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DE4015941A1 - Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board - Google Patents

Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board

Info

Publication number
DE4015941A1
DE4015941A1 DE4015941A DE4015941A DE4015941A1 DE 4015941 A1 DE4015941 A1 DE 4015941A1 DE 4015941 A DE4015941 A DE 4015941A DE 4015941 A DE4015941 A DE 4015941A DE 4015941 A1 DE4015941 A1 DE 4015941A1
Authority
DE
Germany
Prior art keywords
liquid
fluorescent
pins
fluorescent liquid
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4015941A
Other languages
German (de)
Inventor
Gustav Flier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE4015941A priority Critical patent/DE4015941A1/en
Publication of DE4015941A1 publication Critical patent/DE4015941A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The method of accurately mounting components (5) onto a circuit board (7) uses the chip mounting machine (4) which picks up the chip (5) whose pins (2) are first dipped into a fluorescent liquid (6) before mounting. The component (5) is then placed onto the contact pads (1) of the board (7) where the liquid (8) on the pins (2) is spread out to an edge region (10) by the pads (1) such that the camera (3) sees a distinct contrast and can carry out accurate position control or correction. USE/ADVANTAGE - Enables pins to be accurately located onto contact pads of circuit board and their positioning to be controlled, checked and corrected by automatic camera. Damaged pins can also be detected and faulty chip replaced. Enables fully automated, fast and accurate mounting of chips, on high density circuit boards.

Description

Mit der immer weiter zunehmenden Bestückungsdichte von Leiterplatten und fortschreitender Integrierung der Mikrochips mit entsprechend zu­ nehmender Anzahl ihrer Anschlußpins, kommt die autovisuelle Zuordnungs­ bestimmung bei der automatischen Bestückung von Leiterplatten durch Be­ stückungsautomaten immer mehr zur Anwendung.With the ever increasing density of PCBs and progressive integration of the microchips with accordingly increasing number of their connecting pins, comes the autovisual assignment determination in the automatic assembly of printed circuit boards by Be automatic dispensing machines are increasingly being used.

Dabei wird über eine Kamera die Lage des Bauteils, bzw. seiner Pins, zur Lage der entsprechenden Löt-Pads auf der Leiterplatte geortet, über­ wacht und korrigiert, um das Bauteil lagegerecht auf die Leiterplatte abzusetzen.The position of the component or its pins is the location of the corresponding solder pads on the circuit board, via watches and corrects to ensure that the component is correctly positioned on the circuit board to discontinue.

Gleichzeitig ist eine Überwachung auf beschädigte Pins möglich, um für diesen Fall das zu bestückende Chip auszusondern.At the same time, monitoring for damaged pins is possible in order for in this case, separate the chip to be populated.

Erfindungsgemäß soll die hohe Anforderung an die Lagegenauigkeit von Pads (1) zu Pins (2) über die Aufnahmekamera (3) dadurch eine Verbes­ serung erfahren, daß der Bestückungskopf (4) des Bestückungsautomaten mit dem aufgenommenen Chip (5) - siehe Abbildung 1 - dessen Pins (2) vor dem Bestückungsvorgang auf eine fluoreszierende Flüssigkeit (6) zur Benetzung der Pins (2) mit (6) absetzt. Danach wird wie üblich das Bauteil (5) auf die Pads (1) der Leiterplatte (7) abgesetzt, wobei die an den Pins (2) zur Benetzung gekommene Flüssigkeit (8) durch die Pads (1) an die Flankenränder (9) der Pins (2) zur Randzone (10) ab­ gedrängt wird - siehe Abbildung 2 - und durch ihre Fluoreszenz im Licht der Aufnahmekamera (3) einen deutlich abgezeichneten Kontrast bildet, der eine verbesserte Lagekontrolle, bzw. eine weiterführende Korrek­ tur ermöglicht. Zudem läßt dieses Verfahren eine Kontrolle darüber zu, ob alle Pads (1) und Pins (2) zur Auflage gekommen sind, da eine fehlen­ de Auflage die Randzone (10) nur sehr schwach oder gar nicht ausbil­ det und somit Hinweis auf diesen Fehler gibt.According to the invention, the high demands on the positional accuracy of pads ( 1 ) to pins ( 2 ) via the recording camera ( 3 ) should be improved in that the placement head ( 4 ) of the placement machine with the recorded chip ( 5 ) - see Figure 1 - whose pins ( 2 ) are placed on a fluorescent liquid ( 6 ) for wetting the pins ( 2 ) with ( 6 ) before the assembly process. Then, as usual, the component ( 5 ) is placed on the pads ( 1 ) of the printed circuit board ( 7 ), the liquid ( 8 ) coming into contact with the pins ( 2 ) through the pads ( 1 ) on the flank edges ( 9 ) Pins ( 2 ) are pushed to the edge zone ( 10 ) - see Figure 2 - and through their fluorescence in the light of the recording camera ( 3 ) forms a clearly visible contrast, which enables improved position control or further correction. In addition, this method allows a check of whether all pads ( 1 ) and pins ( 2 ) have been placed on the support, since a lack of support the edge zone ( 10 ) only very weakly or not at all and thus gives an indication of this error .

