DE29520391U1 - Vakuumanlage zur Oberflächenbearbeitung von Werkstücken - Google Patents
Vakuumanlage zur Oberflächenbearbeitung von WerkstückenInfo
- Publication number
- DE29520391U1 DE29520391U1 DE29520391U DE29520391U DE29520391U1 DE 29520391 U1 DE29520391 U1 DE 29520391U1 DE 29520391 U DE29520391 U DE 29520391U DE 29520391 U DE29520391 U DE 29520391U DE 29520391 U1 DE29520391 U1 DE 29520391U1
- Authority
- DE
- Germany
- Prior art keywords
- chamber
- vacuum
- loading
- transfer
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 19
- 238000004381 surface treatment Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000000284 resting effect Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- PZASAAIJIFDWSB-CKPDSHCKSA-N 8-[(1S)-1-[8-(trifluoromethyl)-7-[4-(trifluoromethyl)cyclohexyl]oxynaphthalen-2-yl]ethyl]-8-azabicyclo[3.2.1]octane-3-carboxylic acid Chemical compound FC(F)(F)C=1C2=CC([C@@H](N3C4CCC3CC(C4)C(O)=O)C)=CC=C2C=CC=1OC1CCC(C(F)(F)F)CC1 PZASAAIJIFDWSB-CKPDSHCKSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5196—Multiple station with conveyor
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- ing And Chemical Polishing (AREA)
Description
Es zeigen:
10
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH02937/95A CH691376A5 (de) | 1995-10-17 | 1995-10-17 | Vakuumanlage zur Oberflächenbearbeitung von Werkstücken. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE29520391U1 true DE29520391U1 (de) | 1996-05-15 |
Family
ID=4244989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE29520391U Expired - Lifetime DE29520391U1 (de) | 1995-10-17 | 1995-12-22 | Vakuumanlage zur Oberflächenbearbeitung von Werkstücken |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5655277A (de) |
| JP (1) | JPH09176857A (de) |
| KR (1) | KR100437752B1 (de) |
| CH (1) | CH691376A5 (de) |
| DE (1) | DE29520391U1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10348281A1 (de) * | 2003-10-17 | 2005-05-19 | Applied Films Gmbh & Co. Kg | Vakuum-Behandlungsanlage für ebene rechteckige bzw. quadratische Substrate |
| DE102006047010A1 (de) * | 2006-10-02 | 2008-04-03 | Von Ardenne Anlagentechnik Gmbh | Verfahren zum Schleusen von Substraten und Vakuumbeschichtungsanlage für kontinuierlichen Betrieb |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4653263B2 (ja) * | 1996-12-23 | 2011-03-16 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | 真空処理装置 |
| US6045620A (en) * | 1997-07-11 | 2000-04-04 | Applied Materials, Inc. | Two-piece slit valve insert for vacuum processing system |
| US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
| US6000905A (en) * | 1998-03-13 | 1999-12-14 | Toro-Lira; Guillermo L. | High speed in-vacuum flat panel display handler |
| TW469483B (en) * | 1999-04-19 | 2001-12-21 | Applied Materials Inc | Method and apparatus for aligning a cassette |
| US6763281B2 (en) | 1999-04-19 | 2004-07-13 | Applied Materials, Inc | Apparatus for alignment of automated workpiece handling systems |
| US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
| TW512421B (en) * | 2000-09-15 | 2002-12-01 | Applied Materials Inc | Double dual slot load lock for process equipment |
| JP4856308B2 (ja) * | 2000-12-27 | 2012-01-18 | キヤノンアネルバ株式会社 | 基板処理装置及び経由チャンバー |
| US7316966B2 (en) * | 2001-09-21 | 2008-01-08 | Applied Materials, Inc. | Method for transferring substrates in a load lock chamber |
| AU2003239758A1 (en) * | 2002-05-24 | 2003-12-12 | Sig Technology Ltd. | Method and device for treating workpieces |
| US7959395B2 (en) * | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
| US8960099B2 (en) * | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
| US20070183871A1 (en) * | 2002-07-22 | 2007-08-09 | Christopher Hofmeister | Substrate processing apparatus |
| JP4712379B2 (ja) * | 2002-07-22 | 2011-06-29 | ブルックス オートメーション インコーポレイテッド | 基板処理装置 |
| US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
| US7497414B2 (en) * | 2004-06-14 | 2009-03-03 | Applied Materials, Inc. | Curved slit valve door with flexible coupling |
