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DE59303994D1 - METHOD FOR ELECTROLYTICALLY TREATING, IN PARTICULAR, FLAT TREATMENT, AND ARRANGEMENT, IN PARTICULAR FOR IMPLEMENTING THIS METHOD - Google Patents

METHOD FOR ELECTROLYTICALLY TREATING, IN PARTICULAR, FLAT TREATMENT, AND ARRANGEMENT, IN PARTICULAR FOR IMPLEMENTING THIS METHOD

Info

Publication number
DE59303994D1
DE59303994D1 DE59303994T DE59303994T DE59303994D1 DE 59303994 D1 DE59303994 D1 DE 59303994D1 DE 59303994 T DE59303994 T DE 59303994T DE 59303994 T DE59303994 T DE 59303994T DE 59303994 D1 DE59303994 D1 DE 59303994D1
Authority
DE
Germany
Prior art keywords
implementing
arrangement
electrolytically treating
flat treatment
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59303994T
Other languages
German (de)
Inventor
Reinhard Schneider
Rolf Schroeder
Klaus Wolfer
Thomas Kosikowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority claimed from PCT/DE1993/000684 external-priority patent/WO1994003655A1/en
Application granted granted Critical
Publication of DE59303994D1 publication Critical patent/DE59303994D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE59303994T 1992-08-01 1993-08-02 METHOD FOR ELECTROLYTICALLY TREATING, IN PARTICULAR, FLAT TREATMENT, AND ARRANGEMENT, IN PARTICULAR FOR IMPLEMENTING THIS METHOD Expired - Lifetime DE59303994D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4225541 1992-08-01
DE4324330A DE4324330C2 (en) 1992-08-01 1993-07-20 Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process
PCT/DE1993/000684 WO1994003655A1 (en) 1992-08-01 1993-08-02 Process for the electrolytic processing especially of flat items and arrangement for implementing the process

Publications (1)

Publication Number Publication Date
DE59303994D1 true DE59303994D1 (en) 1996-10-31

Family

ID=6464689

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4324330A Expired - Fee Related DE4324330C2 (en) 1992-08-01 1993-07-20 Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process
DE59303994T Expired - Lifetime DE59303994D1 (en) 1992-08-01 1993-08-02 METHOD FOR ELECTROLYTICALLY TREATING, IN PARTICULAR, FLAT TREATMENT, AND ARRANGEMENT, IN PARTICULAR FOR IMPLEMENTING THIS METHOD

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE4324330A Expired - Fee Related DE4324330C2 (en) 1992-08-01 1993-07-20 Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process

Country Status (2)

Country Link
KR (1) KR100297311B1 (en)
DE (2) DE4324330C2 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4402596C2 (en) * 1994-01-28 1997-03-27 Atotech Deutschland Gmbh Electrolytic process in horizontal continuous systems and device for carrying it out
DE4417551C2 (en) * 1994-05-19 1996-04-04 Atotech Deutschland Gmbh Electrolytic method for the precise treatment of printed circuit boards and device for carrying out the method
DE4417550C1 (en) * 1994-05-19 1995-04-20 Atotech Deutschland Gmbh Method for the electrolytic treatment of microstrip line circuit boards and flexible microstrip line circuit boards
DE4418278C1 (en) * 1994-05-26 1995-04-20 Atotech Deutschland Gmbh Electrolytic process for treatment of printed circuit boards in horizontal continuous plants
DE19717512C3 (en) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
EP0959153A3 (en) 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
US6261425B1 (en) 1998-08-28 2001-07-17 Process Automation International, Ltd. Electroplating machine
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6902659B2 (en) 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
AU5733400A (en) * 1999-06-14 2001-01-02 Cvc Products, Inc. Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
US6355153B1 (en) 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US6630059B1 (en) 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
US7141146B2 (en) 2000-02-23 2006-11-28 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
DE10019713C2 (en) 2000-04-20 2003-11-13 Atotech Deutschland Gmbh Device and method for electrical contacting of goods to be treated electrolytically in continuous systems
US6478936B1 (en) 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
DE10043814C1 (en) * 2000-09-06 2002-04-11 Egon Huebel Continuous electrochemical treatment of circuit boards or other goods, comprises placing electrically-insulating, ion-permeable material between electrodes and objects
US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7416975B2 (en) 2005-09-21 2008-08-26 Novellus Systems, Inc. Method of forming contact layers on substrates
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
ITMI20070002A1 (en) * 2007-01-03 2008-07-04 Occleppo S R L NONE
DE102009057465A1 (en) 2009-12-03 2011-06-09 Hübel, Egon, Dipl.-Ing. (FH) Device for driving two rotating transport units of tunnel machine for supplying of goods by rotational axes of transport units, has drive sleeve for transport unit, which is connected in form-fit and axially adjustable manner with drive

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2415580A1 (en) * 1974-03-30 1975-10-02 Schleifenbaum & Steinmetz METHOD OF CLEANING PANELS AND CLEANING MACHINE FOR CARRYING OUT THE PROCEDURE
DE3603856C2 (en) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Method and device for galvanizing flat workpieces such as printed circuit boards
DE3645319C3 (en) * 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Arrangement and method for the electrolytic treatment of plate-shaped objects
DE3916693A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR THE TREATMENT AND / OR CLEANING OF GOODS, IN PARTICULAR BORED BOARDS
DE3916694A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR CHEMICAL TREATMENT AND / OR CLEANING OF GOODS, ESPECIALLY BOLTED PCBS AND RELATED METHOD
DE4106333C1 (en) * 1991-02-28 1992-07-16 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De

Also Published As

Publication number Publication date
KR100297311B1 (en) 2001-10-24
DE4324330C2 (en) 1994-11-17
KR950703077A (en) 1995-08-23
DE4324330A1 (en) 1994-02-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition