DE60014484D1 - Anreiss-Vorrichtung und -Verfahren - Google Patents

Anreiss-Vorrichtung und -Verfahren

Info

Publication number: DE60014484D1
Authority: DE; Germany
Prior art keywords: scribing device; scribing
Prior art date: 1999-04-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60014484T

Other languages

English (en)

Other versions

DE60014484T2 (de

Inventor

Gyo Shimotoyodome

Hirokazu Ishikawa

Takeki Shirai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

THK INTECHS CO., LTD., NERIMA, TOKYO, JP

THK Co Ltd

Original Assignee

THK Co Ltd

Beldex Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-04-06

Filing date

2000-04-04

Publication date

2004-11-11

2000-04-04 Application filed by THK Co Ltd, Beldex Corp filed Critical THK Co Ltd

2004-11-11 Application granted granted Critical

2004-11-11 Publication of DE60014484D1 publication Critical patent/DE60014484D1/de

2005-10-13 Publication of DE60014484T2 publication Critical patent/DE60014484T2/de

2020-04-05 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

DE60014484T 1999-04-06 2000-04-04 Anreiss-Vorrichtung und -Verfahren Expired - Lifetime DE60014484T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP09839599A JP4173245B2 (ja)	1999-04-06	1999-04-06	スクライブ方法
JP9839599		1999-04-06

Publications (2)

Publication Number	Publication Date
DE60014484D1 true DE60014484D1 (de)	2004-11-11
DE60014484T2 DE60014484T2 (de)	2005-10-13

Family

ID=14218660

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60014484T Expired - Lifetime DE60014484T2 (de)	1999-04-06	2000-04-04	Anreiss-Vorrichtung und -Verfahren

Country Status (6)

Country	Link
US (1)	US6478206B2 (de)
EP (1)	EP1043279B1 (de)
JP (1)	JP4173245B2 (de)
KR (1)	KR100638300B1 (de)
DE (1)	DE60014484T2 (de)
TW (1)	TW467872B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6901670B2 (en) *	2001-07-18	2005-06-07	Mitsuboshi Diamond Industrial Co., Ltd.	Scribing head, and scribing apparatus and scribing method using the scribing head
TWI286232B (en) *	2002-10-29	2007-09-01	Mitsuboshi Diamond Ind Co Ltd	Method and device for scribing fragile material substrate
KR100436486B1 (ko) *	2002-11-04	2004-06-22	전성봉	자동 금속 인쇄기
KR100923680B1 (ko) *	2003-04-29	2009-10-28	엘지디스플레이 주식회사	액정 표시패널의 절단장치
DE102004035342B4 (de) *	2004-07-21	2007-12-27	Schott Ag	Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen
US7191529B2 (en) *	2005-02-15	2007-03-20	Columbia Marking Tools	Apparatus and method for controlling a programmable marking scribe
JP2009083295A (ja) *	2007-09-28	2009-04-23	Thk Co Ltd	スクライブ装置及びスクライブ方法
TWI498293B (zh) *	2011-05-31	2015-09-01	Mitsuboshi Diamond Ind Co Ltd	劃線方法、鑽石尖、劃線裝置
US10173316B2 (en) *	2015-02-26	2019-01-08	Wolfram Labs, Inc.	Marking stylus for automated marking systems
JP6519381B2 (ja) *	2015-07-27	2019-05-29	三星ダイヤモンド工業株式会社	脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3122953A (en) *		1964-03-03		Apparatus and method of cutting glass
US1373635A (en) *	1916-03-09	1921-04-05	Rammelsberg Karl	Recording-stylus
NL284965A (de) *	1961-11-17	1900-01-01
US3567086A (en) *	1968-11-29	1971-03-02	Monsanto Co	Method of fracturing sheet material
US3680213A (en) *	1969-02-03	1972-08-01	Karl O Reichert	Method of grooving semiconductor wafer for the dividing thereof
US4095344A (en) *	1976-08-24	1978-06-20	Loomis James W	Scribe tool and mount therefor
JPS563107A (en) *	1979-06-21	1981-01-13	Toyoda Mach Works Ltd	Diamond tool
US4567797A (en) *	1984-01-30	1986-02-04	Folk Donald C	Ultrasonic cutting apparatus and methods
US5100270A (en) *	1990-03-06	1992-03-31	Artistic Mat, Inc.	Apparatus and method for cutting mat board
JPH04361556A (ja) *	1991-06-10	1992-12-15	Fujitsu Ltd	ダイシング方法
EP0540495A1 (de) *	1991-10-30	1993-05-05	GFM Gesellschaft für Fertigungstechnik und Maschinenbau Aktiengesellschaft	Verfahren zum Schneiden von Werkstücken aus faserverstärkten Kunststoffen
JPH06169149A (ja) *	1992-06-04	1994-06-14	Fujitsu Ltd	基板修正装置及び方法
WO1995019247A1 (en) *	1994-01-18	1995-07-20	Dynatex International (Inc.)	Method and apparatus for scribing and/or breaking semiconductor wafers
FR2735412B1 (fr) *	1995-06-19	1997-08-22	Unir Ultra Propre Nutrition In	Dispositif de decoupage par ultrasons
JPH0925134A (ja) *	1995-07-11	1997-01-28	Nippon Sheet Glass Co Ltd	スクライブ溝の形成方法および装置
US6470782B1 (en) *	1997-09-25	2002-10-29	Beldex Corporation	Scribe device

