DE202024000629U1 - Heat transfer system - Google Patents

Abstract

Heat transfer system (100) comprising:
- a cooling element (110) comprising:
• a body (111) extending in a first dimension (X),
• one or more elongated channels (112) integrated into the body (111) and extending in the first dimension (X),
• one or more return channels (114) integrated into the body (111) and extending in the first dimension (X), and
• one or more connecting channels (113a, 113b) integrated into the body (111) and extending in a second dimension (Y) which is angled with respect to the first dimension (X), the one or more connecting channels (113a, 113b) interconnecting one or more of the elongated channels (112) and the one or more return channels (114) to form a loop thermosiphon,
- one or more heat sources (120) configured to be connected to the cooling element (110) to cover a portion of the one or more elongate channels (112), wherein the covered portion of the one or more elongate channels (112) is configured to form an evaporator, and characterized in that the heat transfer system further comprises an uncovered portion of the one or more elongate channels (112), wherein the uncovered portion is configured to form a condenser.

Description

AREA

The present invention relates to heat transfer systems.

STATE OF THE ART

Cooling of electrical and optical components is usually based on the attachment of a heat transfer element that is physically and thermally connected to the component. A typical such heat transfer element consists of a heat sink that provides a large heat dissipation surface to dissipate heat from the component to the environment. The heat sink may comprise a heat pipe integrated into the heat sink.

However, these heatsinks may not be able to mount several different heat sources on a single heatsink and compensate for the temperature differences between the heat sources. In addition, the heatsinks have a limited ability to distribute heat over a large dissipation area.

There remains a need to further develop the cooling of electrical and optical components with the heat transfer elements. An aim of the present invention is therefore to mitigate at least some of the above-mentioned problems.

BRIEF DESCRIPTION

An object of the present invention is to provide a heat transfer system that enables efficient cooling of electrical and optical components. Another object is to enable the mounting of several separate heat sources on a single heat transfer system and to compensate for temperature differences between the heat sources. Another object is to provide a heat transfer system that enables efficient heat distribution across the cooling element.

• - ein Kühlelement, das umfasst:
  • • einen Körper, der sich in einer ersten Dimension erstreckt,
  • • einen oder mehrere längliche Kanäle, die in den Körper integriert sind und sich in der ersten Dimension erstrecken,
  • • einen oder mehrere Rücklaufkanäle, die in den Körper integriert sind und sich in der ersten Dimension erstrecken,
  • • einen oder mehrere Verbindungskanäle, die in den Körper integriert sind und sich in einer zweiten Dimension erstrecken, die in Bezug auf die erste Dimension abgewinkelt ist,
  wobei der eine oder die mehreren Verbindungskanäle einen oder mehrere der länglichen Kanäle und den einen oder die mehreren Rücklaufkanäle miteinander verbinden, um einen Schleifenthermosiphon zu bilden,
• - eine oder mehrere Wärmequellen, die so konfiguriert sind, dass sie mit dem Kühlelement verbunden sind, um einen Abschnitt der länglichen Kanäle abzudecken,

wobei der abgedeckte Abschnitt des einen oder der mehreren länglichen Kanäle so konfiguriert ist, dass er einen Verdampfer bildet, und
das Wärmeübertragungssystem ferner einen unbedeckten Abschnitt des einen oder der mehreren länglichen Kanäle umfasst, wobei der unbedeckte Abschnitt so konfiguriert ist, dass er einen Verflüssiger bildet.According to one aspect of the present disclosure, there is provided a heat transfer system comprising:

• - a cooling element comprising:
  • • a body that extends in a first dimension,
  • • one or more elongated channels integrated into the body and extending in the first dimension,
  • • one or more return channels integrated into the body and extending in the first dimension,
  • • one or more connecting channels integrated into the body and extending in a second dimension which is angled with respect to the first dimension,
  wherein the one or more connecting channels interconnect one or more of the elongated channels and the one or more return channels to form a loop thermosiphon,
• - one or more heat sources configured to be connected to the cooling element to cover a portion of the elongated channels,

wherein the covered portion of the one or more elongated channels is configured to form an evaporator, and
the heat transfer system further comprises an uncovered portion of the one or more elongated channels, the uncovered portion configured to form a condenser.

Significant advantages are achieved by means of the present heat transfer system comprising the cooling element. It provides efficient cooling of the heat source(s) connected to the cooling element. The one or more elongated channels enable heat to be distributed throughout the cooling element. The one or more connecting channels compensate for temperature differences between the heat sources, even when the heat sources have different power levels. The one or more return channels function as condenser channels. The one or more return channels can form an additional condenser zone on one side of the one or more elongated channels and/or between the elongated channels or sets of elongated channels in the second dimension. The one or more return channels improve the performance of the cooling element.

• - das Kühlelement besteht aus zwei oder mehr als zwei länglichen Kanälen,
• - das Kühlelement umfasst einen oder mehrere Rücklaufkanäle, die zwischen den benachbarten länglichen Kanälen in den Körper integriert sind,
• - das Kühlelement umfasst einen oder mehrere Sätze länglicher Kanäle,
• - der Satz umfasst zwei oder mehr als zwei längliche Kanäle,
• - das Kühlelement umfasst einen oder mehrere Rücklaufkanäle, die in den Körper zwischen den benachbarten Sätzen der länglichen Kanäle integriert ist,
• - das Kühlelement umfasst zwei oder mehr als zwei Verbindungskanäle, die in der ersten Dimension in einem Abstand zueinander in den Körper integriert sind,
• - der eine oder die mehreren länglichen Kanäle sind so konfiguriert, dass sie in der ersten Dimension nacheinander eine Verdampfungszone und eine Kondensationszone bilden,
• - das Kühlelement so konfiguriert ist, dass es in der Verdampfungszone eine Wärmequelle empfängt,
• - jeder der einen oder mehreren länglichen Kanäle und der einen oder mehreren Rücklaufkanäle hat jeweils ein erstes Ende und ein zweites Ende,
• - ein erster Verbindungskanal der Verbindungskanäle verbindet die ersten Enden miteinander,
• - ein zweiter Verbindungskanal der Verbindungskanäle verbindet die zweiten Enden miteinander,
• - das Kühlelement umfasst ferner einen Wärmeableitungsabschnitt, der sich von dem Körper in einer dritten Dimension erstreckt, die in Bezug auf die erste Dimension abgewinkelt ist,
• - die länglichen Kanäle oder zumindest einige der länglichen Kanäle weisen eine Vielzahl von Rillen auf, die sich in der ersten Dimension erstrecken,
• - der eine oder die mehreren länglichen Kanäle, der eine oder die mehreren Verbindungskanäle und der eine oder die mehreren Rücklaufkanäle weisen mechanische Stopfen zum Verschließen der Kanäle auf,

