DE60033643T2 - VOLTAGE-FREE CHIP APPLICATION - Google Patents

Abstract

An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Description

background the invention

The The present disclosure relates generally to a method of attachment a mass on a package and in particular the attachment of a Mass on a pack to minimize stress.

At the Attaching a mass to a packing will be thermally induced Contraction and expansion effects in the mass as well as other pack tension effects generated. Elastomer or epoxy resin based attachment materials minimize thermally induced contraction and expansion effects however, the shock resistance of the crowd and can do not facilitate the vacuum seal due to outgassing. mechanical Attachment processes minimize mass-generated thermally induced Contraction and expansion effects, but are complex.

The The present invention seeks to improve the thermally induced contraction and expansion stresses along with other stress effects in bulk and in the housing to minimize while a good manufacturability be made available and a vacuum sealing process allows becomes.

In US-A-5 375 469 describes a capacitive acceleration sensor. and the independent ones claims are about This document is marked.

Summary the invention

According to one The first aspect of the present invention is a device according to Claim 1 provided.

The Device includes a pack, one connected to the pack Mass and one or more elastic connections for attachment the mass of the pack.

According to one second aspect of the present invention is a method according to Claim 23 is provided.

The Method for connecting a mass with a package includes the elastic attachment of the mass to the package at one or several different places.

Summary the drawing

1A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

1B is a plan view of an embodiment of the device 1A ,

1C is a bottom view of an embodiment of the mass of the device 1A ,

1D is a plan view of an embodiment of the elastic connection of the device 1A ,

1E is a detailed view of the embodiment of the elastic connection 1D ,

1F is a bottom view of an alternative embodiment of the mass of the device 1A ,

1G is a plan view of an alternative embodiment of the connection point of the device 1A ,

1H is a plan view of an alternative embodiment of the connection point of the device 1A ,

1y is a plan view of an alternative embodiment of the connection point of the device 1A ,

1K is a plan view of an alternative embodiment of the connection point of the device 1A ,

1L is a plan view of an alternative embodiment of the connection point of the device 1A ,

1M is a plan view of an alternative embodiment of the connection point of the device 1A ,

1N is a plan view of an alternative embodiment of the connection point of the device 1A ,

1P is a plan view of an alternative embodiment of the connection point of the device 1A ,

1Q Figure 4 is a plan view of an alternative embodiment of the elastic connection of the device 1A ,

1R is a detailed view of the alternative embodiment of the elastic connection 1Q ,

1S is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

1T is a plan view of an embodiment of the sliding bearing of the device 1S ,

1U is a plan view of an alternative embodiment of the sliding bearing of the device 1S ,

1V is a plan view of an alternative embodiment of the sliding bearing of the device 1S ,

1W is a plan view of an alternative embodiment of the sliding bearing of the device 1S ,

2A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

2 B is a plan view of an embodiment of the device 2A ,

2C is a bottom view of an embodiment of the mass of the device 2A ,

2D is a plan view of an embodiment of the elastic connection of the device 2A ,

2E is a detailed view of the embodiment of the elastic connection 2D ,

2F is a bottom view of an alternative embodiment of the mass of the device 2A ,

2G is a plan view of an alternative embodiment of the connection point of the device 2A ,

2H is a plan view of an alternative embodiment of the connection point of the device 2A ,

2J is a plan view of an alternative embodiment of the connection point of the device 2A ,

2K is a plan view of an alternative embodiment of the connection point of the device 2A ,

2L is a plan view of an alternative embodiment of the connection point of the device 2A ,

2M is a plan view of an alternative embodiment of the connection point of the device 2A ,

2N is a plan view of an alternative embodiment of the connection point of the device 2A ,

2P is a plan view of an alternative embodiment of the connection point of the device 2A ,

2Q Figure 4 is a plan view of an alternative embodiment of the elastic connection of the device 2A ,

2R is a detailed view of the alternative embodiment of the elastic connection 2Q ,

2S is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

2T is a plan view of an embodiment of the sliding bearing of the device 2S ,

2U is a plan view of an alternative embodiment of the sliding bearing of the device 2S ,

2V is a plan view of an alternative embodiment of the sliding bearing of the device 2S ,

2W is a plan view of an alternative embodiment of the sliding bearing of the device 2S ,

3A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

3B is a plan view of an embodiment of the device 3A ,

3C is a bottom view of an embodiment of the mass of the device 3A ,

3D is a plan view of an embodiment of the elastic connection of the device 3A ,

3E is a detailed view of the embodiment of the elastic connection 3D ,

3F is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

3G is a bottom view of an alternative embodiment of the mass of the device 3A ,

3H is a plan view of an alternative embodiment of the connection point of the device 3A ,

3J is a plan view of an alternative embodiment of the connection point of the device 3A ,

3K is a plan view of an alternative embodiment of the connection point of the device 3A ,

3L is a plan view of an alternative embodiment of the connection point of the device 3A ,

3M is a plan view of an alternative embodiment of the connection point of the device 3A ,

3R Figure 4 is a plan view of an alternative embodiment of the elastic connection of the device 3A ,

3S is a detailed view of the alternative embodiment of the elastic connection 3S ,

3T is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

3U is a plan view of an embodiment of the sliding bearing of the device 3T ,

3V is a plan view of an alternative embodiment of the sliding bearing of the device 3T ,

3W is a plan view of an alternative embodiment of the sliding bearing of the device 3T ,

3X is a plan view of an alternative embodiment of the sliding bearing of the device 3T ,

4A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

4B is a plan view of an embodiment of the device 4A ,

4C is a bottom view of an embodiment of the mass of the device 4A ,

4D is a plan view of an embodiment of the elastic connection of the device 4A ,

4E is a detailed view of the embodiment of the elastic connection 4D ,

4F is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

4G is a bottom view of an alternative embodiment of the mass of the device 4A ,

4H is a plan view of an alternative embodiment of the connection point of the device 4A ,

4J is a plan view of an alternative embodiment of the connection point of the device 4A ,

4K is a plan view of an alternative embodiment of the connection point of the device 4A ,

4L is a plan view of an alternative embodiment of the connection point of the device 4A ,

4M is a plan view of an alternative embodiment of the connection point of the device 4A ,

4R Figure 4 is a plan view of an alternative embodiment of the elastic connection of the device 4A ,

4S is a detailed view of the alternative embodiment of the elastic connection 4R ,

4T is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

4U is a plan view of an embodiment of the sliding bearing of the device 4T ,

4V is a plan view of an alternative embodiment of the sliding bearing of the device 4T ,

4W is a plan view of an alternative embodiment of the sliding bearing of the device 4T ,

4X is a top view of an alternative Embodiment of the sliding bearing of the device 4T ,

5A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

5B is a plan view of an embodiment of the device 5A ,

5C is a bottom view of an embodiment of the mass of the device 5A ,

5D is a plan view of an embodiment of the first elastic connection of the device 5A ,

5E is a detailed view of the embodiment of the first elastic connection 5D ,

5F is a plan view of an embodiment of the second elastic connection of the device 5A ,

5G is a detailed view of the embodiment of the second elastic connection 5F ,

5H is a bottom view of an alternative embodiment of the mass of the device 5A ,

5J is a bottom view of an alternative embodiment of the mass of the device 5A ,

5K is a plan view of an alternative embodiment of the connection point of the device 5A ,

5L is a plan view of an alternative embodiment of the connection point of the device 5A ,

5 M is a plan view of an alternative embodiment of the connection point of the device 5A ,

5N is a plan view of an alternative embodiment of the connection point of the device 5A ,

5P is a plan view of an alternative embodiment of the connection point of the device 5A ,

5Q is a plan view of an alternative embodiment of the connection point of the device 5A ,

5R is a plan view of an alternative embodiment of the connection point of the device 5A ,

5S is a plan view of an alternative embodiment of the connection point of the device 5A ,

5T Figure 10 is a plan view of an alternative embodiment of the first elastic connection of the device 5A ,

5U is a detailed view of the alternative embodiment of the first elastic connection 5T ,

5V Figure 12 is a plan view of an alternative embodiment of the second elastic connection of the device 5A ,

5W is a detailed view of the alternative embodiment of the second elastic connection 5V ,

5X is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

5Y is a plan view of an embodiment of the sliding bearing of the device 5X ,

5Z is a plan view of an alternative embodiment of the sliding bearing of the device 5X ,

5AA is a plan view of an alternative embodiment of the sliding bearing of the device 5X ,

5BB is a plan view of an alternative embodiment of the sliding bearing of the device 5X ,

6A Figure 11 is a sectional view of an embodiment of a device for resiliently attaching a mass to a package.

6B is a plan view of an embodiment of the device 6A ,

6C is a bottom view of an embodiment of the mass of the device 6A ,

6D is a plan view of an embodiment of the first elastic connection of the device 6A ,

6E is a detailed view of the embodiment of the first elastic connection 6D ,

6F is a plan view of an embodiment of the second elastic connection of the device 6A ,

6G is a detailed view of the embodiment of the second elastic connection 6F ,

6H is a bottom view of an alternative embodiment of the mass of the device 6A ,

6J is a bottom view of an alternative embodiment of the mass of the device 6A ,

6K is a plan view of an alternative embodiment of the connection point of the device 6A ,

6L is a plan view of an alternative embodiment of the connection point of the device 6A ,

6M is a plan view of an alternative embodiment of the connection point of the device 6A ,

6N is a plan view of an alternative embodiment of the connection point of the device 6A ,

6P is a plan view of an alternative embodiment of the connection point of the device 6A ,

6Q is a plan view of an alternative embodiment of the connection point of the device 6A ,

6R is a plan view of an alternative embodiment of the connection point of the device 6A ,

6S is a plan view of an alternative embodiment of the connection point of the device 6A ,

6T Figure 10 is a plan view of an alternative embodiment of the first elastic connection of the device 6A ,

6U is a detailed view of the alternative embodiment of the first elastic connection 6T ,

6V Figure 12 is a plan view of an alternative embodiment of the second elastic connection of the device 6A ,

6W is a detailed view of the alternative embodiment of the second elastic connection 6V ,

6X is a sectional view of an alternative embodiment of a device for resiliently attaching a mass to a package.

6Y is a plan view of an embodiment of the sliding bearing of the device 6X ,

6Z is a plan view of an alternative embodiment of the sliding bearing of the device 6X ,

6AA is a plan view of an alternative embodiment of the sliding bearing of the device 6X ,

6BB is a plan view of an alternative embodiment of the sliding bearing of the device 6X ,

7A is a plan view of an alternative embodiment of the device 1A ,

7B is a sectional view of an alternative embodiment of the device 1A ,

7C is a plan view of an alternative embodiment of the device 1A ,

7D is a sectional view of an alternative embodiment of the device 1A ,

Detailed description the explanatory embodiments

First, with reference to the 1A to 1E Let it be noted that one embodiment of a system 100 for elastically connecting a mass to a pack, preferably a pack 102 , a mass 104 , one or more connection points 106 , one or more elastic compounds 108 and one or more electrical connections 112 having.

The package 102 is preferably with the elastic compounds 108 and the electrical connections 112 connected. The package 102 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 102 a housing for optimally providing a surface mounted component. The package 102 preferably has an upper parallel planar surface 114 and a cavity 116 on. The cavity 116 preferably has a first wall 118 , a second wall 120 , a third wall 122 and a fourth wall 124 on. The first wall 118 and the third wall 122 preferably run almost parallel to each other, and the second wall 120 and the fourth wall 124 preferably run almost parallel to each other. The second wall 120 and the fourth wall 124 preferably also run perpendicular to the first wall 118 and to the third wall 122 , The cavity 116 preferably has a bottom surface 126 on. The package 102 can consist of any number of conventional commercially available housing made of ceramic, metal or plastic. According to a preferred embodiment, the pack consists 102 made of ceramic, to optimally a vacuum seal of the mass 104 within the pack 102 provide.

The crowd 104 is preferably by the elastic compounds 108 elastic on the package 102 attached and electrically by the electrical connections 112 with the pack 102 connected. The crowd 104 preferably has a nearly rectangular cross-sectional shape. According to a preferred embodiment, the mass 104 a micromachined sensor substantially similar to that disclosed in pending US patent US-A-6,871,544.

According to a preferred embodiment, the mass 104 an upper parallel flat surface 128 and a lower parallel planar surface 130 on. The lower parallel ebe ne surface 130 the crowd 104 preferably has a first page 132 , a second page 134 , a third page 136 and a fourth page 138 on. The first page 132 and the third page 136 preferably run almost parallel to each other, and the second side 134 and the fourth page 138 preferably run almost parallel to each other and preferably almost perpendicular to the first side 132 and to the third page 136 , The crowd 104 preferably has a passive area 140 at one end and an active area 146 at the opposite end.

According to a preferred embodiment, the lower parallel planar surface 130 the crowd 104 the connection points 106 on. According to a preferred embodiment, the connection points are located 106 in the passive area 140 the lower parallel flat surface 130 the crowd 104 , The connection points 106 may be at a perpendicular distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 are located at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 are located. According to a preferred embodiment, the connection points are located 106 at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stresses, and are spaced at about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stress. The connection points 106 For example, they can be used for bonding with solder, conductive epoxy, non-conductive epoxy or glass frit. According to a preferred embodiment, the connection points 106 used for solder bonding to provide optimum manufacturability. According to a preferred embodiment, the contact surface of the connection points 106 maximizes the shock tolerance of the mass 104 to optimize. According to a preferred embodiment, the connection points 106 minimal discontinuities on the distribution of thermal stresses in the mass 104 to optimize. According to several alternative embodiments, there are a plurality of joints 106 To reduce the thermal stress in the mass 104 to optimize. According to a preferred embodiment, there is a single connection point 106a , The connection point 106a preferably has a nearly rectangular cross-sectional shape. The length L _{106a of} the joint 106a For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{106a of} the joint extends 106a from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{106a of} the joint 106a For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{106a of} the joint extends 106a from about 18 to 22 mils to optimally minimize thermal stress. The height H _{106a of} the junction 106a For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106a of} the connection point is sufficient 106a from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 108 fasten the joints 106 preferably elastic on the package 102 , The elastic connections 108 are preferably with the bottom surface 126 of the cavity 116 the pack 102 connected. The elastic connections 108 are solder preforms. According to a preferred embodiment, the elastic compounds 108 an approximately rectangular cross-sectional shape. According to a preferred embodiment, the elastic compounds 108 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 108 , to the Reduction of thermal stresses in the mass 104 to optimize. The elastic connections 108 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 108 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The elastic connections 108 may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 118 of the cavity 116 the pack 102 are located and at a vertical distance of, for example, 5 to 25 mils from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the elastic compounds are located 108 at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a distance of about 7 to 12 mils from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress. According to a preferred embodiment there is a single elastic connection 108 , The length L _{108 of} the elastic connection 108 For example, it can range from about 5.08 to 6.35 mm (200 to 250 mils). According to a preferred embodiment, the length L _{108 of} the elastic connection is sufficient 108 from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{108 of} the elastic connection 108 For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{108 of} the elastic connection is sufficient 108 from about 0.508 to 0.889 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{100 of} the elastic connection 108 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{108 of} the elastic connection is sufficient 108 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the elastic compounds 108 continue one or more first buffers 142 and one or more second buffers 144 for mass sliding bearing 104 on. According to a preferred embodiment, the first buffers are located 142 on one side of the joints 106 and the second buffers 144 on another side of the joints 106 , According to a preferred embodiment, the first buffers are located 142 and the second buffers 144 near the joints 106 , The width W _{142 of} the first buffer 142 for example, can range from about 2 to 6 mils. According to a preferred embodiment, the width W _{142 of} the first buffer is sufficient 142 from about 0.0762 to 0.127 mm (3 to 5 mils) to minimize thermal stress. The width W _{144 of} the second buffer 144 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{144 of} the second buffer is sufficient 144 from about 0.0762 to 0.127 mm (3 to 5 mils) to minimize thermal stress. According to a preferred embodiment, the elastic compounds 108 using conventional soldering equipment and processes with the joints 106 connected. According to a preferred embodiment, the elastic compounds 108 using conventional bottom surface soldering machines and processes 126 of the cavity 116 the pack 102 connected. According to a preferred embodiment, there is a single first buffer 142 and a single second buffer 144 ,

The electrical connections 112 connect the crowd 104 preferably electrically with the package 102 , According to a preferred embodiment, there is a single electrical connection 112 , The electrical connection 112 connects the upper parallel plane surface 114 the pack 102 preferably electrically with the upper parallel planar surface 128 the crowd 104 , According to a preferred embodiment, the electrical connection 112 a wire connection. The electrical connection 112 may be any of a number of conventional commercially available wire bonds, for example of the aluminum or gold type. According to a preferred embodiment, the electrical connection exists 112 made of gold, for optimal compatibility with the pack 102 and the metallization of the mass 104 provide. According to a preferred embodiment, the electrical connection 112 using conventional wire bonding equipment and processes with the package 102 connected. According to a preferred embodiment, the electrical connection 112 using conventional wire bonding equipment and processes with the earth 104 connected.

