DE2114652A1 - Process for regenerating electrolytes for the chemical deposition of metals - Google Patents
Process for regenerating electrolytes for the chemical deposition of metalsInfo
- Publication number
- DE2114652A1 DE2114652A1 DE19712114652 DE2114652A DE2114652A1 DE 2114652 A1 DE2114652 A1 DE 2114652A1 DE 19712114652 DE19712114652 DE 19712114652 DE 2114652 A DE2114652 A DE 2114652A DE 2114652 A1 DE2114652 A1 DE 2114652A1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- cell
- metal ions
- metals
- regenerating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims description 19
- 229910052751 metal Inorganic materials 0.000 title claims description 19
- 239000003792 electrolyte Substances 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 10
- 238000005234 chemical deposition Methods 0.000 title claims description 6
- 230000001172 regenerating effect Effects 0.000 title claims description 5
- 150000002739 metals Chemical group 0.000 title claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- 230000001502 supplementing effect Effects 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 230000008929 regeneration Effects 0.000 description 9
- 238000011069 regeneration method Methods 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Chemically Coating (AREA)
Description
Berlin, den 22. März 1971Berlin, March 22, 1971
/erfahren zum Regenerieren von Elektrolyten für die chemische Abscheidung von Metallen / experienced in the regeneration of electrolytes for the chemical deposition of metals
Die Erfindung betrifft ein Verfahren zum Regenerieren von Elektrolyten für die chemische Abscheidung von Metallen durch Ergänzung des abgeschiedenen Metalles.The invention relates to a method for regenerating electrolytes for the chemical deposition of metals by supplementing the deposited metal.
Cheuische Reduktionsbäder finden heute vielseitige Verwendung, so insbesondere für die Metallisierung von entsprechend vorbehandelten KunststoffOberflächen.Cheuische reducing baths are used today in many ways, so in particular for the metallization of appropriately pretreated Plastic surfaces.
Eei der hierbei erfolgenden Abscheidung des Metalles tritt naturgemäß sehr schnell eine. Verarmung an Metallionen ein, wodurch die Abscheidungsgeschwindigkeit des Metalles stark beeinträchtigt wird. Aus diesem Grunde wird durch Zugabe von konzentrierten i'ietallsalzlösungen das durch die Abscheidung verbrauchte Metall regelmäßig ergänzt. Diese Metallsalzlösungen enthalten meistens auch größere Mengen einer komplexbildenden Substanz.The deposition of the metal which takes place here occurs naturally very quickly one. Depletion of metal ions, which greatly affects the rate of deposition of the metal will. For this reason, by adding concentrated metal salt solutions, the amount consumed by the deposition is used up Metal replenished regularly. These metal salt solutions usually also contain larger amounts of a complex-forming agent Substance.
u3r iiachteil dieser bisher üblichen Methode liegt jedoch darin, α.-iß en hierbei zu einer unerwünschten Anreicherung an Säure-■ αIonen durch die dem Bad zugeführten Metallsalze und komplex--.; LcJoiiden Substanzen kommt. U3R but iiachteil this usual method is α.-ite s here ■ an undesirable accumulation of acid αIonen by komplex-- the bath supplied metal salts and. ; LcJoiiden substances comes.
209841/0942 pad209841/0942 pad
Die Erfindung hat daher die Aufgabe, eine Ergänzung des durch die chemische Abscheidung verbrauchten Metalles zu ermöglichen, ohne daß es zu einer Anreicherung von Säureanionen und komplex-. bildenden Substanzen kommt.The invention therefore has the task of making it possible to supplement the metal consumed by the chemical deposition, without there being an accumulation of acid anions and complex-. forming substances.
Dies wird erfindungsgeraäß durch ein Verfahren gelöst, das dadurch gekennzeichnet Ist, daß die Elektrolytlösung kontinuierlich durch eine Zelle bewegt wird, in der die durch chemische Abscheidung verbrauchte Menge an Metallionen durch elektro—chemisch in Lösung gebrachte Metallionen ergänzt wird.This is achieved according to the invention by a method that thereby Is characterized in that the electrolyte solution is continuously moved through a cell in which the chemical Deposition of the amount of metal ions consumed by electro-chemical brought into solution metal ions is supplemented.
Hierbei wird erfindungsgemäß eine Regenerierzelle verwendet, die mittels einer für den Elektrolyten durchlässigen.Platte, z. B. aus porösem Kunststoff, Keramik oder anderen permeablen Materialien, in zwei Abteilungen getrennt ist.According to the invention, a regeneration cell is used here, which by means of a plate that is permeable to the electrolyte z. B. made of porous plastic, ceramic or other permeable materials, is separated into two compartments.
