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DE3842572A1 - Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards - Google Patents

Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards

Info

Publication number
DE3842572A1
DE3842572A1 DE3842572A DE3842572A DE3842572A1 DE 3842572 A1 DE3842572 A1 DE 3842572A1 DE 3842572 A DE3842572 A DE 3842572A DE 3842572 A DE3842572 A DE 3842572A DE 3842572 A1 DE3842572 A1 DE 3842572A1
Authority
DE
Germany
Prior art keywords
metal strip
soldering
conductor strips
comb
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3842572A
Other languages
German (de)
Inventor
Manfred Dipl Ing Mueller
Andreas Dipl Ing Thiel
Uwe Kalicinski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE3842572A priority Critical patent/DE3842572A1/en
Publication of DE3842572A1 publication Critical patent/DE3842572A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention is based on the object of simplifying a known method in the case of which the central region of the conductor strips belonging to a soldering comb is covered on both sides by in each case one piece of insulating material film. The achievement of this object comprises the conductor strips (11) belonging to a soldering comb being machined out of a sheet-metal strip (10), the sheet-metal strip being inserted into a screen-printing device (20) and resting on a retaining plate (21) which is provided with a flat depression (22) in the region to be covered. A solder resist is used as the varnish, which also covers the side surface and the underneath of the conductor strips when it is applied. A preferred field of application is the two printed circuit boards, which are to be connected by a soldering comb, of a hearing aid. The drawing shows a cross-section through a screen-printing device having a sheet-metal strip inserted. <IMAGE>

Description

Die Erfindung geht von einem Verfahren nach dem Oberbegriff des Anspruchs 1 aus.The invention relates to a method according to the preamble of Claim 1 from.

Stand der TechnikState of the art

Es ist bekannt, einen Lötkamm aus parallelen Leiterstreifen herzu­ stellen, indem die Leiterstreifen zunächst an den Enden durch Stege miteinander verbunden sind. Anschließend wird der mittlere Bereich der Leiterstreifen auf beiden Seiten durch je eine selbstklebende Isolierstoffolie abgedeckt. Nunmehr können die Stege entfernt wer­ den, weil die Isolierstoffolien die Leiterstreifen zusammenhalten. Nachteilig ist bei dem bekannten Verfahren, daß verhältnismäßig teures Folienmaterial benötigt wird. Ein weiterer Nachteil ergibt sich, wenn die Leiterstreifen und Stege für mehrere Lötkämme Be­ standteil eines sogenannten Nutzens sind, das heißt aus einem grö­ ßeren Blechstreifen durch Ätzen oder Stanzen hergestellt sind. In diesem Fall muß dann das Aufkleben der Isolierstoffolien nacheinan­ der erfolgen, wozu ein bestimmter Zeitaufwand erforderlich ist.It is known to use a soldering comb made of parallel conductor strips place the conductor strips first at the ends through webs are interconnected. Then the middle area the conductor strip on both sides by a self-adhesive Insulating film covered. Now the bars can be removed because the insulating foils hold the conductor strips together. A disadvantage of the known method is that it is relatively expensive film material is needed. Another disadvantage arises if the conductor strips and bars for multiple soldering combs Be are part of a so-called benefit, that is, from a large Outer metal strips are made by etching or stamping. In In this case, the insulating films must be glued on one after the other that take place, which takes a certain amount of time.

Aufgabetask

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren gemäß dem Oberbegriff des Anspruchs 1 derart weiterzubilden, daß sich die Her­ stellung von Lötkämmen vereinfachen, verbilligen und beschleunigen läßt. The invention has for its object a method according to the Develop the preamble of claim 1 such that the Her simplify, reduce the cost and speed up the placement of soldering combs leaves.  

Lösungsolution

Diese Aufgabe wird bei einem Verfahren gemäß dem Oberbegriff des Anspruchs 1 durch die im kennzeichnenden Teil dieses Anspruchs an­ gegebenen Merkmale gelöst. Die mit der Erfindung erzielbaren Vor­ teile bestehen insbesondere darin, daß die Herstellung von Lötkäm­ men vereinfacht, verbilligt und beschleunigt wird.This task is carried out in a method according to the preamble of Claim 1 by in the characterizing part of this claim given characteristics solved. The achievable with the invention parts consist in particular in the fact that the production of solder comb simplified, cheaper and accelerated.

Ein bevorzugtes Anwendungsgebiet für die Erfindung sind Hörgeräte, deren parallel übereinander angeordnete Leiterplatten durch einen Lötkamm verbunden sind.A preferred field of application for the invention is hearing aids, the parallel printed circuit boards arranged by one Soldering comb are connected.