In 1F are according to an alternative embodiment, a first connection point 148a and a second connection point 148b provided whose size is substantially equal and which are horizontally close to each other. The connection points 148a and 148b For example, they can be used for bonding with solder, conductive epoxy, non-conductive epoxy or glass frit. According to a preferred embodiment, the connection points 148a and 148b used for solder bonding to provide optimum manufacturability. The connection points 148a and 148b preferably have an almost rectangular cross-sectional shape. The length L _{148 of} the joints 148a and 148b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{148 of} the joints extends 148a and 148b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stresses. The width W _{148 of} the joints 148a and 148b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{148 of} the connection points is sufficient 148a and 148b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{148 of} the joints 148a and 148b For example, it can range from about 0.1 to 1 μm. According to a preferred embodiment, the height H _{148 of} the connection points is sufficient 148a and 148b from about 0.24 to 0.72 μm to optimally minimize thermal stresses.

The first connection point 148a is preferably in the passive range 140 the lower parallel flat surface 130 the crowd 104 , The first connection point 148a may be at a vertical distance of about 0.127 to 0.635 mm (5 to 25 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 are located at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 are located. The first connection point 148a is preferably located at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stress.

The second connection point 148b is preferably in the passive range 140 the lower parallel flat surface 130 the crowd 104 , The second connection point 148b may be at a perpendicular distance of about 0.381 to 1.143 mm (15 to 45 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 are located at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 are located. The second connection point 148b is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the first side 132 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 134 the lower parallel flat surface 130 the crowd 104 to optimally minimize thermal stress.

Regarding 1G It should be noted that according to an alternative embodiment, it is a single connection point 106b gives. The connection point 106b may have a nearly oval cross-sectional shape. The connection point 106b may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 106b an approximate cross-sectional area of about 192.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the junction 106b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the connection point extends 106b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1H It should be noted that according to an alternative embodiment, a connection point 106c and a connection point 106d available. The connection points 106c and 106d have substantially the same size, are vertically close together and have a nearly oval cross-sectional shape. The connection points 106c and 106d may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 106c and 106d an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the joints 106c and 106d For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the joints extends 106c and 106d from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1y It should be noted that according to an alternative embodiment, a single connection point 106e is present. The connection point 106e has a nearly tri-oval cross-sectional shape. The connection point 106e may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters).

According to a preferred embodiment, the connection point 106e an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally provide minimal thermal stresses. The height H _{106 of} the junction 106e can at For example, range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the connection point extends 106e from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1K It should be noted that according to an alternative embodiment, a single connection point 106f is present. The connection point 106f can have a nearly oct-oval cross-sectional shape. The connection point 106f may have an approximate cross-sectional area of about 4,000 to 8,750 square millimeters. According to a preferred embodiment, the connection point 106f an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the junction 106f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the connection point extends 106f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1L It should be noted that according to an alternative embodiment, a connection point 106g and a connection point 106h available. The connection points 106g and 106h have substantially the same size, are vertically close together and have a nearly rectangular cross-sectional shape. The connection points 106g and 106h may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 106g and 106h an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the joints 106g and 106h For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the joints extends 106g and 106h from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1M It should be noted that according to an alternative embodiment, a connection point 106i , a junction 106j and a connection point 106k available. The connection points 106i . 106j and 106k have substantially the same size, are vertically close together and have a nearly rectangular cross-sectional shape. The connection points 106i . 106j and 106k may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 106i . 106j and 106k an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the joints 106i . 106j and 106k For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the joints extends 106i . 106j and 106k from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1N It should be noted that according to an alternative embodiment, a single connection point 106l is present. The connection point 106l may have a nearly wave-side rectangular cross-sectional shape. The connection point 106l may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 106l an approximate cross-sectional area of approximately 5625 to 7050 square millimeters to optimally minimize thermal stress. The height H _{106 of} the junction 106l For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the connection point extends 106l from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 1P It should be noted that according to an alternative embodiment, a connection point 106m and a connection point 106n available. The connection points 106m and 106n lie horizontally close to each other and have a nearly rectangular cross-sectional shape. The connection point 106m is slightly smaller than the junction 106n , The connection points 106m and 106n may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 106m and 106n an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{106 of} the joints 106m and 106n For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{106 of} the joints extends 106m and 106n from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 1Q and 1R It should be noted that according to an alternative embodiment, a first elastic connection 150a and a second elastic connection 150b available. The elastic connections 150a and 150b are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 150a and 150b are close to each other vertically and are essentially the same size. The elastic connections 150a and 150b may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 150a and 150b a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{150 of} the elastic connections 150a and 150b for example, can range from about 90 to 120 mils. According to a preferred embodiment, the length L _{150 of} the elastic connections is sufficient 150a and 150b from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{150 of} the elastic connections 150a and 150b can range for example from about 20 to 35 mils. According to a preferred embodiment, the width W _{150 of} the elastic connections is sufficient 150a and 150b from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{150 of} the elastic connections 150a and 150b For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{150 of} the elastic connections is sufficient 150a and 150b from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 150a and 150b using conventional bottom surface soldering machines and processes 126 of the cavity 116 the pack 102 connected.

The first elastic connection 150a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the first elastic connection is located 150a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

The second elastic connection 150b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 2.657 to 3.683 mm (105 to 145 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the second elastic connection is located 150b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a distance of about 112 to 127 mils from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

According to a preferred embodiment, the elastic compounds 150a and 150b continue one or more first buffers 152 for mass sliding bearing 104 on. According to a preferred embodiment, the first buffers are located 152 on one side of the joints 106 , According to a preferred embodiment, the first buffers are located 152 near the joints 106 , The width W _{152 of} the first buffer 152 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{152 of} the first buffer is sufficient 152 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the elastic compounds 150a and 150b continue one or more second buffers 154 for mass sliding bearing 104 on. According to a preferred embodiment, the second buffers are located 154 on another side of the joints 106 opposite to the buffers 152 , According to a preferred embodiment, the second buffers are located 154 near the joints 106 , The width W _{154 of} the second buffer 154 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{154 of} the second buffer is sufficient 154 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

With reference to the 1S to 1W be noted that the system 100 one or more plain bearings 110e . 110f . 110g or 110h for mass sliding bearing 104 having. The number of plain bearings 110e . 110f . 110g or 110h depends preferably on whether a sufficient number of plain bearings 110e . 110f . 110g or 110h to the mass 104 to store optimally sliding, is present. The plain bearings 110e . 110f . 110g or 110h are preferably with the lower surface 126 of the cavity 116 the pack 102 connected.

The plain bearings 110e may have a nearly square cross-sectional shape. The plain bearings 110f can have a nearly rectangular cross-sectional shape. The plain bearings 110g can a na have a triangular cross-sectional shape. The plain bearings 110h can have a nearly circular cross-sectional shape. The plain bearings 110e . 110f . 110g or 110h may have an individual approximate cross-sectional area of about 400 to 1600 square millimeters. According to a preferred embodiment, the plain bearings 110e . 110f . 110g or 110h an individual approximate cross-sectional area of about 15.875 to 31.115 mm ² (625 to 1225 square millimeters) to optimally minimize thermal stresses. The height H _{110 of} the plain bearings 110e . 110f . 110g or 110h For example, it may range from about 0.0127 to 0.0762 mm (0.5 to 3 mils). According to a preferred embodiment, the height H _{110 of} the sliding bearing extends 110e . 110f . 110g or 110h from about 0.0254 to 0.0381 mm (1 to 1.5 mils) to optimally minimize thermal stress.

The plain bearings 110e . 110f . 110g or 110h may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 110e . 110f . 110g or 110h tungsten to optimally provide a standard packing procedure. According to a preferred embodiment, the plain bearings 110e . 110f . 110g or 110h using conventional means for integrating the sliding bearings 110 in the pack 102 with the bottom surface 126 of the cavity 116 the pack 102 connected.

According to a preferred embodiment, there is a first sliding bearing 110ea , a second sliding bearing 110EB , a third plain bearing 110EC and a fourth sliding bearing 110ed , According to a preferred embodiment, the plain bearings 110ea . 110EB . 110EC and 110ed a nearly qua dratische cross-sectional shape. The first plain bearing 110ea may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the first sliding bearing is located 110ea at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

The second plain bearing 110EB may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the second sliding bearing is located 110EB at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

The third plain bearing 110EC may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the third sliding bearing is located 110EC at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

The fourth plain bearing 110ed may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 118 of the cavity 116 the pack 102 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 120 of the cavity 116 the pack 102 are located. According to a preferred embodiment, the fourth sliding bearing is located 110ed at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 118 of the cavity 116 the pack 102 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 120 of the cavity 116 the pack 102 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 108 also the mass 104 electrically with the pack 102 connect.

According to an alternative embodiment, the elastic compounds 150a and 150b also the mass 104 electrically with the pack 102 connect.

With reference to the 2A to 2E Let it be noted that one embodiment of a system 200 for elastically connecting a mass to a pack, preferably a pack 202 , a mass 204 , one or more connection points 206 , one or more elastic compounds 208 and one or more electrical connections 212 having.

The package 202 is preferably with the elastic compounds 208 and the electrical connections 212 connected. The package 202 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 202 a housing to optimally provide a surface mounted component. The package 202 preferably has a first parallel planar surface 214 , a second parallel flat surface 216 and a cavity 218 on. The cavity 218 preferably has a first wall 220 , a second wall 222 , a third wall 224 and a fourth wall 226 on. The first wall 220 and the third wall 224 preferably run almost parallel to each other, and the second wall 222 and the fourth wall 226 preferably run almost parallel to each other. The second wall 222 and the fourth wall 226 preferably also run perpendicular to the first wall 220 and to the third wall 224 , The cavity 218 preferably has a bottom surface 228 on. The package 202 can consist of any number of conventional commercially available housing made of ceramic, metal or plastic. According to a preferred embodiment, the pack consists 202 made of ceramic, around a vacuum seal of the mass 204 in the pack 202 to provide optimal.

The crowd 204 is preferably by the elastic compounds 208 elastic on the package 202 attached and through the electrical connections 212 electrically with the pack 202 connected. The crowd 204 preferably has a nearly rectangular cross-sectional shape. The crowd 204 preferably has a passive area 250 at one end and an active area 256 at the opposite end. According to a preferred embodiment, the mass 204 a first element 230 , a second element 232 and a third element 234 on. The first element 230 is preferably located on the second element 232 , and the second element 232 is preferably on the third element 234 , According to a preferred embodiment, the first element 230 , the second element 232 and the third element 234 a micromachined sensor as essentially disclosed in pending US patent US-A-6,871,544. The first element 230 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the first element has an upper parallel planar surface 236 on. The second element 232 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the second element 232 a middle parallel flat surface 238 on. The third element 234 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the third element 234 a lower parallel flat surface 240 on. The lower parallel flat surface 240 the crowd 204 preferably has a first page 242 , a second page 244 , a third page 246 and a fourth page 248 on. The first page 242 and the third page 246 are preferably nearly parallel to each other, and the second side 244 and the fourth page 248 are preferably nearly parallel to each other and preferably nearly perpendicular to the first side 242 and to the third page 246 ,

According to a preferred embodiment, the lower parallel planar surface 240 the crowd 204 the connection points 206 on. According to a preferred embodiment, the connection points are located 206 in the passive area 250 the lower parallel flat surface 240 the crowd 204 , The connection points 206 may be at a perpendicular distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first side 242 the lower parallel flat surface 240 the crowd 204 are located at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the second side 244 the lower parallel flat surface 240 the crowd 204 are located. According to a preferred embodiment, the connection points are located 206 at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 242 the lower parallel flat surface 240 the crowd 204 to optimally minimize thermal stresses, and are spaced at about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 244 the lower parallel flat surface 240 the crowd 204 to optimally minimize thermal stress. The connection points 206 For example, they may be used for bonding to solder, glass frit, conductive epoxy, or non-conductive epoxy. According to a preferred embodiment, the connection points 206 used for solder bonding to provide optimum manufacturability. According to a preferred embodiment, the contact surface of the connection points 206 maximizes the shock tolerance of the mass 204 to optimize. According to a preferred embodiment, the connection points 206 minimal discontinuities on the distribution of thermal stresses in the mass 204 to optimize. According to several alternative embodiments, there are a plurality of joints 206 To reduce the thermal stress in the mass 204 to optimize. According to a preferred embodiment, there is a single connection point 206a , The connection point 206a preferably has a nearly rectangular cross-sectional shape. The length L _{206a of} the joint 206a For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{206a of} the connection point is sufficient 206a from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{206a of} the joint 206a For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{206a of} the joint extends 206a from about 0.4572 to 0.5588 mm (18 to 22 mils) to optimally minimize thermal stress. The height H _{206a of} the junction 206a For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206a of} the joint extends 206a from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 208 fasten the joints 206 preferably elastic on the package 202 , The elastic connections 208 are preferably with the bottom surface 228 of the cavity 218 the pack 202 connected. The elastic connections 208 are solder preforms. According to a preferred embodiment, the elastic compounds 208 an approximately rectangular cross-sectional shape. According to a preferred embodiment, the elastic compounds 208 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 208 To reduce the thermal stress in the mass 204 to optimize. The elastic connections 208 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 208 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The elastic connections 208 may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 220 of the cavity 218 the pack 202 are located at a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the elastic compounds are located 208 at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress. According to a preferred embodiment there is a single elastic connection 208 , The length L _{208 of} the elastic connection 208 For example, it can range from about 5.08 to 6.35 mm (200 to 250 mils). According to a preferred embodiment, the length L _{208 of} the elastic connection is sufficient 208 from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{208 of} the elastic connection 208 For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{208 of} the elastic connection is sufficient 208 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{208 of} the elastic connection 208 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{208 of} the elastic connection is sufficient 208 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the elastic compounds 208 continue one or more first buffers 252 and one or more second buffers 254 for mass sliding bearing 204 on. According to a preferred embodiment, the first buffers are located 252 on one side of the joints 206 and the second buffers 254 on another side of the joints 206 , According to a preferred embodiment, the first buffers are located 252 and the second buffers 254 near the joints 206 , The width W _{252 of} the first buffers 252 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{252 of} the first buffers is sufficient 252 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. The width W _{254 of} the second buffer 254 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{254 of} the second buffer is sufficient 254 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 208 using conventional soldering equipment and processes with the joints 206 connected. According to a preferred embodiment, the elastic compounds 208 using conventional bottom surface soldering machines and processes 228 of the cavity 218 the pack 202 connected. According to a preferred embodiment, there is a single first buffer 252 and a single second buffer 254 ,

The electrical connections 212 connect the crowd 204 preferably electrically with the package 202 , According to a preferred embodiment, the electrical connections 212 Wire connections. The electrical connections 212 may be any of a number of conventional commercially available wire bonds, for example of the gold or aluminum type. According to a preferred embodiment, the electrical connections exist 212 made of gold, for optimal compatibility with the pack 202 and the metallization of the mass 204 provide. According to a preferred embodiment, there is a first electrical connection 212a and a second electrical connection 212b , The first electrical connection 212a connects the first parallel plane surface 214 the pack 202 preferably electrically with the upper parallel planar surface 236 the crowd 204 , The second electrical connection 212b connects the second parallel plane surface 216 the pack 202 preferably electrically with the middle parallel flat surface 238 the crowd 204 , According to a preferred embodiment, the electrical connections 212 using conventional wire bonding equipment and processes with the package 202 connected. According to a preferred embodiment, the electrical connections 212 using conventional wire bonding equipment and processes with the earth 204 connected.

In 2F are in accordance with an alternative embodiment, a connection point 258a and a connection point 258b provided whose size is substantially equal and which are horizontally close to each other. The connection points 258a and 258b For example, they can be used for bonding with solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the connection points 258a and 258b used for solder bonding to provide optimum manufacturability. The connection points 258a and 258b preferably have a nearly rectangular cross-sectional shape. The length L _{258 of} the joints 258a and 258b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{258 of} the connection points is sufficient 258a and 258b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{258 of} the joints 258a and 258b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{258 of} the connection points is sufficient 258a and 258b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{258 of} the joints 258a and 258b For example, it may range from about 0.00254 to 0.0254 mm (0.1 to 1 mil). According to a preferred embodiment, the height H _{258 of} the connection points is sufficient 258a and 258b from about 0.006096 to 0.018288 mm (0.24 to 0.72 mils) to optimally minimize thermal stress.

