DE202005007592U1 - Electronic components` e.g. diodes, heat dissipating arrangement for use in junction box of photo-voltaic modules, has holder containing components, that are pressed against heat sink when force directly/indirectly acts on components - Google Patents

Abstract

The arrangement has a locking plate, disc or cover, a heat sink (8), and a holder containing a set of electronic components (1) e.g. diodes. The components are pressed against the heat sink when a force directly or indirectly acts on the components. Spring legs (3) are diagonally opposite to a housing of a junction box of photo-voltaic modules. Each electronic component and the heat sink are separated by an insulating layer. The spring legs are reinforced laterally to the electronic components so that the legs spread themselves outside the holder under pressure.

Description

The Invention relates to heat dissipation the power loss of arranged in a housing electronic Components, in particular of diodes in the junction box of a Photovoltaic module.

at Junction boxes for Photovoltaic modules it is known to dissipate heat dissipation internally arranged electronic components to this with a heat sink to meet the requirements of IEC 61215 standards. there is it at the heat sink to an extruded aluminum profile and the lower housing part a molded plastic part of fire protection class V0.

to heat dissipation the power loss here existing diodes, these are with the Screwed down heat sink. However, this type of arrangement requires special technical expenses, to ensure the electrical insulation to the heat sink. Furthermore screwing is labor intensive.

task The invention is, in a technologically simple way, the heat dissipation of internally arranged electronic components, in particular of diodes, to realize. Solved This object is achieved with the features of claim 1, advantageous Embodiments are the subject of the dependent claims.

According to the invention is a Arrangement for heat dissipation from in a housing arranged arranged electronic components, wherein the Housing over one Closing plate, disc or a lid has and with provided a heat sink is and the one or the heat-loaded Components elastic against the heat sink as a result of on the Component be pressed directly or indirectly acting force. It should be between the heat-loaded Component and the heat sink a Insulating layer, preferably arranged on the heat sink, are.

The Contact pressure is in a preferred embodiment by one or more Spring elements produced when closing the housing by means of the closure plate, disc or the lid are deformed accordingly elastic. The closure plate, disc or lid, or one or more Parts of it can at the same time act as a heat sink.

A Such arrangement combines in itself two major advantages. To the one is by the pressing of the device to the heat sink a stable heat dissipation secured. On the other hand, the housing with the corresponding equipped with electronic components and then with the closing the lid cooling to be activated. This is technologically very cheap.

In an advantageous embodiment, especially when the heat-loaded electronic component is preferably a diode, this is in a holder mounted on the side and / or bottom arranged preferably obliquely Outside facing struts opposite the housing supported.

Under a pressure from the top of the holder spread the struts outward elastic and press the arranged in the holder diode together with the holder against the pressure force upwards. The pressure of on top of the holder with the electronic component is created at close the lid formed as a heat sink, when the height of the holder with the embedded component is greater than the clear distance inside between the case and the closed lid, if necessary with inclusion the thickness of the insulation layer.

The Struts of the holder should be mounted opposite the housing, so that an automatic Falling out of the holder during the movement of the open housing in any direction is possible.

As well it has proven to be appropriate if the arranged in the holder component in the form of a diode from Holder down to the pressing surface on the Heat sink and the terminal output is enclosed in the form of a receptacle and between the Diode and recording a detachable positive or / and non-positive connection consists.

A such non-positive and / or positive Leave connection each form a latching tongue with locking lug, the above or partially over grab the output terminal of the diode.

One embodiment is shown in the drawings. Show it:

1 : the open junction box in perspective,

2 : the diode holder with diode in perspective and

3 : the diode holder with diode in section.

In the 1 illustrated junction box for a photovoltaic module is for heat dissipation of the power dissipation of internally arranged electronic components 1 with a heat sink 8th and therefore complies with the requirements of the IEC61215 standards. This is the heat sink 8th to an extruded aluminum and the lower housing part 7 an injection-molded plastic part of fire protection class V0.

An essential part of the junction box is the holder 2 the diodes, a mechanical attachment of the respective diode 1 , in this case it is a TO220 housing, avoids and instead uses the kinematics to ensure the function.

The holder 2 The diode is designed to be the respective diode 1 fixed formumschließ and the constructive shape of the diode holder with the non-insulated side of the diode 1 against the heat sink 8th or on the heat sink 8th located insulation film presses.