One or more embodiments may include one or more features from the following list:

• - the cooling element consists of two or more than two elongated channels,
• - the cooling element comprises one or more return channels integrated into the body between the adjacent elongated channels,
• - the cooling element comprises one or more sets of elongated channels,
• - the set comprises two or more than two elongated channels,
• - the cooling element comprises one or more return channels integrated into the body between the adjacent sets of elongated channels,
• - the cooling element comprises two or more than two connecting channels which are integrated into the body at a distance from each other in the first dimension,
• - the one or more elongated channels are configured to form successively an evaporation zone and a condensation zone in the first dimension,
• - the cooling element is configured to receive a heat source in the evaporation zone,
• - each of the one or more elongated channels and the one or more return channels has a first end and a second end,
• - a first connecting channel of the connecting channels connects the first ends with each other,
• - a second connecting channel of the connecting channels connects the second ends with each other,
• - the cooling element further comprises a heat dissipation portion extending from the body in a third dimension that is angled with respect to the first dimension,
• - the elongated channels or at least some of the elongated channels have a plurality of grooves extending in the first dimension,
• - the one or more elongated channels, the one or more connecting channels and the one or more return channels have mechanical plugs for closing the channels,

• - Bereitstellen eines Körpers, der sich in einer ersten Dimension erstreckt,
• - Bereitstellen eines oder mehrerer länglicher Kanäle an dem Körper, die sich in der ersten Dimension erstrecken,
• - Bereitstellen eines oder mehrerer Rücklaufkanäle an dem Körper, die sich in der ersten Dimension erstrecken, und,
• - Bereitstellen eines oder mehrerer Verbindungskanäle, die sich in einer zweiten Dimension erstrecken, die in Bezug auf die erste Dimension abgewinkelt ist, um einen oder mehrere der länglichen Kanäle und den einen oder die mehreren Rücklaufkanäle miteinander zu verbinden, um einen Schleifenthermosiphon zu bilden.

the cooling element which is part of the heat transfer system may be provided by a method comprising:

• - Providing a body extending in a first dimension,
• - providing one or more elongated channels on the body extending in the first dimension,
• - providing one or more return channels on the body extending in the first dimension, and,
• - providing one or more connecting channels extending in a second dimension angled with respect to the first dimension for interconnecting one or more of the elongated channels and the one or more return channels to form a loop thermosyphon.

• - Bereitstellen eines Kühlelements, und
• - Anschließen einer oder mehrerer Wärmequellen an das Kühlelement, um einen Abschnitt des einen oder der mehreren länglichen Kanäle abzudecken.

The heat transfer system may be provided by a method comprising:

• - Providing a cooling element, and
• - Connecting one or more heat sources to the cooling element to cover a portion of the one or more elongated channels.

BRIEF DESCRIPTION OF THE DRAWINGS

• 1 shows a schematic cross-sectional view of a cooling element with elongated channels according to at least some embodiments;
• 2 shows a schematic cross-sectional view of a cooling element with elongated channels and connecting channels according to at least some embodiments;
• 3 shows a heat transfer system that includes a cooling element according to 2 according to at least some embodiments;
• 4 shows a schematic cross-sectional view of a cooling element according to at least some embodiments;
• 5 shows a schematic cross-sectional view of a heat transfer system that uses the cooling element 4 and a heat source mounted on the cooling element according to at least some embodiments;
• 6 shows a schematic cross-sectional view of a cooling element with two connecting channels according to at least some embodiments;
• 7 shows a schematic cross-sectional view of a heat transfer system comprising a cooling element made of 6 and a heat source mounted on the cooling element according to at least some embodiments;
• 8th shows a schematic cross-sectional view of a cooling element with two return channels between adjacent sets of elongated channels, according to at least some embodiments;
• 9 shows a schematic cross-sectional view of a cooling element with elongated channels len according to at least some embodiments;
• 10 shows the cooling element 9 viewed from the first dimension, as used in at least some embodiments;
• 11 shows a heat transfer system in which a cooling element is angled in the first dimension, as provided in at least some embodiments;
• 12 shows an alternative for the heat transfer system of 11 according to at least some embodiments;
• 13 shows a perspective view of a cooling element according to at least some embodiments; and
• 14 shows a cross-sectional view of the cooling element of 12 according to at least some embodiments.

MODELS OF IMPLEMENTATION

In the present context, the term ‘cooling element’ refers to a device for cooling electrical or optical components.

In the present context, the term “evaporation zone” refers to a zone of a cooling element that serves to transform a liquid into a vapor.

In the present context, “condensation zone” refers to a zone of a cooling element that serves to convert a vapor into a liquid.

In the present context, the term "integrated" refers to an element or feature that is an integral part of another element or feature, such that those elements or features are inseparably linked. In addition, the term refers to an element or feature that is formed from the material of a body.

