DE202004006689U1 - External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing - Google Patents
External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing Download PDFInfo
- Publication number
- DE202004006689U1 DE202004006689U1 DE202004006689U DE202004006689U DE202004006689U1 DE 202004006689 U1 DE202004006689 U1 DE 202004006689U1 DE 202004006689 U DE202004006689 U DE 202004006689U DE 202004006689 U DE202004006689 U DE 202004006689U DE 202004006689 U1 DE202004006689 U1 DE 202004006689U1
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- Germany
- Prior art keywords
- housing
- heat pipes
- cooling device
- heat
- external cooling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- H10W40/73—
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Die vorliegende Erfindung bezieht sich auf eine externe Kühlvorrichtung mit Wärmeleitrohren für einen auf einer Grundplatte getragenen Prozessor zum Einbau in einen Schaltschrank oder Gehäuse bestehend aus einem Kühler mit und/oder ohne Lüfter, einem Adaptersystem mit Befestigungssystem zur Aufnahme der wärmeaufnehmenden Enden der Wärmeleitrohre und zum dichten und spaltfreien Anbringen des Adaptersystems an der Prozessoroberfläche, einem und/oder mehreren Wärmeleitrohren, einer Trenn- und/oder Befestigungswand, in der die Wärmeleitrohre dicht integriert sind, so dass kein Luftaustausch mit der Umgebung stattfinden kann und wobei die wärmeabgebenden Enden der Wärmeleitrohre in dem Kühler integriert sind.The present invention relates on an external cooling device with heat pipes for one Processor carried on a base plate for installation in a control cabinet or housing from a cooler with and / or without fan, an adapter system with fastening system to accommodate the heat absorbing Ends of the heat pipes and for tight and gap-free attachment of the adapter system the processor surface, one and / or more heat pipes, one Partition and / or mounting wall in which the heat pipes are tightly integrated are, so that no air exchange with the environment can take place and being the heat releasing Ends of the heat pipes in the cooler are integrated.
Viele elektronische Bauelemente, insbesondere CPU-Prozessoren arbeiten in einem begrenzten Temperaturbereich und zeigen Fehlfunktionen, wenn die Temperatur außerhalb des Bereichs liegt. Außerdem erzeugen sie Wärme während ihres Betriebes. Um nun die richtige Betriebstemperatur aufrechtzuerhalten muss die während des Betriebs der elektronischen Bauelemente erzeugte Wärme abgeführt werden.Many electronic components, CPU processors in particular operate in a limited temperature range and malfunction if the temperature is outside of the range. Moreover they generate heat while of their business. Now to maintain the correct operating temperature must do that during heat generated during the operation of the electronic components are dissipated.
Dazu ist eine Vielzahl von Kühlvorrichtungen bekannt.
So ist in
In
Der Erfindung liegt die Aufgabe zugrunde, eine Kühlvorrichtung für einen auf einer Grundplatte getragenen Prozessor der eingangs genannten Art zu schaffen, bei der die Kühlung extern erfolgt, ohne Luftaustausch zwischen Gehäuse- oder Schaltschrankinnenraum und der Umgebung und das in seiner Herstellung äußerst preiswert ist und kein hohes Gewicht aufweist.The invention has for its object a cooler for one processor on a base plate of the aforementioned Way of creating the cooling done externally, without air exchange between the interior of the housing or control cabinet and the environment and that is extremely inexpensive to manufacture and none has high weight.
Diese Aufgabe wird mit den Merkmalen des Anspruchs 1 gelöst. Hierbei ist also vorgesehen, dass an einer Trennwand ein Kühler mit und/oder ohne Lüfter befestigt ist, wobei in dem Kühler die wärmeabgebenden Enden der Wärmeleitrohre integriert sind, die dicht durch die Trennwand gehen und die wärmeaufnehmenden Enden der Wärmeleitrohre mittels eines Adaptersystems und Befestigungseinheit so an der Grundplatte mit dem Prozessor befestigt sind, dass die Unterseite des Adaptersystems direkt auf der Oberfläche des Prozessors aufliegt und die gesamte Einheit an einer Schaltschrank- oder Gehäusewand mittels der Trennwand befestigt wird.This task comes with the characteristics of claim 1 solved. It is therefore provided here that a cooler is provided on a partition and / or without fan is attached, being in the cooler the heat emitting Ends of the heat pipes are integrated, which go tightly through the partition and the heat absorbing Ends of the heat pipes using an adapter system and mounting unit so on the base plate are attached to the processor that the bottom of the adapter system directly on the surface of the processor and the entire unit is connected to a control cabinet or housing wall is attached by means of the partition.
