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DE3543007C1 - Device for aligning an optical fibre - Google Patents

Device for aligning an optical fibre

Info

Publication number
DE3543007C1
DE3543007C1 DE3543007A DE3543007A DE3543007C1 DE 3543007 C1 DE3543007 C1 DE 3543007C1 DE 3543007 A DE3543007 A DE 3543007A DE 3543007 A DE3543007 A DE 3543007A DE 3543007 C1 DE3543007 C1 DE 3543007C1
Authority
DE
Germany
Prior art keywords
optical fiber
light
layer
silicon
bimetallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3543007A
Other languages
German (de)
Inventor
Walter Pfeiffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Priority to DE3543007A priority Critical patent/DE3543007C1/en
Application granted granted Critical
Publication of DE3543007C1 publication Critical patent/DE3543007C1/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • G02B6/3803—Adjustment or alignment devices for alignment prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

In a device for aligning an optical fibre (11) in the direction of a light source (13), the optical fibre (11) is mounted coaxially on a bimetallic element (5) at a distance from the light source (13). The layer (4) of the bimetallic element (5) having the higher coefficient of thermal expansion can be heated via a light-receiving element (7), which is irradiated via the light flux (14) of the optical fibre (11) and downstream of which an amplifier (8) and an electronic control system (9) are connected, and can be aligned with the centre of an aperture stop (15) arranged in front of the light source (13). <IMAGE>

Description

Die Erfindung bezieht sich auf eine Vorrichtung zum Ausrichten einer Lichtleitfaser in Richtung einer Lichtquelle.The invention relates to a device for Aligning an optical fiber towards one Light source.

Bei bekannten Anordnungen, bei denen das Licht aus ei­ ner Lichtquelle mit kleinem Abstrahlwinkel in eine Lichtleitfaser geleitet werden soll, wird die Licht­ leitfaser mechanisch, z.B. in eine Mikrometerschraube gefaßt und auf die Lichtquelle justiert. Nach der Ju­ stierung wird die Stellung der Lichtleitfaser, z.B. durch Klebstoff, fixiert. Dieses Verfahren ist zeitauf­ wendig und erfordert, insbesondere wenn mehrere Licht­ leitfasern einer Steuer- oder Regelungsanlage zu ju­ stieren sind, viel Platz für die Handhabung der Mikro­ meterschraube. Bei einem erforderlichen Nachjustieren muß die Lichtleitfaser wieder von ihrem Untergrund ge­ löst werden.In known arrangements in which the light from egg ner light source with a small beam angle into one Optical fiber should be routed, the light mechanically conductive fiber, e.g. in a micrometer screw caught and adjusted to the light source. After the Ju The position of the optical fiber, e.g. fixed by adhesive. This process is time-consuming agile and required, especially when multiple lights fibers of a control system for ju bulls, plenty of space for handling the micro meter screw. If necessary readjustment the optical fiber must again ge from its background be solved.

Der Erfindung liegt die Aufgabe zugrunde, das Ausrich­ ten von Lichtleitfasern in Richtung einer Lichtquelle automatisch vorzunehmen. Diese Aufgabe wird durch die in den Ansprüchen gekennzeichneten Merkmale gelöst.The invention has for its object the alignment optical fibers towards a light source automatically. This task is accomplished by the features characterized in the claims solved.

Mit Hilfe der erfindungsgemäßen Vorrichtung erfolgt ei­ ne ständige Selbstjustierung der Lichtleitfaser. Wenn bei einem Ausweichen der Lichtleitfaser aus dem Licht­ strahl der Lichtquelle das lichtempfangende Element ge­ ringer bestrahlt wird, erfolgt über den Verstärker und die Regelelektronik automatisch eine Rückführung der Lichtleitfaser in den Lichtstrahl der Lichtquelle. Bei einem Aufbau in integrierter Bauweise auf einem Sili­ ziumplättchen kann die gesamte Vorrichtung äußerst klein gehalten werden mit einer Länge von 5-10 mm, ei­ ner Breite von 1-3 mm und einer Höhe von maximal 1 mm. Dadurch ist eine äußerst billige Fertigung und Pa­ rallelmontage von vielen Lichtleitfasern auf kleinstem Raum möglich.With the help of the device according to the invention, egg ne constant self-adjustment of the optical fiber. If if the optical fiber diverts from the light beam of the light source, the light receiving element is irradiated via the amplifier and the control electronics automatically return the Optical fiber in the light beam of the light source. At a structure in an integrated design on a silo The entire device can be extremely platy be kept small with a length of 5-10 mm, egg  ner width of 1-3 mm and a maximum height of 1 mm. This makes it extremely cheap to manufacture and pa Parallel installation of many optical fibers on the smallest Space possible.