Diese beiden Abteilungen enthalten nun jeweils eine kathodisch oder anodisch gepolte Elektrode, die an einen Gleichrichter angeschlossen sind..These two departments now each contain a cathodic or anodically polarized electrodes connected to a rectifier ..
Die Abteilung mit der kathodisch gepolten Elektrode wird dann mit einem geeigneten Elektrolyten, u. 'J. einer-KailuMhydro:-:;.-cl- oder Natrluflihydroxyd-Lösung, gefüllt, während die Abteilung mit der anodisch gepolten. Elektrode den das ine tall abscheidenden Elektrolyten enthält» In diesem Anodenraum erfolgt nun die Ergänzung der Metallionen, indem der an Metallionen verarmte Elektrolyt im Kreislauf kontinuierlich durch diesen Ilauni, z,ß,The department with the cathodically polarized electrode is then with a suitable electrolyte, u. 'J. one-KailuMhydro: -:; .- cl- or sodium hydroxide solution, while the department is filled with the anodically polarized. Electrode that separates the ine tall Electrolyte contains »In this anode compartment, the replenishment takes place of metal ions by being depleted of metal ions Electrolyte in circulation continuously through this Ilauni, z, ß,
209841/0942 BAD ORIGINAL209841/0942 B AD ORIGINAL
21U65221U652
durch Pumpen, bewegt und nach erfolgter Ergänzung dann dem Arbeitsbehälter wieder zugeführt wird, in den: die Abscheidung .stattfindet.by pumping, moved and then, after completion, the working container is fed back in, in which: the separation. takes place.
Diese Zuführung der ergänzten bzw. regenerierten Lösung in den Hrbeitsbehälter läßt sich zwe^Kmäßigervieise z. b. mittels eines i'berlaufes durchi'üiiren.This supply of the supplemented or regenerated solution into the working container can be carried out in two ways, for example by means of an overflow.
Die kathodisch ^epolte Elektrode soll vorteilhafterweise aus rostfreiem Stahl bestehen, während als Anodenrnaterial naturgemäß dasjenige he tall zu verwenden ist, v^elches ergänzt vierden sei 1.The cathodically polarized electrode should advantageously be off Stainless steel exist, while the anode material naturally to be used is that of metal, which is supplemented by four be 1.
Die Stärke der Kachbildung von Ketallionen im Anodenraum kann in einfachster Weise durch Regulierung der Stromstärke des Gleichrichters erfolgen. Eine Steuerung des Gleichrichters, z. : . mittels eines die ί-ietallionenkonzentration im Arbeitsbehälter .\iessenden Instrumentes, ermöglicht dann eine kontinuierliche Ergänzung des abgeschiedenen Hetalles und damit die Konstanthaltung der i<letallionenkonzentration im Arbeitsbehälter. Hierdurch wird eine ununterbrochene Ketallisierung ermöglicht, was z. B. beim betrieb automatischer Anlagen besonders weltvoll ist.The strength of the formation of ketallion ions in the anode space can be done in the simplest way by regulating the current strength of the rectifier. A control of the rectifier, e.g. :. by means of an instrument that measures the metal ion concentration in the working container, then enables the deposited metal to be continuously replenished and thus keeping the metal ion concentration constant in the working container. This enables uninterrupted ketallization, which z. B. is particularly worldly when operating automatic systems.
Das erl'inJungsgemäße Verfahren viird nachfolgend anhand der Arbeitsbedingungen beim Eetrieb chemischer rletallbäder näher erläute. . BADORiGINALThe method according to the present invention is shown below on the basis of the working conditions for the operation of chemical metal baths. . BADORiGINAL
209RA1 /09Ä2209RA1 / 09Ä2
21U65221U652
Beispiel 1example 1
Es wird eine Regenerierzelle verwendet, in der man den Abstand zwischen den Elektroden so klein wie möglich hält.A regeneration cell is used in which one can keep the distance as small as possible between the electrodes.
Eine solQhe Zelle ist in-Figur 1 dargestellt. Hierin bedeuten 1 eine Elektrode aus rostfreiem Stahl, 2 eine poröse Keramikplatte und 3 eine Elektrode aus Kupfer. A stellt den Zulauf für die zu regenerierende Lösung dar und B den Ablauf der regenerierten Lösung.Such a cell is shown in FIG. Mean therein 1 a stainless steel electrode, 2 a porous ceramic plate, and 3 an electrode made of copper. A provides the feed for the solution to be regenerated and B the drain of the regenerated solution.