Eine bevorzugte Ausführung der Erfindung weist eine Trennwand aus, an die der Kühler mit Lüfter befestigt wird. Der Kühler besteht aus einem Kühlkörper mit Kühlrippen. Die Wärmeleitrohre sind dicht in die Trennwand eingelötet, so dass kein Luftaustausch zwischen Gehäuseinnenraum und Umgebung stattfinden kann. Die wärmeabgebenden Enden der Wärmeleitrohre sind am Kühlkörper befestigt und/oder integriert. Die wärmeaufnehmenden Enden der Wärmeleitrohre werden mittels einem Adaptersystem und Befestigungseinheit auf den auf der Grundplatte integrierten Prozessor dicht und spaltfrei gepresst. Die Trennwand wird an einer Wand des Schaltschranks oder Gehäuses so befestigt, dass sich der Kühler auf der Außenseite befindet und dass der Schaltschrank oder das Gehäuse hermetisch dicht ist.A preferred embodiment of the Invention has a partition to which the cooler is attached with a fan. The cooler is there from a heat sink with Cooling fins. The heat pipes are soldered tightly into the partition so that no air exchange between the interior of the housing and surroundings can take place. The heat-emitting ends of the heat pipes are attached to the heat sink and / or integrated. The heat absorbing Ends of the heat pipes are attached to the by means of an adapter system and fastening unit Processor integrated on the base plate pressed tightly and without gaps. The partition is so on a wall of the control cabinet or housing attached that the radiator on the outside and that the control cabinet or the housing is hermetically sealed.
Äußerst günstig für die bessere Wärmeabgebung an die Umgebung wirkt sich der Einsatz eines Kühlers mit Finnen aus, wobei das wärmeabgebende Ende der Wärmeleitrohre in einem in den Finnen integrierten Rohr untergebracht sind.Extremely cheap for the better Wärmeabgebung the use of a cooler with fins affects the surroundings, whereby the heat emitting end of the heat pipes are housed in a tube integrated in the fins.
Günstig für die Wärmeübertragung wirkt sich aus, wenn das Adaptersystem, das die wärmeaufnehmenden Enden der Wärmeleitrohre aufnimmt aus Graphit hergestellt ist.Cheap for the heat transfer affects when the adapter system that the heat absorbing Ends of the heat pipes absorbs is made of graphite.
Eine montagefreundliche Ausführung sieht vor, dass die Grundplatte mit dem Prozessor sowie die anderen elektrischen Bauteile für den Computer in einem eigenen Gehäuse integriert sind und wobei das Gehäuse direkt und/oder über Distanzen an der Trennwand befestigt ist, so dass eine kompakte Einheit entsteht.An assembly-friendly version provides that the base plate with the processor as well as the other electrical Components for the computer is integrated in its own housing and where that casing directly and / or via Distances are attached to the partition, making a compact Unity arises.
Eine weitere Ausführung sieht für den Kühler Finnen aus Graphit vor.Another version sees fins for the cooler made of graphite.
Eine demontagefreundliche Ausführung weist Durchführungen mit Dichtungen für die Durchführung der Wärmeleitrohre durch die Trennwand aus.A dismantling-friendly version has bushings with seals for the implementation of the heat pipes through the partition.
Günstig für die Wärmeabgabe an die Umgebung weist sich der Einsatz von Axiallüfter und/oder Radiallüfter und/oder Gebläse aus, wobei der Kühler mit Lüfter in einem am Gehäuse angebrachten und/oder integrierten Kanal untergebracht ist.Cheap for the heat the use of axial fans and / or radial fans and / or refers to the environment fan off, the radiator with Fan in one on the case attached and / or integrated channel is housed.
Montagefreundlich erweist sich die Montage der Trennwand von dem Innenraum des Schaltschrankes oder Gehäuses an die Wand, wobei eine Dichtung zwischen Gehäusewand und Trennwand integriert wird.Installation of the partition wall from the interior of the control cabinet or housing to the wall proves to be easy to install, with a seal between the housing wall and the partition wall is integrated.
Eine Verbesserung der WärmeübertragungAn improvement in heat transfer
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnungen näher erläutert. Es zeigen:The invention is described below of an embodiment explained in more detail with reference to the drawings. Show it:
In
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202004006689U DE202004006689U1 (en) | 2004-04-27 | 2004-04-27 | External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202004006689U DE202004006689U1 (en) | 2004-04-27 | 2004-04-27 | External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE202004006689U1 true DE202004006689U1 (en) | 2004-08-19 |
Family
ID=32892646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE202004006689U Expired - Lifetime DE202004006689U1 (en) | 2004-04-27 | 2004-04-27 | External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE202004006689U1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1898505A1 (en) * | 2006-09-06 | 2008-03-12 | ABB PATENT GmbH | Control cabinet for a high, medium or low voltage substation |
| DE102008000415B4 (en) * | 2008-02-26 | 2011-06-01 | Günther, Eberhard, Dipl.-Ing. | Arrangement for dissipating heat from electrical components |
-
2004
- 2004-04-27 DE DE202004006689U patent/DE202004006689U1/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1898505A1 (en) * | 2006-09-06 | 2008-03-12 | ABB PATENT GmbH | Control cabinet for a high, medium or low voltage substation |
| DE102008000415B4 (en) * | 2008-02-26 | 2011-06-01 | Günther, Eberhard, Dipl.-Ing. | Arrangement for dissipating heat from electrical components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 20040923 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20070524 |
|
| R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20100519 |
|
| R158 | Lapse of ip right after 8 years |
Effective date: 20121101 |