The first connection point 258a is preferably in the passive range 250 the lower parallel flat surface 240 the crowd 204 , The first connection point 258a can be at a vertical distance of about 5 to 25 mils from the first page 242 the lower parallel flat surface 240 the crowd 204 are located at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 244 the lower parallel flat surface 240 the crowd 204 are located. The first connection point 258a is preferably located at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 242 the lower parallel flat surface 240 the crowd 204 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 244 of the lower parallel planar surface 240 mass 204 to optimally minimize thermal stress.

The second connection point 258b is preferably in the passive range 250 the lower parallel flat surface 240 the crowd 204 , The second connection point 258b may be at a perpendicular distance of about 0.381 to 1.143 mm (15 to 45 mils) from the first side 242 the lower parallel flat surface 240 the crowd 204 are located at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 244 the lower parallel flat surface 240 the crowd 204 are located. The second connection point 258b is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the first side 242 the lower parallel flat surface 240 the crowd 204 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 244 the lower parallel flat surface 240 the crowd 204 to optimally minimize thermal stress.

Regarding 2G It should be noted that according to an alternative embodiment, it is a single connection point 206b gives. The connection point 206b may have a nearly oval cross-sectional shape. The connection point 206b may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 206b an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stress. The height H _{206 of} the junction 206b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joint extends 206b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2H It should be noted that according to an alternative embodiment, a first connection point 206c and a second connection point 206d available. The connection points 206c and 206d have substantially the same size, are vertically close together and have a nearly oval cross-sectional shape. The connection points 206c and 206d may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 206c and 206d an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the joints 206c and 206d For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joints extends 206c and 206d from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2J It should be noted that according to an alternative embodiment, a single connection point 206e is present. The connection point 206e has a nearly tri-oval cross-sectional shape. The connection point 206e may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 206e an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the junction 206e For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joint extends 206e from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2K It should be noted that according to an alternative embodiment, a single connection point 206f is present. The connection point 206f can have a nearly oct-oval cross-sectional shape. The connection point 206f may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 206f an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the junction 206f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joint extends 206f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2L It should be noted that according to an alternative embodiment, a connection point 206g and a connection point 206h available. The connection points 206g and 206h have substantially the same size, are vertically close together and have a nearly rectangular cross-sectional shape. The connection points 206g and 206h may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 206g and 206h an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the joints 206g and 206h For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joints extends 206g and 206h from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2M It should be noted that according to an alternative embodiment, a connection point 206i , a junction 206j and a connection point 206k available. The connection points 206i . 206j and 206k have substantially the same size, are vertically close together and have a nearly rectangular cross-sectional shape. The connection points 206i . 206j and 206k may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 206i . 206j and 206k an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the joints 206i . 206j and 206k For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joints extends 206i . 206j and 206k from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2N It should be noted that according to an alternative embodiment, a single connection point 206l is present. The connection point 206l may have a nearly wave-side rectangular cross-sectional shape. The connection point 206l can have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4000 to 8750 square millizoll). According to a preferred embodiment, the connection point 206l an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the junction 206l For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joint extends 206l from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 2P It should be noted that according to an alternative embodiment, a connection point 206m and a connection point 206n available. The connection points 206m and 206n lie horizontally close to each other and have a nearly rectangular cross-sectional shape. The connection point 206m is slightly smaller than the junction 206n , The connection points 206m and 206n may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 206m and 206n an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{206 of} the joints 206m and 206n For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{206 of} the joints extends 206m and 206n from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 2Q and 2R It should be noted that according to an alternative embodiment, a first elastic connection 260a and a second elastic connection 260b available. The elastic connections 260a and 260b are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 260a and 260b are close to each other vertically and are essentially the same size. The ela stischen connections 260a and 260b may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 260a and 260b a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{260 of} the elastic connections 260a and 260b For example, it may range from about 2.286 to 3.048 mm (90 to 120 mils). According to a preferred embodiment, the length L _{260 of} the elastic connections is sufficient 260a and 260b from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{260 of} the elastic connections 260a and 260b For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{260 of} the elastic connections 260a and 260b from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{260 of} the elastic connections 260a and 260b For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{260 of} the elastic connections 260a and 260b from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 260a and 260b using conventional bottom surface soldering machines and processes 228 of the cavity 218 the pack 202 connected. According to a preferred embodiment, the elastic compounds 260a and 260b using conventional soldering equipment and processes with the joints 206 connected.

The first elastic connection 260a may be at a vertical distance of, for example, about 5 to 25 mils from the first wall 220 of the cavity 218 the pack 202 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the first elastic connection is located 260a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress.

The second elastic connection 260b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 220 of the cavity 218 the pack 202 and at a perpendicular distance of, for example, about 105 to 145 mils from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the second elastic connection is located 260b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a distance of about 2.8448 to 3.2258 mm (112 to 127 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress.

According to a preferred embodiment, the elastic compounds 260a and 260b continue one or more first buffers 262 for mass sliding bearing 204 on. According to a preferred embodiment, the first buffers are located 262 on one side of the joints 206 , According to a preferred embodiment, the first buffers are located 262 near the joints 206 , The width W _{262 of} the first buffers 262 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{262 of} the first buffers is sufficient 262 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. According to a preferred embodiment, there is a single first buffer 262 available.

According to a preferred embodiment, the elastic compounds 260a and 260b continue one or more second buffers 264 for mass sliding bearing 204 on. According to a preferred embodiment, the second buffers are located 264 on another side of the joints 206 opposite to the first buffers 262 , According to a preferred embodiment, the second buffers are located 264 near the joints 206 , The width W _{264 of} the second buffer 264 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{264 of} the second buffer is sufficient 264 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. In a preferred embodiment, there is a single second buffer 264 ,

With reference to the 2S to 2W be noted that the system 200 one or more plain bearings 210e . 210f . 210g or 210h having. The plain bearings 210e . 210f . 210g or 210h store the crowd 204 sliding. The number of plain bearings 210e . 210f . 210g or 210h depends preferably on whether a sufficient number of plain bearings to the mass 204 to store optimally sliding, is present. The plain bearings 210e . 210f . 210g or 210h are preferably with the lower surface 228 of the cavity 218 the pack 202 connected. The plain bearings 210e may have a nearly square cross-sectional shape. The plain bearings 210f can have a nearly rectangular cross-sectional shape. The plain bearings 210g may have a nearly triangular cross-sectional shape. The plain bearings 210h may have a nearly circular cross-sectional shape. The plain bearings 210e . 210f . 210g or 210h may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 210e . 210f . 210g or 210h tungsten to optimally provide a standard packaging process. According to a preferred embodiment, the plain bearings 210e . 210f . 210g or 210h using conventional means for integrating the sliding bearings 210e . 210f . 210g or 210h in the pack 202 with the bottom surface 228 of the cavity 218 the pack 202 connected.

The plain bearings 210e . 210f . 210g or 210h individually may have an approximate cross-sectional area of about 10.16 to 40.64 mm ² (400 to 1600 square mils). According to a preferred embodiment, the plain bearings 210e . 210f . 210g or 210h individually approximate cross-sectional area of about 15.875 to 31.115 mm ² (625 to 1225 square mils) to optimally minimize thermal stresses. The height H _{210 of} the plain bearings 210e . 210f . 210g or 210h For example, it may range from about 0.0127 to 0.0762 mm (0.5 to 3 mils). According to a preferred embodiment, the height H _{210 of} the sliding bearing extends 210e . 210f . 210g or 210h from about 0.0254 to 0.0381 mm (1 to 1.5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, there is a first sliding bearing 210ea , a second sliding bearing 210eb , a third plain bearing 210ec and a fourth sliding bearing 210ed , The first plain bearing 210ea may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 220 of the cavity 218 the pack 202 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the first sliding bearing is located 210ea at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress.

The second plain bearing 210eb may be at a vertical distance of, for example, about 45 to 75 mils from the first wall 220 of the cavity 218 the pack 202 and at a vertical distance of, for example, about 15 to 30 mils from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the second sliding bearing is located 210eb at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the two th wall 222 of the cavity 218 the pack 102 to optimally minimize thermal stress.

The third plain bearing 210ec may be at a vertical distance of, for example, about 85 to 115 mils from the first wall 220 of the cavity 218 the pack 202 and at a vertical distance of, for example, about 15 to 30 mils from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the third sliding bearing is located 210ec at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress.

The fourth plain bearing 210ed may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 220 of the cavity 218 the pack 202 and at a vertical distance of, for example, about 85 to 115 mils from the second wall 222 of the cavity 218 the pack 202 are located. According to a preferred embodiment, the fourth sliding bearing is located 210ed at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 220 of the cavity 218 the pack 202 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 222 of the cavity 218 the pack 202 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 208 also the mass 204 electrically with the pack 202 connect.

According to an alternative embodiment, the elastic compounds 260a and 260b also the mass 204 electrically with the pack 202 connect.

With reference to the 3A to 3E Let it be noted that one embodiment of a system 300 for elastically connecting a mass to a pack, preferably a pack 302 , a mass 304 , one or more connection points 306 , one or more elastic compounds 308 and one or more electrical connections 310 having.

The package 302 is with the elastic connections 308 and the electrical connections 310 connected. The package 302 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 302 a housing to optimally provide a surface mounted component. The package 302 preferably has an upper parallel planar surface 312 and a cavity 314 on. The cavity 314 preferably has a first wall 316 , a second wall 318 , a third wall 320 and a fourth wall 322 on. The first wall 316 and the third wall 320 preferably run almost parallel to each other, and the second wall 318 and the fourth wall 322 preferably run almost parallel to each other. The second wall 318 and the fourth wall 322 preferably also run perpendicular to the first wall 316 and to the third wall 320 , The cavity 314 preferably has a bottom surface 324 on. The package 302 can be made of any number of conventional commercially available housing, for example, ceramic, metal or plastic. According to a preferred embodiment, the pack consists 302 made of ceramic, to optimally a vacuum seal of the mass 304 within the pack 302 provide.

The crowd 304 is preferably by the elastic compounds 308 elastic on the package 302 attached and electrically by the electrical connections 310 with the pack 302 connected. The crowd 304 preferably has a nearly rectangular cross-sectional shape. The crowd 304 preferably has all active areas. According to a preferred embodiment, the mass 304 a micromachined sensor substantially similar to that disclosed in pending US patent US-A-6,871,544.

According to a preferred embodiment, the mass 304 an upper parallel flat surface 338 and a lower parallel planar surface 340 on. The lower parallel flat surface 340 the crowd 304 preferably has a first page 342 , a second page 344 , a third page 346 and a fourth page 348 on. The first page 342 and the third page 346 are preferably nearly parallel to each other, and the second side 344 and the fourth page 348 are preferably nearly parallel to each other and preferably nearly perpendicular to the first side 342 and to the third page 346 ,

According to a preferred embodiment, the lower parallel planar surface 340 the crowd 304 the connection points 306 on. According to a preferred embodiment, the connection points are located 306 essentially in the middle of the lower parallel flat surface 340 the crowd 304 , The connection points 306 can be at a vertical distance, for example, from about 80 to 100 mils from the first page 342 the lower parallel flat surface 340 the crowd 304 are located and at a vertical distance, at For example, from about 2.032 to 2.54 mm (80 to 100 mils) from the second side 344 the lower parallel flat surface 340 the crowd 304 are located. According to a preferred embodiment, the connection points are located 306 at a vertical distance of about 85 to 95 mils from the first side 342 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stresses, and are spaced at about 2.159 to 2.413 mm (85 to 95 mils) from the second side 344 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stress. The connection points 306 For example, they may be used for bonding to solder, glass frit, conductive epoxy, or non-conductive epoxy. According to a preferred embodiment, the connection points 306 used for solder bonding to provide optimum manufacturability. According to a preferred embodiment, the contact surface of the connection points 306 maximizes the shock tolerance of the mass 304 to optimize. According to a preferred embodiment, the connection points 306 minimal discontinuities on the distribution of thermal stresses in the mass 304 to optimize. According to several alternative embodiments, there are a plurality of joints 306 To reduce the thermal stress in the mass 304 to optimize. According to a preferred embodiment, there is a single connection point 306a , The connection point 306a preferably has a nearly circular cross-sectional shape. The diameter D _{306a of} the joint 306a for example, can range from about 50 to 100 mils. According to a preferred embodiment, the diameter D _{306a of} the connection point is sufficient 306a from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306a of} the junction 306 For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{306a of} the connection point is sufficient 306 from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 308 fasten the joints 306 preferably elastic on the package 302 , The elastic connections 308 are preferably with the bottom surface 324 of the cavity 314 connected. The elastic connections 308 are solder preforms. According to a preferred embodiment, the elastic compounds 308 an approximately circular cross-sectional shape. According to a preferred embodiment, the elastic compounds 308 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 308 To reduce the thermal stress in the mass 304 to optimize. The elastic connections 308 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 308 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The elastic connections 308 may be at a vertical distance, for example, from about 2.032 to 2.54 mm (80 to 100 mils) from the first wall 316 of the hollow space 314 the pack 302 are located at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the elastic compounds are located 308 at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a distance of about 2.159 to 2.413 mm (85 to 95 mils) from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress. According to a preferred embodiment there is a single elastic connection 308 , The diameter D _{308 of} the elastic connection 308 For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the diameter D _{308 of} the elastic connection is sufficient 308 from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{308 of} the elastic connection 308 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{308 of} the elastic connection is sufficient 308 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the elastic connection 308 continue one or more buffers 350 for mass sliding bearing 304 on. According to a preferred embodiment, there is a single buffer 350 , According to a preferred embodiment, the buffer 350 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer surrounds 350 the connection points 306 , According to a preferred embodiment, the buffer is located 350 near the joints 306 , The width W _{350 of} the buffer 350 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{350 of} the buffer is sufficient 350 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. According to a Favor th embodiment, the elastic compounds 308 using conventional soldering equipment and processes with the joint 306 connected. According to a preferred embodiment, the elastic compounds 308 using conventional bottom surface soldering machines and processes 324 of the cavity 314 the pack 302 connected.

The electrical connections 310 connect the crowd 304 preferably electrically with the package 302 , According to a preferred embodiment, there is a single electrical connection 310 , The electrical connection 310 connects the upper parallel plane surface 312 the pack 302 preferably electrically with the upper parallel planar surface 338 the crowd 304 , According to a preferred embodiment, the electrical connection 310 a wire connection. The electrical connection 310 may be any of a number of conventional commercially available wire bonds, for example of the gold or aluminum type. According to a preferred embodiment, the electrical connection exists 310 made of gold, for optimal compatibility with the pack 302 and the metallization of the mass 304 provide. According to a preferred embodiment, the electrical connection 310 using conventional wire bonding equipment and processes with the package 302 connected. According to a preferred embodiment, the electrical connection 310 using conventional wire bonding equipment and processes with the earth 304 connected.

Regarding 3F It should be noted that according to an alternative embodiment, the bottom surface 324 the pack 302 further a recess 326 for receiving the elastic connection 308 having. The depression 326 can be circular or square. The depression 326 preferably has a first wall 328 , a second wall 330 , a third wall 332 and a fourth wall 334 on. The first wall 328 and the third wall 332 preferably run almost parallel to each other, and the second wall 330 and the fourth wall 334 preferably run almost parallel to each other. The second wall 330 and the fourth wall 334 preferably also run perpendicular to the first wall 328 and to the third wall 332 , The depression 326 preferably has a bottom surface 336 on. The length L _{326 of} the recess 326 For example, it may range from about 2,794 to 3,302 mm (110 to 130 mils). According to a preferred embodiment, the length L _{326 of} the recess is sufficient 326 from about 2.921 to 3.175 mm (115 to 125 mils) to optimally minimize thermal stresses. The width W _{326 of} the recess 326 For example, it may range from about 2,794 to 3,302 mm (110 to 130 mils). According to a preferred embodiment, the width W _{326 of} the recess is sufficient 326 from about 2.921 to 3.175 mm (115 to 125 mils) to optimally minimize thermal stresses. The height H _{326 of} the recess 326 For example, it may range from about 0.0254 to 0.0508 mm (1 to 2 mils). According to a preferred embodiment, the height H _{326 of} the depression is sufficient 326 from about 0.03175 to 0.04445 mm (1.25 to 1.75 mils) to optimally minimize thermal stresses. According to a preferred embodiment, the depression is located 326 essentially in the middle of the floor area 324 the pack 302 , The first wall 328 the depression 326 may be at a vertical distance of, for example, 2.032 to 2.54 mm (80 to 100 mils) from the first wall 316 of the cavity 314 are located. According to a preferred embodiment, the first wall is located 328 the depression 326 at a vertical distance of 2.159 to 2.413 mm (85 to 95 mils) from the first wall 316 of the cavity 314 to optimally minimize thermal stress. The second wall 330 the depression 326 may be at a perpendicular distance of, for example, 2.032 to 2.54 mm (80 to 100 mils) from the second wall 318 of the cavity 314 are located. According to a preferred embodiment, the second wall is located 330 the depression 326 at a vertical distance of 2.159 to 2.413 mm (85 to 95 mils) from the second wall 318 of the cavity 314 to optimally minimize thermal stress.

