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DE3435773A1 - Rear-wall wiring for push-in electrical assemblies - Google Patents

Rear-wall wiring for push-in electrical assemblies

Info

Publication number
DE3435773A1
DE3435773A1 DE19843435773 DE3435773A DE3435773A1 DE 3435773 A1 DE3435773 A1 DE 3435773A1 DE 19843435773 DE19843435773 DE 19843435773 DE 3435773 A DE3435773 A DE 3435773A DE 3435773 A1 DE3435773 A1 DE 3435773A1
Authority
DE
Germany
Prior art keywords
circuit board
backplane
backplane connector
wiring
signal layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843435773
Other languages
German (de)
Inventor
Egon Dipl.-Ing. 8000 München Jäger
Gundolf Dipl.-Ing. Milde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19843435773 priority Critical patent/DE3435773A1/en
Publication of DE3435773A1 publication Critical patent/DE3435773A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/15—Connectors for wire wrapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

The invention relates to rear-wall wiring for the electrical connection of electrical assemblies which can be pushed into a mounting rack and can be plugged onto rear-wall plugs (1) which are arranged side-by-side in a plane, which rear-wall plugs (1) have connecting pins (2) which, on the side of the rear-wall plugs (1) facing away from the assemblies, are plugged through two printed-circuit boards (3, 4) which are insulated from one another, are located one above the other and are coated on both sides. In order to obtain three mutually decoupled signal layers (5, 6, 7), two signal layers (5, 6) are designed using a stripline configuration on a printed-circuit board (3), while the third signal layer (7) is designed on the second printed-circuit board (4), using a microstrip configuration. <IMAGE>

Description

Rückwandverdrahtung für einschiebbare elektrische Bau-Backplane wiring for retractable electrical construction

gruppen.groups.

Die Erfindung betrifft eine Rückwandverdrahtung zum elektrischen Verbinden von in einen Baugruppenrahmen einschiebbaren elektrischen Baugruppen, die auf in einer Ebene nebeneinander angeordnete Rückwandstecker aufdeckbar sind, welche Anschlußstifte aufweisen, die auf der den Baugruppen abgewandten Seite der Rückwandstecker durch zwei voneinander isolierte und übereinanderliegende doppelseitig kaschierte Leiterplatten hindurchgesteckt sind, wobei die Leiterplatten z.B. Freibohrungen für die Anschlußstifte aufweisen.The invention relates to backplane wiring for electrical connection of electrical modules that can be pushed into a module frame and that are based on in rear panel plugs arranged next to one another on one level can be uncovered, which connection pins have on the side facing away from the modules through the backplane connector two double-sided laminated printed circuit boards, one on top of the other, isolated from one another are inserted through, whereby the circuit boards e.g. clear bores for the connecting pins exhibit.

Bei derartigen Rückwandverdrahtungen ist es bekannt, auf der einen Leiterplatte zwei Signallagen und auf der anderen Leiterplatte zwei Potentialebenen unterzubringen.With such backplane wiring, it is known on the one hand Circuit board two signal layers and two potential levels on the other circuit board accommodate.

Diese Aufteilung der Signallagen und der Potentialebenen hat den Nachteil, daß die beiden Signallagen miteinander elektrisch verkoppelt sind.This division of the signal layers and the potential levels has the disadvantage that the two signal layers are electrically coupled to one another.

Aufgabe der Erfindung ist es, eine Rückwandverdrahtung der eingangs genannten Art anzugeben, welche mehr als zwei Signallagen aufweist und mit einfachen technischen Mitteln herstellbar ist, und bei welcher die elektrische Verkoppelung zwischen den Signalleitern der einzelnen Signallagen möglichst gering ist.The object of the invention is to provide a backplane wiring specified type, which has more than two signal layers and with simple technical means can be produced, and in which the electrical coupling between the signal conductors of the individual signal layers is as small as possible.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die dem Rückwandstecker benachbarte Leiterplatte auf jeder Seite eine Signallage aufweist, daß auf der den Rückwandstecker abgewandten Seite der äußeren Leiterplatte eine dritte Signallage und auf der dem Rückwandstecker zugewandten Seite dieser Leiterplatte eine Potentialebene angeordnet ist, und daß zwischen dem Rückwandstecker und der diesen benachbarten Leiterplatte eine einseitig kaschierte Leiterplatte mit einer zweiten Potentialebene angeordnet ist.This object is achieved according to the invention in that the backplane connector adjacent circuit board has a signal layer on each side that on the Backplane connector facing away from the outer circuit board one third signal layer and on the side of this circuit board facing the backplane connector a potential plane is arranged, and that between the backplane connector and the this adjacent circuit board a one-sided laminated circuit board with a second potential level is arranged.

