DE2036387A1 - Process for electroplating and device for carrying out the process - Google Patents

Description

the advance of the cathode is un® whereby iron contains the metal to be deposited © galvanizing solution
The anode and the cathode revolve around the cathode with a tolerance of at least 2 m / s. In addition, a device is described which has a device for the continuous advance of the strip of the electrically conductive substrate on at least one GalYanissierstetioa vorfe @ i _B, wherein the device has a housing with a surface to touch the strip,
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In the manufacture of various materials, in particular in the manufacture of parts for the electronics industry, it is often desirable to obtain a special sample of a metal, deposited on a base of electrically conductive material, generally metallic material. That Substrate is often a long, continuous strip of metal that can be shaped in a particular way to in a particular way To have perforations, or which can be a solid continuous strip of material. It is often desirable to have a pattern to have with different or similar metal that is in a pattern is deposited on the strip, e.g., a strip of metal deposit running along the strip extends, but covers only a small width of the entire metal strip. The methods used so far for this have various disadvantages. For example, one method uses a rotating wheel containing a container of plating solution, rotating in the same direction at the same speed as the continuously advancing strip. The plating solution is applied to the metal strip through openings in the Wheel is applied, an anode is immersed in the solution and the calibrating strip serves as the cathode. While that educated Pattern suitable for some purposes has the one described above Procedure have some major drawbacks. An intense uniform contact between the rotating wheel and itself For example, the advancing metal strip is difficult to maintain. The result is that it fails to achieve a uniform pattern that is, the pattern can vary in thickness and width. Uniformity, however, is both functional as well as from an economic point of view.

-4- 10Ö8DÖ / -1778

Other methods that have been tried, but also have significant disadvantages, contain the precipitation of the metal or a solution over a larger pattern than desired, prompting the unwanted parts of the pattern are removed. The removal can be carried out on different sweeps, but in practice a non-uniform pattern is obtained or the adhesion is poor or the production speeds are slow. In many cases, mechanical damage to the base material can occur. These will be deficiencies caused by a number of reasons. Often, for example, the electroplating solution is fed to one station, the excess part at removed from another station and electroplated at the third station. The feed, removal, or electroplating steps can each affect the finished product.

It is a purpose of the invention to provide an improved method of electroplating a predetermined pattern of a metal on an electrically conductive substrate.

Another purpose of the invention is to provide an apparatus for carrying out an improved electroplating process.

Another purpose of the invention is to provide an apparatus that can be used to produce a uniform To create patterns on a continuously advancing strip of an electrically conductive substrate.

Another purpose of the invention is to provide a device to create that can be applied to substrates that either solid or perforated bind.

108900/177 « _ς

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Summary of the invention

The invention provides a method in which a potential difference between an anode and a cathode, which is a continuously advancing strip of electrically conductive material is produced »with the current density of the Cathode at least about 0.32 A / cm per 30 cm / min of gate thrust of the strip or the cathode, and in which a plating solution containing the metal to be deposited is between the The anode and the cathode rotates around the cathode at a speed of at least about 2 m / s. The invention further provides an apparatus for continuously depositing a relatively uniform metal pattern on a strip of electrically conductive material, the device following Parts includes: (a) means for continuously advancing a strip of electrically conductive material, (b) at least one electroplating station comprising a housing from an electrically having insulating material, one surface of which is in contact with the strip of material, a recessed into the housing Anode, a channel connecting the anode and the strip, the width of which is approximately equal to the width of the desired pattern and whose length is preferably approximately equal to the length of the anode, and includes first and second plating solution passages at opposite ends of the channel, wherein one end of each passage closes off in close proximity to the corresponding ends of the channel, and the other end of each Closes the passage on one of the surfaces other than the surface in contact with the strip, (o) a container for an electroplating solution, (d) facilities for circulating the electroplating solution from the container and to the following elements in series, namely the first passage, the channel and the second passage, and (e) means for receiving the galvanized strip after it has been galvanized has left.

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109809/1778

Brief description of the drawings

Pig. 1 is a view of the device according to the invention, partly cut,

Pig. 2. Figure 3 is a longitudinal cross-section of the plating station the line 2-2 of the Pig. 1,

Pig. 3 is a cross section of another embodiment an electroplating station for use in electroplating a solid strip of electrically conductive material,

Pig. 4 is a view of a section of a preformed strip which has been treated in accordance with the invention;

5 is a view of a section of a solid strip, which has been treated according to the invention.

Description of the preferred embodiments

Exemplary embodiments of the invention are described below.

An improved selective method of electroplating a continuously advancing strip of electrical conductive material is achieved by having a relatively high current density at the cathode (on & © m strips) in relation to maintain the speed of movement of the strip and that a relatively high speed of the plating solutions is maintained past the cathode.

In the method according to the invention, an electroplating solution runs at a relatively high speed between a cathode and an anode. The volume between the anode and the cathode is kept to a minimum. The current density at the This maximizes the cathode for a given potential. It should be noted that the volume between the cathode and the Anode is reduced from that which is generally used, and that thereby the current density for a given potential is increased. In many cases, however, it is out of practicality and design reasons, it is necessary to keep the volume at a value to compensate for the pressure drop in the circulation system of the evaporation solution to keep it at a reasonable level.

