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DE60001943D1 - Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum - Google Patents

Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum

Info

Publication number
DE60001943D1
DE60001943D1 DE60001943T DE60001943T DE60001943D1 DE 60001943 D1 DE60001943 D1 DE 60001943D1 DE 60001943 T DE60001943 T DE 60001943T DE 60001943 T DE60001943 T DE 60001943T DE 60001943 D1 DE60001943 D1 DE 60001943D1
Authority
DE
Germany
Prior art keywords
integrated circuit
grid
producing
cost
portable electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60001943T
Other languages
English (en)
Inventor
Lucille Dossetto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Application granted granted Critical
Publication of DE60001943D1 publication Critical patent/DE60001943D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H10W72/07251—
    • H10W72/20—
    • H10W72/90—
    • H10W72/9415—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Details Of Aerials (AREA)
  • Electric Clocks (AREA)
DE60001943T 1999-05-25 2000-05-11 Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum Expired - Lifetime DE60001943D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9906585A FR2794266B1 (fr) 1999-05-25 1999-05-25 Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout
PCT/FR2000/001268 WO2000072254A1 (fr) 1999-05-25 2000-05-11 Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout

Publications (1)

Publication Number Publication Date
DE60001943D1 true DE60001943D1 (de) 2003-05-08

Family

ID=9545963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60001943T Expired - Lifetime DE60001943D1 (de) 1999-05-25 2000-05-11 Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum

Country Status (8)

Country Link
US (1) US6521985B1 (de)
EP (1) EP1190377B1 (de)
CN (1) CN1351733A (de)
AT (1) ATE236436T1 (de)
AU (1) AU4415800A (de)
DE (1) DE60001943D1 (de)
FR (1) FR2794266B1 (de)
WO (1) WO2000072254A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6791172B2 (en) * 2001-04-25 2004-09-14 General Semiconductor Of Taiwan, Ltd. Power semiconductor device manufactured using a chip-size package
US20050266611A1 (en) * 2004-06-01 2005-12-01 Jack Tu Flip chip packaging method and flip chip assembly thereof
EP1739596A1 (de) * 2005-06-21 2007-01-03 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
US7777317B2 (en) * 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
FR2968431B1 (fr) 2010-12-06 2012-12-28 Oberthur Technologies Procédé de fabrication d'un dispositif a microcircuit
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
US10043541B1 (en) * 2015-12-12 2018-08-07 Magnecomp Corporation Disk drive head stack assembly having height-controlled suspension circuit tail tack
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
TWI688317B (zh) * 2018-10-31 2020-03-11 台灣愛司帝科技股份有限公司 發光二極體晶片的固接方法及固接裝置
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JPH01108095A (ja) * 1987-10-20 1989-04-25 Ryoden Kasei Co Ltd Ｉｃカード
JP3061954B2 (ja) * 1991-08-20 2000-07-10 株式会社東芝 半導体装置
EP0689241A2 (de) * 1991-10-17 1995-12-27 Fujitsu Limited Halter für Halbleiterteil
TW258829B (de) * 1994-01-28 1995-10-01 Ibm
EP0688050A1 (de) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Montageverfahren für IC-Karte und so erhaltene Karte
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US5710695A (en) * 1995-11-07 1998-01-20 Vlsi Technology, Inc. Leadframe ball grid array package
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
DE19621044A1 (de) * 1996-05-24 1997-11-27 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置

Also Published As

Publication number Publication date
FR2794266B1 (fr) 2002-01-25
US6521985B1 (en) 2003-02-18
CN1351733A (zh) 2002-05-29
WO2000072254A1 (fr) 2000-11-30
EP1190377B1 (de) 2003-04-02
ATE236436T1 (de) 2003-04-15
EP1190377A1 (de) 2002-03-27
AU4415800A (en) 2000-12-12
FR2794266A1 (fr) 2000-12-01

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Legal Events

Date Code Title Description
8332 No legal effect for de