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DE202012007478U1 - Passive cooling of computer CPU via direct connection to the massive case - Google Patents

Passive cooling of computer CPU via direct connection to the massive case Download PDF

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Publication number
DE202012007478U1
DE202012007478U1 DE201220007478 DE202012007478U DE202012007478U1 DE 202012007478 U1 DE202012007478 U1 DE 202012007478U1 DE 201220007478 DE201220007478 DE 201220007478 DE 202012007478 U DE202012007478 U DE 202012007478U DE 202012007478 U1 DE202012007478 U1 DE 202012007478U1
Authority
DE
Germany
Prior art keywords
direct connection
via direct
passive cooling
computer cpu
cpu via
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE201220007478
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German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R & S Informations und Computersysteme GmbH
R & S Informations- und Computersysteme GmbH
Original Assignee
R & S Informations und Computersysteme GmbH
R & S Informations- und Computersysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R & S Informations und Computersysteme GmbH, R & S Informations- und Computersysteme GmbH filed Critical R & S Informations und Computersysteme GmbH
Priority to DE201220007478 priority Critical patent/DE202012007478U1/en
Publication of DE202012007478U1 publication Critical patent/DE202012007478U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Der Heatspreader für direkte thermische Anbindung der CPU (*mit integrierten Heatpipes für optimale Wärmeverteilung) wird direkt an das massive Gehäuse befestigt. Dadurch wird der gesamte massive Gehäusekörper (A), (B), (C), (D), (E), als Kühlkörper für die eingebauten CPUs verwendet. Verwendete Module: Hardware-Kits basierend auf Embedded PC Plattform basierend auf COM Express der TQ-Systems GmbH und der congatec AG.The heat spreader for direct thermal connection of the CPU (* with integrated heat pipes for optimal heat distribution) is attached directly to the massive housing. As a result, the entire massive housing body (A), (B), (C), (D), (E) is used as a heat sink for the built-in CPUs. Modules used: Hardware kits based on the embedded PC platform based on COM Express from TQ-Systems GmbH and congatec AG.

Description

Der Heatspreader für direkte thermische Anbindung der CPU (*mit integrierten Heatpipes für optimale Wärmeverteilung) wird direkt an das massive Gehäuse befestigt. Dadurch wird das gesamte massive Gehäusekörper (A), (B), (C), (D), (E), als Kühlkörper für die eingebauten CPUs verwendet.The heatspreader for direct thermal connection of the CPU (* with integrated heatpipes for optimal heat distribution) is attached directly to the massive housing. As a result, the entire solid case body (A), (B), (C), (D), (E) is used as a heat sink for the built-in CPUs.

Verwendete Module: Hardware-Kits basierend auf Embedded PC Plattform basierend auf COM Express der TQ-Systems GmbH und der congatec AG. Modules used: Hardware kits based on Embedded PC platform based on COM Express from TQ-Systems GmbH and congatec AG.

BezugszeichnungslisteReference drawing list

  • (A)(A)
    – Gehäuseunterteil- Housing base
    (B)(B)
    – Frontblende- front panel
    (C)(C)
    – Heatspreader- heatspreader
    (D)(D)
    – Gehäuseoberteil- Housing top
    (E)(E)
    – Rückwand- back wall

Claims (1)

Der Heatspreader für direkte thermische Anbindung der CPU (*mit integrierten Heatpipes für optimale Wärmeverteilung) wird direkt an das massive Gehäuse befestigt. Dadurch wird der gesamte massive Gehäusekörper (A), (B), (C), (D), (E), als Kühlkörper für die eingebauten CPUs verwendet. Verwendete Module: Hardware-Kits basierend auf Embedded PC Plattform basierend auf COM Express der TQ-Systems GmbH und der congatec AG.The heatspreader for direct thermal connection of the CPU (* with integrated heatpipes for optimal heat distribution) is attached directly to the massive housing. As a result, the entire solid case body (A), (B), (C), (D), (E) is used as a heat sink for the built-in CPUs. Modules used: Hardware kits based on Embedded PC platform based on COM Express from TQ-Systems GmbH and congatec AG.
DE201220007478 2012-08-03 2012-08-03 Passive cooling of computer CPU via direct connection to the massive case Expired - Lifetime DE202012007478U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE201220007478 DE202012007478U1 (en) 2012-08-03 2012-08-03 Passive cooling of computer CPU via direct connection to the massive case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201220007478 DE202012007478U1 (en) 2012-08-03 2012-08-03 Passive cooling of computer CPU via direct connection to the massive case

Publications (1)

Publication Number Publication Date
DE202012007478U1 true DE202012007478U1 (en) 2012-09-07

Family

ID=47008049

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201220007478 Expired - Lifetime DE202012007478U1 (en) 2012-08-03 2012-08-03 Passive cooling of computer CPU via direct connection to the massive case

Country Status (1)

Country Link
DE (1) DE202012007478U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9807905B2 (en) 2015-11-25 2017-10-31 General Electric Company Adapter cooling apparatus and method for modular computing devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9807905B2 (en) 2015-11-25 2017-10-31 General Electric Company Adapter cooling apparatus and method for modular computing devices

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20121031

R150 Utility model maintained after payment of first maintenance fee after three years
R151 Utility model maintained after payment of second maintenance fee after six years
R152 Utility model maintained after payment of third maintenance fee after eight years
R071 Expiry of right