Der Aufbau dieser Regenerierzelle ist weiterhin aus den Figuren 2 und 3 ersichtlich, in denen die Bezugszeichen 1, 2, j?, A und B dieselbe Bedeutung wie in Figur 1 besitzen. 5 bedeutet die aus Kunststoff bestehende Behälterwandung und 6 stellt Platten, ebenfalls aus Kunststoff, dar, welche einen sehr geringen Abstand der Elektroden ermöglichen. Die Elektrolytlösung wird durch E und die Alkalihydroxyd-Lösung durch F dargestellt. The structure of this regeneration cell can also be seen from FIGS. 2 and 3, in which the reference symbols 1, 2, j ?, A and B have the same meaning as in FIG. 5 means the container wall made of plastic and 6 represents Plates, also made of plastic, are very low Allow the electrodes to be spaced. The electrolyte solution is represented by E and the alkali hydroxide solution by F.
Die Anodenplatten bestehen naturgemäß aus dem Metall, das ergänzt werden soll.The anode plates naturally consist of the metal that is to be supplemented.
Die Anodenräume werden nun, z.B. mit Hilfe von Schläuchen, in Serie geschaltet, worauf die zu regenerierende Elektrolytlösung hindurchgepumpt wird. Die Lösung wird zu diesem Zweck aus dem Arbeitsbehälter, in dem die chemische Metallabscheidung erfolgt, angesaugt, in den Anodenraurn der Regenerierzelle eln^e-The anode spaces are now connected in series, e.g. with the help of hoses, whereupon the electrolyte solution to be regenerated is pumped through. For this purpose, the solution is extracted from the working container in which the chemical metal deposition takes place. sucked into the anode space of the regeneration cell
209841 /0942209841/0942
BAD ORIGINALBATH ORIGINAL
führt und nach der Ergänzung durch Metallionen wieder in den Arbeitsbehälter zurückgeführt. Der Kathodenraum wird mit einer In Natriumhydroxyd-Lösung gefüllt.leads and returned to the working container after the addition of metal ions. The cathode compartment is with a Filled in sodium hydroxide solution.
Zum Regenerieren eines Kupferelektrolyten der ZusammensetzungFor regenerating a copper electrolyte of the composition
Kupfersulfat (CuSO^ , 5 HgO) 5 g/LiterCopper sulfate (CuSO ^, 5 HgO) 5 g / liter
Komplexbildner (Dinatriumsalz der Ethylendiamintetraessigsäure) 20 g/LiterComplexing agent (disodium salt of ethylenediaminetetraacetic acid) 20 g / liter
Alkalihydroxyd (NaOH) 3 g/LiterAlkali hydroxide (NaOH) 3 g / liter
Stabilisator (Rhodanin)....» 0, OO3 g/LiterStabilizer (rhodanine) .... »0.03 g / liter
Reduktionsmittel (Formaldehyd) 5 g/LiterReducing agent (formaldehyde) 5 g / liter
vom pH 12,5 wurde z. B. beim Anlegen einer Gleichspannung von 40 Volt bei parallel geschalteten Anoden eine Stromstärke von 10 Ampere erreicht. Hierbei erhöhte sich die Kupferkonzentration der Regenerierzelle um 3,5 g/Liter, was bei einer Strömungsgeschwindigkeit von 5 Liter/h einer Metallergänzung von 11 g/Stunde entspricht. Im Arbeitsbehälter ist damit eine kontinuierliche chemische Metallabscheidung von etwa 10,5 g Kupfer/h möglich, was einer Fläche von 1,18 m /h mit einer Schichtdicke von 1 μτη entsprlcnt.from pH 12.5 was z. B. when applying a DC voltage of 40 volts with anodes connected in parallel, a current of 10 amperes can be achieved. This increased the copper concentration the regeneration cell by 3.5 g / liter, which is at a flow rate of 5 liters / h corresponds to a metal supplement of 11 g / hour. There is thus a continuous flow in the working tank chemical metal deposition of about 10.5 g copper / h possible, which is an area of 1.18 m / h with a layer thickness of 1 μτη corresponds.