In the present context, the term "loop thermosyphon" refers to a structure having loops formed from elongated channels, one or more connecting channels, and optionally one or more return channels in a body of a cooling element, the structure being configured to effect a phase change of the heat transfer phase change fluid.

• - einen Körper 111, der sich in einer ersten Dimension X erstreckt, und
• - einen oder mehrere längliche Kanäle 112, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken.

The cooling element 110 may include:

• - a body 111 extending in a first dimension X, and
• - one or more elongated channels 112 integrated into the body 111 and extending in the first dimension X.

The cooling element 110 is easy to manufacture because it can be produced mainly by additive manufacturing, such as extrusion. It does not require machining, such as drilling, to form the one or more elongated channels, because the one or more elongated channels can be formed simultaneously with the body 111 during additive manufacturing of the body 111. The one or more elongated channels 112 are configured to sequentially form an evaporation zone 116 and a condensation zone 117 in the first dimension X when a heat source 120 is mounted on the cooling element 110 to cover a portion of the one or more elongated channels 112 and the cooling element 110 is provided with a heat transfer phase change fluid. Then, the portion of the one or more elongated channels 112 covered by the heat source 120 can absorb heat from the heat source 120, thus forming the evaporation zone 116. The heat transfer phase change fluid is then converted to vapor in the evaporation zone 116. When the vapor reaches the condensation zone 117, it turns back to liquid. The liquid can flow back to the bottom of the cooling element 110 via the one or more elongated channels 112.

The cooling element 110 may include one or more sets of elongated channels 112. The set may consist of two or more than two elongated channels 112.

1 shows a schematic cross-sectional view of a cooling element with elongated channels 112. The cooling element 110 comprises a body 111 extending in a first dimension X. The cooling element 110 comprises three sets of elongated channels 112. Each of the sets consists of three elongated channels 112. However, the number of elongated channels 112 can also be two or more than three.

• - einen Körper 111, der sich in einer ersten Dimension X erstreckt,
• - zwei oder mehr als zwei längliche Kanäle 112, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken, und
• - einen oder mehrere Verbindungskanäle 113a, 113b, die in den Körper 111 integriert sind und sich in einer zweiten Dimension Y erstrecken, die in Bezug auf die erste Dimension X abgewinkelt ist,

wobei der eine oder die mehreren Verbindungskanäle 113a, 113b zwei oder mehr als zwei der länglichen Kanäle 112 miteinander verbinden, um einen Schleifenthermosiphon zu bilden.The cooling element 110 may include:

• - a body 111 extending in a first dimension X,
• - two or more than two elongated channels 112 integrated into the body 111 and extending in the first dimension X, and
• - one or more connecting channels 113a, 113b integrated into the body 111 and extending in a second dimension Y which is angled with respect to the first dimension X,

wherein the one or more connecting channels 113a, 113b interconnect two or more of the elongated channels 112 to form a loop thermosyphon.

The loop thermosyphon formed provides efficient cooling of the heat sources 120 connected to the cooling element 100. The elongated channels 112 allow heat to be distributed across the cooling element 110. The elongated channels 112 are configured to sequentially form an evaporation zone 116 and a condensation zone 117 in the first dimension X when a heat source 120 is mounted on the cooling element 110 to cover a portion of the elongated channels 112 and the cooling element 110 is provided with a heat transfer phase change fluid. Then, the portion of the elongated channels 112 covered by the heat source 120 can absorb heat from the heat source 120, thus forming the evaporation zone 116. Then, the heat transfer phase change fluid is converted to vapor in the evaporation zone 116. When the vapor reaches the condensation zone 117, it turns back into liquid. The liquid can flow back to a bottom of the cooling element 110 via the elongated channels 112. The one or more connecting channels 113a, 113b compensate for temperature differences between the heat sources, even if the heat sources have different outputs.

The cooling element 110 may include one or more sets of elongated channels 112. The set may consist of two or more than two elongated channels 112.

2 shows a schematic cross-sectional view of a cooling element 110 with elongated channels 112 and connecting channels 113a, 113b. The cooling element 110 consists of three sets of elongated channels 112 and two connecting channels 113a, 113b. Each of the sets consists of three elongated channels 112. However, the number of elongated channels 112 can also be two or more than three. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in a second dimension Y which is angled with respect to the first dimension X. The two connecting channels 113a, 113b connect the elongated channels 112 to each other to form a loop thermosiphon.

• - einen Körper 111, der sich in einer ersten Dimension X erstreckt,
• - einen oder mehrere längliche Kanäle 112, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken,
• - einen oder mehrere Rücklaufkanäle 114, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken, und
• - einen oder mehrere Verbindungskanäle 113a, 113b, die in den Körper 111 integriert sind und sich in einer zweiten Dimension Y erstrecken, die in Bezug auf die erste Dimension X abgewinkelt ist,

wobei der eine oder die mehreren Verbindungskanäle 113a, 113b einen oder mehrere der länglichen Kanäle 112 und den einen oder die mehreren Rücklaufkanäle 114 miteinander verbinden, um einen Schleifen-Thermosiphon zu bilden.A cooling element 110 may include:

• - a body 111 extending in a first dimension X,
• - one or more elongated channels 112 integrated into the body 111 and extending in the first dimension X,
• - one or more return channels 114 integrated into the body 111 and extending in the first dimension X, and
• - one or more connecting channels 113a, 113b integrated into the body 111 and extending in a second dimension Y which is angled with respect to the first dimension X,

wherein the one or more connecting channels 113a, 113b interconnect one or more of the elongated channels 112 and the one or more return channels 114 to form a loop thermosyphon.