According to a preferred embodiment, the elastic connection is located 308 in the depression 326 , The elastic connection 308 may be at a perpendicular distance of, for example, about 0,0508 to 0,1778 mm (2 to 7 mils) from the first wall 328 the depression 326 of the cavity 314 the pack 302 and at a vertical distance of, for example, about 0,0508 to 0,1778 mm (2 to 7 mils) from the second wall 330 the depression 326 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the elastic connection is located 308 at a vertical distance of about 0.0762 to 0.127 mm (3 to 5 mils) from the first wall 328 the depression 326 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a distance of about 0.0762 to 0.127 mm (3 to 5 mils) from the second wall 330 the depression 326 of the cavity 314 the pack 302 to optimally minimize thermal stress. According to a preferred embodiment, the elastic connection 308 using conventional soldering equipment and processes with the floor surface 324 the depression 326 connected.

Regarding 3G It should be noted that according to an alternative embodiment, a first connection point 360a and a second verbin binding site 360b present, which are substantially the same size and are vertically close to each other. The connection points 360a and 360b For example, they can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the connection points 360a and 360b used for solder bonding to provide optimum manufacturability. The connection points 360a and 360b preferably have a nearly circular cross-sectional shape. The total diameter D _{360 of} the joints 360a and 360b For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{360 of} the connection points is sufficient 360a and 360b from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{360 of} the joints 360a and 360b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{360 of} the connection points extends 360a and 360b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The first connection point 360a is preferably located substantially in the middle of the lower parallel planar surface 340 the crowd 304 , The first connection point 360a may be at a perpendicular distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first side 342 of the lower parallel planar surface 340 the crowd 304 and at a perpendicular distance of, for example, about 1.016 to 1.27 mm (40 to 50 mils) from the second side 344 the lower parallel flat surface 340 the crowd 304 are located. The first connection point 360a is preferably at a vertical distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first side 342 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stresses and at a perpendicular distance of about 43 to 47 mils from the second side 344 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stress.

The second connection point 360b is preferably located substantially in the middle of the lower parallel planar surface 340 the crowd 304 , The second connection 360 may be at a vertical distance of, for example, about 80 to 100 mils from the first page 342 the lower parallel flat surface 340 the crowd 304 are located and at a vertical distance of, for example, about 135 to 165 mils from the second side 344 the lower parallel flat surface 340 the crowd 304 are located. The second connection point 360 is preferably at a vertical distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first side 342 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stresses and at a vertical distance of about 3.6322 to 3.9878 mm (143 to 157 mils) from the second side 344 the lower parallel flat surface 340 the crowd 304 to optimally minimize thermal stress.

Regarding 3H It should be noted that according to an alternative embodiment, a connection point 306 is present. The connection point 306 may have a nearly oct-cake wedge-shaped cross-sectional shape. The total diameter D _{306b of} the joint 306 For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the total diameter D _{306b of} the connection point is sufficient 306 from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306 of} the junction 306 For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{306 of} the connection point is sufficient 306 from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 3J It should be noted that according to an alternative embodiment, a connection point 306c is present. The connection point 306c may have a nearly hollow oct-cake wedge-shaped cross-sectional shape. The total diameter D _{306c of} the joint 306c For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{306c of} the joint extends 306c from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306 of} the junction 306c For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{306 of} the connection point is sufficient 306c from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 3K It should be noted that according to an alternative embodiment, a connection point 306d is present. The connection point 306d has a nearly nine-circular cross-sectional shape. The total diameter D _{306d of} the joint 306d For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{306d of} the joint extends 306d from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306 of} the junction 306d For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment extends the height H _{306 of} the junction 306d from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 3L It should be noted that according to an alternative embodiment, a single connection point 306e is present. The connection point 306e has a nearly star-shaped cross-sectional shape. The total diameter D _{306e of} the joint 306e For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{306e of} the joint extends 306e from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306 of} the junction 306e For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{306 of} the connection point is sufficient 306e from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 3M It should be noted that according to an alternative embodiment, a single connection point 306f is present. The connection point 306f has a nearly sunbeam-shaped cross-sectional shape. The total diameter D _{306f of} the joint 306f For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{306f of} the joint extends 306f from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{306 of} the junction 306f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{306 of} the connection point is sufficient 306f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 3R and 3S It should be noted that according to an alternative embodiment, a first elastic connection 362a and a second elastic connection 362b available. The elastic connections 362a and 362b are solder preforms, which preferably have a nearly circular cross-sectional shape. The elastic connections 362a and 362b are close to each other vertically and are essentially the same size. The elastic connections 362a and 362b may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 362a and 362b a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The total diameter D _{362 of} the elastic compounds 362a and 362b For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{362 of} the elastic connections is sufficient 362a and 362b from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{362 of} the elastic connections 362a and 362b For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{362 of} the elastic connections is sufficient 362a and 362b from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 362a and 362b using conventional bottom surface soldering machines and processes 324 of the cavity 314 the pack 302 connected. According to a preferred embodiment, the elastic compounds 362a and 362b using conventional soldering equipment and processes with the joints 306 connected.

The first elastic connection 362a may be at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first wall 316 of the cavity 314 the pack 302 and at a perpendicular distance of, for example, about 1.016 to 1.27 mm (40 to 50 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the first elastic connection is located 362a at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a distance of about 1.0922 to 1.1938 mm (43 to 47 mils) from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

The first elastic connection 362a also has one or more buffers 364 for mass sliding bearing 304 on. According to a preferred embodiment, there is a single buffer 364 , According to a preferred embodiment, the buffer 364 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer is located 364 near the joints 306 , The width W _{364 of} the buffer 364 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{364 of} the buffer is sufficient 364 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The second elastic connection 362b may be at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first wall 316 of the cavity 314 the PA ckung 302 and at a perpendicular distance of, for example, about 3429 to 4.191 mm (135 to 165 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the second elastic connection is located 362b at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses, and at a distance of about 3.7338 to 3.9878 mm (147 to 157 mils) from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

The second elastic connection 362b also has one or more buffers 366 for mass sliding bearing 304 on. According to a preferred embodiment, there is a single buffer 366 , According to a preferred embodiment, the buffer 366 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer is located 366 near the joints 306 , The width W ₃₅₀ of the buffer 366 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{366 of} the buffer is sufficient 366 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

With reference to the 3T to 3X be noted that the system 300 one or more plain bearings 354a . 354b . 354c or 354d having. The plain bearings 354a . 354b . 354c or 354d store the crowd 304 sliding. The number of plain bearings 354a . 354b . 354c or 354d depends preferably on whether a sufficient number of plain bearings to the mass 304 to store optimally sliding, is present. The plain bearings 354a . 354b . 354c or 354d are preferably with the lower surface 324 of the cavity 314 the pack 302 connected. The plain bearings 354a may have a nearly square cross-sectional shape. The plain bearings 354b can have a nearly rectangular cross-sectional shape. The plain bearings 354c may have a nearly triangular cross-sectional shape. The plain bearings 354d may have a nearly circular cross-sectional shape. The plain bearings 354a . 354b . 354c or 354d may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 354a . 354b . 354c or 354d tungsten to optimally provide a standard packaging process. According to a preferred embodiment, the plain bearings 354 using conventional means for integrating the sliding bearings 310 in the pack 302 with the bottom surface 324 of the cavity 314 the pack 302 connected.

The plain bearings 354a . 354b . 354c or 354d individually may have an approximate cross-sectional area of about 10.16 to 40.64 mm ² (400 to 1600 square mils). According to a preferred embodiment, the plain bearings 354a . 354b . 354c or 354d individually approximate cross-sectional area of about 15.875 to 31.115 mm ² (625 to 1225 square mils) to optimally minimize thermal stresses. The height H _{354 of} the plain bearings 354a . 354b . 354c or 354d For example, it may range from about 0.0127 to 0.0762 mm (0.5 to 3 mils). According to a preferred embodiment, the height H _{354 of} the sliding bearing extends 354a . 354b . 354c or 354d from about 0.0254 to 0.0381 mm (1 to 1.5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, there is a first sliding bearing 354aa , a second sliding bearing 354ab , a third plain bearing 354ac and a fourth sliding bearing 354ad , The first plain bearing 354aa may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 316 of the cavity 314 the pack 302 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the first sliding bearing is located 354aa at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a vertical distance of about 90 to 105 mils from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

The second plain bearing 354ab may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 316 of the cavity 314 the pack 302 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the second sliding bearing is located 354ab at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a vertical distance of about 20 to 25 mils from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

The third plain bearing 354ac may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 316 of the cavity 314 the pack 302 and at a vertical distance of, for example, about 15 to 30 mils from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the third sliding bearing is located 354ac at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 316 of the cavity 314 the pack 302 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

The fourth plain bearing 354ad may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 316 of the cavity 314 the pack 302 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 318 of the cavity 314 the pack 302 are located. According to a preferred embodiment, the fourth sliding bearing is located 354ad at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 316 of the cavity 314 of the package 302 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 318 of the cavity 314 the pack 302 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 308 also the mass 304 electrically with the pack 302 connect.

According to an alternative embodiment, the elastic compounds 362a and 362b also the mass 304 electrically with the pack 302 connect.

With reference to the 4A to 4E Let it be noted that one embodiment of a system 400 for elastic Ver bind a mass with a pack preferably a pack 402 , a mass 404 , one or more connection points 406 , one or more elastic compounds 408 and one or more electrical connections 410 having.

The package 402 is with the elastic connections 408 and the electrical connections 410 connected. The package 402 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 402 a housing to optimally provide a surface mounted component. The package 402 preferably has a first parallel planar surface 412 , a second parallel flat surface 414 and a cavity 416 on. The cavity 416 preferably has a first wall 418 , a second wall 420 , a third wall 422 and a fourth wall 424 on. The first wall 418 and the third wall 422 preferably run almost parallel to each other, and the second wall 420 and the fourth wall 424 preferably run almost parallel to each other. The second wall 422 and the fourth wall 424 preferably also run perpendicular to the first wall 418 and to the third wall 422 , The cavity 416 preferably has a bottom surface 426 on. The package 402 can be made of any number of conventional commercially available housing, for example, ceramic, metal or plastic. According to a preferred embodiment, the pack consists 402 made of ceramic, to optimally a vacuum seal of the mass 404 within the pack 402 provide.

The crowd 404 is preferably by the elastic compounds 408 elastic on the package 402 attached and electrically by the electrical connections 410 connected to the housing. The crowd 404 preferably has a nearly rectangular cross-sectional shape. The crowd 404 preferably has all active areas.

According to a preferred embodiment, the mass 404 a first element 440 , a second element 442 and a third element 444 on. The first element 440 is preferably located on the second element 442 , and the second element 442 is preferably on the third element 444 , According to a preferred embodiment, the first element 440 , the second element 442 and the third element 444 a micromachined sensor as essentially disclosed in pending US patent US-A-6,871,544. The first element 440 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the first element 440 an upper parallel flat surface 446 on. The second element 442 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the second element 442 a middle parallel flat surface 448 on. The third element 444 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the third element 444 a lower parallel flat surface 450 on. The lower parallel flat surface 450 the crowd 404 preferably has a first page 452 , a second page 454 , a third page 456 and a fourth page 458 on. The first page 452 and the third page 456 are preferably nearly parallel to each other, and the second side 454 and the fourth page 458 are preferably nearly parallel to each other and preferably nearly perpendicular to the first side 452 and to the third page 456 ,

According to a preferred embodiment, the lower parallel planar surface 450 the crowd 404 the connection points 406 on. According to a preferred embodiment, the connection points are located 406 essentially in the middle of the lower parallel flat surface 450 the crowd 404 , The connection points 406 may be at a perpendicular distance, for example, from about 2.032 to 2.54 mm (80 to 100 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 are located at a vertical distance, for example, from about 2.032 to 2.54 mm (80 to 100 mils) from the second side 454 the lower parallel flat surface 450 the crowd 404 are located. According to a preferred embodiment, the connection points are located 406 at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 to optimally minimize thermal stresses, and are spaced at about 2.159 to 2.413 mm (85 to 95 mils) from the second side 454 the lower parallel flat surface 450 the crowd 404 to optimally minimize thermal stress. The connection points 406 For example, they may be used for bonding to solder, glass frit, conductive epoxy, or non-conductive epoxy. According to a preferred embodiment, the connection points 406 used for solder bonding to provide optimum manufacturability. According to a preferred embodiment, the contact surface of the connection points 406 maximizes the shock tolerance of the mass 404 to optimize. According to a preferred embodiment, the connection points 406 minimal discontinuities on the distribution of thermal stresses in the mass 404 to optimize. According to several alternative embodiments, there are a plurality of joints 406 To reduce the thermal stress in the mass 404 to optimize. According to a preferred embodiment, there is a single connection point 406a , The connection point 406a preferably has a nearly circular cross-sectional shape. For example, the diameter D _406a may range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the diameter D _{406a of} the connection point is sufficient 406a from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the junction 406a For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406a from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 408 fasten the joints 406 preferably elastic on the package 402 , The elastic connections 408 are preferably with the bottom surface 426 of the cavity 416 connected. The elastic connections 408 are solder preforms. According to a preferred embodiment, the elastic compounds 408 an approximately circular cross-sectional shape. According to a preferred embodiment, the elastic compounds 408 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 408 To reduce the thermal stress in the mass 404 to optimize. The elastic connections 408 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 408 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The elastic connections 408 may be at a vertical distance, for example, of about 80 to 100 mils from the first wall 418 of the cavity 416 the pack 402 are located at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the elastic compounds are located 408 at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a distance of about 2.159 to 2.413 mm (85 to 95 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress. According to a preferred embodiment there is a single elastic connection 408 , The diameter D _{408 of} the elastic connection 408 For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the diameter D _{408 of} the elastic connection is sufficient 408 from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{408 of} the elastic connection 408 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{408 of} the elastic connection is sufficient 408 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the elastic connection 408 continue one or more buffers 460 for mass sliding bearing 404 on. According to a preferred embodiment, there is a single buffer 460 , According to a preferred embodiment, the buffer 460 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer surrounds 460 the connection points 406 , According to a preferred embodiment, the buffer is located 460 near the joints 406 , The width W _{460 of} the buffer 460 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{460 of} the buffer is sufficient 460 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 408 using conventional soldering equipment and processes with the joint 406 connected. According to a preferred embodiment, the elastic compounds 408 using conventional bottom surface soldering machines and processes 426 of the cavity 416 the pack 402 connected.

The electrical connections 410 connect the crowd 404 preferably electrically with the package 402 , According to a preferred embodiment, the electrical connections 410 Wire connections. The electrical connections 410 may be any number of conventional commercially available wire bonds, for example of the gold or aluminum type. According to a preferred embodiment, the electrical connections exist 410 made of gold, for optimum compatibility with the packing and the metallization of the mass 404 provide. According to a preferred embodiment, there is a first electrical connection 410a and a second electrical connection 410b , The first electrical connection 410a connects the first parallel plane surface 412 the pack 402 preferably electrically with the upper parallel planar surface 446 the crowd 404 , The second electrical connection 410b connects the second parallel plane surface 414 the pack 402 preferably electrically with the middle parallel flat surface 448 the crowd 404 , According to a preferred embodiment, the electrical connections 410 using conventional wire bonding equipment and processes with the package 402 connected. According to a preferred embodiment, the electrical connections 410 using conventional wire bonding equipment and processes with the earth 404 connected.