Die Erfindung wird nachstehend anhand einer in der Zeichnung dargestellten Ausführungsform erläutert. Es zeigen in stark vergrößerter Darstellung:The invention is illustrated below in a Drawing illustrated embodiment explained. It show in a greatly enlarged representation:

Fig. 1 einen Schnitt durch eine Vorrichtung zum Aus­ richten einer Lichtleitfaser entsprechend den Linien I-I der Fig. 2 und Fig. 1 shows a section through an apparatus for aligning an optical fiber according to the lines II of Fig. 2 and

Fig. 2 eine Draufsicht auf die Vorrichtung nach Fig. 1. FIG. 2 shows a top view of the device according to FIG. 1.

In eine kleine Platte 1 aus n- bzw. p -Silizium ist ein Schlitz 2 ausgeschnitten, so daß sich eine freitragende Zunge 3 ergibt. Auf die Zunge 3 ist eine Metallschicht 4 aufgedampft. Auf Grund der unterschiedlichen Ausdeh­ nung bei Erwärmung der Zunge 3 und der Metallschicht 4 bilden diese beiden Teile ein Bimetallelement 5. In ei­ nem Ausschnitt 6 der Platte 1 sind ein lichtempfangen­ des Element , wie z.B. eine Photodiode 7, ein Verstär­ ker 8 und eine Regelelektronik 9 hintereinandergeschal­ tet. Die Regelelektronik 9 ist durch eine Leiterbahn 10 mit der Metallschicht 4 verbunden. Auf die Mitte der Platte 1 ist in Längsrichtung eine Lichtleitfaser 11 aus Glas aufgelegt und mit dem Bimetallelement 5 ver­ bunden. Im Bereich 11 a, also gegenüber der Photodiode 7 ist die Wandung der Lichtleitfaser 11 so bearbeitet, daß ein Lichtaustritt aus dem Kern 12 der Lichtleit­ faser in die Photodiode 7 erfolgt. Gegenüber dem Ende der Lichtleitfaser 11 ist eine Lichtquelle 13 ange­ deutet, deren Licht 14 infolge einer Blende 15 mit einem kleinen Abstrahlwinkel austritt. In a small plate 1 made of n or p silicon, a slot 2 is cut out, so that a self-supporting tongue 3 results. A metal layer 4 is evaporated onto the tongue 3 . Due to the different expansion when the tongue 3 and the metal layer 4 are heated, these two parts form a bimetallic element 5 . In egg nem section 6 of the plate 1 , a light reception of the element, such as a photodiode 7 , an amplifier 8 and a control electronics 9 are switched one behind the other. The control electronics 9 are connected to the metal layer 4 by a conductor track 10 . On the center of the plate 1 , an optical fiber 11 made of glass is placed in the longitudinal direction and with the bimetallic element 5 a related party. In the area 11 a , that is, opposite the photodiode 7 , the wall of the optical fiber 11 is processed in such a way that light emerges from the core 12 of the optical fiber into the photodiode 7 . Towards the end of the optical fiber 11 , a light source 13 is indicated, whose light 14 emerges as a result of an aperture 15 with a small radiation angle.

An die Stelle der Metallschicht 4 kann mit gleichem Er­ folg ein in die Platte 1 integrierter n- bzw. p -Wider­ stand mit einer Abdeckung aus Siliziumnitrid oder Sili­ ziumdioxid treten. Dabei können auch das lichtempfan­ gende Element 7, der Verstärker 8, die Regelelektro­ nik 9 und die Leiterbahn 10 in integrierter Bauweise mit der Siliziumplatte 1 verbunden sein. Es liegt auch im Rahmen der Erfindung, das Bimetallelement 5 mit der mit ihm verbundenen Lichtleitfaser 11 in einem von den übrigen Teilen gesonderten Bauelement unterzubrin­ gen.In place of the metal layer 4 can with the same He result an integrated into the plate 1 n- or p-resistance stood with a cover made of silicon nitride or silicon dioxide. In this case, the light-receiving element 7 , the amplifier 8 , the control electronics 9 and the conductor track 10 can also be connected to the silicon plate 1 in an integrated manner. It is also within the scope of the invention to accommodate the bimetallic element 5 with the optical fiber 11 connected to it in a component separate from the other parts.