Die erfindungsgemäße Rückwandverdrahtung weist drei voneinander unabhängige Signallagen auf, die aufgrund ihrer Lage zu den einzelnen Potentialebenen nahezu entkoppelt sind. Gleichzeitig zeichnet sich die erfindungsgemäße Rückwandverdrahtung durch einen einfach herzustellenden und billigen Multibordaufbau aus, so daß auf einen aufwendigen Multilayeraufbau verzichtet werden kann.The backplane wiring according to the invention has three mutually independent Signal layers, which due to their location to the individual potential levels almost are decoupled. At the same time, the backplane wiring according to the invention is distinguished by a simple to manufacture and cheap multi-board structure, so that on an expensive multilayer structure can be dispensed with.

Weitere vorteilhafte Ausbildungen der erfindungsgemäßen Rückwandverdrahtung ergeben sich aus dem Unteranspruch sowie aus der nachfolgenden Beschreibung eines Ausführungsbeispiels der Erfindung.Further advantageous configurations of the backplane wiring according to the invention result from the dependent claim and from the following description of a Embodiment of the invention.

Im folgenden wird die Erfindung anhand eines in der Figur dargestellten Ausführungsbeispiels näher beschrieben.In the following, the invention is illustrated by means of one in the figure Embodiment described in more detail.

Nach der Figur sind nicht dargestellte elektrische Baugruppen auf Rückwandstecker 1 eines Baugruppenrahmens aufsteckbar. Die Rückwandsteckerl sind auf der den Baugruppen abgewandten Seite mit Anschlußstiften 2 versehen, die der elektrischen Verbindung der Baugruppen untereinander dienen.According to the figure, electrical assemblies are not shown Backplane connector 1 of a module frame can be plugged on. The backplane connectors are on the side facing away from the modules provided with pins 2, which the Serve electrical connection of the assemblies with each other.

Die dargestellte erfindungsgemäße Rückwandverdrahtung besteht aus zwei doppelseitig kaschierten Leiterplatten 3 und 4, sowie aus einer einseitig kaschierten Leiterplatte 12. Die beiden doppelseitig kaschierten Leiterplatten 3 und 4 sind durch eine Isolationsfolie 11 voneinander getrennt. Die Leiterplatte 3 enthält zwei Signallagen 5 und 6 während die Leiterplatte 4 eine Signallage 7 aufweist.The illustrated backplane wiring according to the invention consists of two double-sided laminated circuit boards 3 and 4, as well as a single-sided laminated one Circuit board 12. The two double-sided laminated circuit boards 3 and 4 are separated from one another by an insulating film 11. The circuit board 3 contains two Signal layers 5 and 6 while the circuit board 4 has a signal layer 7 having.

Von den beiden Potentialebenen 8 und 9 befindet sich die Potentialebene 8 auf der Leiterplatte 4 und die Potentialebene 9 auf der einseitig kaschierten Leiterplatte 12. Zwischen der einseitig kaschierten Leiterplatte 12 und dem Rückwandstecker 1 ist noch ein Kontaktblech 10 vorgesehen. Im dargestellten Ausführungsbeispiel wird davon ausgegangen, daß die Potentialebene 9 mit der Versorgungsspannung beaufschlagt ist, während die Potentialebene 8 mit Erdpotential verbunden ist.Of the two potential levels 8 and 9 is the potential level 8 on the circuit board 4 and the potential plane 9 on the one-sided laminated Printed circuit board 12. Between the printed circuit board 12, which is laminated on one side, and the backplane connector 1 a contact plate 10 is also provided. In the illustrated embodiment it is assumed that the potential plane 9 has the supply voltage applied to it is, while the potential plane 8 is connected to ground potential.