Beschreibungdescription

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung an Hand mehrerer Figuren dargestellt und wird im folgenden näher erläutert. Es zeigenAn embodiment of the invention is in the drawing on hand shown several figures and is explained in more detail below. Show it

Fig. 1 eine Ansicht eines geätzten oder gestanzten Blechsteifens, Fig. 1 is a view of an etched or stamped Blechsteifens,

Fig. 2 eine Schnittansicht einer erfindungsgemäßen Siebdruckvorrichtung, Fig. 2 is a sectional view of a screen printing apparatus according to the invention,

Fig. 3 eine Ansicht eines bedruckten Blechstreifens, Fig. 3 is a view of a printed sheet metal strip,

Fig. 4 einen zwei Leiterplatten verbindenden Lötkamm in aufgeklapptem Zustand und Fig. 4 a soldering comb connecting two circuit boards in the opened state and

Fig. 5 einen zwei Leiterplatten verbindenden Lötkamm in fertig gebogenem Zustand. Fig. 5 a soldering comb connecting two circuit boards in the finished bent state.

In Fig. 1 ist ein länglicher Blechstreifen 10 gezeigt, aus dem Leiter­ streifen 11, 12 durch Ätzen oder Stanzen herausgearbeitet sind. An den Enden sind die Leiterstreifen jeweils durch Stege 13 miteinander verbun­ den. Der Blechstreifen 10 wird in eine Siebdruckvorrichtung 20 einge­ führt und ruht auf einer metallischen Aufnahmeplatte 21, die an der Ober­ seite eine Vertiefung 22 enthält, deren Abmessungen der auf dem mittle­ ren Bereich der Leiterstreifen anzubringenden Isolierstoffabdeckung 30 (Fig. 3) entsprechen.In Fig. 1 an elongated sheet metal strip 10 is shown, from the conductor strips 11 , 12 are worked out by etching or punching. At the ends, the conductor strips are each connected to one another by webs 13 . The sheet metal strip 10 is inserted into a screen printing device 20 and rests on a metal mounting plate 21 which contains a recess 22 on the upper side, the dimensions of which correspond to the insulating material cover 30 to be attached to the central region of the conductor strips ( FIG. 3).

Zu der Siebdruckvorrichtung 20 gehören in bekannter Weise ein Sieb 23 und eine Maske 24, deren längliche Öffnungen 25 jeweils einem Leiter­ streifen 11 gegenüberstehen. Die Öffnungen 25 weisen je eine Länge auf, die der Breite b der Isolierstoffabdeckung 30 entspricht.In a known manner, the screen printing device 20 includes a screen 23 and a mask 24 , the elongated openings 25 of which strip 11 each face a conductor. The openings 25 each have a length that corresponds to the width b of the insulating material cover 30 .

Durch Aufbringen von Lötstopplack auf die Maske 24 gelangt dieser durch die Öffnungen 25 und das Sieb 23 hindurch auf die Leiterstreifen 11 und um diese herum in die Vertiefung 22 hinein. Werden dann Maske 24 und Sieb 23 abgehoben und ist der Lötstopplack getrocknet, dann sind die Leiterstreifen 11 in ihrem mittleren Bereich beidseitig von der Iso­ lierstoffabdeckung 30 umgeben. Anschließend werden die Stege 13 entlang der Linien 31, 32 (Fig. 3) abgetrennt, so daß ein Lötkamm 40 (Fig. 4) entsteht. Der Lötkamm 40 wird mit seinem entweder vollständig oder nur an den Enden vorverzinnten Leiterstreifen 11 auf entsprechende Kontakt­ flächen 41, 42 zweier Leiterplatten 43, 44 gelegt. Die Kontaktflächen stehen über Leiterbahnen 45, 46 mit elektrischen Bauelementen in Ver­ bindung, von denen in Fig. 4 nur zwei Bauelemente 47, 48 gezeigt sind.By applying solder mask to the mask 24 , the mask 24 passes through the openings 25 and the sieve 23 onto the conductor strips 11 and around them into the recess 22 . Then mask 24 and the screen 23 is lifted and the solder resist is dried, then the conductor strips 11 are surrounded in its central region on both sides of the lierstoffabdeckung Iso 30th The webs 13 are then cut off along the lines 31, 32 ( FIG. 3), so that a soldering comb 40 ( FIG. 4) is produced. The soldering comb 40 is either completely or only tinned at the ends of the conductor strips 11 on corresponding contact surfaces 41 , 42 of two circuit boards 43 , 44 . The contact surfaces are connected via conductor tracks 45 , 46 to electrical components in Ver, of which only two components 47 , 48 are shown in FIG. 4.

Nach dem vorzugsweise maschinellen Löten des Lötkamms werden die beiden Leiterplatten 43, 44 parallel zueinander geklappt, wobei die Enden der Leiterstreifen 11 an der Längskante der Isolierstoffabdeckung 30 abge­ winkelt werden; vgl. Fig. 5.After the preferably automatic soldering the Lötkamms the two printed circuit boards 43 are folded parallel to each other 44, the ends of the conductor strips 11 at the longitudinal edge of the insulating cover 30 are abge angles; see. Fig. 5.

Der Lötstopplack ist vorzugsweise ein Zweikomponenten-Lötstopplack.The solder mask is preferably a two-component solder mask.

Als Material für den Blechstreifen eignet sich insbesondere CuBe-Blech.CuBe sheet metal is particularly suitable as the material for the sheet metal strip.

Claims (5)

1. Verfahren zum Herstellen eines Lötkamms für das elektrische und mechanische Verbinden von Leiterplatten, wobei der Lötkamm aus parallelen Leiterstreifen besteht, die an den Enden durch Stege verbunden sind, in ihrem mittleren Bereich beidseitig durch Iso­ liermaterial abgedeckt werden und deren Stege nach dem Abdecken der Leiterstreifen entfernt werden, dadurch gekennzeichnet, daß das beidseitige Aufbringen des Isoliermaterials durch Siebdruck mittels flexiblen Lötstopplacks in einem Siebdruckarbeitsgang erfolgt.1. A method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards, the soldering comb consisting of parallel conductor strips which are connected at the ends by webs, are covered on both sides in their central region by insulating material and whose webs after covering the Conductor strips are removed, characterized in that the insulation material is applied on both sides by screen printing by means of flexible solder mask in one screen printing operation. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß zum gleichzeitigen Herstellen mehrerer Lötkämme (40) die Leiterstrei­ fen (11) und Stege (13) aus einem Blechstreifen (10) geätzt oder gestanzt werden.2. The method according to claim 1, characterized in that for the simultaneous production of several soldering combs ( 40 ) the Leiterstrei fen ( 11 ) and webs ( 13 ) from a sheet metal strip ( 10 ) are etched or punched. 3. Blechstreifen für ein Verfahren nach Anspruch 2, dadurch gekenn­ zeichnet, daß der Blechstreifen aus einem verzinnten CuBe-Blech besteht.3. Sheet metal strip for a method according to claim 2, characterized records that the metal strip from a tinned CuBe sheet consists. 4. Lötstopplack für ein Verfahren nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Lötstopplack ein Zweikomponenten-Lötstopplack ist.4. solder mask for a method according to claim 1, characterized records that the solder mask is a two-component solder mask is. 5. Siebdruckvorrichtung für ein Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Aufnahmeplatte (21) für den zu bedrucken­ den Blechstreifen (10) eine flache Vertiefung (22) zur Aufnahme des Lötstopplacks enthält.5. Screen printing device for a method according to claim 1, characterized in that the receiving plate ( 21 ) for the sheet metal strip ( 10 ) to be printed contains a flat depression ( 22 ) for receiving the solder resist.
DE3842572A 1988-12-17 1988-12-17 Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards Withdrawn DE3842572A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3842572A DE3842572A1 (en) 1988-12-17 1988-12-17 Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3842572A DE3842572A1 (en) 1988-12-17 1988-12-17 Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards

Publications (1)

Publication Number Publication Date
DE3842572A1 true DE3842572A1 (en) 1990-06-21

Family

ID=6369432

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3842572A Withdrawn DE3842572A1 (en) 1988-12-17 1988-12-17 Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards

Country Status (1)

Country Link
DE (1) DE3842572A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0891128A1 (en) * 1997-07-11 1999-01-13 Lucas S.E.I. Wiring Systems Limited Circuit board
DE102005056208A1 (en) * 2005-11-25 2007-06-06 Robert Bosch Gmbh Contact arrangements for controller on ceramic substrate, used in e.g. vehicle braking system, employs fan-out connections made without wire bonding
EP2988530A1 (en) * 2014-08-19 2016-02-24 Starkey Laboratories, Inc. Flexible hearing aid circuit with motherboard and peripheral attachments
EP3076488A1 (en) 2015-03-31 2016-10-05 SUMIDA flexible connections GmbH Electrical connector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0891128A1 (en) * 1997-07-11 1999-01-13 Lucas S.E.I. Wiring Systems Limited Circuit board
DE102005056208A1 (en) * 2005-11-25 2007-06-06 Robert Bosch Gmbh Contact arrangements for controller on ceramic substrate, used in e.g. vehicle braking system, employs fan-out connections made without wire bonding
EP2988530A1 (en) * 2014-08-19 2016-02-24 Starkey Laboratories, Inc. Flexible hearing aid circuit with motherboard and peripheral attachments
US10827283B2 (en) 2014-08-19 2020-11-03 Starkey Laboratories, Inc. Flexible hearing aid circuit with motherboard and peripheral attachments
EP3076488A1 (en) 2015-03-31 2016-10-05 SUMIDA flexible connections GmbH Electrical connector
DE102015104923A1 (en) 2015-03-31 2016-10-06 Sumida Flexible Connections Gmbh Electrical connector

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