DE2166060A1 - Electroless deposited nickel alloy. Eliminated from: 2122455 - Google Patents

Description

2300 Washington Street
Newton, Massachusetts / V.St, A.

Our reference: S 2680

Electroless deposited nickel alloy

[Elimination from P 21 22 4-55.5-4-5]

The invention relates to an electrolessly deposited nickel alloy, which, in addition to nickel, also contains copper and phosphorus.

Electroless nickel alloys are already known from US Patents 2,690,401, 2,690,402, 2,762,723, 2 925 4-25, 2,929,742 and 3,338,726 which are deposited on a substrate by chemical reduction in the absence of an external electrical current to be deposited. Such nickel alloys have also already been described in the 35th annual edition of the "Metal Finishing Handbook", 1967 _v Metal and Plastics Publications, Inc., Westwood, New Jersey, pages 483 to 486.

For the production of such electroless nickel alloys, solutions are usually used that contain at least 4 contained in a solvent, preferably water, dissolved components. These are (1) a source of nickel ions, (2) a reducing agent such as hypophosphite, (3) an acid or hydroxide pH regulator

Dr Hn/ou

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to adjust the desired pH and (4) a complexing agent for metal ions, which their precipitation from the Solution should prevent.

It is true that "attempts have already been made from such, currentless deposited nickel alloys to produce decorative alloy coatings, but these have evolved from different Reasons so far not proven to be satisfactory. First, the previously known, electroless deposited Nickel coatings do not have the sheen, mirror-like appearance that a decorative metal surface coating does Second, some of these electroless nickel coatings occur within a short period of time a yellow haze, which is a corrosion product that occurs when the nickel alloy is exposed to air arises. Finally, the decorative metal surface coatings desired should be corrosion resistant. The coatings made from the previously known electroless nickel alloys have good corrosion resistance on, but they do not have the appearance required for a decorative and protective metal surface coating at the same time. - · ·

The present invention is now a currentless deposited nickel alloy, which is characterized in that it consists essentially of from 1 to 25% by weight of copper, consists of 5 to 15% by weight of phosphorus and the best of nickel. -

From the nickel alloy according to the invention can by electroless Deposition produced exceptionally smooth, pore-free surface coatings practically free of defects will. These have a shiny appearance, their surface does not fog up and they are exceptionally resistant to corrosion, so that they are excellent as decorative and at the same time protective metal surfaces

Suitable.- The electroless deposited according to the invention. Nickel alloy can be made from a solution ^ which comprises (1) a source of nickel ions, (2) a

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Hypophosphite reducing agent for the nickel ions, (3) one pH regulator, (4) a complexing agent for the nickel ions which, if necessary, prevent them from precipitating out of the solution should, (5) a source of copper ions, preferably in the monovalent (copper (I) -} form and (6) if necessary a complexing agent for copper (II) ions.

Figure 1 of the accompanying drawings is a graphical representation the concentration of copper in a NickelrCopper ™ Phosphorus alloy deposition as a function of the pH of the electroless plating solution used to create the deposit.

Figure 2 is a graph of the concentration of copper in a nickel-copper-phosphorus alloy deposit as Function of the copper ion concentration in the electroless plating solution;

Figures 3 are four photomicrographs of the surface of the various alloy deposits with and without copper and / or Sulfur compounds contained in the metal deposition solution th are; and

FIG. 4 presents two photomicrographs of the cross section of FIG represents two alloy deposits produced according to the invention.

As stated above, it is assumed that the copper (I) ions for the increased stability of the bath, the increased corrosion resistance of the deposit and the improved appearance of the deposit are responsible and that the copper ions in the copper (II) form form a deposit with an improved appearance deliver. As a result, electroless nickel deposition

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■ - ■ 5 ■ - ■

solution, both copper (I) and copper (II) compounds may be added, although the copper (I) compounds are preferred are.