The cooling element 110 provides efficient cooling of the one or more heat sources 120 connected to the cooling element 110. The one or more elongated channels 112 enable heat to be distributed across the cooling element 110. The one or more elongated channels 112 are configured to sequentially form an evaporation zone 116 and a condensation zone 117 in the first dimension X when a heat source 120 is mounted on the cooling element 110 to cover a portion of the one or more elongated channels 112 and the cooling element 110 is provided with a heat transfer phase change fluid. Then, the portion of the one or more elongated channels 112 covered by the heat source 120 can absorb heat from the heat source 120, thus forming the evaporation zone 116. Then, the heat transfer phase change fluid is converted to vapor in the evaporation zone 116. When the vapor reaches the condensation zone 117, it turns back into liquid. The one or more return channels 114 function as one or more condenser channels. The liquid may flow back to the bottom of the cooling element 110 via the one or more return channels 114. The one or more return channels 114 may form an additional condenser zone, for example, on a side of the one or more elongated channels 112 and/or between the elongated channels 112 or sets of elongated channels 112 in the second dimension Y. The one or more return channels 114 improve the performance of the cooling element 110. The liquid may also flow via the elongated channels 112 to a bottom of the cooling elements 110. In addition, the one or more elongated channels 112 can also function as condenser channels above the heat source when viewed in the first dimension X. The connecting channel(s) 113a, 113b compensate for temperature differences between the heat sources, even if the heat sources generate different powers.

The cooling element 110 may include one or more sets of elongated channels 112. The set may consist of two or more than two elongated channels 112. The one or more return channels 114 may then be located on one side of the one or more sets of elongated channels 112 and/or between the adjacent sets of elongated channels 112 in the second dimension Y.

The one or more connecting channels 113a, 113b connect one or more elongate channels 112 and the one or more return channels 114 to each other. That is, the one or more connecting channels 113a, 113b connect at least one of the elongate channels 112 or sets of elongate channels 112 to the one or more return channels 114. Some of the elongate channels 112 or sets of elongate channels 112 may not be connected to the one or more return channels 114 by the one or more connecting channels 113a, 113b. For example, if the cooling element 110 includes three sets of the elongate channels 112, one or two sets of the elongate channels 112 may be connected to the one or more return channels 114.

4 shows a schematic cross-sectional view of a cooling element 110. The cooling element 100 comprises a body 111 which extends in a first dimension X. A set of elongated channels 112 is integrated into the body 111 and extends in the first dimension X. The set comprises three elongated channels 112. However, the number of elongated channels 112 can also be two or more than three. Two return channels 114 are integrated into the body 111 and extend in the first dimension X. However, the number of return channels 114 can be one or more than two. The elongated channels 112 are arranged between the two return channels 114. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in a second dimension Y which is angled with respect to the first dimension X. The two connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 to each other to form a loop thermosiphon.

The one or more elongated channels 112 may be configured to sequentially form an evaporation zone 116 and a condensation zone 117 in the first dimension X. The evaporation zone 116 may receive heat from the heat source 120 and allows for the conversion of a heat transfer phase change fluid into a vapor. The condensation zone 117 allows for the conversion of the vapor back into the fluid. The evaporation zone 116 and the condensation zone 117 provide a thermosiphon cycle. This in turn provides for effective cooling of the heat source 120.

The thermosiphon cycle refers to a physical phenomenon in which a heat source 120 heats a phase change fluid to vapor in an area covered by the heat source 120, the vapor traveling through the elongated channels 112 to a relatively cold area of the body 111, i.e., an area not covered by the heat source 120, where the vapor condenses to liquid. After returning to liquid, the heat transfer phase change fluid returns to the evaporation zone 116 via the one or more return channels 114 and optionally also via the elongated channels 112 for a next round in the cycle. The thermosiphon cycle is in 7 represented by arrows. The phase changes either absorb or release latent heat trapped in the heat transfer phase change fluid, resulting in effective heat transfer. The fluid can return to the evaporation zone in several ways, such as gravity or capillary action.

The location of the heat source 120 determines the formation of the evaporation zone 116 and the condensation zone 117. A portion of the one or more elongated channels 112 covered by the heat source 120 forms the evaporation zone 116. An uncovered portion of the one or more elongated channels 112 and the one or more return channels 114 is configured to form the condensation zone 117. The one or more return channels 114 are preferably substantially covered by a heat source 120. The one or more elongated channels 112 in the condensation zone 117 form a first condensation zone and the one or more return channels 114 form a second condensation zone.

It should be noted, however, that the heat transfer phase change fluid condensed to liquid may also return to the evaporation zone 116 via the one or more elongated channels 112. The liquid may be one or more elongated channels 112 return to the evaporation zone 116, in particular before the heat flow exceeds a condensation capacity. When the heat flow exceeds the condensation capacity, the liquid is also or mainly returned via the return channels 114.

The cooling element 110 may be configured to receive one or more heat sources 120 in the evaporation zone 116. The one or more heat sources 120 may be mounted at one end of the body 111 to reserve sufficient space for the condensation zone 117. All heat sources 120 are preferably mounted on the same side of the body 111.

The cooling element 110 may comprise two or more than two elongate channels 112 or sets of elongate channels 112 and one or more return channels 114 integrated into the body 111 between the adjacent elongate channels or sets of elongate channels 112. This allows two or more than two heat sources 120 to be connected to the cooling element 110. Then, the heat transfer phase change fluid in liquid form may return to a bottom of the elongate channels 112 via the one or more return channels arranged between the heat sources 120.

The cooling element 110 may comprise two or more than two connecting channels 113a, 113b, which are integrated into the body 111 at a distance from one another in the first dimension X. Two connecting channels 113a, 113b make it possible to connect the elongated channels 114 and the one or more return channels 114 from their two ends. This provides the thermosiphon between the two ends and thus more efficient cooling of the heat source 120.