The cathode used is the continuously advancing electrically conductive strip on which a pattern of metal is to be deposited. In general, the process can be used to electroplate any electrically conductive material. Such materials suitable for substrates are known. Materials that have heretofore been electroplated and are satisfactory cathode materials include stainless steels, copper, nickel, various alloys, metallic coated plastics etc.

The anodes are generally non-consumable, i.e. the anode does not provide the metal for the coating. The choice of material for the anode depends on the metal that is deposited on the strip of material, these materials in electroplating technology are known. The shape of the anode depends on various factors, such as the width of the pattern, the length of the channel connecting the anode and the cathode and others' Features of the particular manufacturing unit desired.

1 096Ö9 / 1778

A relatively high current density is used. Current densities greater than 0.32 A / cm per 30 cm / min of advancement of the strip of material are used. Preferably a Current density of at least about 0.36 A / cm used for 30 cm / min. Of advance of the strip of material when silver is deposited and at least about 0.325 A / cm per 30 cm / min of advance of the strip of material as gold is deposited from the commercially available gold and silver plating solutions. Although a higher current density can be used, it is seldom necessary, for example To exceed the advance of the strip.

Because of this, it is seldom necessary, about 1.075 A / cm per 30 cm / min

The plating solution is at a relatively high velocity at the cathode _s vorbergehalten ie, a rate of at least about 2 m / s is maintained. In general, speeds of about 2.1 to 3.0 m / s are used. Lower speeds lead to non-uniform deposition and low production speeds. Higher speeds can be used, but no additional beneficial results are achieved, thus only leading to increased energy costs.

The flow of the electroplating solution preferably flows in opposite directions Direction or countercurrent to the direction of movement of the continuously advancing material strip. In this way, the desired plating solution speeds can be obtained with lower energy costs and somewhat better uniformity and adhesion are achieved.

The plating solutions useful in the method of the invention are known. Gold samples will be 3.B. from a

109000/1778

Electroplating solution with a gold concentration of about 6 "to 7 »5 g / dnr generally in the form of an aqueous aqueous solution ! solution of potassium gold cyanide precipitated. An example a suitable gold plating solution is available under the trade name "Temperex" from Sel-Rex Corporation. A suitable aqueous silver plating solution contains about 19 to about 22.5 g / dm * silver, about 6.75 to about 9 g / dn potassium cyanide, and about 1.5 to about 3 g / dnP potassium hydroxide. Any metal, such as nickel, tin, and the like, which is generally present a base metal is deposited by electroplating, can be deposited in the method according to the invention.

As mentioned above, the current density used is dependent on the speed of advance of the strip of material past the electroplating station. For example, if silver is deposited on a base metal strip of material and the strip of material is moving at about 15 cm / min, the preferred current density is about -0.215 A / ora and at 30 cm / min about 0.43 A / cm. In general, although the speed of travel of the material tire can be increased to any value so long as there is a corresponding increase in current density in order to maintain the predetermined relationship of the variables, for practical mechanical reasons the advance speed will be below about 2.4 m / min and generally held at about 1.5 m / min. In most cases it is desirable to have a strip of material that advances at a speed of less than about 15 cm / min. Therefore, the current density is kept within the corresponding value d «8. t ■

Although a single plating station can be used in many cases, multiple stations can be used in series or in parallel. If a relatively thick pattern is desired, the stations can be used in series. if parallel patterns are desired, stations can be

10-9809 / 1778 " ¹⁰ ~

be turned. In addition, both sides of a strip of material can be used can be electroplated using two electroplating stations.

In Pig. 1 shows an embodiment of an electroplating device. A plating solution is in the container 10 stored. This circulates to the electroplating station 12, which contains a housing 14 having an anode 16, which is of the Surface 18 is let into contact with the continuously advancing material strip 20 from electrically conductive material that serves as a cathode. The plating solution flows from the solution circulating device 22 a first passage 24 in the housing 14. The solution flows then via a channel 26 which connects the anode 16 to the material strip 20. The solution is at a rate of at least 2 m / s past the strip or the cathode 20. The electroplating solution emerges from the other surface 27 of the Electroplating station 12 exits through a second passage 28 and returns to the storage container 10. The strip of material 20 is applied to the Electroplating station 12 advanced past by the feed device 29. The contact between the strip of material 20 and the Electroplating station 12 is through the guide devices 30 and maintained by the plate 31. The strip is after it has been electroplated in station 12 by the receiving device 32 added.

Pig. 2 shows a longitudinal cross-section of the electroplating station 12 the line 2-2 of Fig, ί. The width of the channel 26 is substantially the same width as the pattern desired on the strip of material 20,

In Fig. 3, a plating station 12 is shown, which for the Ver ° Application when electroplating a solid (uninterrupted) strip 33 is adapted.

The station is essentially the same as the station described with reference to Figure 1 except that there a plate is not provided and the shape of the surface is slightly curved.