Both the simple and the complex, in the currentless Nickel plating solution-soluble copper compounds are used as the source of the copper ions for the purposes of the present invention suitable. Typical examples of such compounds are copper (I) acetate, copper (II) acetate, copper (I.) ^ Benzoate. Copper (II) benzoate, Copper (I) bromide, copper (II) citrate, copper (II) bromide, copper (I) carbonate, copper (II) carbonate, copper (I) chloride, copper (II) chlorides Copper (I) fluoride, copper (II) fluoride, copper (II) nitrate, Copper (I) hydroxide, copper (I) sulfate, copper (I) ammonium chloride and copper (II) ammonium chloride.

A complexing agent can be used to keep the copper in solution be necessary, especially if the copper is present in relatively large quantities. Complexing agent for copper are known and are described, for example, in U.S. Patents 2,938,805,3 312 430 and 3,383,224.

With regard to the copper (I) connection it should be noted that many of these compounds are not completely soluble in aqueous solution and that some are considered insoluble. the Copper (I) compound, however, is for the purposes of the present Invention only necessary in such an amount that the concentrations of copper (I) ions in the order of magnitude of only a few Deliver ppm. As a result, copper (I) compounds known as Considered essentially insoluble in aqueous solution, soluble to such an extent that they contain copper (I) ions provide their concentration for the purposes of the present invention sufficient. Easily soluble copper (I) compounds are preferred.

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In use, as metal deposits form from the plating solution, copper and nickel are co-deposited starting with the formation of a nickel-copper-phosphorus alloy. There are several factors that affect the amount of in the electroless alloy commonly deposited copper. One such factor is the pH of the solution and it has been found that a lower pH value, especially below 4.5, a higher one Concentration of the co-precipitated copper favors. the The relationship between the pH of the solution and the concentration of the coprecipitated copper is shown in Fig. T of the accompanying drawings Drawings shown in which, for explanatory purposes, the electroless solution of Example 1 under the specified conditions was used, the 200 ppm copper (I) ions (in the form of Copper (I) chloride) had been added. The pH was through Addition of ammonium hydroxide stopped. From Fig. 1 it can be seen that that the common copper deposit increases considerably, when the pH falls below 5.0 »

Another factor that appears to affect the concentration of copper in the deposit is the concentration of copper in the plating solution. This relationship is in Fig. 2 for a acid bath, in which curve A shows the relationship between the content of copper (I) ions in the solution and the copper content explained in the preserved Niekel deposit, while ^ in the Curve B shows the relationship between copper (II) content in the solution and copper content in the deposit is shown. The electroless plating base solution is that of Example 1 given below using the conditions given.

A third factor that appears to affect the copper concentration in the deposit is the working temperature of the solution. It has been found that the copper in the deposit increases substantially in acid baths having a pH value between about 4.0 and 5.0, the concentration if the solution temperature drops to a value below about 88 ° C (190 ⁰ F).

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From the above it can be seen that the copper content in the deposit can be relatively high compared to the Cooper content in the solution, especially if the solution is at low pH, low solution temperature, or both. The above experiments show that the copper deposit may be preferred over nickel deposition and frequent replenishment with a copper salt may be necessary. Typically the copper concentration varies in the deposit between 0.1 and 12% by weight, but it can also be 25% by weight or more, especially in thin deposits, z. B. those with a thickness of 0.635 mm (1 / .4 mils) Or less. .

The numerical indicated in the deposit in the drawings Copper concentration value can be a bit misleading. Without being bound by theory, it is believed that at least in acidic solutions with a pH of less than 5 on a highly activated surface the copper first alone or together with some nickel in the form of a thin film and then together with nickel to form a first of copper highly concentrated layer, which is coated with the combination of nickel and copper, is plated. It is believed, that this is particularly true at a low pH of the solution and at a low bath temperature. As a result, it is assumed that the total thickness of the deposit obtained from a boundary layer which is in contact with the coated substrate, with the highest concentration of co-precipitated copper and the surface furthest from the substrate with the lowest copper concentration, between them a copper concentration gradient (transition) exists in both layers. If during the plating of a certain substrate the solution is replenished with copper, the result is «

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also a structure in which the concentration in the part the deposit formed at the time of replenishment is high being, being a new one. The gradient is from the high copper concentration to the low copper concentration sufficient, depending on the plating of the replenished copper. This is explained in FIGS. 4A and 4B, the cross sections through Represent deposits, with in Fig. 4A during plating twice again, while in Fig. 4B not again has been replenished. The layer structure can be clearly seen from FIG. 4A.