The one or more elongated channels 112 and the one or more return channels 114 may each have a first and a second end. A first connecting channel 113a of the connecting channels 113a, 113b connects the first ends to each other and a second connecting channel 113b of the connecting channels 113a, 113b connects the second ends to each other.

Preferably, the connecting channel 113a, which connects the first ends to each other, is arranged below a heat source 120 as seen in the first dimension X.

Preferably, the cooling element 110 comprises two connecting channels 113a, 113b. However, the cooling element 110 can also comprise more than two connecting channels 113a, 113b, for example three connecting channels (not shown). The cooling element can then have one connecting channel 113a that connects the first ends to one another and two connecting channels 113b that connect the second ends to one another. The connecting channels 113b that connect the second ends to one another can be integrated into the body 111 at a distance from one another in the first dimension X.

6 shows a schematic cross-sectional view of a cooling element 110 with two connecting channels 113a, 113b. The connecting channels 113a, 113b are integrated in a body 111 at a distance from each other in the first dimension X and extend in a second dimension Y which is angled with respect to the first dimension X. The cooling element 110 further comprises three sets of elongated channels 112 which are integrated in the body 111 and extend in the first dimension X. Each of the tree sets comprises three elongated channels 112. However, the number of elongated channels 112 in the sets can also be two or more than three. Furthermore, a return channel 114 is integrated in the body 111 and extends in the first dimension X between the adjacent sets of elongated channels 112. However, the number of return channels 114 between the adjacent sets of elongated channels 112 can also be two or more. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 to each other to form a loop thermosiphon. A first connecting channel 113a of the connecting channels 113a, 113b connects the first ends of the elongated channels 112 and the return channels 114 to each other, and a second connecting channel 113b of the connecting channels 113a, 113b connects the second ends of the elongated channels 112 and the return channels 114 to each other.

8th shows a schematic cross-sectional view of a cooling element 110 with two return channels 114 between adjacent sets of the elongated channels 112. However, the number of return channels 114 between the adjacent sets of the elongated channels 112 can be more than two. The return channels 114 are integrated into the body 111 and extend in the first dimension X. The cooling element 110 comprises three sets of the elongated channels 112 which are integrated into the body 111 and extend in the first dimension X. Each of the tree sets comprises three elongated channels 112. However, the number of elongated channels 112 in the sets can also be two or more than three. The sets can have a different number of elongated channels 112. The connecting channels 113a, 113b are integrated into a body 111 at a distance from each other in the first dimension X and extend in a second dimension Y that is angled with respect to the first dimension X. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 to each other to form a loop thermosiphon. A first connecting channel 113a of the connecting channels 113a, 113b connects the first ends of the elongated channels 112 and the return channels 114 to each other, and a second connecting channel 113b of the connecting channels 113a, 113b connects the second ends of the elongated channels 112 and the return channels 114 to each other.

13 shows a perspective view of a cooling element 110 and 14 shows a cross-sectional view of the cooling element 110 from 13 . The cooling element 110 comprises a body 111 extending in a first dimension X. A set of elongated channels 112 is integrated into the body 111 and extends in the first dimension X. The set comprises two elongated channels 112. Two return channels 114 are integrated into the body 111 and extend in the first dimension. Two connecting channels 113a, 113b are integrated into the body 111 and extend in a second dimension Y that is angled with respect to the first dimension X. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 to each other to form a loop thermosyphon.

The cooling element 110 may further comprise a heat dissipation portion 115 extending from the body 111 in a third dimension Z that is angled with respect to the first dimension X, as shown in 1 to 10, 13 and 14 The heat dissipation section 115 may be arranged on the opposite side of the housing 111 from which the one or more heat sources 120 are located. The heat dissipation section 115 may extend over the entire width and length of the body 111, as shown in 1 to 10 shown, or the heat dissipation section 115 may deviate from the evaporation zone 116 (not shown).

The heat dissipation portion 115 may be comprised of a plurality of fins. The fin may be a plate-shaped, planar or curved member extending from a body 111. The fins provide a large heat dissipation area to dissipate heat from the heat source to the environment.

The heat dissipation portion 115 may include a first plurality of fins and a second plurality of fins, wherein the first plurality of fins and the second plurality of fins extend in opposite directions from the body 111 in the third dimension Z, as shown in 13 This provides a large heat dissipation section and effective heat transfer as the heat can be dissipated in two directions.

13 shows a heat dissipation portion 115. The heat dissipation portion 115 extends in the third dimension Z. The heat dissipation portion 115 includes a first plurality of fins and a second plurality of fins. The first plurality of fins and the second plurality of fins extend in opposite directions from the body 111 in the third dimension Z.

The elongated channel 112, or at least a portion of the one or more elongated channels 112, includes a plurality of grooves extending in the first dimension X. The grooves may extend the entire length of the one or more elongated channels 112. The grooves allow for an increase in the area of the one or more elongated channels 112, which in turn allows for more effective heat transfer across the one or more elongated channels 112.

9 shows a schematic cross-sectional view of a cooling element 110 with elongated channels 112. All elongated channels 112 have the grooves. However, the grooves can also be formed only in some of the elongated channels 112. The grooves extend over the entire length of the elongated channels 112.

10 shows the cooling element 110 from 9 as viewed from the first dimension X. Each of the elongated channels 112 has the grooves over the entire circumference of the elongated channel 112.

The one or more elongated channels 112, the one or more connecting channels 113a, 113b and the one or more return channels 114 may have mechanical plugs 118 for closing the channels 112, 113a, 113b, 114. The mechanical plugs 118 may be made of metal, such as aluminum, an aluminum alloy or copper, or a copper alloy, such as brass. The mechanical plugs 118 prevent the channels from leaking. The mechanical plugs 118 thus protect the structure of the cooling element from damage and enable the cooling element to function efficiently.

