DE2950589A1 - Prepn. of plastics for chemical metallisation - by embedding corundum grains to provide roughened surface, increasing adhesion - Google Patents
Prepn. of plastics for chemical metallisation - by embedding corundum grains to provide roughened surface, increasing adhesionInfo
- Publication number
- DE2950589A1 DE2950589A1 DE19792950589 DE2950589A DE2950589A1 DE 2950589 A1 DE2950589 A1 DE 2950589A1 DE 19792950589 DE19792950589 DE 19792950589 DE 2950589 A DE2950589 A DE 2950589A DE 2950589 A1 DE2950589 A1 DE 2950589A1
- Authority
- DE
- Germany
- Prior art keywords
- corundum
- embedded
- organic materials
- particles
- metallisation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001465 metallisation Methods 0.000 title claims abstract description 12
- 239000000126 substance Substances 0.000 title claims abstract description 8
- 229910052593 corundum Inorganic materials 0.000 title claims description 23
- 239000010431 corundum Substances 0.000 title claims description 23
- 229920003023 plastic Polymers 0.000 title description 5
- 239000004033 plastic Substances 0.000 title description 5
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000011368 organic material Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 3
- 230000007547 defect Effects 0.000 claims abstract 2
- 229920000642 polymer Polymers 0.000 claims description 10
- 238000011109 contamination Methods 0.000 claims description 2
- 238000010924 continuous production Methods 0.000 claims description 2
- 238000010348 incorporation Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 2
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 239000002318 adhesion promoter Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004873 anchoring Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 aluminum silicates Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
Besch: bungDescrizione
Verfahren zur haftfesten chemischen Metallisierung von hochpolymeren organischen Werkstoffen Die Erfindung bezieht sich auf ein Verfahren zur haftfesten chemischen Metallisierung von hochpolymeren organischen Werkstoffen.Process for the adhesive chemical metallization of high polymers organic materials The invention relates to a method for firmly adhering chemical metallization of high polymer organic materials.
Die technische Entwicklung der Bedarfsgüter hat im Laufe der letzten Jahre dazu geführt, Metallteile durch Kunststoffteile zu ersetzen. Damit gehen Gewichtseinsparungen und größere Korrosionsbeständigkeit einher. Durch Aufbringen metallischer Überzüge auf die Kunststoffteile können vielfältige technische und dekorative Zwecke erfüllt werden.The technical development of consumer goods has taken place in the course of the last Years of replacing metal parts with plastic parts. This goes with weight savings and greater corrosion resistance. By applying metallic coatings A variety of technical and decorative purposes can be fulfilled on the plastic parts will.
Für die Herstellung dieser nun von einem neuen Grundwerkstoff, nämlich einem hochpolymeren organischen Werkstoff, ausgehenden Güter besteht nun die Aufgabe, Verfahren zu entwickeln, einen Metallbelag haftfest auf den Grundwerkstoff aufzubringen.For the production of this now from a new base material, namely a high-polymer organic material, outgoing goods now have the task of To develop a method to apply a metal coating firmly to the base material.
Aber auch in weitern Bereichen der Technik, in denen auf Tragermaterlal aus hochpolymeren organischen Werkstoffen metallische Schichten aufzubringen sind, z. B. als elektrische Leiter, ist es erforderlich eine hohe Haftfähigkeit zwischen Metallbelag und Trägermaterial herzustellen.But also in other areas of technology, in which on carrier material Metallic layers made of high-polymer organic materials are to be applied, z. B. as an electrical conductor, it is necessary to have a high degree of adhesion between Manufacture metal covering and carrier material.
Nachdem Klarheit darüber gewonnen war, daß die glatte Oberfläche der Kunststofform bzw. Trägerteile keine geeignete Basis für das haftfeste Aufbringen von Beschichzungen darstellte, realisierte man Lösungen, die eine chemische, chemi sorptive oder mechanische Verankerung der ueberzüge zum Gegenstand hat.After it was clear that the smooth surface of the Plastic mold or support parts are not a suitable basis for firmly adhering application of Beschichzungen represented, solutions were realized that have a chemical, chemi sorptive or mechanical anchoring of the coatings.
