DE20011590U1 - Semiconductor chip module with protective film - Google Patents

Description

Semiconductor chip module with protective film

The invention relates to a semiconductor chip module in which the semiconductor chips are particularly well protected against damage.

In chip size packages in particular, where the housing enclosing the semiconductor chip is only slightly larger than the semiconductor chip itself, the back of the chip is often exposed. They are therefore very easily exposed to mechanical damage and can easily break under mechanical stress. In some cases, the risk of damage is reduced by protecting the semiconductor chip in the finished module with a cover (globetop). Heat spreaders, which are attached to the back of the chip to dissipate the heat generated in the semiconductor chip, also increase protection against mechanical damage. When attaching a heat spreader, however, high demands are placed on the coplanarity of the individual components at module level. To protect the semiconductor chips, it is also known to run so-called support rings around the semiconductor chip. However, this requires the distance between the semiconductor chips to be increased, and attaching individual support rings for each semiconductor chip is relatively complex.

The object of the invention is accordingly to provide a semiconductor chip module in which the semiconductor chip or chips are well protected against mechanical damage despite a simple and cost-effective method of manufacture.

This object is achieved with the semiconductor chip module according to claim 1. Preferred embodiments are described in the subclaims.

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2000G12621

In the semiconductor chip module according to the invention, in which at least one semiconductor chip is attached to a carrier and is in electrically conductive contact with the carrier, the semiconductor chip is protected by a protective film being glued to the surface of the semiconductor chip facing away from the carrier. This protective film consists of an adhesive layer and an elastomer layer. It is attached to the semiconductor chip with the adhesive layer first in such a way that the protective film protrudes over the surface of the semiconductor chip on all sides. The protruding protective film protects the chip edges particularly well against mechanical stress.

There are no significant restrictions with regard to the materials for the protective film according to the invention. In principle, all elastomers and adhesive layers that are customary in the state of the art can be used. Those that are already used for other applications in the field of semiconductor technology are particularly suitable. The materials should of course be selected so that they are compatible with the components of the semiconductor chip module and can withstand the expected operating temperatures.

The protective film according to the invention is not only cost-effective, but can also be easily applied to the back of the chip using conventional process steps and tools. A lamination process is particularly suitable for applying the film.

The protection of semiconductor chips from mechanical damage using the protective film can generally be used for all common semiconductor chip modules. It is particularly useful for modules that have chip size packages.

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The invention can be used not only in semiconductor chip modules with just one semiconductor chip, but also in those in which several semiconductor chips are arranged, for example on a circuit board. An example of a module in which the invention can be used particularly effectively is an SDRAM module. After applying the protective film according to the invention, the risk of the SDRAM module being damaged by careless storage, falling, etc., for example by the end customer during a memory upgrade of the motherboard, is significantly reduced.

If several semiconductor chips are arranged on a module, either each semiconductor chip can be provided with a protective film, or several or all semiconductor chips together can be covered with a protective film. For example, if several semiconductor chips are arranged in a row, the protective film can have the form of a strip that is guided over all semiconductor chips.

Regardless of whether the protective film covers one or more semiconductor chips, its size can be determined so that the protruding edges remain free in the air. Alternatively, it is possible to lead at least one of the sides of the protective film that protrudes over a semiconductor chip down to the carrier, for example the circuit board, and to stick it there. If the protective film is attached to the carrier with all of its sides, this not only provides excellent protection against mechanical damage, but also against harmful environmental influences.

Another advantage is that the protective film can be labeled. The area available for labeling is even larger than the chip surface to which the protective film is glued.

2000G12621

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The invention will be explained in more detail below using the example of a drawing. In it, schematically

Fig. 1 shows a semiconductor chip module according to the invention in cross section and

Fig.2

the module according to Fig. 1 in top view.

In Fig. 1, a semiconductor chip module 1 according to the invention is shown using the example of an SDRAM module. Four semiconductor chips 2 are attached to a circuit board 3 and contacted with the circuit board. The semiconductor chips 2 are chip size packages in which the chip back or chip surface 4 is only poorly protected against mechanical damage. In the module 1 according to the invention, excellent protection of the semiconductor chips 2 is achieved by applying a protective film 7 to the chip surfaces 4. The protective film 7 consists of an adhesive layer 5 with a laminated elastomer layer 6.

The protective film 7 has the shape of a strip which covers all the semiconductor chips 2. This can be seen in Fig. 2. The protective film 7 protrudes laterally over all sides of each semiconductor chip 2. This means that the edges of the semiconductor chips 2 are particularly well protected against mechanical damage. The flexible and elastic protective film adapts to all deformations and thus cushions bending or other loads on the chips.

Fig. 1 shows two different ways of handling the side areas of the protective film 7. In the left area of the module 1 in Fig. 1, the lateral end of the protective film 7 is guided down towards the carrier 3 and glued to it.

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In contrast, in the right edge area of the protective film 7, the projection over the right semiconductor chip is smaller. The side area of the protective film 7 projects freely over the surface 4 of the right semiconductor chip.

Claims (7)

1. Semiconductor chip module ( 1 ), in which at least one semiconductor chip ( 2 ) is fastened to a carrier ( 3 ) and is in electrically conductive contact with the latter, characterized in that a protective film ( 7 ) consisting of an adhesive layer ( 5 ) and an elastomer layer ( 6 ) is applied to the surface ( 4 ) of the semiconductor chip ( 2 ) facing away from the carrier (3), with the adhesive layer ( 5 ) first, and this protective film ( 7 ) projects over the surface ( 4 ) of the semiconductor chip ( 2 ) on all sides. 2. Semiconductor chip module according to claim 1, characterized in that it comprises a plurality of semiconductor chips ( 2 ) arranged on a circuit board ( 3 ). 3. Semiconductor chip module according to claim 2, characterized in that the semiconductor chip ( 2 ) is a chip size package. 4. Semiconductor chip module according to claim 2 or 3, namely SDRAM module. 5. Semiconductor chip module according to one of claims 2 to 4, characterized in that the semiconductor chips ( 2 ) are arranged in a row and the protective film ( 7 ) is designed in the form of a strip covering all the semiconductor chips ( 2 ). 6. Semiconductor chip module according to one of claims 1 to 5, characterized in that the protective film ( 7 ) is led down to the carrier ( 3 ) on at least one of its sides projecting beyond the semiconductor chip ( 2 ) and is glued to the latter. 7. Semiconductor chip module according to one of claims 1 to 6, characterized in that the protective film ( 7 ) is labeled.