| US20070006936A1 (en) * | 2005-07-07 | 2007-01-11 | Applied Materials, Inc. | Load lock chamber with substrate temperature regulation |
| US7845891B2 (en) | 2006-01-13 | 2010-12-07 | Applied Materials, Inc. | Decoupled chamber body |
| US8097084B2 (en) * | 2006-01-24 | 2012-01-17 | Vat Holding Ag | Vacuum chamber system for semiconductor processing |
| JP5026715B2 (ja) * | 2006-03-17 | 2012-09-19 | 株式会社アルバック | 金属とSiO2の混合膜の成膜方法 |
| US8398355B2 (en) * | 2006-05-26 | 2013-03-19 | Brooks Automation, Inc. | Linearly distributed semiconductor workpiece processing tool |
| US7665951B2 (en) | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
| US7845618B2 (en) | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
| US8124907B2 (en) | 2006-08-04 | 2012-02-28 | Applied Materials, Inc. | Load lock chamber with decoupled slit valve door seal compartment |
| WO2009053435A1 (en) | 2007-10-24 | 2009-04-30 | Oc Oerlikon Balzers Ag | Method for manufacturing workpieces and apparatus |
| US8602706B2 (en) * | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
| KR20210068566A (ko) * | 2018-10-10 | 2021-06-09 | 에바텍 아크티엔게젤샤프트 | 진공 처리 장치 및 기판을 진공 처리하는 방법 |
| CN110860820B (zh) * | 2019-12-27 | 2024-11-22 | 华北水利水电大学 | 一种制备高熵钎料合金的多边形装置 |
| CN115747781A (zh) * | 2022-10-27 | 2023-03-07 | 李梦洋 | 一种铝制品表面钝化处理系统 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5996270A (ja) * | 1982-11-24 | 1984-06-02 | Tdk Corp | 連続式スパツタ装置 |
| JPS6052574A (ja) * | 1983-09-02 | 1985-03-25 | Hitachi Ltd | 連続スパツタ装置 |
| US4663009A (en) * | 1985-02-08 | 1987-05-05 | Hewlett-Packard Company | System and method for depositing plural thin film layers on a substrate |
| JPH0613751B2 (ja) * | 1986-03-07 | 1994-02-23 | 株式会社日立製作所 | 連続スパッタ装置 |
| US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
| JP2639093B2 (ja) * | 1989-04-28 | 1997-08-06 | 日新電機株式会社 | イオン処理装置 |
| EP0408216A3 (en) * | 1989-07-11 | 1991-09-18 | Hitachi, Ltd. | Method for processing wafers and producing semiconductor devices and apparatus for producing the same |
| KR0162102B1 (ko) * | 1991-05-29 | 1999-02-01 | 이노우에 아키라 | 반도체 제조장치 |
-
1995
- 1995-10-17 CH CH02937/95A patent/CH691376A5/de not_active IP Right Cessation
- 1995-12-22 DE DE29520391U patent/DE29520391U1/de not_active Expired - Lifetime
-
1996
- 1996-08-08 US US08/693,987 patent/US5655277A/en not_active Expired - Lifetime
- 1996-10-16 JP JP8273741A patent/JPH09176857A/ja active Pending
- 1996-10-16 KR KR1019960046173A patent/KR100437752B1/ko not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10348281A1 (de) * | 2003-10-17 | 2005-05-19 | Applied Films Gmbh & Co. Kg | Vakuum-Behandlungsanlage für ebene rechteckige bzw. quadratische Substrate |
| DE10348281B4 (de) * | 2003-10-17 | 2007-06-06 | Applied Materials Gmbh & Co. Kg | Vakuum-Behandlungsanlage für ebene rechteckige oder quadratische Substrate |
| DE102006047010A1 (de) * | 2006-10-02 | 2008-04-03 | Von Ardenne Anlagentechnik Gmbh | Verfahren zum Schleusen von Substraten und Vakuumbeschichtungsanlage für kontinuierlichen Betrieb |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970021362A (ko) | 1997-05-28 |
| US5655277A (en) | 1997-08-12 |
| KR100437752B1 (ko) | 2004-11-08 |
| CH691376A5 (de) | 2001-07-13 |
| JPH09176857A (ja) | 1997-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 19960627 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 19990127 |
|
| R081 | Change of applicant/patentee |
Owner name: UNAXIS DEUTSCHLAND VERTRIEBS GMBH, DE Free format text: FORMER OWNER: BALZERS PROZESS SYSTEME VERTRIEBS- UND SERVICE GMBH, 81476 MUENCHEN, DE Effective date: 20001219 |
|
| R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20020326 |
|
| R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20040206 |
|
| R081 | Change of applicant/patentee |
Owner name: UNAXIS DEUTSCHLAND VERTRIEBS GMBH, DE Free format text: FORMER OWNER: UNAXIS DEUTSCHLAND VERTRIEBS GMBH, 81476 MUENCHEN, DE Effective date: 20040506 |
|
| R071 | Expiry of right |