4 and 5 there are shown two types of electrically conductive strips which can be produced by the invention. In Fig. 4 is a preformed electrically conductive strip 34 and a strip-shaped pattern 35 is deposited on the preformed strip 34. The width of the strei ~ Fen-shaped pattern 35 corresponds approximately to the width of the channel 26 (Fig. 2). In Fig. 5 is a solid electrically conductive strip 36 shown with a cough 33 cast down on it.

Examples are described below, whereby all parts, Relate percentages and ratios to the “court, if nothing otherwise stated 1st.

Example I.

A nickel strip approximately 2.9 cm wide is moved past an electroplating station at a speed of 60 cm / min. An aqueous silver plating solution having about 15 g / dm of silver and a cyanide content of about 15.75 g / dm * at a temperature of about 82 ⁰ C circulates in the Galvanisierstation. The solution runs past the strip that serves as the cathode at a sufficient speed of around 2.44 m / s. The current density at the cathode is about 0.86 A / cm ² with a strip advance speed of about 60 cm / min. A silver streak about 0.35 cm wide and about 0.00061 cn thick is deposited in a uniform pattern.

109ÖÖS / 1778

Samples of the strip with the deposited pattern are placed on a hot plate at 480 ° 0 to determine whether any blistering occurs. The samples are additionally subjected to a 90 ° bending test in order to determine the liability of the precipitation. For samples that have been manufactured and tested in the above manner no blistering or flaking was observed.

Grim attempts were made using "the following gate push speeds and current densities with equally satisfactory results

Feed speed (cm / min)

Current density Thickness of the down the cathode blow (A / cm ² ) (μ) 0.215 6.10 0.43 610 0.645 610 1.115 610

15.25 30.5 45.75 91.5 '

Example II

The method Bach B _@ isplel 1 is carried out with the exception that a gold plating solution is used instead of silver plating solution and that the strip is advanced at a speed of about 60 cm / min and that a current density of 0.8 A / cm is used · The solution circulates at about 2.44 m / s · A uniform precipitation ¥ on about 0 _s 00051 cm is obtained. Samples of the strip, when subjected to the blistering and flexing tests of Example I, show no blistering or flaking.

109003/1778

Claims (1)

S6 P1O5 D PATEHT CLAIMS ssssssssssassssssssssa 1. A method for electroplating a Metallmustera on a continuously advancing, electrically conductive substrate, characterized in that a potential difference between an anode and a cathode from a strip of continuously advancing »electrically conductive material is generated that a current density at the cathode of at least about 0.32 amps / cm per 30 cm / min of stroke of the strip is maintained and that a plating solution containing the metal to be deposited is circulated between the anode and the cathode. 2. The method according to claim 1, characterized in that silver is used as precipitation material. 3. The method according to claim 2, characterized in that a speed of the advance of the metal strip »of about 15 offl / min to about 2.4 a / min is used. 4. The method according to claim 3 »characterized in that a Speed of the advance of about 30 cm / min to about 91 cm / min is used that a current density of little- et ens about 0.4 A / c »per 30 cm / min feed is used, and that a plating solution velocity of about 2.1 to 5 v / s past the cathode is used. · The method according to claim 1, characterized in that gold is used as a downlay metal. -2-77Ö -X- 6. The method according to claim 5 »characterized $ that a speed of the advance of the Metallstreifen® of about 15 cm / min to about 2.4 n / nin is used« 7. The method according to spoke 6, thereby gekeaazeictoet » a speed of the feed worn about 30 to 1.5 m / min is used» that a current density v © a at least about 0.375 A / em per 3® ca / pia is used and that an Oesobvindlgkoit sierl ^ solution of about 2.1 to 3 a / s aa ie »Katlaofe is used. 8. device sram continuous. Sied © 2B © iüL® / g @ ® © imos latlv.glelchföraigen electrically leitfäklg "g Facility for l £ © atiaiil © rll @ lk © a T © si3eM © l) @s feas from electrical, conductive a galvanizing station, * lie © in the I Insulating material old eiaes MetesaM which one is right for Beriteiiag with, one in the anode india strip te about the same. the width i @ s getifea @ first passage for 'eia © Sal ¥ aj2i8lex ^> lisia.g _{£ r} one end of the canal which is not connected with a second passage on Channel contains the calibration in contact with the strip, 1st, a galvanization solution! durek Electroplating solution from the container the electroplating ration in Sttte, let the canal waä dem ewtitea B »© MaS _B tiai i ^ yela eiae Sia« · » direction awn recording »i @ s galiranlsi © Ft @ a this is pushed past the electroplating station * 9 * device according to. Claim. 8, characterized in that the plating station has a back-up plate attached to the surface, which is in contact with the strip at a distance from the plate approximately equal to the thickness of the Strip is. 10. Electroplating station, characterized by a housing an electrically insulating material having a plurality of surfaces, one of which is intended for contact with the strip of material, through one recessed in the housing Anode, through a channel connecting the anode and the strip, the width of which is approximately equal to the width of the desired pattern and the length of which is approximately equal to the length of the Anode is through a first plating solution passage that extends from one end of the channel to a surface of the housing does not allow contact with the Strip is determined, and through a second passage at the opposite end of the channel, which becomes one Area that is not in contact with the strip. 100809/1778