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DE60011731D1 - Mehrschichtiges Millimeterwellen-Bauelement - Google Patents

Mehrschichtiges Millimeterwellen-Bauelement

Info

Publication number
DE60011731D1
DE60011731D1 DE60011731T DE60011731T DE60011731D1 DE 60011731 D1 DE60011731 D1 DE 60011731D1 DE 60011731 T DE60011731 T DE 60011731T DE 60011731 T DE60011731 T DE 60011731T DE 60011731 D1 DE60011731 D1 DE 60011731D1
Authority
DE
Germany
Prior art keywords
millimeter wave
wave device
layer millimeter
layer
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60011731T
Other languages
English (en)
Other versions
DE60011731T2 (de
Inventor
Walter R Demore
Richard A Holloway
Bruce A Holmes
Benjamin T Johnson
Dale A Londre
Lloyd Y Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T MVPD Group LLC
Original Assignee
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Electronics Corp filed Critical Hughes Electronics Corp
Application granted granted Critical
Publication of DE60011731D1 publication Critical patent/DE60011731D1/de
Publication of DE60011731T2 publication Critical patent/DE60011731T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
DE60011731T 1999-10-21 2000-10-18 Mehrschichtiges Millimeterwellen-Bauelement Expired - Lifetime DE60011731T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US422581 1999-10-21
US09/422,581 US6249439B1 (en) 1999-10-21 1999-10-21 Millimeter wave multilayer assembly

Publications (2)

Publication Number Publication Date
DE60011731D1 true DE60011731D1 (de) 2004-07-29
DE60011731T2 DE60011731T2 (de) 2005-07-07

Family

ID=23675503

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60011731T Expired - Lifetime DE60011731T2 (de) 1999-10-21 2000-10-18 Mehrschichtiges Millimeterwellen-Bauelement

Country Status (3)

Country Link
US (1) US6249439B1 (de)
EP (1) EP1094541B1 (de)
DE (1) DE60011731T2 (de)

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US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
DE69937677T2 (de) 1998-04-07 2008-11-20 X2Y Attenuators, L.L.C. Bauelementeträger
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
US6617946B2 (en) * 2000-01-13 2003-09-09 Skyworks Solutions, Inc. Microwave package
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
WO2002015360A1 (en) 2000-08-15 2002-02-21 X2Y Attenuators, L.L.C. An electrode arrangement for circuit energy conditioning
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
AU2002213356B2 (en) 2000-10-17 2005-03-10 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
US6580402B2 (en) * 2001-07-26 2003-06-17 The Boeing Company Antenna integrated ceramic chip carrier for a phased array antenna
US6738598B2 (en) * 2001-08-17 2004-05-18 The Boeing Company Multilayer radio frequency interconnect system
US6498551B1 (en) 2001-08-20 2002-12-24 Xytrans, Inc. Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC)
US6670930B2 (en) * 2001-12-05 2003-12-30 The Boeing Company Antenna-integrated printed wiring board assembly for a phased array antenna system
EP1986244B1 (de) * 2002-11-12 2017-01-11 Fujitsu Limited Montagestruktur
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
KR100548244B1 (ko) * 2003-03-14 2006-02-02 엘지전자 주식회사 저가형 능동 스마트 안테나 시스템 및 그 제조 방법
JP3734807B2 (ja) * 2003-05-19 2006-01-11 Ｔｄｋ株式会社 電子部品モジュール
EP1629582A2 (de) 2003-05-29 2006-03-01 X2Y Attenuators, L.L.C. Verbinderbezogene strukturen mit einer energie-aufbereitungseinrichtung
WO2005015719A2 (en) 2003-07-21 2005-02-17 X2Y Attenuators, Llc Filter assembly
WO2005050708A2 (en) * 2003-11-13 2005-06-02 Silicon Pipe, Inc. Stair step printed circuit board structures for high speed signal transmissions
US7271767B2 (en) * 2003-11-26 2007-09-18 The Boeing Company Beamforming architecture for multi-beam phased array antennas
US7675729B2 (en) 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
US7817397B2 (en) 2005-03-01 2010-10-19 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
GB2439862A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Conditioner with coplanar conductors
WO2006099297A2 (en) 2005-03-14 2006-09-21 X2Y Attenuators, Llc Conditioner with coplanar conductors
US7443354B2 (en) * 2005-08-09 2008-10-28 The Boeing Company Compliant, internally cooled antenna apparatus and method
CN101395683A (zh) 2006-03-07 2009-03-25 X2Y衰减器有限公司 能量调节装置结构
US8503941B2 (en) 2008-02-21 2013-08-06 The Boeing Company System and method for optimized unmanned vehicle communication using telemetry
WO2012099602A1 (en) * 2011-01-21 2012-07-26 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US8617927B1 (en) 2011-11-29 2013-12-31 Hrl Laboratories, Llc Method of mounting electronic chips
US10079160B1 (en) 2013-06-21 2018-09-18 Hrl Laboratories, Llc Surface mount package for semiconductor devices with embedded heat spreaders
US20160197400A1 (en) * 2015-01-07 2016-07-07 Delphi Technologies, Inc. Circuit board assembly with high and low frequency substrates
US9385083B1 (en) 2015-05-22 2016-07-05 Hrl Laboratories, Llc Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
US10026672B1 (en) 2015-10-21 2018-07-17 Hrl Laboratories, Llc Recursive metal embedded chip assembly
JP6420226B2 (ja) * 2015-11-19 2018-11-07 日本電信電話株式会社 インピーダンス変換器
US9508652B1 (en) 2015-11-24 2016-11-29 Hrl Laboratories, Llc Direct IC-to-package wafer level packaging with integrated thermal heat spreaders
US10950562B1 (en) 2018-11-30 2021-03-16 Hrl Laboratories, Llc Impedance-matched through-wafer transition using integrated heat-spreader technology
CN110739288B (zh) * 2019-11-12 2025-05-30 河北新华北集成电路有限公司 毫米波频段放大器芯片封装结构及制作方法