Bei den in der Figur dargestellten Rückwandverdrahtungen sind die beiden Signallagen 5 und 6 zwischen zwei Schirmebenen, die durch die Potentialebene 8 und 9 gebildet werden, geführt. Durch den unterschiedlichen Abstand der einzelnen Signallagen 5 und 6 von den Potentialebenen 8 und 9 sind diese beiden Signallagen nahezu entkoppelt.In the case of the backplane wiring shown in the figure, the two signal layers 5 and 6 between two shield levels that go through the potential level 8 and 9 are formed, guided. Due to the different distance between the individual Signal layers 5 and 6 from potential levels 8 and 9 are these two signal layers almost decoupled.

Die beiden Signallagen 5 und 6 sind in unsymmetrischer kopplungsarmer Striplinekonfiguration. Die dritte Signallage 7 ist als Mikrostripkonfiguration, d.h. als Leiter über einer Schirmebene, ausgeführt. In diesem Fall dient als Schirmebene die Erdpotential führende Potentialebene 8.The two signal layers 5 and 6 are unsymmetrical with less coupling Stripline configuration. The third signal layer 7 is a microstrip configuration, i.e. designed as a conductor over a shielding level. In this case it serves as the screen level the potential level leading to earth potential 8.

Die erfindungsgemäße Rückwandverdrahtung enthält also drei unabhängige voneinander elektrisch entkoppelte Signallagen.The backplane wiring according to the invention thus contains three independent ones signal layers electrically decoupled from one another.

Eine weitere Entkopplung der Signallagen untereinander kann durch eine orthogonale Weiterführung erreicht werden. Weiterhin ist bei der dargestellten Rückwandverdrahtung eine Restverdrahtung mittels Wrapverdrahtung der vorstehenden Anschlußstifte 2 möglich.A further decoupling of the signal layers from one another can be achieved by an orthogonal continuation can be achieved. Furthermore, is shown in the Backplane wiring remaining wiring using wraparound wiring of the above Connection pins 2 possible.

2 Patentansprüche 1 Figur2 claims 1 figure

Claims (2)

Patentansprüche 1. Rückwandverdrahtung zum elektrischen Verbinden von in einen Baugruppenrahmen einschiebbaren elektrischen Baugruppen, die auf in einer Ebene nebeneinander angeordnete Rückwandstecker aufsteckbar sind, welche Anschlußstifte aufweisen, die auf der den Baugruppen abgewandten Seite der Rückwandstecker durch zwei voneinander isolierte und übereinanderliegende doppelseitig kaschierte Leiterplatten hindurchgesteckt sind, wobei die Leiterplatten zum Teil Freibohrungen für die Anschlußstifte aufweisen, d a d u r c h g e k e n n z e i c h n e t , daß die dem Rückwandstecker (1) benachbarte Leiterplatte (3) auf jeder Seite eine Signallage (5,6) aufweist, daß auf der dem Rückwandsttecker (1) abgewandten Seite der äusseren Leiterplatte (4) eine dritte Signallage (7) und auf der dem Rückwandstecker (1) zugewandten Seite dieser Leiterplatte (4) eine Potentialebene (8) angeordnet ist, und daß zwischen dem Rückwandstecker (1) und der dieser benachbarten Leiterplatte (3) eine einseitig kaschierte Leiterplatte (12) mit einer zweiten Potentialebene (9) angeordnet ist.Claims 1. Backplane wiring for electrical connection of electrical modules that can be pushed into a module frame and that are based on in Rear panel plugs arranged next to one another on one level can be plugged on, which connecting pins have on the side facing away from the modules through the backplane connector two double-sided laminated printed circuit boards, one on top of the other, isolated from one another are inserted through, the circuit boards partially free bores for the connecting pins show that the backplane connector (1) adjacent circuit board (3) has a signal layer (5,6) on each side, that on the backplane connector (1) facing away from the outer circuit board (4) a third signal layer (7) and on the side facing the backplane connector (1) this circuit board (4) a potential plane (8) is arranged, and that between the backplane connector (1) and the adjacent printed circuit board (3) on one side laminated circuit board (12) is arranged with a second potential plane (9). 2. Rückwandverdrahtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Potentialebene (9) der einseitig kaschierten Leiterplatte (12) mit der Versorgungsspannung beaufschlagt ist.2. Backplane wiring according to claim 1, d a d u r c h g e k e n n z e i c h n e t that the potential plane (9) of the printed circuit board laminated on one side (12) is supplied with the supply voltage.
DE19843435773 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies Withdrawn DE3435773A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843435773 DE3435773A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843435773 DE3435773A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Publications (1)