Die beiden erstgenannten Lösungen zur vorbereitenden Oberflächenbehandlung für die spätere Metallisierung haben die Nachteile, daß die verwendeten chemischen Substanzen nur mit hohem wirtschaftlichem Aufwand umweltneutralisiert werden können. Der Vorgang der chemischen Einwirkung erfordert darüber hinaus erhebliche Zeit, was einem Produktronsfluß hemmend entgegensteht.The first two solutions for preparatory surface treatment for the subsequent metallization have the disadvantages that the chemical Substances can only be neutralized for the environment at great economic expense. The process of chemical exposure also requires considerable time, what hinders a flow of product.
Die dritte der vorgenannten Lösungen, die mechanische Verankerung der metallischen Überzüge, ging von einem Aufrauhen der Oberfläche auf mechanischem Wege aus, wobei vor jedem weiteren Arbeitsgang erst immer auch analog zu den chemischen Verfahren für eine gründliche Entfernung des Aufrauhungsmittels Sorge getragen wurde.The third of the aforementioned solutions, mechanical anchoring the metallic coatings, went from a roughening of the surface to mechanical Ways out, whereby before each further work step always analogous to the chemical Procedure for a thorough removal of the roughening agent was taken care of.
Da bisher mit den rein mechanischen Verfahren kein letztlich befriedigendes Ergebnis hinsichtlich der Haftfestigkeit zu erzielen war, wurde es auch oft in Kombination mit den chemischen Verfahren, insbesondere als Xorbehandlung hierfür, zur Verwendung gebracht.Since so far the purely mechanical process has not been ultimately satisfactory Result in terms of adhesive strength was achieved, it was also often in combination with the chemical processes, in particular as Xor treatment therefor, for use brought.
Abweichend von den bisher bekannten Verfahrensweisen zur haftfesten Metallisierung von hochpolymeren organischen Werkstoffen wird eine Lösung der erfindungsgemäßen Aufgabe nun dadurch erreicht, daß deren entsprechende Flächen vor der Metallisierung mit eingelagerten Korundkörnern versehen werden. Dabei können die Korundkörner von außen in die Fläche durch Druck ein- bzw. aufgegeben werden, z. B. mit Hilfe eines Gasdruckstrahls. Hierbei kann ein kontinuierliches Verfahren durch eine relative Bewegung der Werkstoffteile zur Korundteilchenquelle in Anwendung kommen. Es können jedoch auch die Korundkörner als Füllstoff in den hochpolymeren organischen Werkstoffeingebettet werden.Deviating from the previously known methods of adhering firmly Metallization of high polymer organic materials is a solution of the invention Task is now achieved in that their corresponding surfaces before the metallization be provided with embedded corundum grains. The corundum grains of be entered or abandoned externally in the area by pressure, z. B. with the help of a Gas pressure jet. Here, a continuous process can be replaced by a relative Movement of the material parts to the source of corundum particles come into use. It can however, the corundum grains are also embedded in the high-polymer organic materials as fillers will.
Zur Verdeutlichung des erfindungsgemäßen Verfahrens sei es im Einzelnen am Beispiel der Herstellung gedruckter elektrischer Schaltungen erläutert. Ausgangsmaterial ist, in diesem Fall in Trägerfunktion, ein Leiterplatten-Basis-Material auf Epoxid/Glas- bzw. Phenol/Papier-Basis.To clarify the method according to the invention, let it be in detail explained using the example of the manufacture of printed electrical circuits. Source material is, in this case with a carrier function, a printed circuit board-based material on epoxy / glass or phenol / paper-based.