• - ein Kühlelement 110, das umfasst:
  • ◯ einen Körper 111, der sich in einer ersten Dimension X erstreckt,
  • ◯ einen oder mehrere längliche Kanäle 112, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken.
  • ◯ einen oder mehrere Rücklaufkanäle 114, die in den Körper 111 integriert sind und sich in der ersten Dimension X erstrecken, und
  • ◯ einen oder mehrere Verbindungskanäle 113a, 113b, die in den Körper 111 integriert sind und sich in einer zweiten Dimension Y erstrecken, die in Bezug auf die erste Dimension X abgewinkelt ist,
  wobei der eine oder die mehreren Verbindungskanäle 113a, 113b einen oder mehrere der länglichen Kanäle 112 und den einen oder die mehreren Rücklaufkanäle 114 miteinander verbinden, um einen Schleifenthermosiphon zu bilden, und
• - eine oder mehrere Wärmequellen 120, die so konfiguriert sind, dass sie mit dem Kühlelement 110 verbunden sind, um einen Abschnitt des einen oder der mehreren länglichen Kanäle 112 abzudecken,

wobei der abgedeckte Abschnitt des einen oder der mehreren länglichen Kanäle 112 so konfiguriert ist, dass er einen Verdampfer bildet, und
das Wärmeübertragungssystem ferner einen unbedeckten Abschnitt des einen oder der mehreren länglichen Kanäle 112 umfasst, wobei der unbedeckte Abschnitt so konfiguriert ist, dass er einen Verflüssiger bildet.According to one embodiment, a heat transfer system 100 is provided, comprising:

• - a cooling element 110 comprising:
  • ◯ a body 111 extending in a first dimension X,
  • ◯ one or more elongated channels 112 integrated into the body 111 and extending in the first dimension X.
  • ◯ one or more return channels 114 integrated into the body 111 and extending in the first dimension X, and
  • ◯ one or more connecting channels 113a, 113b integrated into the body 111 and extending in a second dimension Y which is angled with respect to the first dimension X,
  wherein the one or more connecting channels 113a, 113b interconnect one or more of the elongated channels 112 and the one or more return channels 114 to form a loop thermosiphon, and
• - one or more heat sources 120 configured to be connected to the cooling element 110 to cover a portion of the one or more elongated channels 112,

wherein the covered portion of the one or more elongated channels 112 is configured to form an evaporator, and
the heat transfer system further comprises an uncovered portion of the one or more elongated channels 112, the uncovered portion configured to form a condenser.

The heat transfer system 100 provides efficient cooling of the one or more heat sources 120 because the one or more elongated channels 112 distribute the heat across the cooling element 110 and the one or more connecting channels 113a, 113b compensate for the temperature differences between the heat sources 120, even if the heat sources generate different powers.

According to one embodiment, the covered portion of the one or more elongated channels 112 is configured to form an evaporator.

According to one embodiment, the one or more elongated channels 112 further comprise an uncovered portion configured to form a condenser.

5 shows a schematic cross-sectional view of a heat transfer system 100 with the cooling element 110 of 4 and a heat source 120 mounted on the cooling element 110. The heat source 120 is attached to one end of the body 111 in the first dimension X. The heat source 120 covers a portion of the elongated channels 112 which forms an evaporator. The heat source 120 is thus attached to an evaporation zone 116. The body 111 of the cooling element 110 further comprises an uncovered portion of the elongated channels 112, the uncovered portion forming a condenser. Thus, the body 111 comprises a condensation zone 117 which follows the evaporation zone 116 in the first dimension X. The elongated channels 112 in the condensation zone 117 form a first condensation zone. The return channels 114 in the condensation zone 117 form a second condensation zone. The heat source 120 is mounted on the body 111 so that it does not obstruct the return channels 114 or the connecting channels 113a, 113b. A fluid level may be located between the evaporation zone 116 and the condensation zone 117 (not shown).

7 shows a schematic cross-sectional view of a heat transfer system 100 with a cooling element 110 made of 6 and a heat source 120 mounted on the cooling element 110. The heat source 120 is attached to one end of the body 111 in the first dimension X. The heat source 120 is attached to an evaporation zone 116. The body 111 includes a condensation zone 117 that adjoins the evaporation zone 116 in the first dimension X. The heat source 120 is attached to the body 111 so that it covers a portion of the elongated channels 112, but not the return channels 114 or the connecting channels 113a, 113b.

According to one embodiment, the heat transfer system 100 includes two or more than two heat sources 120 configured to be connected to the cooling element 110 such that one or more return channels 114 are uncovered by the heat sources 120 (not shown). A single cooling element 110 can then be used to cool a plurality of heat sources 120. The one or more uncovered return channels 114 allow condensed liquid to flow back to the bottom of the housing 111, thereby cooling the heat sources 120.

7 shows only one heat source, but it is possible to mount one or two heat sources next to the illustrated heat source 120 in the second direction Y. Then the heat sources can be arranged next to each other so that one or more return channels 114 between the adjacent heat sources 120 are not covered by the heat sources 120.

According to one embodiment, the heat source is an electrical or optical component, such as an insulated gate bipolar transistor (IGBT) module, a circuit board, a chip-on-board light emitting diode (COB-LED), or a power electronics module.

In one embodiment, the one or more elongated channels 112 comprise a heat transfer phase change fluid.

3 shows a heat transfer system 100 with a cooling element 110 made of 2 . The heat transfer system 100 consists of a heat transfer phase change fluid. The fluid level 119 of the heat transfer phase change fluid is arranged horizontally with respect to the direction of gravity g.

