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DE577454C - Impedance for high frequency circuits - Google Patents

Impedance for high frequency circuits

Info

Publication number
DE577454C
DE577454C DEM119078D DEM0119078D DE577454C DE 577454 C DE577454 C DE 577454C DE M119078 D DEM119078 D DE M119078D DE M0119078 D DEM0119078 D DE M0119078D DE 577454 C DE577454 C DE 577454C
Authority
DE
Germany
Prior art keywords
increase
impedance
temperature
compensated
substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEM119078D
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Application granted granted Critical
Publication of DE577454C publication Critical patent/DE577454C/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/008Details of transformers or inductances, in general with temperature compensation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Description

Impedanz für Hochfrequenzkreise Die Erfindung bezieht sich auf Selbstinduktionen und Kapazitäten für elektrische Schwingungskreise, die vom Temperaturgang in ihren Impedanzwerten unabhängig sind.Impedance for high frequency circuits The invention relates to self inductions and capacities for electrical oscillating circuits that depend on the temperature profile in their Impedance values are independent.

Es sind bereits Generatoranordnungen bekanntgeworden, bei welchen zwecks Aufrechterhaltung der Frequenz der erzeugten Schwingungen bei Temperaturschwankungen die Anwendung von temperaturkompensierten Impedanzen vorgesehen ist.There are already generator arrangements become known in which in order to maintain the frequency of the generated vibrations in the event of temperature fluctuations the use of temperature-compensated impedances is provided.

So ist beispielsweise eine temperaturkonstante Kapazität beschrieben worden, bei welcher unter Anwendung sich geeignet ausdehnender Materialien eine Regelung des Abstandes des Rotorpaketes gegenüber dem Statorpaket des Kondensators bewirkt sind; derart, daß leine Temperaturkompensation der Impedanzschwankungen erfolgt.For example, a temperature-constant capacitance is described in which, using appropriately expanding materials, a Regulation of the distance between the rotor core and the stator core of the capacitor are effected; such that no temperature compensation for impedance fluctuations he follows.

Erfindungsgemäß sind die Impedanzen für die Hochfreduenzkreise aus derartigen Stoffen hergestellt, daß die bei Temperaturschwankungen in einer Dimension sich auswirkenden Längenänderungen durch die m einer dazu senkrechten Dimension auftretenden linearen Änderungen kompensiert werden.According to the invention, the impedances for the high-frequency circuits are off such substances produced that the temperature fluctuations in one dimension changes in length that have an effect due to the m of a dimension perpendicular to it occurring linear changes are compensated.

Im Falle von Kondensatoren sind die Stoffe, aus denen die Platten hergestellt sind, so gewählt, daß die Vergrößerung der Kapazität, die durch die Vergrößerung der Plattenfläche bei Temperaturzunahme bedingt ist, durch eine Vergrößerung des Plattenabstandes ausgeglichen wird. @ Es können die Kondensatoren als koaxiale Zylinder ausgebildet sein und der äußere Zylinder aus einem Stoff bestehen, dessenWärmeausdehnungskoeffizient größer ist als der des Stoffes des inneren Zylinders. Bei einer solchen Konstruktion wird die Wirkung der Vergrößerung der Oberflächen der Belegungen durch den vergrößerten Abstand bei Temperaturzunahme ausgeglichen.In the case of capacitors, these are the substances that make up the plates are made, chosen so that the increase in capacity caused by the Enlargement of the plate surface with an increase in temperature is caused by an enlargement the plate spacing is compensated. @ It can make the capacitors as coaxial Cylinder be formed and the outer cylinder consist of a substance whose coefficient of thermal expansion is larger than that of the fabric of the inner cylinder. With such a construction the effect of enlarging the surfaces of the coverings is increased by the Distance compensated for when the temperature rises.

Man erkennt, daß, wenn' die Belegungen aus denselben Stoffen bestehen würden, die Kapazität mit zunehmender Temperatur zunehmen würde, da das Verhältnis der Durchmesser nahezu konstant bleiben, ihre Längen hingegen wachsen würden.It can be seen that when 'the coatings consist of the same substances the capacity would increase with increasing temperature, since the ratio the diameter would remain almost constant, but their lengths would increase.