Regarding 4F It should be noted that according to an alternative embodiment, the bottom surface 426 the pack 402 further a recess 428 having. The depression 428 can be circular or rectangular. The depression 428 preferably has a first wall 430 , a second wall 432 , a third wall 434 and a fourth wall 436 on. The first wall 430 and the third wall 434 preferably run almost parallel to each other, and the second wall 432 and the fourth wall 436 preferably run almost parallel to each other. The second wall 432 and the fourth wall 436 preferably also run perpendicular to the first wall 430 and to the third wall 434 , The depression 428 preferably has a bottom surface 438 on. The length L _{428 of} the recess 428 For example, it may range from about 2,794 to 3,302 mm (110 to 130 mils). According to a preferred embodiment, the length L _{428 of} the recess is sufficient 428 from about 2.921 to 3.175 mm (115 to 125 mils) to optimally minimize thermal stresses. The width W _{428 of} the recess 428 For example, it may range from about 2,794 to 3,302 mm (110 to 130 mils). According to a preferred embodiment, the width W _{428 of} the recess is sufficient 428 from about 2.921 to 3.175 mm (115 to 125 mils) to optimally minimize thermal stresses. The height H _{428 of} the recess 428 For example, it may range from about 0.0254 to 0.0508 mm (1 to 2 mils). According to a preferred embodiment, the height H _{428 of} the recess reaches 428 from about 0.03175 to 0.04445 mm (1.25 to 1.75 mils) to optimally minimize thermal stresses. According to a preferred embodiment, the depression is located 428 essentially in the middle of the floor area 426 the pack 402 , The first wall 430 the depression 428 may be at a vertical distance of, for example, 2.032 to 2.54 mm (80 to 100 mils) from the first wall 418 of the cavity 416 are located. According to a preferred embodiment, the first wall is located 430 the depression 428 at a perpendicular distance of 2.159 to 2.413 mm (85 to 95 mils) from the first wall 418 of the cavity 416 to optimally minimize thermal stress. The second wall 432 the depression 428 may be at a vertical distance of, for example, 80 to 100 mils from the second wall 420 of the cavity 416 are located. According to a preferred embodiment, the second wall is located 432 the depression 428 at a vertical distance of 2.159 to 2.413 mm (85 to 95 mils) from the second wall 420 of the cavity 416 to optimally minimize thermal stress.

According to a preferred embodiment, the elastic connection is located 408 in the depression 428 , The elastic connection 408 may be at a perpendicular distance of, for example, about 0,0508 to 0,1778 mm (2 to 7 mils) from the first wall 430 the depression 428 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 2 to 7 mils from the second wall 432 the depression 428 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the elastic connection is located 408 at a vertical distance of about 0.0762 to 0.127 mm (3 to 5 mils) from the first wall 430 the depression 428 of cavity 416 the pack 402 to optimally minimize thermal stresses and at a distance of about 0.0762 to 0.127 mm (3 to 5 mils) from the second wall 432 the depression 428 of the cavity 416 the pack 402 to optimally minimize thermal stress. According to a preferred embodiment, the elastic connection 408 using conventional soldering equipment and processes with the floor surface 438 the depression 428 connected.

Regarding 4G It should be noted that according to an alternative embodiment, a first connection point 468a and a second connection point 468b present, which are substantially the same size and are vertically close to each other. The connection points 468a and 468b For example, they can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. In accordance with a preferred embodiment, solder joint junctions 468 are used to provide optimum manufacturability. The connection points 468 preferably have a nearly circular cross-sectional shape. The total diameter D _{468 of} the joints 468a and 468b For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{468 of} the connection points is sufficient 468a and 468b from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{468 of} the joints 468a and 468b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{468 of} the joints extends 468a and 468b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The first connection point 468a is preferably located substantially in the middle of the lower parallel planar surface 450 the crowd 404 , The first connection 468a may be at a perpendicular distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 and at a perpendicular distance of, for example, about 1.016 to 1.27 mm (40 to 50 mils) from the second side 454 the lower parallel flat surface 450 the crowd 404 are located. The first connection point 468a is preferably at a vertical distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 to optimally minimize thermal stresses and at a perpendicular distance of about 43 to 47 mils from the second side 454 the lower parallel flat surface 450 the crowd 404 to optimally minimize thermal stress.

The second connection point 468b is preferably located substantially in the middle of the lower parallel planar surface 450 the crowd 404 , The second connection point 468b may be at a perpendicular distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 are located at a vertical distance of, for example, about 3,429 to 4,191 mm (135 to 165 mils) from the second side 454 the lower parallel flat surface 450 the crowd 404 are located. The second connection point 468b is preferably at a vertical distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first side 452 the lower parallel flat surface 450 the crowd 404 to optimally minimize thermal stresses and at a perpendicular distance of about 3.3738 to 3.9878 mm (147 to 157 mils) from the second side 454 of the lower parallel planar surface 450 the mass 404 to optimally minimize thermal stresses.

Regarding 4H It should be noted that according to an alternative embodiment, a connection point 406b is present. The connection point 406b may have a nearly oct-cake wedge-shaped cross-sectional shape. The diameter D _{406b of} the joint 406b For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the diameter D _{406b of} the connection point is sufficient 406b from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the junction 406b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 4J It should be noted that according to an alternative embodiment, a connection point 406c is present. The connection point 406c may have a nearly hollow oct-cake wedge-shaped cross-sectional shape. The diameter D _{406c of} the joint 406c for example, can range from about 50 to 100 mils. According to a preferred embodiment, the diameter D _{406c of} the connection point is sufficient 406c from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the Verbindungsstel le 406c For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406c from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 4K be noted that ge According to an alternative embodiment, a connection point 406d is present. The connection point 406d has a nearly nine-circular cross-sectional shape. The total diameter D _{406d of} the joint 406d For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{406d of} the joint extends 406d from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the junction 406d For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406d from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 4L It should be noted that according to an alternative embodiment, a single connection point 406e is present. The connection point 406e has a nearly star-shaped cross-sectional shape. The total diameter D _{406e of} the joint 406e For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{406e of} the joint extends 406e from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the junction 406e For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406e from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 4M It should be noted that according to an alternative embodiment, a single connection point 406f is present. The connection point 406f has a nearly sunbeam-shaped cross-sectional shape. The total diameter D _{406f of} the joint 406f For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{406f of} the connection point is sufficient 406f from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{406 of} the junction 406f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{406 reaches} the connection point 406f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 4R and 4S It should be noted that according to an alternative embodiment, a first elastic connection 470a and a second elastic connection 470b available. The elastic connections 470a and 470b are solder preforms, which preferably have a nearly circular cross-sectional shape. The elastic connections 470a and 470b may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 470a and 470b a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The total diameter D _{470 of} the elastic compounds 470a and 470b For example, it can range from about 1.27 to 2.54 mm (50 to 100 mils). According to a preferred embodiment, the overall diameter D _{470 of} the elastic compounds is sufficient 470a and 470b from about 1,778 to 2,032 mm (70 to 80 mils) to optimally minimize thermal stress. The height H _{470 of} the elastic connections 470a and 470b For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{470 of} the elastic connections is sufficient 470a and 470b from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 470a and 470b using conventional bottom surface soldering machines and processes 426 of the cavity 416 the pack 402 connected. According to a preferred embodiment, the elastic compounds 470a and 470b using conventional soldering equipment and processes with the joint 406 connected.

The first elastic connection 470a may be at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first wall 418 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 1.016 to 1.27 mm (40 to 50 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the first elastic connection is located 470a at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a distance of about 1.0922 to 1.1938 mm (43 to 47 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

The first elastic connection 470a also has one or more buffers 472 for mass sliding bearing 404 on. According to a preferred embodiment, there is a single buffer 472 , According to a preferred embodiment, the buffer 472 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer is located 472 near the joints 406 , The width W _{472 of} the buffer 472 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{472 of} the buffer is sufficient 472 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The second elastic connection 470b may be at a vertical distance of, for example, about 2.032 to 2.54 mm (80 to 100 mils) from the first wall 418 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 3429 to 4.191 mm (135 to 165 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the second elastic connection is located 470b at a perpendicular distance of about 2.159 to 2.413 mm (85 to 95 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a distance of about 147 to 157 mils from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

The second elastic connection 470b also has one or more buffers 474 for mass sliding bearing 404 on. According to a preferred embodiment, there is a single buffer 474 , According to a preferred embodiment, the buffer 474 a nearly annular cross-sectional shape. According to a preferred embodiment, the buffer is located 474 near the joints 406 , The width W _{474 of} the buffer 474 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{474 of} the buffer is sufficient 474 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

With reference to the 4T to 4X be noted that the system 400 one or more plain bearings 462a . 462b . 462c or 462d having. The plain bearings 462a . 462b . 462c or 462d store the crowd 404 sliding. The number of plain bearings 462a . 462b . 462c or 462d depends preferably on whether a sufficient number of plain bearings to the mass 404 to store optimally sliding, is present. The plain bearings 462a . 462b . 462c or 462d are preferential, with the lower surface 426 of the cavity 416 the pack 402 connected. The plain bearings 462a may have a nearly square cross-sectional shape. The plain bearings 462 can have a nearly rectangular cross-sectional shape. The plain bearings 462c may have a nearly triangular cross-sectional shape. The plain bearings 462d may have a nearly circular cross-sectional shape. The plain bearings 462a . 462b . 462c or 462d may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 462a . 462b . 462c or 462d tungsten to optimally provide a standard packaging process. The total cross-sectional area of the plain bearings 462a . 462b . 462c or 462d For example, it can range individually from about 10.16 to 40.64 mm ² (400 to 1600 square mils). According to a preferred embodiment, the total cross-sectional area of the plain bearings is sufficient 462a . 462b . 462c or 462d individually from about 15,875 to 31,115 mm ² (625 to 1225 square mils) to optimally minimize thermal stress. The height H _{462 of} the plain bearings 462a . 462b . 462c or 462d for example, can range from about 0.5 to 3 mils. According to a preferred embodiment, the height H _{462 of} the sliding bearing extends 462a . 462b . 462c or 462d from about 1 to 1.5 mils to optimally minimize thermal stress.

According to a preferred embodiment, there is a first sliding bearing 462aa , a second sliding bearing 462ab , a third plain bearing 462ac and a fourth sliding bearing 462ad , The first plain bearing 462aa may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 418 of the cavity 416 the pack 402 are located at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the first sliding bearing is located 462aa at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

The second plain bearing 462ab may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 418 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the second sliding bearing is located 462ab at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

The third plain bearing 462ac can be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) of the ers th wall 418 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the third sliding bearing is located 462ac at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

The fourth plain bearing 462ad may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 418 of the cavity 416 the pack 402 and at a perpendicular distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 420 of the cavity 416 the pack 402 are located. According to a preferred embodiment, the fourth sliding bearing is located 462ad at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 418 of the cavity 416 the pack 402 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 420 of the cavity 416 the pack 402 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 408 also the mass 404 electrically with the pack 402 connect.

According to an alternative embodiment, the elastic compounds 470a and 470b also the mass 404 electrically with the pack 402 connect.

With reference to the 5A to 5G Let it be noted that an alternative embodiment of a system 500 for elastically connecting a mass to a pack, preferably a pack 502 , a mass 504 , one or more connection points 506 , one or more elastic compounds 508 and one or more electrical connections 510 having.

The package 502 is with the elastic connections 508 and the electrical connections 510 connected. The package 502 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 502 a housing to optimally provide a surface mounted component. The package 502 preferably has an upper parallel planar surface 512 and a cavity 514 on. The cavity 514 preferably has a first wall 516 , a second wall 518 , a third wall 520 and a fourth wall 522 on. The first wall 516 and the third wall 520 preferably run almost parallel to each other, and the second wall 518 and the fourth wall 522 preferably run almost parallel to each other. The second wall 518 and the fourth wall 522 preferably also run perpendicular to the first wall 516 and to the third wall 520 , The cavity 514 preferably has a bottom surface 524 on. The package 502 can consist of any number of conventional commercially available housing, for example, metal, plastic or ceramic. According to a preferred embodiment, the pack consists 502 made of ceramic, to optimally a vacuum seal of the mass 504 in the pack 502 provide.

The crowd 504 is preferably by the elastic compounds 508 elastic on the package 502 attached and electrically by the electrical connections 510 with the pack 502 connected. The crowd 504 preferably has a nearly rectangular cross-sectional shape. The crowd 504 preferably has a passive area 538 at one end and an active area 540 at the opposite end. According to a preferred embodiment, the mass 504 a micromachined sensor substantially similar to that disclosed in pending US patent US-A-6,871,544.

According to a preferred embodiment, the mass 504 an upper parallel flat surface 526 and a lower parallel planar surface 528 on. The lower parallel flat surface 528 the crowd 504 preferably has a first page 530 , a second page 532 , a third page 534 and a fourth page 536 on. The first page 530 and the third page 534 are preferably nearly parallel to each other, and the second side 532 and the fourth page 536 Preferably, they are nearly parallel to each other and preferably nearly perpendicular to the first side 530 and to the third page 534 ,

According to a preferred embodiment, the lower parallel planar surface 528 the crowd 504 the connection points 506 on. According to a preferred embodiment, the contact surface of the connection points 506 maximizes the shock tolerance of the mass 504 to optimize. According to a preferred embodiment, the connection points 506 minimal discontinuities, around the distribution of thermal stresses in the earth 504 to optimize. According to several alternative embodiments, there are a plurality of joints 506 to reduce the thermal stress in the mass 504 to optimize. According to a preferred embodiment there is a first connection point 506a and a second connection point 506b , According to a preferred embodiment, the first connection point is located 506a in the passive area 538 the lower parallel flat surface 528 the crowd 504 , The first connection point 506a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 and a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 are located. According to a preferred embodiment, the first connection point is located 506a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 7 to 12 mils from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

According to a preferred embodiment, the second connection point is located 506b in the active area 540 the lower parallel flat surface 528 the crowd 504 , The second connection point 506b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 and a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 are located. According to a preferred embodiment, the second connection point is located 506b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

The first connection point 506a For example, it can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the first connection point 506a used for solder bonding to provide optimum manufacturability. The first connection point 506a preferably has a nearly rectangular cross-sectional shape. The length L _{506a of} the first joint 506a For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{506a of} the first connection point is sufficient 506a from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{506a of} the first joint 506a For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{506a of} the first connection point is sufficient 506a from about 0.4572 to 0.5588 mm (18 to 22 mils) to optimally minimize thermal stress. The height H _{506a of} the first junction 506a For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506a of} the first connection point is sufficient 506a from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The second connection point 506b For example, it can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the second connection point 506b used for solder bonding to provide optimum manufacturability. The second connection point 506b preferably has a nearly rectangular cross-sectional shape. The length L _{506b of} the second joint 506b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{506b of} the second connection point is sufficient 506b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{506b of} the second joint 506b For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{506b of} the second connection point is sufficient 506b from about 0.4572 to 0.5588 mm (18 to 22 mils) to optimally minimize thermal stress. The height H _{506b of} the second junction 506b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506b of} the second connection point is sufficient 506b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 508 fasten the joints 506 preferably elastic on the package 502 , According to a preferred embodiment, the elastic compounds 508 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 508 To reduce the thermal stress in the mass 504 to optimize. The elastic connections 508 are solder preforms, which preferably have an approximately rectangular cross-sectional shape. The elastic connections 508 may be any number of conventional commercially available solder preforms of, for example, eutectic or not eutectic type. According to a preferred embodiment, the elastic compounds 508 a eutectic type to provide optimum tensile strength at a reasonable melting temperature.

The elastic connections 508 are preferably with the bottom surface 524 of the cavity 514 connected.

According to a preferred embodiment, there is a first elastic connection 508a and a second elastic connection 508b , The length L _{508a of} the first elastic connection 508a For example, it can range from about 5.08 to 6.35 mm (200 to 250 mils). According to a preferred embodiment, the length L _{508a of} the first elastic connection is sufficient 508a from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{508a of} the first elastic connection 508a for example, can range from about 20 to 35 mils. According to a preferred embodiment, the width W _{508a of} the first elastic connection is sufficient 508a from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{508a of} the first elastic connection 508a for example, can range from about 2 to 4 mils. According to a preferred embodiment, the height H _{508a of} the first elastic connection is sufficient 508a from about 2.5 to 3 mils to optimally minimize thermal stress.

The length L _{508b of} the second elastic connection 508b for example, can range from about 200 to 250 mils. According to a preferred embodiment, the length L _{508b of} the second elastic connection is sufficient 508b from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{508b of} the second elastic connection 508b may range, for example, from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{508b of} the second elastic connection is sufficient 508b from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{508b of} the second elastic connection 508b for example, can range from about 2 to 4 mils. According to a preferred embodiment, the height H _{508b of} the second elastic connection is sufficient 508b from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

The first elastic connection 508a may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 516 of the cavity 514 the pack 502 are located and at a vertical distance of, for example, about 5 to 25 mils from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the first elastic connection is located 508a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The second elastic connection 508b may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 520 of the cavity 514 the pack 502 are located at a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the second elastic connection is located 508b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 520 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

According to a preferred embodiment, the first elastic connection 508a continue a first buffer 542 and a second buffer 544 for mass sliding bearing 504 on. According to a preferred embodiment, the first buffer is located 542 the first elastic connection 508a on one side of the first junction 506a and the second buffer 544 the first elastic connection 508a on another side of the first junction 506a , According to a preferred embodiment, the first buffer is located 542 the first elastic connection 508a and the second buffer 544 the first elastic connection 508a near the first junction 506a , The width W _{542 of} the first buffer 542 the first elastic connection 508a for example, can range from about 2 to 6 mils. According to a preferred embodiment, the width W _{542 of} the first buffer is sufficient 542 the first elastic connection 508a from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. The width W _{544 of} the second buffer 544 the first elastic connection 508a For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{544 of} the second buffer is sufficient 544 the first elastic connection 508a from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the second elastic connection 508b continue a first buffer 546 and a second buffer 548 for mass sliding bearing 504 on. According to a preferred embodiment, the first buffer is located 546 the second elastic connection 508b on one side of the second connection point 506b and the second buffer 548 the second elastic connection 508b on another side of the second junction 506b , According to a preferred embodiment, the first buffer is located 546 the second elastic connection 508b and the second buffer 548 the second elastic connection 508b near the second junction 506b , The width W _{546 of} the first buffer 546 the second elastic connection 508b For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{546 of} the first buffer is sufficient 546 the second elastic connection 508b from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. The width W _{548 of} the second buffer 548 the second elastic connection 508b For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{548 of} the second buffer is sufficient 548 the second elastic connection 508b from about 3 to 5 mils to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 508a and 508b using conventional soldering equipment and processes with the joints 506 connected. According to a preferred embodiment, the elastic compounds 508a and 508b using conventional bottom surface soldering machines and processes 524 of the cavity 514 the pack 502 connected.