Ein Teil des durch den Kern 12 fließenden Lichtes 14 aus der Lichtquelle 13 wird im Bereich 11 a der Licht­ leitfaser 11 in die Photodiode 7 geleitet und durch den Verstärker 8 verstärkt. Die nachgeschaltete Regelelek­ tronik 9 maximiert dieses Lichtsignal durch entspre­ chende Aufheizung der Metallschicht 4 des Bimetallele­ mentes 5. Das Bimetallelement 5 und die Regelelektronik 9 sind so eingestellt, daß sich die Lichtleitfaser 11 bei größtmöglichem Durchfluß des Lichtstromes 14 durch die Bohrung 12 gegenüber der Mitte der Blende 15 befin­ det. Bei geringerem Lichtstrom 14 und damit geringerer Erwärmung der Metallschicht 4 biegt sich somit das Bi­ metallelement 5 mit der Lichtleitfaser 11 in Richtung eines Pfeiles 16 nach oben.A portion of the light 14 flowing through the core 12 from the light source 13 is passed in the region 11 a of the optical fiber 11 into the photodiode 7 and amplified by the amplifier 8 . The downstream electronic control 9 maximizes this light signal by accordingly heating the metal layer 4 of the bimetallic element 5 . The bimetallic element 5 and the control electronics 9 are set so that the optical fiber 11 is at the greatest possible flow of the light flux 14 through the bore 12 relative to the center of the diaphragm 15 . With a lower luminous flux 14 and thus less heating of the metal layer 4 , the bimetal element 5 thus bends with the optical fiber 11 in the direction of an arrow 16 upwards.

Claims (6)

1. Vorrichtung zum Ausrichten einer Lichtleitfaser in Richtung einer Lichtquelle, dadurch gekenn­ zeichnet, daß die Lichtleitfaser (11) gegen­ über der Lichtquelle (13) koaxial auf einem Bimetall­ element (5) befestigt ist, dessen Schicht mit dem grö­ ßeren Wärmeausdehnungskoeffizienten (4), gesteuert von einem durch den Lichtstrom (14) der Lichtleitfaser bestrahltes lichtempfangendes Element (7), erwärmbar ist.1. Device for aligning an optical fiber in the direction of a light source, characterized in that the optical fiber ( 11 ) against the light source ( 13 ) coaxially attached to a bimetallic element ( 5 ), the layer with the larger coefficient of thermal expansion ( 4 ) , controlled by a light-receiving element ( 7 ) irradiated by the luminous flux ( 14 ) of the optical fiber, can be heated. 2. Vorrichtung nach Anspruch 1, dadurch ge­ kennzeichnet, daß das Bimetallelement (5) aus einer unteren Schicht (3) aus Silizium und einer oberen Metallschicht (4) besteht.2. Device according to claim 1, characterized in that the bimetallic element ( 5 ) consists of a lower layer ( 3 ) made of silicon and an upper metal layer ( 4 ). 3. Vorrichtung nach Anspruch 1, dadurch ge­ kennzeichnet, daß das Bimetallelement (5) aus einer unteren Schicht (3) aus n- bzw. p -Silizium mit einer, in die untere Schicht eindiffundierten oder implantierten Schicht (4) aus einer n- bzw. p -Silizium­ verbindung sowie einer oberen Isolationsschicht mit ei­ nem gegenüber Silizium unterschiedlichen Wärmeausdeh­ nungs-Koeffizienten besteht.3. Device according to claim 1, characterized in that the bimetallic element ( 5 ) from a lower layer ( 3 ) made of n- or p -silicon with a, in the lower layer diffused or implanted layer ( 4 ) of an n- or p-silicon connection and an upper insulation layer with a different than silicon expansion coefficient of expansion. 4. Vorrichtung nach den Ansprüchen 1 und 2 oder 1 und 3, dadurch gekennzeichnet, daß das lichtempfangende Element (7) z.B. eine Photodiode ist, deren Strom in einem Verstärker (8) verstärkt und über eine Regelelektronik (9) sowie einer Leiterbahn (10) der oberen Bimetallschicht (4) zugeführt ist. 4. Device according to claims 1 and 2 or 1 and 3, characterized in that the light-receiving element ( 7 ) is, for example, a photodiode whose current is amplified in an amplifier ( 8 ) and via control electronics ( 9 ) and a conductor track ( 10 ) the upper bimetallic layer ( 4 ) is supplied. 5. Vorrichtung nach einem oder mehreren der An­ sprüche 1 bis 4, gekennzeichnet durch ein zur Erzeugung des biegsamen Bimetallelementes (5) eingeschnittenes Siliziumplättchen (1), in das die obe­ re Bimetallschicht (4), die Photodiode (7), der Ver­ stärker (8), die Regelelektronik (9) und die Leiterbahn (10) integriert sind und auf dem die Lichtleitfaser (11) befestigt ist.5. The device according to one or more of claims 1 to 4, characterized by a cut to produce the flexible bimetallic element ( 5 ) cut silicon plate ( 1 ), in which the top re bimetallic layer ( 4 ), the photodiode ( 7 ), the United stronger ( 8 ), the control electronics ( 9 ) and the conductor track ( 10 ) are integrated and on which the optical fiber ( 11 ) is attached. 6. Vorrichtung nach einem oder mehreren der An­ sprüche 1 bis 5, dadurch gekennzeich­ net, daß die dem lichtempfangenden Element (7) ge­ genüberliegende Wandung der Lichtleitfaser (11) so bearbeitet ist, daß ein Lichtaustritt aus dem Kern (12) der Lichtleitfaser in die Photodiode (7) erfolgt.6. Device according to one or more of claims 1 to 5, characterized in that the light-receiving element ( 7 ) ge opposite wall of the optical fiber ( 11 ) is processed so that a light exit from the core ( 12 ) of the optical fiber in the photodiode ( 7 ) takes place.
DE3543007A 1985-12-05 1985-12-05 Device for aligning an optical fibre Expired DE3543007C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3543007A DE3543007C1 (en) 1985-12-05 1985-12-05 Device for aligning an optical fibre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3543007A DE3543007C1 (en) 1985-12-05 1985-12-05 Device for aligning an optical fibre