Eine entsprechende Ausführungsform ist auch für Induktionsspulen möglich. Es kann die Spule m einer oder mehreren Lagen um einen zylindrischen oder polygonalen Spulenkörper gewickelt sein. Die Anordnung ist derart, däß die proportionale axiale Ausdehnung die radiale Ausdehnung übersteigt. Eine erfindungsgemäße Selbstinduktion kann aus einer Anzahl scheibenförmiger Spulen bestehen, die parallel oder in Reihe geschaltet angeordnet sind. ,A corresponding embodiment is also possible for induction coils. The coil can have one or more layers around a cylindrical or polygonal one Be wound bobbin. The arrangement is such that the proportional axial Expansion exceeds the radial expansion. A self-induction according to the invention can consist of a number of disc-shaped coils, which are parallel or in series are arranged switched. ,

Claims (6)

PATENTANSPRÜCHE: i. Impedanz für Hochfrequenzkreise, dadurch gekennzeichnet, daß dieselbe aus derartigen Stoffen besteht, daß die -bei Temperaturschwankungen in einer Dimension sich auswirkenden Längenänderungen durch die meiner dazu senkrechten Dimension auftretenden linearen Änderungen in ihrer Wirkung auf .den Wert der Impedanz kompensiert werden. PATENT CLAIMS: i. Impedance for high frequency circuits, characterized in that that it consists of such substances that the temperature fluctuations changes in length that have an effect in one dimension due to mine perpendicular to it Linear changes occurring in their effect on the value of the impedance be compensated. 2. Kapazitive Impedanz nach Anspruch i, dadurch gekennzeichnet, daß die Belegungen des Kondensators aus solchen Stoffen hergestellt :sind und voneinander durch solche Stoffe distanziert gehalten wer-den, daßeine Vergrößerung der Kapazität, die ,einer Vergrößerung der Be-Iegungsfiäche bei Temperaturzunahme entspricht, durch eine Vergrößerung des Abstandes der Belegungen ausgeglichen wird. 2. Capacitive impedance according to claim i, characterized in that the coatings of the capacitor are made of such substances and are kept at a distance from one another by such substances that an increase in the capacitance, which corresponds to an increase in the Be-Iegungsfiäne with an increase in temperature, is compensated for by increasing the spacing between the occupancies. 3. Kapazitive Impedanz mit plattenförmigen Belegungen nach Anspruch i oder 2, dadurch gekennzeichnet, daß die Platten voneinander durch solche Träger distanziert gehalten werden, daß die Vergrößerung der Kapazität bei Temperaturzunahme durch eine Vergrößerung des Plattenabstandes ausgeglichen wird. q.. 3. Capacitive Impedance with plate-shaped coverings according to claim 1 or 2, characterized in that that the plates are kept spaced from one another by such supports that the increase in capacity with an increase in temperature by increasing the Plate spacing is compensated. q .. Kapazitive Impedanz nach Anspruch i :oder z, bei der die Belegungen als koaxiale Zylinder ausgebildet sind, dadurch :gekennzeichnet, daß der ,äußere Zylinder aus einem Stoff hergestellt ist, dessen Wärmeausdehnungskoeffizient größer als der des Stoffes des inneren Zylinders ist. Capacitive impedance according to claim i: or z, in which the assignments are designed as coaxial cylinders, characterized by: that the outer cylinder is made of a substance whose coefficient of thermal expansion is larger than that of the fabric of the inner cylinder. 5. Induktive Impedanz nach Anspruch i, dadurch gekennzeichnet, daß der die Spule tragende Spulenkörper so gewählt ist, daß seine proportionale axiale Ausdehnung bei Temperaturschwankungen die radiale Ausdehnung übersteigt. 5. Inductive impedance according to Claim i, characterized in that the bobbin carrying the bobbin is chosen in this way is that its proportional axial expansion with temperature fluctuations the radial Extension exceeds. 6. Induktive Impedanz nach Anspruch i bis 5; dadurch gekennzeichnet, daß die Indiiktanz aus einer Anzahl auf .einer gemeinsamen Achse angeordneter scheibenförmiger Teilinduktanzen besteht.6. Inductive impedance according to claim i to 5; characterized, that the indication of a number of disc-shaped Partial inductances exist.
DEM119078D 1929-05-23 1930-05-16 Impedance for high frequency circuits Expired DE577454C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB577454X 1929-05-23

Publications (1)

Publication Number Publication Date
DE577454C true DE577454C (en) 1933-05-31

Family

ID=10479928

Family Applications (1)

Application Number Title Priority Date Filing Date
DEM119078D Expired DE577454C (en) 1929-05-23 1930-05-16 Impedance for high frequency circuits

Country Status (1)

Country Link
DE (1) DE577454C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1068370B (en) * 1959-11-05 Messwandler-Bau G.m.b.H., Bamberg Error-compensated capacitive voltage converter with grounded divider capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1068370B (en) * 1959-11-05 Messwandler-Bau G.m.b.H., Bamberg Error-compensated capacitive voltage converter with grounded divider capacitor

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