11 shows a heat transfer system 110 in which a cooling element 110 is angled in the first dimension X. The cooling element 100 comprises a body 111 that extends in a first dimension X. Elongated channels 112 are integrated into the body 111 and extend in the first dimension X. A number of the elongated channels 112 is three. However, the number of elongated channels 112 can also be one, two or more than three. The return channels 114 are integrated into the body 111 and extend in the first dimension X. The number of return channels 114 is two. However, the number of return channels 114 can also be one or more than two. The return channels 114 are arranged on one side of the elongated channels 112 in a second dimension Y that is angled with respect to the first dimension X. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in the second dimension Y. The connecting channels 113a, 113b extend from an outer surface of the cooling element 110 into the interior of the cooling element 110. Thus, the elongated channels 112, the return channels 114 and the connecting channels 113a, 113b form a thermosiphon loop. After the cooling element 110 has been manufactured, the cooling element 110 is placed in the application at an angle in the first dimension X, as shown in 11 . The cooling element 110 is comprised of a heat transfer phase change fluid. A fluid mirror 119 is disposed horizontally to the direction of gravity g. One or more heat sources 120 (not shown) may be mounted on the cooling element in an XY plane covering a portion of the elongated channels 112. The one or more heat sources 120 heat the fluid to vapor, causing the vapor to migrate through the elongated channels 112 and two connecting channels 113a, 113b to a relatively cold zone where the vapor condenses to a liquid. The liquid then flows in the second direction Y back to the bottom of the cooling element 110. The temperature of the one or more heat sources 120 decreases.

12 shows an alternative for the heat transfer system 110 from 11 . A cooling element 100 includes a body 111 extending in a first dimension X. Elongated channels 112 are integrated into the body 111 and extend in the first dimension X. A number of the elongated channels is two. However, the number of elongated channels 112 may be more than two. The return channels 114 are integrated into the body 111 and extend in the first dimension X. The number of return channels 114 is two. However, the number of return channels 114 may be more than two. A return channel 114 is arranged between the elongated channels 112 and a return channel 114 is arranged on one side of the set of channels in a second dimension Y that is angled with respect to the first dimension X. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in the second dimension Y. Both connecting channels 113a, 113b comprise two separate sections that extend from an outer surface of the cooling element 110 into the interior of the cooling element 110. The separate sections extend from the opposite sides of the cooling element 110 into the interior of the cooling element. Thus, the sections of the connecting channels 113a, 113b form two loop thermosiphons in the body 111, which comprises an elongated channel 112 and a return channel 114. After manufacturing the cooling element 110, the cooling element 110 is placed in the application angled in the first dimension X, as shown in 12 . The cooling element 110 is comprised of a heat transfer phase change fluid. The fluid levels 119 are arranged horizontally with respect to the direction of gravity g. One or more heat sources 120 (not shown) may be mounted on the cooling element in an XY plane covering a portion of the elongated channels 112. The one or more heat sources 120 heat the fluid to vapor, causing the vapor to migrate through the portions of the connecting channel 113b to a relatively cold zone of the body 111 where the vapor condenses to a liquid. The liquid flows in the second direction Y back to a bottom of the formed thermosyphons. The temperature of the one or more heat sources 120 decreases.

According to one embodiment, the heat transfer system 100 is configured to form an integrated loop thermosyphon. The integrated loop thermosiphon performs a thermosiphon cycle.

• - Bereitstellen eines Körpers 111, der sich in einer ersten Dimension X erstreckt,
• - Bereitstellen eines oder mehrerer länglicher Kanäle 112 für den Körper 111 und die sich in der ersten Dimension X erstrecken,
• - Bereitstellen eines oder mehrerer Rückführungskanäle 114 für den Körper 111, die sich in der ersten Dimension X erstrecken, und
• - Bereitstellen eines oder mehrerer Verbindungskanäle 113a, 113b, die sich in einer zweiten Dimension Y erstrecken, die in Bezug auf die erste Dimension X abgewinkelt ist, um einen oder mehrere der länglichen Kanäle 112 und den einen oder die mehreren Rücklaufkanäle 114 miteinander zu verbinden, um einen Schleifenthermosiphon zu bilden.

The cooling element 110, which is part of the heat transfer system 100, may be provided by a method comprising:

• - Providing a body 111 extending in a first dimension X,
• - providing one or more elongated channels 112 for the body 111 and extending in the first dimension X,
• - providing one or more return channels 114 for the body 111, which extend in the first dimension X, and
• - Providing one or more connecting channels 113a, 113b extending in a second dimension Y angled with respect to the first dimension X to interconnect one or more of the elongated channels 112 and the one or more return channels 114 to form a loop thermosyphon.

The method may include providing one or more sets of elongate channels 112. The set may consist of two or more than two elongate channels 112. Then, one or more connecting channels 113a, 113b interconnect one or more of the sets of elongate channels 112 and the one or more return channels 114 to form a loop thermosyphon.

• - Bereitstellen von zwei oder mehr als zwei länglichen Kanälen 112 an dem Körper 111, die sich in der ersten Dimension X erstrecken, und
• - Bereitstellen eines oder mehrerer Rücklaufkanäle 114 am Körper 111, die sich in der ersten Dimension X zwischen den benachbarten länglichen Kanälen 112 erstrecken.

The procedure may include:

• - providing two or more than two elongated channels 112 on the body 111 extending in the first dimension X, and
• - Providing one or more return channels 114 on the body 111 extending in the first dimension X between the adjacent elongate channels 112.

• - Bereitstellen von zwei oder mehr als zwei Sätzen von länglichen Kanälen 112 an dem Körper 111, die sich in der ersten Dimension X erstrecken, und
• - Bereitstellen eines oder mehrerer Rücklaufkanäle 114 am Körper 111, die sich in der ersten Dimension X zwischen den benachbarten Sätzen der länglichen Kanäle 112 erstrecken.

The procedure may include:

• - providing two or more than two sets of elongated channels 112 on the body 111 extending in the first dimension X, and
• - Providing one or more return channels 114 on the body 111 extending in the first dimension X between the adjacent sets of elongate channels 112.