The amount of copper that can be tolerated in the solution depends on various factors. For example, changing the basic solution, e.g. The change in the complexing agent, the change in the nickel or hypophosphite content and the like lead to a change in the maximum amount of copper tolerable in the solution. B. pH and temperature, factors related to the maximum copper content in the solution. In this regard, under preferred operating conditions, the content of copper ions in the solution is preferably maintained between 5 and 200 ppm of the solution (expressed as copper metal), more preferably between about 15 and 100 ppm of the solution. Working conditions preferred according to the invention are a pH between about 4.0 and 7.0, preferably between 4.0 and 5.5, within the pH range from 4.0 to 5.5. a preferred working temperature for the electroless solutions is at least 88 ⁰ C (190 ⁰ F). Under these conditions, at a relatively high concentration of the solution of copper, e.g. B. obtained from more than about 200 ppm of the solution, for reasons not yet clear, deposits with a more matte than glossy appearance and a granular (powdery) structure. It should be noted that

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the copper ion concentration ranges given here. • only guidelines and that the copper ion concentration kept in the solution the most appropriate at a value> will be sufficient to achieve the above aims an improved corrosion resistance and an improved appearance to, while powdery simultaneously matte deposits or excessive Kupferausplattierungvermieden is . Therefore, the maximum copper content can be higher under different working conditions without a powdery (granular) deposit being formed. ^

As already stated above, increased bath stability is obtained, if the copper is in the form of copper (I) ions, Although electroless nickel solutions have been used for many years, the formulations used technically have as is well known, often the disadvantage that they are relatively low Deposition rates result and that the bath is unstable is. It has also already been established that the plating speed to some extent on the concentration of the reducing agent or that in the plating solution existing nickel ions depends and that an increased concentration generally leads to an increased rate of deposition leads. An increased concentration of reducing agent " u ^ d / or nickel, however, leads to a lower bath stability, This manifests itself in a reduction in the period of time within which the plating solution undergoes uncontrollable decomposition (Trigger) is subject. It is also already known that certain additives or inhibitors added to an electroless nickel solution in properly controlled trace amounts act as stabilizers and the speed of the Retard bath decomposition. In general, these stabilizers are catalytic poisons and their concentration in the solution is unusually critical. Trace amounts, preferably within the

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21BBOiO - to -

Range of a few, ppm of the solution, depending on the lead used special stabilizer to stabilize. A However, excess stabilizer partially or completely stops the electroless deposition of metal.

One such stabilizer, which is also a catalytic poison, is described in U.S. Patent No. 2,762,723. In this. The patent describes an acidic nickel plating solution which is stabilized with a source of sulfide ions and a "sulfide ion regulator ¹¹ which combines with the sulfide ions to prevent their release from a hot or boiling solution. Such sulfide ion regulators are lead, bismuth, tin , Selenium, tellurium, tungsten, thorium, titanium, copper, zinc, manganese and rhenium. The sulfide ions, which are the active constituents of the stabilizing combination, are catalyst poisons and as such reduce the plating speed in trace amounts and prevent plating According to the invention, a significantly improved stability is achieved with small amounts of copper (I) ions, and there is only a negligible effect on the plating speed, since the copper (I) ions are not a catalyst poison.