Claims (12)

1. Kontrastverstärkte, autovisuelle Zuordungsbestimmung durch ablage­ definierter, fluoreszierender Flankenränder, insbesondere für die autovisuelle Bestückung von Leiterplatten mit hochintegrierten Mikrochips, erfindungsgemäß dadurch gekennzeichnet, daß die An­ schlußpins des zu bestückenden Bauteils vor seiner Bestückung mit einer fluoreszierenden Flüssigkeit benetzt werden, solcher Art, daß die anhaftende Flüssigkeit beim Aufsetzen der Pins auf die zu­ geordneten Leiterpads an die Randzonen der Pins abgedrängt wird und dort eine fluoreszierende, kontrastbildende Randzone ausbilden.1. Contrast-enhanced, autovisual assignment determination by depositing defined, fluorescent flank edges, in particular for the autovisual assembly of printed circuit boards with highly integrated microchips, according to the invention, characterized in that the connection pins of the component to be assembled are wetted with a fluorescent liquid before it is assembled, in such a way that the adhering liquid is pushed onto the edge zones of the pins when the pins are placed on the assigned conductor pads and there form a fluorescent, contrast-forming edge zone. 2. Nach Anspruch 1 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüssigkeit in einem Behälter mit dosiertem Zu­ lauf einen offenen Flüssigkeitspiegel besitzt.2. According to claim 1, characterized in that the fluorescent liquid in a container with dosed addition barrel has an open liquid level. 3. Nach Anspruch 1 und 2 erfindungsgemäß dadurch gekennzeichnet, daß der Flüssigkeitsbehälter eine im Arbeitstakt freiwerdende Tauch­ öffnung besitzt.3. According to claim 1 and 2, characterized in that the liquid container is a dive released in the work cycle opening. 4. Nach Anspruch 1 bis 3 erfindungsgemäß dadurch gekennzeichnet, daß eine schwammartige Behältereinlage die fluoreszierende Flüssig­ keit aufnimmt.4. According to claim 1 to 3, characterized in that a sponge-like container insert the fluorescent liquid takes up. 5. Nach Anspruch 1 bis 4 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüssigkeit einen niedrigen Siedepunkt besitzt.5. According to claim 1 to 4, characterized in that the fluorescent liquid has a low boiling point. 6. Nach Anspruch 1 bis 5 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüssigkeit und ihre Verdampfungsrückstände sich lötneutral verhalten.6. According to claim 1 to 5, characterized in that the fluorescent liquid and its evaporation residues behave solder-neutral. 7. Nach Anspruch 6 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüssigkeit und ihre Verdampfungsrückstände sich lötaktiv verhalten.7. According to claim 6, characterized in that the fluorescent liquid and its evaporation residues themselves behave soldering. 8. Nach Anspruch 1 bis 7 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüßigkeit eine benetzungsfreundliches Additiv besitzt. 8. According to claim 1 to 7, characterized in that the fluorescent liquid is a wetting-friendly additive owns.   9. Nach Anspruch 1 bis 8 erfindungsgemäß dadurch gekennzeichnet, daß die Fluoreszenzfarbe der Flüssigkeit auf eine hohe Empfindlichkeit der Kamera-Aufnahme ausgelegt ist.9. According to claim 1 to 8, characterized in that the fluorescent color of the liquid for high sensitivity the camera recording is designed. 10. Nach Anspruch 1 bis 4 erfindungsgemäß dadurch gekennzeichnet, daß die fluoreszierende Flüssikeit zur Unterstützung der Pin-Be­ netzung mit Ultraschall beaufschlagt ist.10. According to claim 1 to 4, characterized in that that the fluorescent liquid to support the Pin-Be ultrasound is applied to the network. 11. Nach Anspruch 10 erfindungsgemäß dadurch gekennzeichnet, daß die Ultraschallbeaufschlagung der fluoreszierenden Flüssigkeit kurz­ fristig während des Tauchvorgangs erfolgt.11. According to claim 10, characterized in that the Ultrasound exposure to the fluorescent liquid briefly timely during the diving process. 12. Nach Anspruch 1 bis 8 erfindungsgemäß dadurch gekennzeichnet, daß die Verdampfungsrückstände der fluoreszierenden Flüssigkeit eine Klebewirkung zwischen Pins und Pads aufbringen.12. According to claim 1 to 8, characterized in that the evaporation residues of the fluorescent liquid Apply adhesive effect between pins and pads.
DE4015941A 1990-05-18 1990-05-18 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board Withdrawn DE4015941A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4015941A DE4015941A1 (en) 1990-05-18 1990-05-18 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4015941A DE4015941A1 (en) 1990-05-18 1990-05-18 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board

Publications (1)

Publication Number Publication Date
DE4015941A1 true DE4015941A1 (en) 1991-11-21

Family

ID=6406656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4015941A Withdrawn DE4015941A1 (en) 1990-05-18 1990-05-18 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board

Country Status (1)

Country Link
DE (1) DE4015941A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002015659A1 (en) * 2000-08-17 2002-02-21 Datacon Semiconductor Equipment Gmbh Method and device for the fixing of electronic circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002015659A1 (en) * 2000-08-17 2002-02-21 Datacon Semiconductor Equipment Gmbh Method and device for the fixing of electronic circuits

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Legal Events

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8139 Disposal/non-payment of the annual fee