The electrical connections 510 connect the crowd 504 preferably electrically with the package 502 , According to a preferred embodiment, there is a single electrical connection 510 , The electrical connection 510 connects the upper parallel plane surface 512 the pack 502 preferably electrically with the upper parallel planar surface 526 the crowd 504 , According to a preferred embodiment, the electrical connection 512 a wire connection. The electrical connection 512 may be any of a number of conventional commercially available wire bonds, for example of the gold or aluminum type. According to a preferred embodiment, the electrical connection exists 512 made of gold, for optimal compatibility with the pack 502 and the metallization of the mass 504 provide. According to a preferred embodiment, the electrical connection 512 using conventional wire bonding equipment and processes with the package 502 connected. According to a preferred embodiment, the electrical connection 512 using conventional wire bonding equipment and processes with the earth 504 connected.

Regarding 5H It should be noted that according to an alternative embodiment, the mass 504 continue a second passive area 552 at the of the passive area 538 from the opposite end of the lower parallel flat surface of the mass 504 having. The active area 540 is preferably located between the passive area 538 and the second passive area 552 , According to a preferred embodiment, the second connection point is located 506b in the second passive area 552 ,

Regarding 5J It should be noted that it according to an alternative embodiment, one or more connection points 562 and one or more connection points 564 gives. According to a preferred embodiment there is a first connection point 562a and a second connection point 562b , The connection points 562a and 562b have substantially the same size and are vertically close to each other horizontally. The connection points 562a and 562b For example, they can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the connection points 562a and 562b used to provide good manufacturability for solder bonding. The connection points 562a and 562b preferably have a nearly rectangular cross-section. The length L _{562 of} the joints 562a and 562b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{562 of} the connection points is sufficient 562a and 562b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{562 of} the joints 562a and 562b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{562 of} the connection points is sufficient 562a and 562b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{562 of} the joints 562a and 562b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{562 of} the connection points is sufficient 562a and 562b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

According to a preferred embodiment, the first connection point is located 562a preferably in the passive area 538 the lower parallel flat surface 528 the crowd 504 , The first connection point 562a can be in one vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 532 the lower parallel flat surface 530 the crowd 504 are located. The first connection point 562a is preferably located at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

According to a preferred embodiment, the second connection point is located 562b in the passive area 538 the lower parallel flat surface 528 the crowd 504 , The second connection point 562b may be at a perpendicular distance of, for example, about 0.381 to 1.143 mm (15 to 45 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 are located. The second connection point 562b is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the first side 530 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

According to a preferred embodiment there is a third connection point 564a and a fourth connection point 564b , The connection points 564a and 564b can be used for bonding to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the connection points 564 used for solder bonding to provide optimum manufacturability. The connection points 564a and 564b preferably have a nearly rectangular cross-sectional shape. The length L _{564 of} the joints 564a and 564b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{564 of} the connection points is sufficient 564a and 564b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{564 of} the joints 564a and 564b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{564 of} the connection points is sufficient 564a and 564b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{564 of} the joints 564a and 564b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{564 of} the joints extends 564a and 564b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

According to a preferred embodiment, the third connection point is located 564a in the active area 540 the lower parallel flat surface 528 the crowd 504 , The third connection point 564a may be at a perpendicular distance of, for example, about 0.381 to 1.143 mm (15 to 45 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 are located. The third connection point 564a is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

The fourth connection point 564b is preferably in the active area 540 the lower parallel flat surface 528 the crowd 504 , The fourth connection point 564b may be at a vertical distance of, for example, about 0.127 to 0.835 mm (5 to 25 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 and at a vertical distance of, for example, about 5 to 25 mils from the second side 532 the lower parallel flat surface 528 the crowd 504 are located. The fourth connection point 564b It is preferably located at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third side 534 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stresses and at a vertical distance of about 7 to 12 mils from the second side 532 the lower parallel flat surface 528 the crowd 504 to optimally minimize thermal stress.

According to an alternative embodiment, the third connection point is located 564a and the fourth connection point 564b in the second passive area 552 the crowd 504 ,

With reference to the 5K to 5S It should be noted that according to several alternative embodiments, a joint 506c , a pair of joints 506d and 506e , a junction 506f , a junction 506g , a pair of joints 506h and 506i , a trio of junctions 506j . 506k and 506L , a junction 506m and a pair of joints 506n and 506o Essentially, each of the above with reference to 5A described connection points 506a and 506b can replace.

Regarding 5K be noted that the junction 506c may have a nearly oval cross-sectional shape. The connection point 506c individually may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 506 an approximate cross-sectional area individually ranging from about 142.875 to 179.07 mm ² (5625 to 7050 square mils) to optimally minimize thermal stresses. The height H _{506 of} the junction 506c For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection points is sufficient 506c from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5L It should be noted that according to an alternative embodiment, the connection points 506d and 506e have substantially the same size, are close to each other vertically and have a nearly oval cross-sectional shape. The connection points 506d and 506e may have an approximate total cross-sectional area of about 4,000 to 8,750 square millimeters. According to a preferred embodiment, the connection points 506d and 506e an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the joints 506d and 506e For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection points is sufficient 506d and 506e from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5 M be noted that the junction 506f according to an alternative embodiment has a nearly tri-oval cross-sectional shape. The connection point 506f may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 506f an approximate cross-sectional area of about 142.875 to 222.25 mm ² (5625 to 8750 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the junction 506f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection point is sufficient 506f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5N be noted that the junction 506g according to an alternative embodiment has a nearly oct-oval cross-sectional shape. The connection point 506g may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 506g an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the junction 506g For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection point is sufficient 506g from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5P It should be noted that according to an alternative embodiment, the connection points 506h and 506i have substantially the same size, are vertically close to each other and have a nearly rectangular cross-sectional shape. The connection points 506h and 506i may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 506h and 506i an approximate total cross-sectional area of about 142.875 to 222.25 mm ² (5625 to 8750 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the joints 506h and 506i For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection points is sufficient 506h and 506i from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5Q It should be noted that according to an alternative embodiment, the connection points 506j . 506k and 506L have substantially the same size, are vertically close to each other and have a nearly rectangular cross-sectional shape. The connection points 506j . 506k and 506L may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 506j . 506k and 506L an approximated Ge total cross-sectional area of about 142.875 to 222.25 mm ² (5625 to 8750 square millimeters) in order to optimally minimize thermal stresses. The height H _{506 of} the joints 506j . 506k and 506L For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection points is sufficient 506j . 506k and 506L from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5R be noted that the junction 506m according to an alternative embodiment may have a nearly wave-side rectangular cross-sectional shape. The connection point 506m may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a ferred embodiment, the connection point 506m an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the junction 506m For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection point is sufficient 506m from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 5S It should be noted that according to an alternative embodiment, the connection points 506n and 506o lie horizontally close to each other and have a nearly rectangular cross-sectional shape. The connection point 506n is slightly smaller than the junction 506o , The connection points 506n and 506o may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 506n and 506o an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{506 of} the joints 506n and 506o For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{506 of} the connection points is sufficient 506n and 506o from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 5T to 5W It should be noted that it according to an alternative embodiment, one or more re elastic compounds 566 and one or more elastic compounds 568 gives. The elastic connections 566 are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 566 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 566 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{566 of} the elastic connections 566 For example, it may range from about 2.286 to 3.048 mm (90 to 120 mils). According to a preferred embodiment, the length L _{566 of} the elastic connections is sufficient 566 from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{566 of} the elastic connections 566 for example, can range from about 20 to 35 mils. According to a preferred embodiment, the width W _{566 of} the elastic connections is sufficient 566 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{566 of} the elastic connections 566 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{566 of} the elastic connections is sufficient 566 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 566 using conventional bottom surface soldering machines and processes 524 of the cavity 514 the pack 502 connected. According to a preferred Ausfüh tion form, the elastic compounds 566 using conventional soldering equipment and processes with the joints 506 connected. According to a preferred embodiment, there is a first elastic connection 566a and a second elastic connection 566b ,

The first elastic connection 566a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 516 of the cavity 514 the pack 502 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the first elastic connection is located 566a at a vertical distance of about 7 to 12 mils from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The first elastic connection 566a further includes one or more first buffers 554 for mass sliding bearing 504 on. According to a preferred embodiment, the first buffers are located 554 on both sides of the first junction 506a , According to a preferred embodiment, the first buffers are located 554 near the first connection point 506a , The width W _{554 of} the first buffers 554 for example, can range from about 2 to 6 mils. According to a preferred embodiment, the width W _{554 of} the first buffer is sufficient 554 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The second elastic connection 566b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 516 of the cavity 514 the pack 502 and at a perpendicular distance of, for example, about 2.657 to 3.683 mm (105 to 145 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the second elastic connection is located 566b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 112 to 127 mils from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The second elastic connection 566b further includes one or more second buffers 556 for mass sliding bearing 504 on. According to a preferred embodiment, the second buffers are located 556 on one side of the first junction 506a , According to a preferred embodiment, the second buffers are located 556 near the first junction 506a , The width W _{556 of} the second buffer 556 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{556 of} the second buffer is sufficient 556 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The elastic connections 568 are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 568 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 568 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{568 of} the elastic connections 568 For example, it may range from about 2.286 to 3.048 mm (90 to 120 mils). According to a preferred embodiment, the length L _{568 of} the elastic connections is sufficient 568 from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{568 of} the elastic connections 568 for example, can range from about 20 to 35 mils. According to a preferred embodiment, the width W _{568 of} the elastic connections is sufficient 568 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{568 of} the elastic connections 568 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{568 of} the elastic connections is sufficient 568 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 568 using conventional bottom surface soldering machines and processes 524 of the cavity 514 the pack 502 connected. According to a preferred embodiment, the elastic compounds 568 using conventional soldering equipment and processes with the joints 506 connected. According to a preferred embodiment, there is a third elastic connection 568a and a fourth elastic connection 568b ,

The third elastic connection 568a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 520 of the cavity 514 the pack 502 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the third elastic connection is located 568a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 520 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The third elastic connection 568a further includes one or more third buffers 558 for mass sliding bearing 504 on. According to a preferred embodiment, the third buffers are located 558 on both sides of the second junction 506b , According to a preferred embodiment, the third buffers are located 558 near the second junction 506b , The paste W _{558 of} the third buffer 558 for example, can range from about 2 to 6 mils. According to a preferred embodiment, the width W _{558 of} the third buffer is sufficient 558 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The fourth elastic connection 568b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 520 of the cavity 514 the pack 502 and at a vertical distance from for example, about 2.667 to 3.683 mm (105 to 145 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the fourth elastic connection is located 568b at a vertical distance of, for example, about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 520 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a distance of about 2.8448 to 3.2258 mm (112 to 127 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The fourth elastic connection 568b further includes one or more fourth buffers 560 for mass sliding bearing 504 on. According to a preferred embodiment, there are the fourth buffers 560 on both sides of the second junction 506b , According to a preferred embodiment, there are the fourth buffers 560 near the second junction 506b , The width W _{560 of} the fourth buffer 560 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{560 of} the fourth buffer is sufficient 560 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

With reference to the 5X to 5BB be noted that the system 500 one or more plain bearings 550a . 550b . 550c or 550d having. The plain bearings 550a . 550b . 550c or 550d store the crowd 504 sliding. The plain bearings 550a . 550b . 550c or 550d are preferably with the bottom surface 524 of the cavity 514 the pack 502 connected. The number of plain bearings 550a . 550b . 550c or 550d depends preferably on whether a sufficient number of plain bearings to the mass 504 to store optimally sliding, is present. The plain bearings 550a may have a nearly square cross-sectional shape. The plain bearings 550b can have a nearly rectangular cross-sectional shape. The plain bearings 550c may have a nearly triangular cross-sectional shape. The plain bearings 550d may have a nearly circular cross-sectional shape. The plain bearings 550a . 550b . 550c or 550d may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 550a . 550b . 550c or 550d tungsten to optimally provide a standard packaging process. The cross-sectional area of the plain bearings 550a . 550b . 550c or 550d For example, it can range individually from about 10.16 to 40.64 mm ² (400 to 1600 square mils). According to a preferred embodiment, the cross-sectional area of the plain bearings 550a . 550b . 550c or 550d for example, individually from about 15.875 to 31.115 mm ² (625 to 1225 square mils) to optimally minimize thermal stresses. The height H _{550 of} the plain bearings 550a . 550b . 550c or 550d For example, it may range from about 0.0127 to 0.0762 mm (0.5 to 3 mils). According to a preferred embodiment, the height H _{550 of} the sliding bearing extends 550a . 550b . 550c or 550d from about 0.0254 to 0.0381 mm (1 to 1.5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, there is a first sliding bearing 550aa , a second sliding bearing 550ab , a third plain bearing 550ac and a fourth sliding bearing 550ad , The first plain bearing 550aa may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 516 of the cavity 514 the pack 502 are located at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the first sliding bearing is located 550aa at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The second plain bearing 550ab may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 516 of the cavity 514 the pack 502 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the second sliding bearing is located 550ab at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

The third plain bearing 550ac may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 516 of the cavity 514 the pack 502 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the third sliding bearing is located 550ac at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 518 of the cavity 514 Pack 502 to optimally minimize thermal stress.

The fourth plain bearing 550ad may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 516 of the cavity 514 the pack 502 are located at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 518 of the cavity 514 the pack 502 are located. According to a preferred embodiment, the fourth sliding bearing is located 550ad at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 516 of the cavity 514 the pack 502 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 518 of the cavity 514 the pack 502 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 508 also the mass 504 electrically with the pack 502 connect.

According to an alternative embodiment, the elastic compounds 566 and 568 also the mass 504 electrically with the pack 502 connect.

With reference to the 6A to 6G Let it be noted that an alternative embodiment of a system 600 for elastically connecting a mass to a pack, preferably a pack 602 , a mass 604 , one or more connection points 606 , one or more elastic compounds Ver 608 and one or more electrical connections 610 having.

The package 602 preferably is with the elastic compounds 608 and the electrical connections 610 connected. The package 602 For example, it may be a case or a substrate. According to a preferred embodiment, the pack is 602 a housing to optimally provide a surface mounted component. The package 602 preferably has a first parallel planar surface 612 , a second parallel flat surface 614 and a cavity 616 on. The cavity 616 preferably has a first wall 618 , a second wall 620 , a third wall 622 and a fourth wall 624 on. The first wall 618 and the third wall 622 preferably run almost parallel to each other, and the second wall 620 and the fourth wall 624 preferably run almost parallel to each other. The second wall 620 and the fourth wall 624 preferably also run perpendicular to the first wall 618 and to the third wall 622 , The cavity 616 preferably has a bottom surface 626 on. The package 602 can be made of any number of conventional commercially available housing, for example, metal, ceramic or plastic. According to a preferred embodiment, the pack consists 602 made of ceramic, to optimally a vacuum seal of the mass 604 in the pack 602 provide.

The crowd 604 is preferably by the elastic compounds 608 elastic on the package 602 attached and through the electrical connections 610 electrically with the pack 602 connected. The crowd 604 preferably has a nearly rectangular cross-sectional shape. The crowd 604 preferably has a passive range 648 at one end and an active area 650 at the opposite end.

According to a preferred embodiment, the mass 604 a first element 628 , a second element 630 and a third element 632 on. The first element 628 is preferably located on the second element 630 , and the second element 630 is preferably on the third element 632 , According to a preferred embodiment, the first element 628 , the second element 630 and the third element 632 a micromachined sensor as essentially disclosed in pending US patent US-A-6,871,544.

