 (de) *	1983-11-05	1988-10-19	Zevatech AG	Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück
JPS60171799A (ja) *	1984-02-17	1985-09-05	松下電器産業株式会社	電子部品自動装着装置
DE3532500C2 (de) *	1984-09-17	1996-03-14	Tdk Corp	Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPS62169423A (ja)	1986-01-22	1987-07-25	Hitachi Ltd	部品移載装置
JPS645100A (en)	1987-06-29	1989-01-10	Hitachi Ltd	Shortest route search system
JP2604167B2 (ja)	1987-08-18	1997-04-30	三洋電機株式会社	部品実装方法及び部品実装装置
JPH0774969B2 (ja)	1987-10-16	1995-08-09	三洋電機株式会社	電子部品の装着装置
JP2628392B2 (ja) *	1990-01-16	1997-07-09	新明和工業株式会社	Ｉｃパッケージのハンドリング方法
US5040291A (en) *	1990-05-04	1991-08-20	Universal Instruments Corporation	Multi-spindle pick and place method and apparatus
DE69300850T2 (de) *	1992-07-01	1996-03-28	Yamaha Motor Co Ltd	Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JP3094188B2 (ja)	1992-10-27	2000-10-03	ヤマハ発動機株式会社	電子部品実装装置
JPH07193397A (ja) *	1993-12-27	1995-07-28	Yamaha Motor Co Ltd	実装機の吸着ポイント補正装置
KR970007078Y1 (en)	1994-06-03	1997-07-15	Lg Semicon Co Ltd	Devices feeding apparatus
JPH08162797A (ja) *	1994-12-08	1996-06-21	Matsushita Electric Ind Co Ltd	電子部品実装装置
CN1099226C (zh) *	1995-07-12	2003-01-15	松下电器产业株式会社	电子零部件装配方法和装置
US6789310B1 (en) *	1995-11-06	2004-09-14	Matsushita Electric Industrial Co., Ltd.	Component mounting apparatus
JP3196626B2 (ja) *	1995-12-26	2001-08-06	ソニー株式会社	部品実装方法
US5839769A (en) *	1996-10-03	1998-11-24	Kinetrix, Inc.	Expanding gripper with elastically variable pitch screw
EP1040740A1 (de)	1997-12-18	2000-10-04	Pentus Research Limited	Bauteilplazierungssystem

2000
- 2000-09-26 JP JP2001527619A patent/JP3996768B2/ja not_active Expired - Fee Related
- 2000-09-26 DE DE60039547T patent/DE60039547D1/de not_active Expired - Lifetime
- 2000-09-26 DE DE60035605T patent/DE60035605T8/de active Active
- 2000-09-26 EP EP00962845A patent/EP1227711B9/de not_active Expired - Lifetime
- 2000-09-26 EP EP07009527A patent/EP1816906B1/de not_active Expired - Lifetime
- 2000-09-26 US US10/088,759 patent/US6842974B1/en not_active Expired - Lifetime
- 2000-09-26 WO PCT/JP2000/006598 patent/WO2001024598A1/ja not_active Ceased

Also Published As

Publication number	Publication date
EP1816906B1 (de)	2008-07-16
DE60039547D1 (de)	2008-08-28
JP3996768B2 (ja)	2007-10-24
WO2001024598A1 (en)	2001-04-05
EP1227711B9 (de)	2008-08-13
EP1227711B1 (de)	2007-07-18
US6842974B1 (en)	2005-01-18
EP1227711A1 (de)	2002-07-31
DE60035605D1 (de)	2007-08-30
DE60035605T2 (de)	2008-02-21
EP1227711A4 (de)	2004-09-01
EP1816906A1 (de)	2007-08-08

Publication	Publication Date	Title
DE60035605T8 (de)	2008-06-05	Bauteilbestuckungsverfahren und -einrichtung
DE60025136D1 (de)	2006-02-02	Empfangsvorrichtung und Empfangsverarbeitungsverfahren
DE69921699D1 (de)	2004-12-09	Detektions-Verfahren und -Vorrichtung
DE60044764D1 (de)	2010-09-16	Durchgangs -Vorrichtung und -Verfahren
DE69941179D1 (de)	2009-09-10	Laserbearbeitungsvorrichtung
DE60019828D1 (de)	2005-06-09	Bildverarbeitungsvorrichtung
DE60030027D1 (de)	2006-09-28	Bildverarbeitungsgerät
DE60027515D1 (de)	2006-06-01	Elektronisches Gerät
DE69827915D1 (de)	2005-01-05	Verarbeitungsverfahren und -vorrichtung
DE60004573D1 (de)	2003-09-25	Zeicheneingabevorrichtung und -methoden
DE60020656D1 (de)	2005-07-14	Autofokusgerät und -verfahren
DE69735042D1 (de)	2006-03-30	Verarbeitungsvorrichtung
DE50010609D1 (de)	2005-07-28	Sport-trainings-vorrichtung sowie sport-trainings-system
DE60019490D1 (de)	2005-05-25	Brennstofförder-und behandlungsvorrichtung
DE60038838D1 (de)	2008-06-26	Signalverarbeitungsgerät
DE60129897D1 (de)	2007-09-27	Datenverarbeitungsverfahren und Gerät
DE60043938D1 (de)	2010-04-15	Halbleiterscheibepolierverfahren und vorrichtung
DE60023808D1 (de)	2005-12-15	Bildlesegerät und Bildverarbeitungsgerät
DE60031928D1 (de)	2007-01-04	Eingabeeinrichtung und Informationsverarbeitungsvorrichtung
DE69736636D1 (de)	2006-10-19	Verarbeitungsvorrichtung
DE50009766D1 (de)	2005-04-21	Befestigungs- und Fixierungsvorrichtung
DE60001791D1 (de)	2003-04-30	Bilderzeugungsgerät und -Verfahren
DE60041473D1 (de)	2009-03-19	Bildverarbeitungsgerät
DE60026785D1 (de)	2006-05-11	Bildverarbeitungsgerät
EP1152490A4 (de)	2004-05-06	Elektronisches gerät

Legal Events

Date	Code	Title	Description
2008-08-07	8364	No opposition during term of opposition
2009-05-07	8327	Change in the person/name/address of the patent owner	Owner name: PANASONIC CORP., KADOMA, OSAKA, JP
2010-03-25	8320	Willingness to grant licences declared (paragraph 23)