1999
- 1999-04-06 JP JP09839599A patent/JP4173245B2/ja not_active Expired - Lifetime
2000
- 2000-04-04 KR KR1020000017494A patent/KR100638300B1/ko not_active Expired - Lifetime
- 2000-04-04 EP EP00302839A patent/EP1043279B1/de not_active Expired - Lifetime
- 2000-04-04 DE DE60014484T patent/DE60014484T2/de not_active Expired - Lifetime
- 2000-04-05 TW TW089106209A patent/TW467872B/zh not_active IP Right Cessation
- 2000-04-06 US US09/544,299 patent/US6478206B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
KR20010014681A (ko)	2001-02-26
EP1043279B1 (de)	2004-10-06
JP2000290032A (ja)	2000-10-17
DE60014484T2 (de)	2005-10-13
EP1043279A3 (de)	2001-05-02
KR100638300B1 (ko)	2006-10-25
JP4173245B2 (ja)	2008-10-29
EP1043279A2 (de)	2000-10-11
TW467872B (en)	2001-12-11
US20020050504A1 (en)	2002-05-02
US6478206B2 (en)	2002-11-12

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DE60028676D1 (de)	2006-07-27	Positionierungsverfahren und Positionierungsvorrichtung
DE60014484D1 (de)	2004-11-11	Anreiss-Vorrichtung und -Verfahren
DE60025792D1 (de)	2006-04-13	Bearbeitungsvorrichtung und Bearbeitungsverfahren
DE60118450D1 (de)	2006-05-18	Kommunikationsverfahren und Kommunikationsgerät
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DE60041297D1 (de)	2009-02-26	Empfangsgerät und- Verfahren
DE60025435D1 (de)	2006-04-06	Parallelverarbeitungsvorrichtung und -verfahren

Legal Events

Date	Code	Title	Description
2005-11-17	8364	No opposition during term of opposition
2010-04-08	8327	Change in the person/name/address of the patent owner	Owner name: THK CO., LTD., TOKIO/TOKYO, JP Owner name: THK INTECHS CO., LTD., NERIMA, TOKYO, JP

Date

Code

Title

Description

2005-11-17

8364

No opposition during term of opposition

2010-04-08

8327

Change in the person/name/address of the patent owner

Owner name: THK CO., LTD., TOKIO/TOKYO, JP

Owner name: THK INTECHS CO., LTD., NERIMA, TOKYO, JP