\ ^v

Regarding the use of the sulfide ions as a stabilizer, such as it is described in the aforementioned US Pat. No. 2,762,723, it was also found according to the invention that the presence of sulfide ions or any other sulfur compound, which together with the electroless alloy at least partially deposited and / or dissociated with the formation of sulfur in the solution, for example in the form of the sulfide or llydrosulfide ion, detrimental both to the appearance of the deposit and to the other properties, such as, for example Corrosion resistance, is. Although the addition of copper to the solution creates an electroless nickel-copper-phosphorus alloy deposit delivers that are smooth and dense and therefore shiny in

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their appearance and is corrosion resistant go, these advantageous properties lost ^one, even if sulfur is present in the plating solution of the type described. Sulfur compounds that can be tolerated in the solution to a limited extent are those that are covalently bonded to carbon atoms, thereby preventing the introduction of the sulfur into the solution. While these compounds are disadvantageous, they are not as harmful as those that dissociate. Accordingly, the compositions of the invention are preferred. free of sulfur compounds which dissociate in solution to form harmful sulfur ions, and most preferred are those compositions which are free of all sulfur compounds "which form sulfur in the alloy deposit, even if present in trace amounts.

The effect of sulfur in the solution is readily apparent from Figure 3 of the accompanying drawing which is four photomicrographs illustrating the surface of four nickel deposits at a magnification of 5000 times. Photomicrograph A shows a deposit of a nickel-hypophosphite solution free of both copper and sulfur compounds. From this it can be seen that the deposit has a rough, irregular appearance. Photomicrograph B shows a deposit of the same composition but containing 10 ppm thiourea based on the composition. There is little difference between the deposits in photomicrographs A and B. Photomicrograph C shows a deposit made from the same composition as A, but containing 100 ppm copper (I) chloride based on the solution. A comparison of photomicrograph C with photomicrographs A and B shows the sharp contrast which consists in the fact that no imperfections can be seen on the surface of the deposit shown in photomicrograph C. Microphotograph D shows one

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Deposit of the same composition as the photomicrograph C, but containing 100 ppm thiourea in the deposit composition, it can be seen that the deposit exhibits a rough surface which is only slightly improved over that shown in photomicrographs A and B. Deposits. - -

The particular copper compound selected as the source of the copper ions for the purposes of the present invention is not critical as long as it provides sufficient copper ions and as long as the anion of the copper compound is applied to the plating solution has no adverse effect. In this regard it is known that certain anions in sufficiently large amounts, such as. B. cyanide, are detrimental to plating solutions and Salts containing these anions or other anions known to be harmful should be avoided.

The nickel solutions according to the invention can Ilypophosphit as Contain reducing agents. It is known that the deposit obtained contains phosphorus as an alloying element when the Phosphorus content is typically within the range of about 5 to 15 weight percent, depending on numerous factors, such as The ratio of glyphosphite to nickel in the plating solution, the pH of the solution, and the like. The most common range for such deposits using well known methods varies between about 5 and 10%, although higher phosphorus levels if desired are available within the range between 10 and 151.

The electroless nickel alloy plating solutions made in accordance with the present invention are used to deposit nickel in the same way as the well-known electroless ones Nickel solutions. The surface of the substrate to be plated

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should be free from grease and contaminating material. If a non-metallic surface is to be plated, the surface area to which the deposit is to be deposited must first be sensitized to make it receptive to the electroless nickel alloy by treating it in a manner known per se with a acidic aqueous solution of tin (II) chloride and then with an acidic
treated dilute aqueous / solution of palladium chloride. Extremely good sensitization of non-metallic surfaces can also be achieved by bringing them into contact with a catalyst which has been prepared by mixing tin (II) chloride and a noble metal chloride, preferably palladium chloride, the tin (II) chloride is present in a stoichiometric excess over the amount of noble metal chloride.

For a better understanding, the invention is explained in more detail with reference to the following examples, in which the stability of a solution was determined by the time it took for a bath to decompose spontaneously (trigger) when a catalyzed tissue (cloth) or activated aluminum was plated and the deposition properties were determined by plating a chromium-plated steel substrate certainly. The catalyzed fabric was made by treating a cotton fabric according to the following sequence of steps:

1. Rinse the tissue for 5 minutes in a 20% by weight Ammonium hydroxide solution that has been kept at room temperature - rinsing with cold water,

2. Rinse for 5 minutes with a 20% acetic acid solution that kept at room temperature, rinsing with cold

.Water.