Üeispiel 2 Example 2
Die im Beispiel 1 beschriebene Regenerierzelle wurde zur Regenerierung eines Elektrolyten folgender Zusammensetzung verwendet;The regeneration cell described in Example 1 was used for regeneration an electrolyte of the following composition is used;
-6-209841/0942 -6-209841 / 0942
Nickelchlorid (NiCl2 . 6 H2O) 26 g/LiterNickel chloride (NiCl 2. 6 H 2 O) 26 g / liter
Natriumhy pophos phi t ". j50 g/LiterSodium hypophosphite ". 50 g / liter
Milchsäure 27 g/LiterLactic acid 27 g / liter
Propionsäure 2 g/LiterPropionic acid 2 g / liter
Bleichlorid 0,0027 g/LiterLead chloride 0.0027 g / liter
Zu diesem Zweck wurde diese Lösung aus dem Arbeitsbehälter angesaugt, in den Anodenraurn gepumpt und nach Durchströmen der Regenerierzelle zurück in den Arbeitsbehälter geleitet. Der Kathodenraum enthielt andererseits eine etwa 1 η Natriumhydroxyd-Lösung. Beim Anlegen einer Gleichspannung von 40 Volt erzielte man eine Stromstärke von 8,2 Ampere. Bei einer Strömungsgeschwindigkeit von 3 Liter/h erhielt man eine Konzentrationserhöhung von 2,7 g Nickel/Liter, was einer Metallergänzung von 8,1 g/h im Arbeitsbehälter entsprach.For this purpose, this solution was sucked out of the working container, pumped into the anode chamber and, after flowing through the regeneration cell, returned to the working tank. Of the On the other hand, the cathode compartment contained an approximately 1 η sodium hydroxide solution. When a direct voltage of 40 volts was applied, a current of 8.2 amperes was achieved. An increase in concentration was obtained at a flow rate of 3 liters / h of 2.7 g nickel / liter, which corresponds to a metal addition of 8.1 g / h in the working container.
-7--7-
209841 /0942209841/0942
Claims (5)
Elektrolyten permeablen Platte, in 2 Abteilungen getrennt ist.2. The method according to claim 1, characterized in that a cell is used which by means of a for the
Electrolyte permeable plate, separated into 2 compartments.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712114652 DE2114652A1 (en) | 1971-03-23 | 1971-03-23 | Process for regenerating electrolytes for the chemical deposition of metals |
| GB814272A GB1384118A (en) | 1971-03-23 | 1972-02-22 | Treatment processes using metal ion-containing treating solutions |
| IT2194072A IT950267B (en) | 1971-03-23 | 1972-03-16 | PROCEDURE FOR REGENERATING ELECTRO LITES FOR THE CHEMICAL DEPOSITION OF METALS |
| FR7209967A FR2130529B1 (en) | 1971-03-23 | 1972-03-22 | |
| JP47029365A JPS5234572B1 (en) | 1971-03-23 | 1972-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712114652 DE2114652A1 (en) | 1971-03-23 | 1971-03-23 | Process for regenerating electrolytes for the chemical deposition of metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2114652A1 true DE2114652A1 (en) | 1972-10-05 |
Family
ID=5802817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712114652 Pending DE2114652A1 (en) | 1971-03-23 | 1971-03-23 | Process for regenerating electrolytes for the chemical deposition of metals |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5234572B1 (en) |
| DE (1) | DE2114652A1 (en) |
| FR (1) | FR2130529B1 (en) |
| GB (1) | GB1384118A (en) |
| IT (1) | IT950267B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2713392A1 (en) * | 1977-03-23 | 1978-09-28 | Ruwel Gmbh | METHOD AND DEVICE FOR PRODUCING METAL COMPLEX COMPOUNDS SUITABLE FOR CHEMICAL METAL DEPOSITION AND FOR OPERATING CHEMICAL METALIZING BATHS |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4425205A (en) * | 1982-03-13 | 1984-01-10 | Kanto Kasei Co., Ltd. | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
| CN114672792B (en) * | 2022-04-20 | 2024-11-22 | 深圳市恒博智造有限公司 | Nickel cylinder device for nickel plating with load and nickel plating time control function |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3303111A (en) * | 1963-08-12 | 1967-02-07 | Arthur L Peach | Electro-electroless plating method |
| IL31031A (en) * | 1967-12-04 | 1972-08-30 | Stauffer Chemical Co | Process of chemical nickel plating and baths therefore |
-
1971
- 1971-03-23 DE DE19712114652 patent/DE2114652A1/en active Pending
-
1972
- 1972-02-22 GB GB814272A patent/GB1384118A/en not_active Expired
- 1972-03-16 IT IT2194072A patent/IT950267B/en active
- 1972-03-22 FR FR7209967A patent/FR2130529B1/fr not_active Expired
- 1972-03-23 JP JP47029365A patent/JPS5234572B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2713392A1 (en) * | 1977-03-23 | 1978-09-28 | Ruwel Gmbh | METHOD AND DEVICE FOR PRODUCING METAL COMPLEX COMPOUNDS SUITABLE FOR CHEMICAL METAL DEPOSITION AND FOR OPERATING CHEMICAL METALIZING BATHS |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2130529A1 (en) | 1972-11-03 |
| IT950267B (en) | 1973-06-20 |
| JPS5234572B1 (en) | 1977-09-03 |
| FR2130529B1 (en) | 1976-08-06 |
| GB1384118A (en) | 1975-02-19 |
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