The first element 628 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the first element 628 an upper parallel flat surface 634 on. The second element 630 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the second element 630 a middle parallel flat surface 636 on. The third element 632 preferably has one or more parallel planar surfaces. According to a preferred embodiment, the third element 632 a lower parallel flat surface 638 on. The lower parallel flat surface 638 the crowd 604 preferably has a first page 640 , a second page 642 , a third page 644 and a fourth page 646 on. The first page 640 and the third page 644 are preferably nearly parallel to each other, and the second side 642 and the fourth page 646 are preferably nearly parallel to each other and preferably nearly perpendicular to the first side 640 and to the third page 644 ,

According to a preferred embodiment, the lower parallel planar surface 638 the crowd 604 the connection points 606 on. According to one preferred embodiment is the contact surface of the joints 606 maximizes the shock tolerance of the mass 604 to optimize. According to a preferred embodiment, the connection points 606 minimal discontinuities to the distribution of thermal stresses in the mass 604 to optimize. According to several alternative embodiments, there are a plurality of joints 606 To reduce the thermal stress in the mass 604 to optimize. According to a preferred embodiment there is a first connection point 606a and a second connection point 606b , According to a preferred embodiment, the first connection point is located 606a in the passive area 648 the lower parallel flat surface 638 the crowd 604 , The first connection point 606a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first side 640 the lower parallel flat surface 638 the crowd 604 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 are located. According to a preferred embodiment, the first connection point is located 606a at a vertical distance of about 7 to 12 mils from the first side 640 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

According to a preferred embodiment, the second connection point is located 606b in the active area 650 the lower parallel flat surface 638 the crowd 604 , The second connection point 606b may be at a vertical distance of, for example, about 5 to 25 mils from the third page 644 the lower parallel flat surface 638 the crowd 604 and at a vertical distance of, for example, about 5 to 25 mils from the second side 642 the lower parallel flat surface 638 the crowd 604 are located. According to a preferred embodiment, the second connection point is located 606b at a vertical distance of about 7 to 12 mils from the third side 644 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

The first connection point 606a For example, it can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy.

According to a preferred embodiment, the first connection point 606a used for solder bonding to provide optimum manufacturability. The first connection point 606a preferably has a nearly rectangular cross-sectional shape. The length L _{606a of} the first joint 606a For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{606a of} the first connection point is sufficient 606a from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{606a of} the first joint 606a For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{606a of} the first connection point is sufficient 606a from about 18 to 22 mils to optimally minimize thermal stress. The height H _{606a of} the first junction 606a For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606a of} the first connection point is sufficient 606a from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The second connection point 606b For example, it can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the second connection point 606b used for solder bonding to provide optimum solderability. The second connection point 606b preferably has a nearly rectangular cross-sectional shape. The length L _{606b of} the second joint 606b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{606b of} the second connection point is sufficient 606 from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{606b of} the second joint 606 For example, it can range from about 0.381 to 0.635 mm (15 to 25 mils). According to a preferred embodiment, the width W _{606b of} the second connection point is sufficient 606 from about 0.4572 to 0.5588 mm (18 to 22 mils) to optimally minimize thermal stress. The height H _{606b of} the second junction 606 For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606b of} the second connection point is sufficient 606 from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The elastic connections 608 fasten the joints 606 preferably elastic on the package 602 , According to a preferred embodiment, the elastic Verbindun gene 608 minimal discontinuities to optimize the distribution of thermal stresses. According to several alternative embodiments, there are a plurality of elastic connections 608 To reduce the thermal stress in the mass 604 to optimize. The elastic connections 608 are solder preforms, which preferably have an approximately rectangular cross-sectional shape. According to a preferred embodiment, the elastic compounds 608 with the bottom surface 626 of the cavity 616 connected. The elastic connections 608 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 608 a eutectic type to provide optimum tensile strength at a reasonable melting temperature.

According to a preferred embodiment, there is a first elastic connection 608a and a second elastic connection 608b , The length L _{608a of} the first elastic connection 608a For example, it can range from about 5.08 to 6.35 mm (200 to 250 mils). According to a preferred embodiment, the length L _{608a of} the first elastic connection is sufficient 608a from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{608a of} the first elastic connection 608a For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{608a of} the first elastic connection is sufficient 608a from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{608a of} the first elastic connection 608a for example, can range from about 2 to 4 mils. According to a preferred embodiment, the height H _{608a of} the first elastic connection is sufficient 608a from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

The length L _{608b of} the second elastic connection 608b For example, it can range from about 5.08 to 6.35 mm (200 to 250 mils). According to a preferred embodiment, the length L _{608b of} the second elastic connection is sufficient 608b from about 5,715 to 5,969 mm (225 to 235 mils) to optimally minimize thermal stresses. The width W _{608b of} the second elastic connection 608 For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{608b of} the second elastic connection is sufficient 608 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{608b of} the second elastic connection 608 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{608b of} the second elastic connection is sufficient 608 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress.

The first elastic connection 608a may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 618 of the cavity 616 the pack 602 are located at a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the first elastic connection is located 608a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The second elastic connection 608b may be at a vertical distance, for example, from about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 622 of the cavity 616 the pack 602 are located at a vertical distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the second elastic connection is located 608b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 622 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

According to a preferred embodiment, the first elastic connection 608a continue a first buffer 652 and a second buffer 654 for mass sliding bearing 604 on. According to a preferred embodiment, the first buffer is located 652 the first elastic connection 608a on one side of the first junction 606a and the second buffer 654 the first elastic connection 608a on another side of the first junction 606a , According to a preferred embodiment, the first buffer is located 652 the first elastic connection 608a and the second buffer 654 the first elastic connection 608a near the first junction 606a , The width W _{652 of} the first buffer 652 the first elastic connection 608a can beispielswei range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{652 of} the first buffer is sufficient 652 the first elastic connection 608a from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. The width W _{654 of} the second buffer 654 the first elastic connection 608a For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{654 of} the second buffer is sufficient 654 the first elastic connection 608a from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, the second elastic connection 608b continue a first buffer 656 and a second buffer 658 for mass sliding bearing 604 on. According to a preferred embodiment, the first buffer is located 656 the second elastic connection 608b on one side of the second connection point 606b and the second buffer 658 the second elastic connection 608b on another side of the second junction 606b , According to a preferred embodiment, the first buffer is located 656 the second elastic connection 608b and the second buffer 658 the second elastic connection 608b near the second junction 606b , The width W _{656 of} the first buffer 656 the second elastic connection 608b For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{656 of} the first buffer is sufficient 656 the second elastic connection 608b from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. The width W _{658 of} the second buffer 658 the second elastic connection 608b For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{658 of} the second buffer is sufficient 658 the second elastic connection 608b from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 608 using conventional soldering equipment and processes with the joints 606 connected. According to a preferred embodiment, the elastic compounds 608 using conventional bottom surface soldering machines and processes 626 of the cavity 616 the pack 602 connected.

The electrical connections 610 connect the crowd 604 preferably electrically with the package 602 , According to a preferred embodiment, the electrical connections 610 Wire connections. The electrical connections 610 may be any number of conventional commercially available wire bonds, for example of the gold or aluminum type. According to a preferred embodiment, the electrical connections exist 610 made of gold, for optimal compatibility with the pack 602 and the metallization of the mass 604 provide. According to a preferred embodiment, there is a first electrical connection 610a and a second electrical connection 610b , The first electrical connection 610a preferably connects the first parallel planar surface 612 the pack 602 electrically with the upper parallel plane surface 634 the crowd 404 , The second electrical connection 610b preferably connects the second parallel planar surface 614 the pack 602 electrically with the middle parallel flat surface 636 the crowd 604 , According to a preferred embodiment, the electrical connections 610 using conventional wire bonding equipment and processes with the package 602 connected. According to a preferred embodiment, the electrical connections 610 using conventional wire bonding equipment and processes with the earth 604 connected.

Regarding 6H It should be noted that according to an alternative embodiment, the mass 604 continue a second passive area 662 at the of the passive area 648 from the opposite end of the lower parallel flat surface 638 the crowd 604 having. The active area 650 is preferably located between the passive area 648 and the second passive area 662 , According to a preferred embodiment, the second connection point is located 606b in the second passive area 662 ,

Regarding 6J It should be noted that it according to an alternative embodiment, one or more connection points 672 and one or more connection points 674 gives. According to a preferred embodiment there is a first connection point 672a and a second connection point 672b , The connection points 672a and 672b have substantially the same size and are horizontally close to each other. The connection points 672a and 672b For example, they can be used to bond to solder, glass frit, non-conductive epoxy, or conductive epoxy. According to a preferred embodiment, the connection points 672 used to provide good manufacturability for solder bonding. The connection points 672a and 672b preferably have a nearly rectangular cross-section. The length L _{672 of} the joints 672a and 672b For example, it can range from about 4,572 to 6,096 mm (180 to 240 mils). According to a preferred embodiment, the length L _{672 of} the connection points is sufficient 672a and 672b about 5.08 to 5.558 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{672 of} the joints 672a and 672b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{672 of} the connection points is sufficient 672a and 672b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{672 of} the joints 672a and 672b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{672 of} the connection points is sufficient 672a and 672b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The first connection point 672a is preferably in the passive range 648 the lower parallel flat surface 638 the crowd 604 , The first connection point 672a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first side 640 the lower parallel flat surface 638 the crowd 604 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 are located. The first connection point 672a is preferably located at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first side 640 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

The second connection point 672b is preferably in the passive area 648 the lower parallel flat surface 638 the crowd 604 , The second connection point 672b may be at a vertical distance of, for example, about 15 to 45 mils from the first page 640 the lower parallel flat surface 638 the crowd 604 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 are located. The second connection point 672b is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the first side 640 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 0.127 to 0.635 mm (5 to 25 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

According to a preferred embodiment there is a third connection point 674a and a fourth connection point 674b , The connection points 674a and 674b are preferably substantially the same size and are horizontally close to each other. The connection points 674a and 674b For example, they can be used to bond to solder, glass frit, conductive epoxy or non-conductive epoxy. According to a preferred embodiment, the connection points 674a and 674b used for solder bonding to provide optimum manufacturability. The connection points 674a and 674b preferably have a nearly rectangular cross-sectional shape. The length L _{674 of} the joints 674a and 674b for example, can range from about 180 to 240 mils. According to a preferred embodiment, the length L _{674 of} the connection points is sufficient 674a and 674b from about 5,08 to 5,588 mm (200 to 220 mils) to optimally minimize thermal stress. The width W _{674 of} the joints 674a and 674b For example, it may range from about 0.254 to 0.508 mm (10 to 20 mils). According to a preferred embodiment, the width W _{674 of} the connection points is sufficient 674a and 674b from about 0.3302 to 0.4572 mm (13 to 18 mils) to optimally minimize thermal stresses. The height H _{674 of} the joints 674a and 674b For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{674 of} the connection points is sufficient 674a and 674b from about 0.24 to 0.72 microns to optimally minimize thermal stress.

The third connection point 674a is preferably in the active area 650 the lower parallel flat surface 638 the crowd 604 , The third connection point 674a may be at a perpendicular distance of, for example, about 0.381 to 1.143 mm (15 to 45 mils) from the third side 644 the lower parallel flat surface 638 the crowd 604 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 are located. The third connection point 674a is preferably located at a vertical distance of about 0.508 to 0.762 mm (20 to 30 mils) from the third side 644 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

The fourth connection point 674b is preferably in the active area 650 the lower parallel flat surface 638 the crowd 604 , The fourth connection point 674b may be at a perpendicular distance of, for example, about 5 to 25 mils from the third side 644 of the lower parallel planar surface 638 the crowd 604 and at a vertical distance of, for example, about 5 to 25 mils from the second side 642 the lower parallel plane surface 638 the crowd 604 are located. The fourth connection point 674b is preferably at a vertical distance of about 7 to 12 mils from the third side 644 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stresses and at a vertical distance of about 7 to 12 mils from the second side 642 the lower parallel flat surface 638 the crowd 604 to optimally minimize thermal stress.

According to an alternative embodiment, the third connection point is located 674a and the fourth connection point 674b in the second passive area 662 ,

With reference to the 6K to 6S It should be noted that according to an alternative embodiment, a connection point 606c , a pair of joints 606d and 606e , a junction 606f , a junction 606g , a pair of joints 606h and 606i , a trio of junctions 606j . 606k and 606L , a junction 606m and a pair of joints 606n and 606o Essentially, each of the above with reference to 6A described connection points 606a and 606b can replace.

Regarding 6K be noted that the junction 606c according to an alternative embodiment may have a nearly oval cross-sectional shape. The connection point 606c individually may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 606c an approximate cross-sectional area individually ranging from about 142.875 to 179.07 mm ² (5625 to 7050 square mils) to optimally minimize thermal stresses. The height H _{606 of} the junction 606c For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 reaches} the joint 606c from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6L It should be noted that according to an alternative embodiment, the connection points 606e and 606d have substantially the same size, are close to each other vertically and have a nearly oval cross-sectional shape. The connection points 606e and 606d may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 606e and 606d an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{606 of} the joints 606e and 606d For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 of} the joints extends 606e and 606d from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6M be noted that the junction 606f according to an alternative embodiment has a nearly tri-oval cross-sectional shape. The connec- tion office 606f may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 606f individually approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square mils) to optimally minimize thermal stresses. The height H _{606 of} the junction 606f For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 reaches} the joint 606f from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6N be noted that the junction 606g according to an alternative embodiment has a nearly oct-oval cross-sectional shape. The connection point 606g may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 606g an approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{606 of} the junction 606g For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 reaches} the joint 606g from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6P It should be noted that according to an alternative embodiment, the connection points 606h and 606i have substantially the same size, are vertically close to each other and have a nearly rectangular cross-sectional shape. The connection points 606h and 606i may have an approximate total cross-sectional area of about 4,000 to 8,750 square millimeters. According to a preferred embodiment, the connection points 606h and 606i an approximate total cross-sectional area of about 5625 to 7050 Square millimeters to optimally minimize thermal stress. The height H _{606 of} the joints 606h and 606i For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 of} the joints extends 606h and 606i from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6Q It should be noted that according to an alternative embodiment, the connection points 606j . 606k and 606L have substantially the same size, are vertically close to each other and have a nearly rectangular cross-sectional shape. The connection points 606j . 606k and 606L may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 606j . 606k and 606L an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{606 of} the joints 606j . 606k and 606L For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 of} the joints extends 606j . 606k and 606L from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6R be noted that the junction 606m according to an alternative embodiment may have a nearly wave-side rectangular cross-sectional shape. The connection point 606m individually may have an approximate cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection point 606m individually approximate cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square mils) to optimally minimize thermal stresses. The height H _{606 of} the junction 606m For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 reaches} the joint 606m from about 0.24 to 0.72 microns to optimally minimize thermal stress.

Regarding 6S It should be noted that according to an alternative embodiment, the connection points 606n and 606o lie horizontally close to each other and have a nearly rectangular cross-sectional shape. The connection point 606n is slightly smaller than the junction 606o , The connection points 606n and 606o may have an approximate total cross-sectional area of about 101.6 to 222.25 mm ² (4,000 to 8,750 square millimeters). According to a preferred embodiment, the connection points 606n and 606o an approximate total cross-sectional area of about 142.875 to 179.07 mm ² (5625 to 7050 square millimeters) to optimally minimize thermal stresses. The height H _{606 of} the joints 606n and 606o For example, it can range from about 0.1 to 1 micrometer. According to a preferred embodiment, the height H _{606 of} the joints extends 606n and 606o from about 0.24 to 0.72 microns to optimally minimize thermal stress.