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3. About. Immersing the tissue in a sensitizing solution of a palladium colloid for 20 to 40 seconds with a tin (IV) acid protective colloid (catalyst 6F), which was kept at room temperature, rinsing with cold water,

4. Immersion in a dilute for 1 to 3 minutes at room temperature held hydrochloric acid solution, rinse with cold water,

5. Dry the fabric and cut it to the appropriate size.

The activated aluminum used was that obtained by immersion in 371 hydrochloric acid for 2 minutes activated 2024 alloy.

In all examples, 930 cm (1 square foot) of the catalyzed tissue or activated aluminum per 3.79 liters (1 gallon) of solution to start the deposition and the trigger formation is used to determine the stability. In order to avoid pollution from contaminants, wasdoiauch distilled water and reagent grade chemicals used.

example 1

Nickel sulfate hexahydrate ad 35 G Sodium hypophosphate monohydrate 15th G Sodium acetate approximately 15th G water 1 1 temperature 91 -96 PH value 5 , 0

⁰ C (195-205 ⁰ F)

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The activated aluminum led to a decomposition (triggering) of the abovementioned bath within 12 minutes, whereby within a heavy deposit appeared on the sidewalls after about 8 minutes. If 50 ppm copper (I) ions (in the form of copper (I) chloride) were added to the bath, it did not decompose within 6Ό minutes.

Example 2

Nickel chloride hexahydrate Sodium hypophosphite monohydrate ■ Ammonium chloride Ammonium hydroxide

Water temperature

This bath decomposed within about 20 minutes of use of activated aluminum. With the addition of 50 ppm, based on the solution, of copper (I) ions (in the form of copper (I) chloride) no triggering occurred for about 40 to 45 minutes.

Example 3

Nickel chloride hexahydrate sodium hypophosphite monohydrate ammonium chloride Ainiuonium Liydroxyd Water temperature

30th G 1 10 G C Π95-2O5 ° Fl 100 G until on a pH from approximately 9 ad 1 91 - 96 °

30th G 1 drat 10 G C (180 ⁰ F) 25th G up to a pH of about 8.5 ad 1 approximately 82 °

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The addition of the catalyzed tissue to the above solution resulted decomposition thereof within about 1 to 2 minutes. When adding about 25 ppm of copper (I) ions in the form of Copper (I) chloride did not decompose within 4 minutes on. When the copper (I) ion content is increased to 40 ppm on the solution, no decomposition occurred for about 7 to 8 minutes. An increase in the copper (I) ion content to 50 ppm, based on on the solution, caused decomposition in about 10 to 12 minutes. When finally the copper (I) ion content was increased to 200 ppm of the solution, no decomposition occurred for 12 to 15 minutes, but the appearance of the deposited nickel was dull and had a powdery structure (grainy Structure). From the above it can be seen that the copper (I) ion stabilizer is more effective in acidic nickel baths than in alkaline baths, but also a certain amount in the latter Improvement is achieved.

Examples 4 to 10

Nickel sulfate hexahydrate Sodium hypophosphite monohydrate Sodium acetate

Sulfur stabilizer * · ■ * water

temperature

PH value

* ■ • 'added in the form of thiourea

The copper (I) ions were added in the form of copper (I) chloride and a catalyzed tissue was used to determine stability in the manner described above. There were the gloss and corrosion resistance are also determined, the following results being obtained:

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91 35 G approximately 15th G 15th G S. ppm ad 1 1 -96 ° C (195-2O5 ° F) 5

216606G

Example ^ · * Copper (I) - , ' ₂ \ Corrosion ,,. Stability No. content (ppm) Gloss ^{1 J} resistance ^ ^J (minutes)

O 1 strong gas formation> 60

within 30

'Seconds, instantaneous

Formation of black dirt

5 1 gas formation in 3 1/2> 60

Minutes, black stripes in 1 min.