Nun kann entweder dies oder aber eine daraufgebrachte in Haftvermittler- oder Kleberfunktion wirkende Schicht'- beide stellen hochpolymere organische Werkstoffe dar - mit eingelagerten Korundkörnern versehen werden. Die Einlagerung und Wirkung des Korunds kann durch entsprechenden Aufbau der Haftvermittlerschicht zusätzlich vorteilhaft beeinflunt werden. Als besonders wirkungsvoil hat sich ein Haftvermittler auf Nitrilkautschuk/Phenolharz-Basis mit Zusätzen von Aminoplastharz und Polyglykol sowie von anorganischem Füllstoff erwiesen - vorzugsweise Al-Silikaten und -Hydroxiden. Dabei konnte dann nachgewiesen werden, daß ein zumindest teilweise irreversibles Verankern des Strahlungsmaterials Korund in der Kunststoffoberfläche metallisieraktive Zentren schafft, die sowohl eine gute Adhäsion von Katalysatorlösungen und in der Folge eine chemisch-reduktive (stromlose) Abscheidung von Kupfer als auch eine gute Kupferhaftfestigkeit gewährleistet.Now either this or an applied in adhesion promoter or layer acting as an adhesive - both represent high-polymer organic materials dar - be provided with embedded corundum grains. The storage and effect of the corundum can be obtained by appropriate Structure of the adhesion promoter layer can also be beneficially influenced. A has proven to be particularly effective Adhesion promoter based on nitrile rubber / phenolic resin with additions of aminoplast resin and polyglycol as well as inorganic filler - preferably aluminum silicates and hydroxides. It could then be demonstrated that at least a partial irreversible anchoring of the radiation material corundum in the plastic surface Metallizing centers creates both a good adhesion of catalyst solutions and subsequently a chemical-reductive (electroless) deposition of copper as also ensures good copper bond strength.
Weiterhin zeigte sich nun, daß durchaus nicht jeder Korund bei sonst gleichartigen optimalen Bedingungen zu einer stromlosen Metallisierung führt. Ausgewählte -A12O3-Produkte mit geringer oder keiner Siliziumverunreinigung und unwesentllcher Gitterstörung und Netzebenenaufweitung, z. B. durch Erdalkalititanate, erwiesen sich als vorteilhaft.Furthermore, it has now been shown that not every corundum with otherwise similar optimal conditions leads to an electroless metallization. Selected -A12O3 products with little or no silicon contamination and negligible Lattice disturbance and network level expansion, e.g. B. by alkaline earth titanates to be beneficial.
Die Korngröße des Korunds bis zu 120zum hat sich als besonders geeignet erwiesen. Dabei ist es weiterhin vorteilhaft, die Dosierung der Teilchen und ihre kinetische Energie so zu bemessen, daß in der Werkstoffoberfläche eine Unebenheit vonl-7gum mindestens jedoch 3-5 kum erzeugt wird. Die Verformungsunebenheiten der Werkstoffoberfläche, die durch die Einlagerung vori Korund erfolgen, stellen Aufwellungen dar, wie man sie auch an Kraterwänden beobachtet. Die Verformungsunebenheiten erstrecken sich jedoch auch in die Schichttiefe, wobei dies durch das Herausreißen von Oher-fl;ichenteiRchen der Schicht begründet ist. Unterhalb der Werkstoffoberfläche in der Schicht entstehen dabei in beabsichtigter Weise Hinterschneidungsräume, die für eine gute Verankerung des später auf die Haftvermittlerschicht aufgetragenen metallischen Werkstoffes sorgen.The grain size of the corundum up to 120 um has proven to be particularly suitable proven. It is also advantageous to control the dosage of the particles and their kinetic energy to be measured so that an unevenness in the material surface vonl-7gum is produced at least 3-5 kum. The deformation unevenness of the The surface of the material, which occurs through the incorporation of corundum, represents corundum as seen on crater walls. The deformation bumps extend However, it also extends into the depth of the layer, whereby this is achieved by tearing out outer skin particles the shift is justified. They arise in the layer below the surface of the material while in the intended way undercut spaces that allow for good anchoring of the metallic material later applied to the adhesion promoter layer care for.