Publication Number Publication Date
DE3435773A1 true DE3435773A1 (en) 1986-04-10

Family

ID=6246688

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843435773 Withdrawn DE3435773A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Country Status (1)

Country Link
DE (1) DE3435773A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8903913U1 (en) * 1989-03-30 1989-05-18 Siemens AG, 1000 Berlin und 8000 München PCB-shaped bus wiring field
DE4303793A1 (en) * 1993-02-10 1994-08-11 Hartmann Karlheinz Elektronic Busbar arrangement
EP0692841A1 (en) * 1994-07-15 1996-01-17 Connector Systems Technology N.V. Assembly of shielded connectors and a board having plated holes
EP0677897A3 (en) * 1994-04-14 1996-09-11 Siemens Ag Circuit board arrangement for connectors.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1273021B (en) * 1963-07-30 1968-07-18 Ibm Arrangement for tight packing of electrical circuits in data processing systems
GB1157432A (en) * 1965-08-18 1969-07-09 Int Computers Ltd Electric Circuit Interconnection Means
DE2362239A1 (en) * 1972-12-28 1974-07-11 Cii Honeywell Bull ELECTRICAL CONNECTION PLATE
US4016463A (en) * 1973-10-17 1977-04-05 Amdahl Corporation High density multilayer printed circuit card assembly and method
DE2840890A1 (en) * 1978-09-20 1980-04-03 Licentia Gmbh Multilayer connection printed circuit board assembly - has perforated metal plates circuit boards separated by insulating layers, with metal plated holes for interconnection

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1273021B (en) * 1963-07-30 1968-07-18 Ibm Arrangement for tight packing of electrical circuits in data processing systems
DE1283310B (en) * 1963-07-30 1968-11-21 Ibm Package connection of micro-assemblies and similar circuit elements
GB1157432A (en) * 1965-08-18 1969-07-09 Int Computers Ltd Electric Circuit Interconnection Means
DE2362239A1 (en) * 1972-12-28 1974-07-11 Cii Honeywell Bull ELECTRICAL CONNECTION PLATE
US4016463A (en) * 1973-10-17 1977-04-05 Amdahl Corporation High density multilayer printed circuit card assembly and method
DE2840890A1 (en) * 1978-09-20 1980-04-03 Licentia Gmbh Multilayer connection printed circuit board assembly - has perforated metal plates circuit boards separated by insulating layers, with metal plated holes for interconnection

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8903913U1 (en) * 1989-03-30 1989-05-18 Siemens AG, 1000 Berlin und 8000 München PCB-shaped bus wiring field
DE4303793A1 (en) * 1993-02-10 1994-08-11 Hartmann Karlheinz Elektronic Busbar arrangement
EP0677897A3 (en) * 1994-04-14 1996-09-11 Siemens Ag Circuit board arrangement for connectors.
EP0692841A1 (en) * 1994-07-15 1996-01-17 Connector Systems Technology N.V. Assembly of shielded connectors and a board having plated holes
WO1996002958A1 (en) * 1994-07-15 1996-02-01 Connector Systems Technology N.V. Assembly of shielded connectors and a board having plated holes
US6196876B1 (en) 1994-07-15 2001-03-06 Berg Technology, Inc. Assembly of shielded connectors and a board having plated holes

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