DE3379090D1 - Semiconductor device package - Google Patents

Semiconductor device package

Info

Publication number: DE3379090D1
Authority: DE; Germany
Prior art keywords: semiconductor device; device package; package; semiconductor
Prior art date: 1982-03-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

DE8383301536T

Other languages

English (en)

Inventor

Susumu Kida

Hayato Usami

Hideji Aoki

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujitsu Ltd

Original Assignee

Fujitsu Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-03-29

Filing date

1983-03-18

Publication date

1989-03-02

1983-03-18 Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd

1989-03-02 Application granted granted Critical

1989-03-02 Publication of DE3379090D1 publication Critical patent/DE3379090D1/de

Status Expired legal-status Critical Current

Classifications

- H10W70/66—
- H10W72/30—
- H10W76/157—
- H10W95/00—
- H10W70/682—
- H10W72/07554—
- H10W72/5449—
- H10W72/5522—
- H10W72/5524—
- H10W72/932—
- H10W72/952—
- H10W90/754—
- H10W90/756—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

DE8383301536T 1982-03-29 1983-03-18 Semiconductor device package Expired DE3379090D1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP57050734A JPS58169942A (ja)	1982-03-29	1982-03-29	半導体装置

Publications (1)

Publication Number	Publication Date
DE3379090D1 true DE3379090D1 (en)	1989-03-02

Family

ID=12867075

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE8383301536T Expired DE3379090D1 (en)	1982-03-29	1983-03-18	Semiconductor device package

Country Status (5)

Country	Link
US (1)	US4558346A (de)
EP (1)	EP0090566B1 (de)
JP (1)	JPS58169942A (de)
DE (1)	DE3379090D1 (de)
IE (1)	IE54534B1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4570337A (en) *	1982-04-19	1986-02-18	Olin Corporation	Method of assembling a chip carrier
EP0139029A1 (de) *	1983-10-19	1985-05-02	Olin Corporation	Halbleiterpackung
US4837928A (en) *	1986-10-17	1989-06-13	Cominco Ltd.	Method of producing a jumper chip for semiconductor devices
JPH06244231A (ja) *	1993-02-01	1994-09-02	Motorola Inc	気密半導体デバイスおよびその製造方法
JP2938344B2 (ja) *	1994-05-15	1999-08-23	株式会社東芝	半導体装置
US5508556A (en) *	1994-09-02	1996-04-16	Motorola, Inc.	Leaded semiconductor device having accessible power supply pad terminals
JPH11305205A (ja) *	1998-04-22	1999-11-05	Hitachi Ltd	液晶表示装置
US6062461A (en) *	1998-06-03	2000-05-16	Delphi Technologies, Inc.	Process for bonding micromachined wafers using solder
US6564449B1 (en) *	2000-11-07	2003-05-20	Advanced Semiconductor Engineering, Inc.	Method of making wire connection in semiconductor device
KR100706516B1 (ko)	2001-02-06	2007-04-11	앰코 테크놀로지 코리아 주식회사	반도체 패키지
US20130167482A1 (en) *	2011-09-08	2013-07-04	Advanced Numicro Systems, Inc.	Vacuum sealing process of a mems package
US10014189B2 (en) *	2015-06-02	2018-07-03	Ngk Spark Plug Co., Ltd.	Ceramic package with brazing material near seal member

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3497774A (en) *	1967-06-07	1970-02-24	Beckman Instruments Inc	Electrical circuit module and method of manufacture
US3585711A (en) *	1968-09-06	1971-06-22	Us Navy	Gold-silicon bonding process
JPS5840370B2 (ja) *	1974-09-03	1983-09-05	日本電気株式会社	ゾウフクカイロ
JPS598358Y2 (ja) *	1978-02-08	1984-03-15	京セラ株式会社	半導体素子パツケ−ジ
JPS5910584B2 (ja) *	1978-08-17	1984-03-09	住友金属鉱山株式会社	Ｉｃパツケ−ジ用クラツド材
JPS55153341A (en) *	1979-05-17	1980-11-29	Toshiba Corp	Semiconductor device
JPS56105660A (en) *	1980-01-28	1981-08-22	Nec Corp	Semiconductor device
EP0039507A1 (de) *	1980-05-05	1981-11-11	LeaRonal, Inc.	Verfahren zum Anschliessen eines Halbleiters und Anschlussstruktur für Halbleiterelemente
JPS5758340A (en) *	1980-09-24	1982-04-08	Nec Corp	Semiconductor device
JPS5854644A (ja) *	1981-09-28	1983-03-31	Nec Corp	ボンデイング用樹脂基板
US4447857A (en) *	1981-12-09	1984-05-08	International Business Machines Corporation	Substrate with multiple type connections

1982
- 1982-03-29 JP JP57050734A patent/JPS58169942A/ja active Pending
1983
- 1983-03-18 DE DE8383301536T patent/DE3379090D1/de not_active Expired
- 1983-03-18 EP EP83301536A patent/EP0090566B1/de not_active Expired
- 1983-03-23 US US06/477,934 patent/US4558346A/en not_active Expired - Lifetime
- 1983-03-29 IE IE707/83A patent/IE54534B1/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
US4558346A (en)	1985-12-10
IE830707L (en)	1983-09-29
IE54534B1 (en)	1989-11-08
EP0090566A3 (en)	1985-10-30
EP0090566A2 (de)	1983-10-05
EP0090566B1 (de)	1989-01-25
JPS58169942A (ja)	1983-10-06

Publication	Publication Date	Title
DE3379134D1 (en)	1989-03-09	Semiconductor device package
GB8302769D0 (en)	1983-03-02	Semiconductor device
GB2131603B (en)	1985-12-18	Semiconductor devices
GB8300539D0 (en)	1983-02-09	Semiconductor device
GB8311430D0 (en)	1983-06-02	Semiconductor device manufacture
GB8324448D0 (en)	1983-10-12	Semiconductor device
GB8332597D0 (en)	1984-01-11	Semiconductor device
DE3380004D1 (en)	1989-07-06	Semiconductor memory device
DE3370092D1 (en)	1987-04-09	Semiconductor memory device
GB8326578D0 (en)	1983-11-09	Semiconductor device
DE3377436D1 (en)	1988-08-25	Semiconductor memory device
DE3377553D1 (en)	1988-09-01	Semiconductor device with moulded package
GB8333893D0 (en)	1984-02-01	Semiconductor device
GB8325513D0 (en)	1983-10-26	Semiconductor device
DE3379883D1 (en)	1989-06-22	Semiconductor device
GB8330763D0 (en)	1983-12-29	Semiconductor device
GB8332106D0 (en)	1984-01-11	Semiconductor device encapsulation
DE3380194D1 (en)	1989-08-17	Semiconductor device
DE3374103D1 (en)	1987-11-19	Semiconductor memory device
DE3379366D1 (en)	1989-04-13	Semiconductor memory device
DE3379090D1 (en)	1989-03-02	Semiconductor device package
DE3380385D1 (en)	1989-09-14	A semiconductor device
DE3376704D1 (en)	1988-06-23	Semiconductor memory device
GB8426633D0 (en)	1984-11-28	Packages for semi-conductor devices
GB8300945D0 (en)	1983-02-16	Semiconductor device

Legal Events

Date	Code	Title	Description
1990-02-15	8364	No opposition during term of opposition
1994-03-10	8339	Ceased/non-payment of the annual fee