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DE60017004D1 - Hochfrequenz-Kommunikationsgerät - Google Patents

Hochfrequenz-Kommunikationsgerät

Info

Publication number
DE60017004D1
DE60017004D1 DE60017004T DE60017004T DE60017004D1 DE 60017004 D1 DE60017004 D1 DE 60017004D1 DE 60017004 T DE60017004 T DE 60017004T DE 60017004 T DE60017004 T DE 60017004T DE 60017004 D1 DE60017004 D1 DE 60017004D1
Authority
DE
Germany
Prior art keywords
communication device
radio frequency
frequency communication
radio
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60017004T
Other languages
English (en)
Other versions
DE60017004T2 (de
Inventor
Hiroshi Kondoh
Hiroshi Shinoda
Kenji Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60017004D1 publication Critical patent/DE60017004D1/de
Publication of DE60017004T2 publication Critical patent/DE60017004T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W42/20—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/211—Waffle-iron filters; Corrugated structures
    • H10W70/682—
    • H10W70/685—
    • H10W72/075—
    • H10W72/951—
DE60017004T 1999-04-26 2000-04-26 Hochfrequenz-Kommunikationsgerät Expired - Lifetime DE60017004T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11804799 1999-04-26
JP11804799A JP3739230B2 (ja) 1999-04-26 1999-04-26 高周波通信装置

Publications (2)

Publication Number Publication Date
DE60017004D1 true DE60017004D1 (de) 2005-02-03
DE60017004T2 DE60017004T2 (de) 2006-04-27

Family

ID=14726720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60017004T Expired - Lifetime DE60017004T2 (de) 1999-04-26 2000-04-26 Hochfrequenz-Kommunikationsgerät

Country Status (4)

Country Link
US (2) US6337661B1 (de)
EP (1) EP1049192B1 (de)
JP (1) JP3739230B2 (de)
DE (1) DE60017004T2 (de)

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JP3739230B2 (ja) * 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置
JP3589137B2 (ja) 2000-01-31 2004-11-17 株式会社日立製作所 高周波通信装置およびその製造方法
DE10024852C1 (de) * 2000-05-19 2001-11-15 Siemens Ag Verfahren zur Innenraum-/Außenraumerkennung eines mit einer Basisstation drahtlos kommunizierenden Antwortgebers sowie Kommunikationssystem
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JP4028769B2 (ja) * 2002-06-21 2007-12-26 京セラ株式会社 電磁波吸収体及びこれを用いた高周波回路用パッケージ
JP4028765B2 (ja) * 2002-06-18 2007-12-26 京セラ株式会社 電磁波吸収体及びこれを用いた高周波回路用パッケージ
JP3764877B2 (ja) * 2002-10-16 2006-04-12 株式会社日立製作所 レーダ装置
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JP4575247B2 (ja) * 2005-07-11 2010-11-04 株式会社東芝 高周波パッケージ装置
JP2007250938A (ja) * 2006-03-17 2007-09-27 Nippon Telegr & Teleph Corp <Ntt> Ｉｃチップ実装モジュール及びｉｃチップ実装方法
JP4641286B2 (ja) * 2006-06-21 2011-03-02 株式会社豊田中央研究所 半導体パッケージ
JP4286855B2 (ja) * 2006-09-07 2009-07-01 株式会社日立製作所 レーダ装置
JP4983219B2 (ja) * 2006-11-22 2012-07-25 株式会社村田製作所 部品内蔵基板
JP4627527B2 (ja) * 2006-12-28 2011-02-09 日立オートモティブシステムズ株式会社 高周波半導体装置およびその実装方法
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US8514036B2 (en) * 2007-08-14 2013-08-20 Wemtec, Inc. Apparatus and method for mode suppression in microwave and millimeterwave packages
US8816798B2 (en) * 2007-08-14 2014-08-26 Wemtec, Inc. Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
JP2010074588A (ja) * 2008-09-19 2010-04-02 New Japan Radio Co Ltd 導波管フィルタ
JP5281504B2 (ja) * 2009-07-02 2013-09-04 株式会社ユポ・コーポレーション 電磁波遮蔽体
JP5573027B2 (ja) * 2009-07-09 2014-08-20 富士ゼロックス株式会社 電子回路を収容する容器及び電子装置
JP2011044623A (ja) * 2009-08-24 2011-03-03 Hitachi Ltd 低輻射構造を備えた電子機器
CN102415230B (zh) * 2009-12-25 2015-09-02 加川清二 复合电磁波吸收薄膜
JP2011233642A (ja) 2010-04-26 2011-11-17 Nitto Denko Corp 電磁波吸収体
JP5831450B2 (ja) * 2010-07-12 2015-12-09 日本電気株式会社 電子機器
DE102010038517A1 (de) * 2010-07-28 2012-02-02 Robert Bosch Gmbh Radom für einen Radarsensor in einem Kraftfahrzeug und entsprechender Radarsensor
JP5555087B2 (ja) 2010-07-30 2014-07-23 株式会社豊田中央研究所 レーダ装置
US9386688B2 (en) * 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
US9553371B2 (en) 2010-11-12 2017-01-24 Nxp Usa, Inc. Radar module
JP5566933B2 (ja) 2011-03-23 2014-08-06 古河電気工業株式会社 高周波通信装置
GB2496835B (en) 2011-09-23 2015-12-30 Radio Physics Solutions Ltd Package for high frequency circuits
JP6361252B2 (ja) * 2014-04-14 2018-07-25 富士通株式会社 半導体装置
JP6184610B2 (ja) * 2014-10-29 2017-08-23 三菱電機株式会社 高周波装置及び高周波装置の製造方法
JP6346373B2 (ja) * 2015-03-19 2018-06-20 株式会社東芝 電子機器
JP6723754B2 (ja) * 2016-02-08 2020-07-15 キヤノン株式会社 電子機器
US10433417B2 (en) 2016-02-08 2019-10-01 Canon Kabushiki Kaisha Electronic apparatus
JP6687469B2 (ja) 2016-06-14 2020-04-22 日立オートモティブシステムズ株式会社 ミリ波帯通信装置
JP6971119B2 (ja) * 2017-10-13 2021-11-24 株式会社ヨコオ パッチアンテナおよび車載用アンテナ装置
KR102442131B1 (ko) * 2018-01-26 2022-09-13 삼성전자 주식회사 안테나 장치 및 안테나 장치를 포함하는 전자 장치
JP2019179790A (ja) * 2018-03-30 2019-10-17 日本電信電話株式会社 高周波モジュール
JP7095582B2 (ja) * 2018-12-11 2022-07-05 日本電信電話株式会社 高周波モジュール
CN109887904A (zh) * 2019-04-16 2019-06-14 中国电子科技集团公司第十三研究所 一种毫米波芯片的封装结构及印刷电路板
US11925009B2 (en) * 2021-03-09 2024-03-05 Hamilton Sundstrand Corporation Adaptive design and fabrication of radiation shielding inserts for electronic components
JP2023098230A (ja) 2021-12-28 2023-07-10 株式会社ニフコ 高周波通信装置の電波吸収体

