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DE60019397D1 - Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms - Google Patents

Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms

Info

Publication number
DE60019397D1
DE60019397D1 DE60019397T DE60019397T DE60019397D1 DE 60019397 D1 DE60019397 D1 DE 60019397D1 DE 60019397 T DE60019397 T DE 60019397T DE 60019397 T DE60019397 T DE 60019397T DE 60019397 D1 DE60019397 D1 DE 60019397D1
Authority
DE
Germany
Prior art keywords
composition
polyimide
patterned
electroplate
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60019397T
Other languages
English (en)
Other versions
DE60019397T2 (de
Inventor
Hiroshi Itatani
Shunichi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PI R&D Co Ltd
Original Assignee
PI R&D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PI R&D Co Ltd filed Critical PI R&D Co Ltd
Publication of DE60019397D1 publication Critical patent/DE60019397D1/de
Application granted granted Critical
Publication of DE60019397T2 publication Critical patent/DE60019397T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Materials For Photolithography (AREA)
DE60019397T 1999-08-06 2000-08-07 Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms Expired - Lifetime DE60019397T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP25614399 1999-08-06
JP25614399 1999-08-06
PCT/JP2000/005285 WO2001010964A1 (fr) 1999-08-06 2000-08-07 Composition destinee a l'electrodeposition de polyimide et procede de formation de film de polyimide a motifs a partir de cette composition

Publications (2)

Publication Number Publication Date
DE60019397D1 true DE60019397D1 (de) 2005-05-19
DE60019397T2 DE60019397T2 (de) 2006-03-16

Family

ID=17288509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60019397T Expired - Lifetime DE60019397T2 (de) 1999-08-06 2000-08-07 Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms

Country Status (6)

Country Link
US (1) US6630064B1 (de)
EP (1) EP1123954B1 (de)
JP (1) JP4958355B2 (de)
AT (1) ATE293152T1 (de)
DE (1) DE60019397T2 (de)
WO (1) WO2001010964A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4141625B2 (ja) * 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
JP4683763B2 (ja) * 2001-05-11 2011-05-18 リコー光学株式会社 高分子材料層の加熱方法及び装置
TW200302253A (en) * 2002-01-15 2003-08-01 Pi R & D Co Ltd Solvent-soluble block copolyimide composition, process for producing the same, positive photosensitive polyimide composition and positive photosensitive block copolyimide ink composition
WO2004087793A1 (ja) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. 架橋ポリイミド、それを含む組成物及びその製造方法
CA2435538A1 (en) * 2003-07-18 2005-01-18 Universite Laval Solvent resistant asymmetric integrally skinned membranes
JP2005162954A (ja) * 2003-12-05 2005-06-23 Pi R & D Co Ltd 電着塗料組成物及びそれを用いた電着方法
JP4737938B2 (ja) * 2004-02-13 2011-08-03 株式会社ピーアイ技術研究所 コイル用リング状絶縁板の製造方法
US7892651B2 (en) * 2004-09-14 2011-02-22 Mitsubishi Gas Chemical Company, Inc. Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
JP4994238B2 (ja) * 2005-09-05 2012-08-08 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
US7989081B2 (en) * 2006-01-25 2011-08-02 Mitsubishi Gas Chemical Company, Inc. Resin composite copper foil, printed wiring board, and production processes thereof
DE112007003428B4 (de) * 2007-04-03 2015-07-23 Solpit Industries Ltd. Lösungsmittel-lösliche Polyimid-Copolymere sowie Verfahren zu deren Herstellung
US8496796B2 (en) 2007-10-17 2013-07-30 Agency For Science, Technology And Research Composite films comprising carbon nanotubes and polymer
JP6168884B2 (ja) * 2013-07-05 2017-07-26 東京応化工業株式会社 ネガ型感光性樹脂組成物
KR102672003B1 (ko) * 2016-10-21 2024-06-03 한국전기연구원 전착코팅용 이미드계 고분자 콜로이드 분산액 및 그 제조방법
KR102433079B1 (ko) * 2017-04-28 2022-08-17 주식회사 동진쎄미켐 감광성 수지 조성물
DE102017119280A1 (de) * 2017-08-23 2019-02-28 Heraeus Noblelight Gmbh Verfahren und Vorrichtung zur Herstellung einer Polyimidschicht auf einem Substrat
JPWO2021182207A1 (de) * 2020-03-13 2021-09-16
TW202244130A (zh) * 2021-03-03 2022-11-16 美商杜邦電子股份有限公司 塗佈溶液及交聯聚合物膜

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100076A (ja) * 1989-09-14 1991-04-25 Hitachi Chem Co Ltd ポリイミド薄膜の製造法
JP2906637B2 (ja) * 1989-10-27 1999-06-21 日産化学工業株式会社 ポジ型感光性ポリイミド樹脂組成物
US5202411A (en) 1990-04-06 1993-04-13 W. R. Grace & Co.-Conn. Tri-component polyimide composition and preparation thereof
US5502143A (en) 1992-12-25 1996-03-26 Pi Material Research Laboratory Process for preparing polyimide resins
JP3089195B2 (ja) * 1995-10-12 2000-09-18 大日本塗料株式会社 電着用ポリイミド組成物
WO1999019771A1 (en) * 1997-10-13 1999-04-22 Pi R & D Co., Ltd. Positive photosensitive polyimide composition
JP4034403B2 (ja) * 1998-01-16 2008-01-16 株式会社ピーアイ技術研究所 ポジ型感光性ポリイミド組成物及び絶縁膜

Also Published As

Publication number Publication date
US6630064B1 (en) 2003-10-07
EP1123954A1 (de) 2001-08-16
EP1123954A4 (de) 2002-07-03
DE60019397T2 (de) 2006-03-16
JP4958355B2 (ja) 2012-06-20
WO2001010964A1 (fr) 2001-02-15
EP1123954B1 (de) 2005-04-13
ATE293152T1 (de) 2005-04-15

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