25 3 Gas formation in 40> 60

Minutes, black stripes in 14 1/2 minutes

50 4 no gas formation> 60

or banding within 8 hours

0 - because of insufficient 2

The sample could not be evaluated for the same plating time

25 5 no gas formation or> 60

Banding, within 72 hours

50 5 no gas formation> 60

or banding within 150 hours

* ■ 'In Examples 8, 9 and 10 compositions were used in which the thiourea was omitted _%

* ■ • 'Arbitrarily determined scale obtained by visual observation was determined, with the number 1 a, matte, non-reflective Surface and the number 5 mean a shiny, mirror-like surface; the digits between 1 and 5 represent gradations in the ability to reflect.

* ■ '' Determined by immersing the plated part in a 6N hydrochloric acid at 38 ^° C (100 ^° F).

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From the table above it can be seen that thiourea is a effective stabilizer, but no improvement the corrosion resistance or the gloss of the deposit and that it is in the presence of copper CI) ions a has an adverse effect on the deposit. In addition, copper (I) ions without thiourea improve the gloss and the Corrosion resistance of the deposit as well as the stability of the solution are considerable. As a result, those of sulfur-containing Connections of the type described above free electroless Alloy solutions preferred for the purposes of the invention.

Examples 11 to 16

Copper (II) chloride was added to the composition of Example 1 was added in varying amounts and the resulting composition was used to clad chromed steel. Subsequently, the deposits thus obtained were peeled from the substrate and each was examined for its copper content analyzed. The amount of copper added to the solution and the amount in the deposit for each plated substrate found copper are given in the following table.

Copper content in the deposit (wt%)

0.01 0.36 0.68 1.28 1.50 3.44

example
No. Copper (II) content in
of the solution (ppm) 11 0 12th 20th 13th 40 14th 80 15th 100 16 200

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The deposits of Examples .12 to 15 had a shiny appearance, and there was observed no gas formation or streaking when the films of the deposited alloys were immersed at 38 ⁰ C in 6N hydrochloric acid. The deposit of Example 16 was dull in appearance and had a powdery (granular) texture.

Examples 17-22

The procedure of Examples 11 to 16 was repeated, wherein this time the copper (II) chloride was replaced by copper (I) chloride became. The results obtained are summarized in the table below.

example
No. Copper (I) content in ....
of the solution (ppm) Copper content in the
Deposit (wt .-%) 17th 0 0.01 18th "20th 0.39 19th 40 0.76 .20 80 1.40 21st 100 1.90 22nd 200 3.90

The results of Examples 11 through 22 are in Figure 2 of the drawing in which the curve A is the curve for the copper (I) addition and curve B represents the curve for the copper (II) addition. From this it can be seen that the two curves are almost run parallel to each other.

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35 G 15th G 15th he
ο 25th ppm 100 ppm 1 1 91-96 ⁰ C (195-205 ⁰ F)

Example 23

Nickel sulfate hexahydrate Sodium hypophosphite monohydrate. Sodium acetate
Thiodiethylene glycol copper (I) chloride

Water ad

temperature
m pH about 5.0

An electroless nickel-copper-phosphorus alloy was deposited from the above composition. She had a shiny appearance. No gas formation or streaking was observed when the foil of the alloy was immersed in 6N hydrochloric acid ^{at 38 ° C.} This shows that certain types of sulfur compounds can be tolerated in the solution without adversely affecting the deposit, thereby improving the stability of the plating solution.