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JPS5834602A (ja) * 1981-08-25 1983-03-01 Tdk Corp 電波吸収体
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FI87854C (fi) * 1991-04-12 1993-02-25 Lk Products Oy Foerfarande foer att tillverka ett hoegfrekvensfilter samt hoegfrekvensfilter tillverkat enligt foerfarandet
GB9115970D0 (en) * 1991-07-24 1999-08-11 Secr Defence Brit Frequency selective radar absorbent structure
JPH08288684A (ja) * 1995-04-20 1996-11-01 K Lab:Kk 電磁波吸収体
US5886671A (en) * 1995-12-21 1999-03-23 The Boeing Company Low-cost communication phased-array antenna
JPH09246803A (ja) * 1996-03-01 1997-09-19 Murata Mfg Co Ltd 誘電体一体型ｎｒｄ線路超電導帯域通過フィルタ装置
JPH09321521A (ja) * 1996-05-31 1997-12-12 Hitachi Ltd 携帯無線端末
US6204825B1 (en) * 1997-04-10 2001-03-20 Intermec Ip Corp. Hybrid printed circuit board shield and antenna
JP3786497B2 (ja) * 1997-06-13 2006-06-14 富士通株式会社 アンテナ素子を内蔵する半導体モジュール
JPH11261283A (ja) * 1998-03-09 1999-09-24 Shimizu Corp 反射波干渉低減型電磁遮蔽建物
JP3739230B2 (ja) * 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置

Also Published As

Publication number Publication date
EP1049192A3 (de) 2002-02-06
US20020067313A1 (en) 2002-06-06
DE60017004T2 (de) 2006-04-27
US6337661B1 (en) 2002-01-08
EP1049192A2 (de) 2000-11-02
EP1049192B1 (de) 2004-12-29
US6862001B2 (en) 2005-03-01
JP3739230B2 (ja) 2006-01-25
JP2000307305A (ja) 2000-11-02

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