Publications (1)

Publication Number Publication Date
DE3543007C1 true DE3543007C1 (en) 1987-04-30

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ID=6287703

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3543007A Expired DE3543007C1 (en) 1985-12-05 1985-12-05 Device for aligning an optical fibre

Country Status (1)

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DE (1) DE3543007C1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4028305A1 (en) * 1990-09-06 1992-03-12 Messerschmitt Boelkow Blohm Optical fibre adjuster for coupling to high power laser - surrounds coupling-in end by thermo-elastic movable support elements
DE19529558A1 (en) * 1995-08-11 1997-02-13 Bosch Gmbh Robert Optical control of semiconductor device using optical waveguide - has gate region and electrode of FET exposed to light from opening in sheath of superimposed optical fibre or adjacent pair of fibres
DE10248969A1 (en) * 2002-10-17 2004-05-06 Infineon Technologies Ag Production of an optical arrangement used in optical telecommunications comprises arranging an adjusting unit with an auxiliary waveguide between an optical component and a waveguide

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3206919A1 (en) * 1982-02-26 1983-09-15 Philips Patentverwaltung Gmbh, 2000 Hamburg DEVICE FOR OPTICALLY DISCONNECTING AND CONNECTING LIGHT GUIDES

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3206919A1 (en) * 1982-02-26 1983-09-15 Philips Patentverwaltung Gmbh, 2000 Hamburg DEVICE FOR OPTICALLY DISCONNECTING AND CONNECTING LIGHT GUIDES

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4028305A1 (en) * 1990-09-06 1992-03-12 Messerschmitt Boelkow Blohm Optical fibre adjuster for coupling to high power laser - surrounds coupling-in end by thermo-elastic movable support elements
DE19529558A1 (en) * 1995-08-11 1997-02-13 Bosch Gmbh Robert Optical control of semiconductor device using optical waveguide - has gate region and electrode of FET exposed to light from opening in sheath of superimposed optical fibre or adjacent pair of fibres
DE10248969A1 (en) * 2002-10-17 2004-05-06 Infineon Technologies Ag Production of an optical arrangement used in optical telecommunications comprises arranging an adjusting unit with an auxiliary waveguide between an optical component and a waveguide
DE10248969B4 (en) * 2002-10-17 2005-12-29 Infineon Technologies Ag Method for producing an optical arrangement

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8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
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Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

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