Example 24

Nickel sulfate hexahydrate Hydroxyacetic acid (7Q% solution) sodium hypophosphite monohydrate Sodium acetate

Copper (I) chloride

Water 'ad

temperature

PH value . about 5.0

35 G 30th G 15th G 15th G 75 ppm 1 1 93 ° C (20O ⁰ F)

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The above composition became glossy, corrosion-resistant Deposits obtained containing about 3.0% by weight co-deposited Copper, contained in a sample 0.254 mm (1 rail) thick. It had the following characteristics:

specific gravity melting point ( ⁰ C) Vickers hardness (plated) maximum Vickers hardness through. Heat treatment hydrogen content (ppm) magnetic properties

specific resistance (micro-ohm χ cm) 150 cm

"•" magnetic moment = 1 _of pure Ni

1000

The corrosion resistance of the deposits with varying thicknesses were as follows: ■.

Salt spray test (ASTM B-17-57T) Thickness on the steel treatment time

0.0254 mm (1 mil) - at least 500 hours *

0.0127 mm (0.5 mil) 240 hours minimum *

approximately 8.20 approximately 1000 600 1100 30-50 not magnetic

0.0076, mm (0.3 mil) at least 96 hours

0.0051 mm (0.2 mil) at least 48 hours

After treatment with the 51 salt spray, the surfaces could be applied no rust formation or discoloration can be observed «

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The provision of a new jewelry metal surface coating (Decorative metal finish) according to the invention represents a considerable technical progress. At present, the most widely used jewelry metal surface coating is chrome, the is electroplated onto a substrate. In a process for the deposition of chromium, for example for the production of smooth Leveling layers, corrosion resistant layers and when a non-conductor such as plastic is plated and many steps are required to produce a conductive layer. By using the electroless plating composition the invention can be a jewelry metal! surface coating can be produced solely by electroless deposition from the plating solution of the invention, wherein the deposition progresses to full thickness.

Because of their unusual properties, they are electroless Nickel-copper-phosphorus alloy deposits of the invention are useful for many new technical purposes. Although it is a mirror-like one Appearance, their appearance can be changed, for example, by flash coating to achieve a blue-white surface appearance, which is characteristic of surfaces plated with chrome. It the alloy deposit was also found to lend itself to soldering, brazing, ultrasonic joining and fabrication other metal-metal bonds according to known methods. Since the phosphorus content is consistently above 8 and can preferably be kept above 10%, the deposited alloy has non-magnetic properties, making it suitable for a metal substrate is suitable for the subsequent deposition of magnetic coatings. This is especially true with regard to to the fact that the alloy is extremely smooth Has surface, which a uniform distribution of the magnetic coating material on the non-magnetic a

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Alloy base allows. Another desirable property is the hardness of the alloy, which makes it suitable as a wear-resistant surface. Finally, the alloy is characterized by a high degree of flexural ductility, which is surprising in view of the high phosphorus content, which so far has always led to brittleness. Therefore, the alloy deposit can also be used in applications where there is movement of the alloy itself or of the combination of the alloy and the substrate on which it is clad. In this regard, the alloy can be used alone without a substrate, for example for making metal fans. The ductility is maintained even when the alloy in use, is exposed to high temperatures or exposed to up to about 100 minutes to heat treatment at temperatures of up to 26O ⁰ C. The ductility may be due to a low hydrogen content, which preferably does not exceed 100 ppm and usually varies between about 20 and 60 ppm.

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Claims (6)

Claims 1. Electrolessly deposited nickel alloy, characterized in that that they essentially consist of 0.1 to 25% by weight of copper, 5 to 15% by weight of phosphorus and the remainder consists of nickel. 2. Nickel alloy according to claim 1, characterized in that it is practically free of co-deposited sulfur. 3. Nickel alloy according to claims 1 and 2, characterized characterized in that their copper content varies between about 0.1 and about 8% by weight. 4-. Nickel alloy according to claim 3, characterized in that its copper content varies between about 0.5 and about 4% by weight, 5. Nickel alloy according to claims 1 to 4-, characterized characterized in that their phosphorus content is between about 5 and varies about 10% by weight. 6. Nickel alloy according to claims 1 to 4, characterized characterized in that their phosphorus content is between about 10 and varies about 15% by weight. 2 0 9 8 5 3/0551