The method may include providing two or more than two connecting channels 113a, 113b spaced apart in the first dimension X and extending in the second dimension Y to interconnect the one or more elongated channels 112 and the one or more return channels 114 to form a loop thermosyphon.

The body 110 can be manufactured by additive manufacturing, e.g. by extrusion.

The one or more elongated channels 112 and the one or more return channels 114 may be manufactured simultaneously with the body 110. The one or more elongated channels 112 and the one or more return channels 114 may thus be manufactured by additive manufacturing, e.g., by extrusion.

The one or more connecting channels 113a, 113b may be manufactured by machining, e.g., by drilling. Thus, the one or more connecting channels 113a, 113b may be attached to the body 111 after the body 111, the one or more elongated channels 112, and the one or more return channels 114 have been manufactured by additive manufacturing.

The method may further include providing a plurality of grooves in the elongated channels 112 or in at least some of the elongated channels 112 that extend in the first dimension X. The grooves may be added during additive manufacturing of the body 111 and the one or more elongated channels 112, or the grooves may be formed by machining after forming the one or more elongated channels 112.

The method may further comprise providing a heat dissipation portion 115 extending from the body 111 in a third dimension Z that is angled with respect to the first dimension X. The heat dissipation portion 115 may be formed simultaneously with the body 111. Then, the heat dissipation portion 115 may be formed during additive manufacturing, e.g., extrusion, of the body 111. Alternatively, the heat dissipation portion 115 may also be a separate component. Then, it may be manufactured separately from the housing 111 and attached to the housing 111. Suitable attachment methods are welding, shrinking, laser welding, friction stir welding, brazing, press-fitting, skiving, finning, and any combination thereof.

The method may further comprise attaching mechanical plugs 118 to the one or more elongated channels 112, the one or more connecting channels 113a, 113b and the one or more return channels 114 for closing the channels 112, 113a, 113b, 114.

• - Bereitstellen eines Kühlelements 110 durch ein oben beschriebenes Verfahren, und
• - Anschließen einer oder mehrerer Wärmequellen 120 an das Kühlelement 110, um einen Abschnitt des einen oder der mehreren länglichen Kanäle 112 abzudecken.

The heat transfer system 100 may be provided by a method comprising:

• - providing a cooling element 110 by a method described above, and
• - Connecting one or more heat sources 120 to the cooling element 110 to cover a portion of the one or more elongated channels 112.

The heat source 120 may be attached to the evaporation zone 116 by means of fasteners penetrating the body 111, brackets or other external mounting devices, by soldering, brazing, etc. Thermal paste may be applied beneath the heat source.

It is to be understood that embodiments of the disclosed invention are not limited to the particular structures, process steps, or materials disclosed herein, but are extended to equivalents thereof as would be recognized by those skilled in the art. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided, such as example lengths, widths, shapes, etc., in order to provide a thorough understanding of embodiments of the invention.

The verbs "comprise" and "include" are used in this document as open limitations that neither exclude nor require the existence of features not mentioned. The features mentioned in dependent claims can be freely combined with each other unless expressly stated otherwise. Furthermore, it is to be understood that the use of "a" or "an", i.e. the singular, throughout the document does not exclude the plural.

LIST OF REFERENCE SIGNS

100

Heat transfer system

110

Cooling element

111

Body

112

extended channel

113

Connecting channel

113b

Connecting channel

114

Return channel

115

Heat dissipation section

116

Evaporation zone

117

Condensation zone

118

mechanical plug

119

Fluid level

120

Heat source

Claims (9)

A heat transfer system (100) comprising: - a cooling element (110) comprising: • a body (111) extending in a first dimension (X), • one or more elongated channels (112) integrated into the body (111) and extending in the first dimension (X), • one or more return channels (114) integrated into the body (111) and extending in the first dimension (X), and • one or more connecting channels (113a, 113b) integrated into the body (111) and extending in a second dimension (Y) angled with respect to the first dimension (X), wherein the one or more connecting channels (113a, 113b) interconnect one or more of the elongated channels (112) and the one or more return channels (114) to form a loop thermosyphon, - one or more heat sources (120) configured to connected to the cooling element (110) to cover a portion of the one or more elongated channels (112), the covered portion of the one or more elongated channels (112) configured to form an evaporator, and characterized in that the heat transfer system further comprises an uncovered portion of the one or more elongated channels (112), the uncovered portion configured to form a condenser. Heat transfer system according to Claim 1 which comprises two or more than two connecting channels (113a, 113b) which are integrated into the body (111) at a distance from one another in the first dimension (X). A heat transfer system according to any preceding claim, wherein: - each of the one or more elongate channels (112) and the one or more return channels (114) each has a first end and a second end, - a first connecting channel (113a) of the connecting channels (113a, 113b) connects the first ends to one another, and - a second connecting channel (113b) of the connecting channels (113a, 113b) connects the second ends to one another. A heat transfer system according to any preceding claim, further comprising a heat dissipation portion (115) extending from the body (111) in a third dimension (Z) angled with respect to the first dimension (X). A heat transfer system according to any preceding claim, wherein the elongated channel (112) or at least some of the elongated channels (112) comprise a plurality of grooves extending in the first dimension (X). A heat transfer system (100) according to any preceding claim, comprising two or more than two heat sources (120) configured to be connected to the cooling element (110) such that one or more return channels (114) are not covered by the heat sources (120). A heat transfer system (100) according to any preceding claim, wherein the heat source is an electrical or optical component, such as an insulated gate bipolar transistor module, a printed circuit board, a chip-on-board light-emitting diode, or a power electronics module. The heat transfer system (100) of any preceding claim, wherein the one or more elongated channels (112) contain a heat transfer phase change fluid. A heat transfer system (100) according to any preceding claim, wherein the heat transfer system (100) is configured to form an integrated loop thermosyphon.

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