The constructive shape of the holder with respect to the pressing is characterized by struts 3 , at the same time a plan concern of the diode 1 to the heat sink 8th or on the heat sink 8th Ensure that the insulation film is present. Here are the struts 3 designed such that they rest flat on the housing bottom, can move in the expected direction and that falling out of the diode holder is prevented from the intended position. The protection against falling out occurs primarily by a stop and secondarily by two further guides and an undercut, which is arranged opposite the primary stop.

The Height of Contact pressure is determined by the determination of the spring travel.

The diode housing itself is fixed in five directions, only towards the heat sink 8th is the diode 1 free from the plastic sheath.

The diode 1 itself is structurally protected against falling out, with the insertion and removal of the diode 1 from or into the diode holder is fully guaranteed.

The 2 and 3 show in detail the holder 2 for one diode each 1 ,

The heat-loaded electronic component 1 in the form of a diode 1 will be in the holder 2 stored, located on the side and bottom, arranged obliquely outward-facing struts 3 opposite the housing 7 supports, so that the struts 3 under pressure from above on the holder 2 or the diode 1 and thus on the holder 2 to spread elastically outwards and in the holder 2 arranged component 1 together with the holder 2 Press upwards against the pressure force.

The pressure from above on the holder 2 with the diode 1 arises when closing the lid 6 trained heat sink 8th because the height of the holder 2 with the embedded diode 1 is greater than the inside clearance between the housing 7 and the closed lid 6 ,

The struts 3 are on the case 7 stored, so that an automatic falling out of the holder 2 in no direction is possible.

Also shown is that in the holder 2 arranged diode 1 , from the holder 2 except for the pressure surface on the heat sink 8th and the terminal output in the form of a receptacle 4 is enclosed.

It consists between the diode 1 and the recording 4 a releasable positive and non-positive connection.

The frictional connection is made by a respective locking tongue 5 formed with locking lug, which is over or partially over the output terminal 6 the diode 1 to grab.

1

component, diode

2

holder

3

Suspensions

4

admission

5

catch tongue

6

Closing plate, disc, lid

7

casing

8th

heatsink

Claims (10)

Arrangement for dissipating heat in a housing ( 7 ) arranged electronic components ( 1 ), the housing ( 7 ) via a closure plate, disc or cover ( 6 ) and with a heat sink { 8th ) and the one or more heat-loaded components ( 1 ) are elastically pressed against the heat sink (8) as a result of a force acting directly or indirectly on the component (Z). Arrangement according to claim 1, characterized in that between the heat-loaded component ( 1 ) and the heat sink ( 8th ) an insulating layer, preferably on the heat sink ( 8th ) is arranged. Arrangement according to claim 1 or 2, characterized in that the contact pressure by one or more spring elements ( 3 ) generated during the Closing the housing ( 7 ) are elastically deformed by means of the closure plate, disc or the cover (6). Arrangement according to one of claims 1 to 3, characterized in that the closure plate, disc or the cover (6) or one or more parts thereof, the heat sink ( 8th ) form. Arrangement according to one of claims 1 to 4, characterized in that the heat-stressed electronic component ( 1 ), preferably a diode ( 1 ), in a holder ( 2 ), which is arranged on laterally and / or below, preferably obliquely outwardly facing struts ( 3 ) opposite the housing ( 7 ) is supported, so that the struts ( 3 ) under pressure from above onto the holder ( 2 ) spread out elastically to the outside and in the holder ( 2 ) arranged component ( 1 ) together with the holder ( 2 ) press against the pressure force upwards. Arrangement according to claim 5, characterized in that the pressure from above on the holder ( 2 ) with the electronic component ( 1 ) when closing the lid ( 6 ) formed heat sink ( 8th ) arises because the height of the holder ( 2 ) with the embedded component ( 1 ) is greater than the inside clearance between the housing ( 7 ) and the closed lid ( 6 ). Arrangement according to claim 5 or 6, characterized in that the struts ( 3 ) on the housing ( 7 ) Are guided out, so that an automatic falling out of the holder ( 2 ) in any direction is possible. Arrangement according to one of claims 1 to 7, characterized in that in the holder ( 2 ) arranged component ( 1 ) a diode ( 1 ), which is from the holder ( 2 ) except for the pressure surface on the heat sink ( 8th ) and the terminal output in the form of a receptacle ( 4 ) is enclosed. Arrangement according to claim 8, characterized in that between the electronic component ( 1 ) and the recording ( 4 ) There is a releasable form and / or non-positive connection. Arrangement according to claim 9, characterized in that the non-positive and / or positive connection by a respective latching tongue ( 5 ) is formed with latching lug which over or partially over the output terminal ( 6 ) of the diode ( 1 ) to grab.