With reference to the 6T to 6W It should be noted that it according to an alternative embodiment, one or more elastic compounds 676 and one or more elastic compounds 678 gives. The elastic connections 676 are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 676 are preferably substantially the same size and are vertically close together. The elastic connections 676 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 676 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{676 of} the elastic connections 676 For example, it may range from about 2.286 to 3.048 mm (90 to 120 mils). According to a preferred embodiment, the length L _{676 of} the elastic connections is sufficient 676 from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{676 of} the elastic connections 676 For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{676 of} the elastic connections is sufficient 676 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{676 of} the elastic connections 676 for example, can range from about 2 to 4 mils. According to a preferred embodiment, the height H _{676 of} the elastic connections is sufficient 676 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 676 using conventional bottom surface soldering machines and processes 626 of the cavity 616 the pack 602 connected. According to a preferred embodiment, the elastic compounds 676 using conventional soldering equipment and processes with the joints 606 connected. According to a preferred embodiment, there is a first elastic connection 676a and a second elastic connection 676b ,

The first elastic connection 676a can be at a vertical distance of beispielswei about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 618 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the first elastic connection is located 676a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The first elastic connection 676a further includes one or more first buffers 664 for mass sliding bearing 604 on. According to a preferred embodiment, the first buffers are located 664 on both sides of the first junction 606a , According to a preferred embodiment, the first buffers are located 664 near the first junction 606a , The width W _{664 of} the first buffers 664 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{664 of} the first buffers is sufficient 664 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The second elastic connection 676b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the first wall 618 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 2.657 to 3.683 mm (105 to 145 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the second elastic connection is located 676b at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a distance of about 2.8448 to 3.2258 mm (112 to 127 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The second elastic connection 676b further includes one or more second buffers 666 for mass sliding bearing 604 on. According to a preferred embodiment, the second buffers are located 666 on one side of the first junction 606a , According to a preferred embodiment, the second buffers are located 666 near the first junction 606a , The width W _{666 of} the second buffer 666 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{666 of} the second buffer is sufficient 666 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The elastic connections 678 are solder preforms, which preferably have a nearly rectangular cross-sectional shape. The elastic connections 678 may be any number of conventional commercially available solder preforms of the eutectic or non-eutectic type, for example. According to a preferred embodiment, the elastic compounds 678 a eutectic type to provide optimum tensile strength at a reasonable melting temperature. The length L _{678 of} the elastic connections 678 For example, it can range from about 2.286 to 2.667 mm (90 to 120 mils). According to a preferred embodiment, the length L _{678 of} the elastic connections is sufficient 678 from about 2,5654 to 2,8448 mm (101 to 112 mils) to optimally minimize thermal stresses. The width W _{678 of} the elastic connections 678 For example, it may range from about 0.508 to 0.889 mm (20 to 35 mils). According to a preferred embodiment, the width W _{678 of} the elastic connections is sufficient 678 from about 0.635 to 0.762 mm (25 to 30 mils) to optimally minimize thermal stress. The height H _{678 of} the elastic connections 678 For example, it may range from about 0.0508 to 0.1016 mm (2 to 4 mils). According to a preferred embodiment, the height H _{678 of} the elastic connections is sufficient 678 from about 0.0635 to 0.0762 mm (2.5 to 3 mils) to optimally minimize thermal stress. According to a preferred embodiment, the elastic compounds 678 using conventional bottom surface soldering machines and processes 626 of the cavity 616 the pack 602 connected. According to a preferred embodiment, the elastic compounds 678 using conventional soldering equipment and processes with the joints 606 connected. According to a preferred embodiment, there is a third elastic connection 678a and a second elastic connection 678b ,

The third elastic connection 678a may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 622 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the third elastic connection is located 678a at a vertical distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 622 of the cavity 616 the pack 602 to optimize thermal stresses times to minimize, and at a distance of about 0.1778 to 0.3048 mm (7 to 12 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The third elastic connection 678a further includes one or more third buffers 668 for mass sliding bearing 604 on. According to a preferred embodiment, the third buffers are located 668 on both sides of the second junction 606b , According to a preferred embodiment, the third buffers are located 668 near the second junction 606b , The width W _{668 of} the third buffer 668 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). In a preferred embodiment, the width W _{668 of} the third buffer is sufficient 668 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

The fourth elastic connection 678b may be at a perpendicular distance of, for example, about 0.127 to 0.635 mm (5 to 25 mils) from the third wall 622 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 2.657 to 3.683 mm (105 to 145 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the fourth elastic connection is located 678b at a vertical distance of, for example, about 0.1778 to 0.3048 mm (7 to 12 mils) from the third wall 622 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a distance of about 2.8448 to 3.2258 mm (112 to 127 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The fourth elastic connection 678b further includes one or more fourth buffers 670 for mass sliding bearing 604 on. According to a preferred embodiment, there are the fourth buffers 670 on one side of the second connection point 606b , According to a preferred embodiment, there are the fourth buffers 670 near the second junction 606b , The width W _{670 of} the fourth buffer 670 For example, it may range from about 0.0508 to 0.1524 mm (2 to 6 mils). According to a preferred embodiment, the width W _{670 of} the fourth buffer is sufficient 670 from about 0.0762 to 0.127 mm (3 to 5 mils) to optimally minimize thermal stress.

With reference to the 6X to 6BB be noted that the system 600 one or more plain bearings 660a . 660b . 660c or 660d having. The plain bearings 660a . 660b . 660c or 660d store the crowd 604 sliding. The plain bearings 660a . 660b . 660c or 660d are preferably with the bottom surface 626 of the cavity 616 the pack 602 connected. The plain bearings 660a may have a nearly square cross-sectional shape. The plain bearings 660b can have a nearly rectangular cross-sectional shape. The plain bearings 660c may have a nearly triangular cross-sectional shape. The plain bearings 660d may have a nearly circular cross-sectional shape. The plain bearings 660a . 660b . 660c or 660d may for example consist of tungsten or ceramic. According to a preferred embodiment, the plain bearings exist 660a . 660b . 660c or 660d tungsten to optimally provide a standard packaging process. The cross-sectional area of the plain bearings 660a . 660b . 660c or 660d For example, it can range individually from about 10.16 to 40.64 mm ² (400 to 1600 square mils). According to a preferred embodiment, the cross-sectional area of the plain bearings 660a . 660b . 660c or 660d for example, individually from about 625 to 1225 square millimeters rich in order to optimally minimize thermal stresses. The height H _{660 of} the plain bearings 660a . 660b . 660c or 660d For example, it may range from about 0.0127 to 0.0762 mm (0.5 to 3 mils). According to a preferred embodiment, the height H _{660 of} the sliding bearing extends 660a . 660b . 660c or 660d from about 0.0254 to 0.0381 mm (1 to 1.5 mils) to optimally minimize thermal stress.

According to a preferred embodiment, there is a first sliding bearing 660aa , a second sliding bearing 660ab , a third plain bearing 660ac and a fourth sliding bearing 660AD , The first plain bearing 660aa may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 618 of the cavity 616 the pack 602 are located at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the first slide bearing is located 660aa at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The second plain bearing 660ab may be at a perpendicular distance of, for example, about 1.143 to 1.905 mm (45 to 75 mils) from the first wall 618 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 620 of the cavity 616 the PA ckung 602 are located. According to a preferred embodiment, the second sliding bearing is located 660ab at a vertical distance of about 1.3208 to 1.5748 mm (52 to 62 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The third plain bearing 660ac may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 618 of the cavity 616 the pack 602 and at a perpendicular distance of, for example, about 0.381 to 0.762 mm (15 to 30 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the third sliding bearing is located 660ac at a vertical distance of about 90 to 105 mils from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a vertical distance of about 0.508 to 0.635 mm (20 to 25 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

The fourth plain bearing 660AD may be at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the first wall 618 of the cavity 616 the pack 602 are located at a vertical distance of, for example, about 2.159 to 2.921 mm (85 to 115 mils) from the second wall 620 of the cavity 616 the pack 602 are located. According to a preferred embodiment, the fourth sliding bearing is located 660AD at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the first wall 618 of the cavity 616 the pack 602 to optimally minimize thermal stresses and at a vertical distance of about 2.286 to 2.667 mm (90 to 105 mils) from the second wall 620 of the cavity 616 the pack 602 to optimally minimize thermal stress.

According to an alternative embodiment, the elastic compounds 608 also the mass 604 electrically with the pack 602 connect.

According to an alternative embodiment, the elastic compounds 676 and 678 also the mass 604 electrically with the pack 602 connect.

With reference to the 7A to 7D It should be noted that according to several alternative embodiments, the packages 102 . 202 . 302 . 402 . 502 and 602 one or more bearing elements 702a or 702b for storing one or more elastic connections 108 . 150 . 208 . 260 . 308 . 363 . 408 . 470 . 508 . 566 . 568 . 608 . 676 and 678 exhibit. The bearing elements 702a and 702b For example, they can be made of tungsten or ceramic. According to a preferred embodiment, the bearing elements 702a and 702b made of ceramic. The height H _{702 of} the bearing elements 702a and 702b For example, it can range from about 0 to 0.254 mm (0 to 10 mils). According to a preferred embodiment, the height is H _{702 of} the bearing elements 702a and 702b in about 0.127 mm (5 mils). The bearing element 702a is preferably a rectangular storage tube. The bearing element 702a preferably has straight edges. According to an alternative embodiment, the bearing element 702b a cylindrical section. The bearing element 702b preferably has narrowing sides. According to an alternative embodiment, the bearing element 702b straight sides up. According to a preferred embodiment, the bearing elements 702a and 702b a shape that the thermal stresses between the bearing elements 702a and 702b and the stored elastic compounds 108 . 150 . 208 . 260 . 308 . 363 . 408 . 470 . 508 . 566 . 568 . 608 . 676 and 678 optimally minimized.

According to several alternative embodiments, those described above with reference to FIGS 1A . 2A . 5A and 6A described packs 102 . 202 . 502 and 602 one or more with reference to above 3G described depressions 326 for picking up one or more above with respect to 1A . 2A . 3A . 4A . 5A and 6A described elastic compounds 108 . 208 . 308 . 408 . 508 and 608 on.

According to several alternative embodiments, by dividing the elastic attachment, the above with reference to 1A . 2A . 3A . 4A . 5A and 6A described mass 104 . 204 . 304 . 404 . 504 and 604 at the above with reference to the 1A . 2A . 3A . 4A . 5A and 6A described pack 102 . 202 . 302 . 402 . 502 and 602 reduces the tension for attaching.

According to several alternative embodiments, those described above with reference to FIGS 1A . 2A . 3A . 4A . 5A and 6A described elastic compounds 108 . 208 . 308 . 408 . 508 and 608 by dividing the solder preform, the conductive epoxy resin, the non-conductive epoxy resin or the glass frit into one or more pieces.

According to several alternative embodiments, those described above with reference to FIGS 1A . 2A . 3A . 4A . 5A and 6A described connection points 106 . 206 . 306 . 406 . 506 and 606 by dividing the above with reference to the 1A . 2A . 3A . 4A . 5A and 6A described connection points 106 . 206 . 306 . 406 . 506 and 606 decomposed into one or more pieces using a conventional division method.

The above with reference to the 1A . 2A . 3A . 4A . 5A and 6A described mass 104 . 204 . 304 . 404 . 504 and 604 is a micromachined device, integrated circuit chip or optical device.

Although explanatory Embodiments of Invention have been described and described is in the above Revelation a wide range of modifications, amendments and exchanges in one with the scope of the attached Claims are consistent Way provided.

Claims (35)

Apparatus with heat load protection, comprising: a package ( 102 ); a mass associated with the package ( 104 ) with an area and also with an active area ( 146 ), where the mass ( 104 ) is selected from the group consisting of a micromachined device, an integrated circuit chip, and an optical device; one or more substantially rigid solder preforms for bonding at least one location on the surface to the package ( 102 ), to create an elastic connection between the mass ( 104 ) and the package ( 102 ), wherein at least a part of the active area ( 146 ) is spaced from the at least one connection point; characterized in that the apparatus further comprises: one or more sliding bearings connected to the package for slidingly supporting the mass. Device according to claim 1, in which the package ( 102 ) a cavity for receiving the mass ( 104 ) having. Device according to claim 1 or 2, in which the package ( 102 ) has a recess for receiving the rigid solder preforms. Device according to one of claims 1 to 3, wherein the mass ( 104 ) one or more connection fields ( 106 ) for connecting the mass ( 104 ) with the pack ( 102 ) having. Device according to Claim 4, in which the cross-sectional shape of the connecting fields ( 106 ) from the group consisting of almost rectangular, almost oval, almost tri-oval, almost oct-oval, almost wavy sided rectangular ("wavy sided rectangular"), almost oct-cuneiform ("oct-pie-wedge"), almost hollow oct "cake pie"("oct-pie-wedge"), almost nine-circular ("nine-circular"), almost star-shaped, or almost sunbeam-shaped is selected. Apparatus according to claim 4 or 5, wherein the mass comprises one or more passive regions ( 140 ) having; and wherein the connection fields ( 106 ) approximately in the passive areas ( 140 ) are arranged. Device according to one of claims 4 to 6, wherein the mass ( 104 ) further comprises a first passive region, wherein the connection fields ( 106 ) are arranged approximately in the first passive region. Apparatus according to claim 7, wherein the first passive region is at one end of the mass ( 104 ) is located. Apparatus according to claim 7 or 8, wherein the mass ( 104 ) further comprises a first passive region and a second passive region, and wherein the connection fields ( 106 ) are arranged in the first passive area and in the second passive area. Apparatus according to claim 9, wherein the first passive region is at one end of the mass ( 104 ) and the second passive region at the opposite end of the mass ( 104 ) is arranged. Device according to one of claims 4 to 6, wherein the mass ( 104 ) further comprises a first passive region and a first active region, and wherein the connection fields ( 106 ) are arranged in the first passive region and in the first active region. Apparatus according to claim 11, wherein the first passive region is at one end of the mass ( 104 ), and the first active region at the opposite end of the mass ( 104 ) is arranged. Device according to one of claims 4 to 6, wherein the mass ( 104 ) further comprises an active region, and the connection fields ( 106 ) are arranged approximately in the active region. Device according to Claim 13, in which the connection fields ( 106 ) are located in the approximate center of the active area. Device according to one of claims 1 to 14, wherein the rigid solder preforms a cross-sectional shape selected have almost rectangular and almost circular. Device according to one of claims 1 to 15, wherein the rigid solder preforms are located approximately at one end of the package ( 102 ) are arranged. Device according to one of Claims 1 to 15, in which the rigid solder preforms are located approximately at the approximate center of the package ( 102 ) are arranged. The device of any one of claims 1 to 15, wherein the one or more rigid solder preforms are one or more first rigid solder preforms and one or more second rigid solder preforms; the first rigid solder preforms being approximately at one end of the package ( 102 ) and wherein the second rigid solder preforms are located approximately at the opposite end of the package (US Pat. 102 ) are arranged. Device according to one of Claims 4 to 14, in which the connection fields ( 106 ) are selected from a material selected from the group consisting of solder, conductive epoxy, non-conductive epoxy, and glass frit. Device according to one of claims 1 to 19, wherein the plain bearings have a cross-sectional shape selected from the group consisting of almost square, almost circular, almost triangular and almost rectangular, selected is. Device according to claim 1, in which the package ( 102 ) further comprises a bearing member for supporting the rigid solder preforms. Device according to one of claims 1 to 21, wherein the rigid solder preforms are designed to be the mass ( 104 ) with the pack ( 102 ) electrically connect. Method for connecting a mass ( 104 ), which has an active area ( 146 ), with a pack ( 102 ) in order to reduce the effects of heat stress, in which the mass ( 104 ) is selected from the group consisting of a micro-machined device, an integrated circuit chip, and an optical device; Bonding at least one surface site on the mass to the package ( 102 ) using one or more substantially rigid solder preforms to provide a resilient connection between the mass ( 104 ) and the package ( 102 ), wherein at least a part of the active area ( 146 ) is spaced from the at least one joint; characterized by connecting one or more sliding bearings to the packing for slidingly supporting the mass ( 104 ). A method according to claim 23, wherein attaching the mass ( 104 ) attaching or connecting the mass ( 104 ) in several places. A method according to claim 23 or 24, wherein the mass ( 104 ) a passive area ( 140 ), and wherein connecting the mass ( 104 ) connecting the passive area to the package ( 102 ). Method according to Claim 25, in which the passive area ( 140 ) at one end of the mass ( 140 ) is arranged. The method of any one of claims 23 to 26, wherein joining the mass ( 104 ) connecting the active area to the package ( 102 ). The method of claim 27, wherein connecting the active area ( 146 ) connecting the package ( 102 ) with the approximate center of the active area ( 146 ). The method of claim 23, wherein the mass comprises a first passive region and a second passive region; and wherein connecting the mass ( 104 ) connecting the first passive area to the package ( 102 ) and connecting the second passive region to the package ( 102 ). The method of claim 29, wherein the first passive region is at one end of the mass ( 104 ) is arranged; and wherein the second passive region is at an opposite end of the mass ( 104 ) is arranged. Method according to Claim 27, in which the passive area ( 140 ) at one end of the mass ( 104 ); and where the active area ( 146 ) at an opposite end of the mass ( 104 ). Method according to one of claims 23 to 31, wherein, when connecting the mass ( 104 ), the mass can expand and contract without stresses in the mass ( 104 ) to cause. Method according to one of claims 23 to 32, wherein when connecting the mass ( 104 ) ensure that expansion and contraction of the packing ( 102 ), without causing stresses in the mass ( 104 ), is possible. Method according to one of claims 23 to 33, in which the joining of the sliding bearing with the packing is a sliding mounting of the mass ( 104 ) at one or more different locations. A method according to any one of claims 29 to 39, further comprising electrically connecting the mass ( 104 ) with the pac kung ( 102 ) at one or more different locations.