Nach dem vorstehen dargestellten Verfahren konnte bei haftvermittler-bschichtetem Leiterplatten-Basismaterial auf Epoxid/Glas- und Phenol/Papier-Basis nach einer an sich bekannten Edeimetallkatalysierung in einem ebenfalls an sich hekannten chemisch-reduktiv arbeitenden Kupferabscheidungsbad vollflächige Anverkupferungen von ca.Following the procedure outlined above, adhesion promoter-coated PCB base material based on epoxy / glass and phenol / paper after a per se known Edeimetallkatalysierung in a likewise known per se chemical-reductive working copper plating bath full-surface copper plating of approx.
2 jum Dicke erhalten werden, welche nach galvanischer Verstärkung auf 35 ,um Dicke eine Haftfestigkeit von >40, in der Regel 50-7C N/inch lieferten. Damit wird die Haftungshöhe wie bei chemisch gebeiztem Vergleichsmaterial erzielt.2 jum thickness can be obtained, which after galvanic reinforcement at 35 µm thick provided a bond strength of> 40, usually 50-7C N / inch. This achieves the same level of adhesion as with chemically pickled reference material.
Die genannte gute Kupferhaftfestigkeit ist auch noch bei dem bei Leiterplatten-Basis-Material geforderten Hitzeschock bei 2600 C bzw. 2350 C, je nach Basismaterial, gewährleistet.The good copper bond strength mentioned is also the case with the printed circuit board base material required heat shock at 2600 C or 2350 C, depending on the base material.
Außerdem ist durch die Korundeinlagerung in die Oberfläche auch die Gewähr gegeben, daß ein einmal aufgerauhtes Material selbst nach langer, sachgerechter Lagerzeit von z. B. 10 Monaten noch aktivierbar und verkupferbar ist.In addition, due to the corundum in the surface, the A guarantee that once a material has been roughened, it will be more appropriate even after a long period of time Storage time of z. B. 10 months can still be activated and copper-plated.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792950589 DE2950589A1 (en) | 1979-12-15 | 1979-12-15 | Prepn. of plastics for chemical metallisation - by embedding corundum grains to provide roughened surface, increasing adhesion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792950589 DE2950589A1 (en) | 1979-12-15 | 1979-12-15 | Prepn. of plastics for chemical metallisation - by embedding corundum grains to provide roughened surface, increasing adhesion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2950589A1 true DE2950589A1 (en) | 1981-06-19 |
| DE2950589C2 DE2950589C2 (en) | 1982-09-30 |
Family
ID=6088614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19792950589 Granted DE2950589A1 (en) | 1979-12-15 | 1979-12-15 | Prepn. of plastics for chemical metallisation - by embedding corundum grains to provide roughened surface, increasing adhesion |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE2950589A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2640905A1 (en) * | 1988-12-23 | 1990-06-29 | Stihl Andreas |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3328339A1 (en) * | 1983-08-05 | 1985-02-14 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Process for metallising a plastic surface |
| DE19620935A1 (en) * | 1996-05-24 | 1997-11-27 | Daimler Benz Ag | Process for coating polymers |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
| DE2145905B2 (en) * | 1971-09-14 | 1975-08-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Process for the production of surface metallized insulating materials by electroless metal deposition |
-
1979
- 1979-12-15 DE DE19792950589 patent/DE2950589A1/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
| DE2145905B2 (en) * | 1971-09-14 | 1975-08-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Process for the production of surface metallized insulating materials by electroless metal deposition |
Non-Patent Citations (1)
| Title |
|---|
| JP-AZ-Patentdokument, Kokai-No. 53-128671 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2640905A1 (en) * | 1988-12-23 | 1990-06-29 | Stihl Andreas |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2950589C2 (en) | 1982-09-30 |
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