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DE50114664D1 - SILICONE RUBBER FORMULATIONS AND THEIR USE - Google Patents

SILICONE RUBBER FORMULATIONS AND THEIR USE

Info

Publication number
DE50114664D1
DE50114664D1 DE50114664T DE50114664T DE50114664D1 DE 50114664 D1 DE50114664 D1 DE 50114664D1 DE 50114664 T DE50114664 T DE 50114664T DE 50114664 T DE50114664 T DE 50114664T DE 50114664 D1 DE50114664 D1 DE 50114664D1
Authority
DE
Germany
Prior art keywords
silicone rubber
rubber formulations
formulations
insulating material
low relative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50114664T
Other languages
German (de)
Inventor
Christoph Tiburtius
Eckhard Wendt
Beate Ganter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials GmbH
Momentive Performance Materials Inc
Original Assignee
Momentive Performance Materials GmbH
Momentive Performance Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Momentive Performance Materials GmbH, Momentive Performance Materials Inc filed Critical Momentive Performance Materials GmbH
Application granted granted Critical
Publication of DE50114664D1 publication Critical patent/DE50114664D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Materials For Medical Uses (AREA)

Abstract

Insulating material comprising silicone rubber formulations with low relative conductivity.
DE50114664T 2000-09-25 2001-09-25 SILICONE RUBBER FORMULATIONS AND THEIR USE Expired - Lifetime DE50114664D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10047276A DE10047276A1 (en) 2000-09-25 2000-09-25 Silicone rubber formulations with a low dielectric constant and their use as insulator material
PCT/EP2001/011092 WO2002024813A1 (en) 2000-09-25 2001-09-25 Silicone rubber formulations and the use thereof

Publications (1)

Publication Number Publication Date
DE50114664D1 true DE50114664D1 (en) 2009-03-05

Family

ID=7657426

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10047276A Ceased DE10047276A1 (en) 2000-09-25 2000-09-25 Silicone rubber formulations with a low dielectric constant and their use as insulator material
DE50114664T Expired - Lifetime DE50114664D1 (en) 2000-09-25 2001-09-25 SILICONE RUBBER FORMULATIONS AND THEIR USE

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10047276A Ceased DE10047276A1 (en) 2000-09-25 2000-09-25 Silicone rubber formulations with a low dielectric constant and their use as insulator material

Country Status (11)

Country Link
US (1) US20040092643A1 (en)
EP (1) EP1337588B1 (en)
JP (1) JP5148042B2 (en)
KR (1) KR100852028B1 (en)
CN (1) CN100349980C (en)
AT (1) ATE420925T1 (en)
AU (1) AU2002218195A1 (en)
BR (1) BR0113993A (en)
CA (1) CA2423418C (en)
DE (2) DE10047276A1 (en)
WO (1) WO2002024813A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10238369A1 (en) * 2002-08-22 2004-03-04 Degussa Ag Agent as an adhesion promoter for filled and peroxidically cross-linked rubber compounds
CN1323103C (en) * 2005-04-28 2007-06-27 陈俊光 Ball-shaped organic silicon bubber products and its preparation process
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7951871B2 (en) * 2006-11-10 2011-05-31 Exxonmobil Chemical Patents Inc. Curing rubber by hydrosilation
US8247494B2 (en) * 2009-11-23 2012-08-21 Exxonmobil Chemical Patents Inc. Thermoset compositions with dispersed thermoplastic resin therein and process for making them
CN102190890B (en) * 2010-01-26 2015-06-17 横滨橡胶株式会社 Organic silicon resin composition, using method thereof, organic silicon resin, structure comprising the same, and optical semiconductor component sealing member
DE102010062139A1 (en) * 2010-11-29 2012-05-31 Wacker Chemie Ag One-component organopolysiloxane compositions with high relative permittivity
CN102827479A (en) * 2012-08-20 2012-12-19 中昊晨光化工研究院有限公司 Liquid silicone rubber
CN103756329B (en) * 2013-12-25 2016-04-27 广东阿尔派新材料股份有限公司 A kind of electro-insulating rubber being applied to electric cable fitting and preparation method thereof
JP7457450B2 (en) * 2017-10-20 2024-03-28 信越化学工業株式会社 Silicone compositions, cured silicone rubber products, and power cables
CN114752223B (en) * 2022-05-13 2023-06-30 成都拓利科技股份有限公司 High-strength leakage-resistant tracking liquid silicone rubber and preparation method thereof
CN116875057B (en) * 2023-08-04 2024-04-05 浙江凌志新能源科技有限公司 Preparation method of low-density silicone rubber foaming material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290754A (en) * 1986-06-11 1987-12-17 Toshiba Silicone Co Ltd Method of preventing interference in curing
JPH01313565A (en) * 1988-06-10 1989-12-19 Toray Dow Corning Silicone Co Ltd Curable organopolysiloxane composition
JP3270489B2 (en) * 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 Curable organopolysiloxane composition
KR0135217B1 (en) * 1993-10-25 1998-04-22 에리히 프랑크, 칼-하인즈 림뵉 Transition Metal Containing Hydrophobic Silica
JPH1046029A (en) * 1996-07-30 1998-02-17 Toray Dow Corning Silicone Co Ltd Silicone rubber composition and its production
JP3488345B2 (en) * 1996-08-20 2004-01-19 信越化学工業株式会社 Curable silicone rubber composition, cured product thereof, and resin-sealed semiconductor device sealed thereby
JPH1112470A (en) * 1997-06-25 1999-01-19 Toray Dow Corning Silicone Co Ltd Liquid silicone rubber composition for high-voltage electrical insulating component
JP3354104B2 (en) * 1998-08-04 2002-12-09 ソニー株式会社 How to insulate a cathode ray tube

Also Published As

Publication number Publication date
DE10047276A1 (en) 2002-04-18
HK1071152A1 (en) 2005-07-08
CN1553937A (en) 2004-12-08
KR100852028B1 (en) 2008-08-13
CA2423418A1 (en) 2003-03-24
US20040092643A1 (en) 2004-05-13
CN100349980C (en) 2007-11-21
EP1337588A1 (en) 2003-08-27
CA2423418C (en) 2010-04-06
KR20030045812A (en) 2003-06-11
BR0113993A (en) 2003-08-12
ATE420925T1 (en) 2009-01-15
AU2002218195A1 (en) 2002-04-02
JP5148042B2 (en) 2013-02-20
EP1337588B1 (en) 2009-01-14
WO2002024813A1 (en) 2002-03-28
JP2004510010A (en) 2004-04-02

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Legal Events

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