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US4862120A (en) * 1988-02-29 1989-08-29 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Wideband stripline to microstrip transition
US5206986A (en) * 1989-08-11 1993-05-04 Fujitsu Limited Method of producing an electronic circuit package
US5045820A (en) * 1989-09-27 1991-09-03 Motorola, Inc. Three-dimensional microwave circuit carrier and integral waveguide coupler
US5119048A (en) * 1990-11-05 1992-06-02 Grunwell Randall L Pseudo tapered lines using modified ground planes
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
US5219377A (en) * 1992-01-17 1993-06-15 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array package
CA2109441C (en) * 1992-10-29 1997-05-13 Yuhei Kosugi Composite microwave circuit module assembly and its connection structure
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits
US5293171A (en) * 1993-04-09 1994-03-08 Cherrette Alan R Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power
US5359488A (en) * 1993-06-21 1994-10-25 Westinghouse Electric Corporation Packaging system for a standard electronic module
US5450090A (en) * 1994-07-20 1995-09-12 The Charles Stark Draper Laboratory, Inc. Multilayer miniaturized microstrip antenna
DE4441073C1 (de) * 1994-11-18 1996-01-18 Ant Nachrichtentech Übergang von einer Microstrip-Leitung auf einen Hohlleiter
US5644277A (en) * 1995-02-27 1997-07-01 Hughes Aircraft Company Three-wire-line vertical interconnect structure for multilevel substrates
FR2743199B1 (fr) * 1996-01-03 1998-02-27 Europ Agence Spatiale Antenne reseau plane hyperfrequence receptrice et/ou emettrice, et son application a la reception de satellites de television geostationnaires
US5870063A (en) * 1996-03-26 1999-02-09 Lockheed Martin Corp. Spacecraft with modular communication payload
US5990836A (en) * 1998-12-23 1999-11-23 Hughes Electronics Corporation Multi-layered patch antenna

Also Published As

Publication number Publication date
EP1094541A3 (de) 2003-05-14
EP1094541A2 (de) 2001-04-25
EP1094541B1 (de) 2004-06-23
DE60011731T2 (de) 2005-07-07
US6249439B1 (en) 2001-06-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART