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DE3641688C2 - - Google Patents

Info

Publication number
DE3641688C2
DE3641688C2 DE3641688A DE3641688A DE3641688C2 DE 3641688 C2 DE3641688 C2 DE 3641688C2 DE 3641688 A DE3641688 A DE 3641688A DE 3641688 A DE3641688 A DE 3641688A DE 3641688 C2 DE3641688 C2 DE 3641688C2
Authority
DE
Germany
Prior art keywords
ball
electrode layer
depth
copper
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3641688A
Other languages
German (de)
English (en)
Other versions
DE3641688A1 (de
Inventor
Kazumichi Machida
Jitsuho Amagasaki Hyogo Jp Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60291084A external-priority patent/JPS62150730A/ja
Priority claimed from JP61017348A external-priority patent/JPS62174936A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3641688A1 publication Critical patent/DE3641688A1/de
Application granted granted Critical
Publication of DE3641688C2 publication Critical patent/DE3641688C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • H10W72/019—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0098—Tests specified by its name, e.g. Charpy, Brinnel, Mullen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10P74/203—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/934—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19863641688 1985-12-24 1986-12-06 Verfahren zur qualitaetspruefung einer elektrodenschicht eines halbleiterbauelements Granted DE3641688A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60291084A JPS62150730A (ja) 1985-12-24 1985-12-24 半導体装置の評価方法
JP61017348A JPS62174936A (ja) 1986-01-28 1986-01-28 半導体装置の評価方法

Publications (2)

Publication Number Publication Date
DE3641688A1 DE3641688A1 (de) 1987-07-02
DE3641688C2 true DE3641688C2 (ja) 1989-10-12

Family

ID=26353848

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863641688 Granted DE3641688A1 (de) 1985-12-24 1986-12-06 Verfahren zur qualitaetspruefung einer elektrodenschicht eines halbleiterbauelements

Country Status (1)

Country Link
DE (1) DE3641688A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030951A1 (de) * 2007-07-04 2009-01-08 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013222439B4 (de) 2013-11-05 2023-10-12 F&S Bondtec Semiconductor GmbH Messung der Nachgiebigkeit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030951A1 (de) * 2007-07-04 2009-01-08 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts
DE102007030951B4 (de) * 2007-07-04 2011-05-12 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts

Also Published As

Publication number Publication date
DE3641688A1 (de) 1987-07-02

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee