DE1920061U - CARRIER PLATE ACCORDING TO THE PRINTED CIRCUIT WITH METAL CONDUCTOR TRACKS PROVIDED IN SEVERAL LEVELS, SOME OF WHICH ARE IN ELECTRICAL CONTACT WITH EACH OTHER. - Google Patents

Description

P.A.285 616 * -2.6.65

Siemens & Halsice ■ Munich 2, 27 9 63

Aktiengesellschaft Witteisbacherplatz'2

63/2854

"Carrier plate in the manner of a printed circuit with metal conductor tracks provided in several levels, dio partly with one another are in electrical contact. "

This relates to a carrier plate of the printed type Circuit. Both electrical components can be placed on this carrier plate as well as assemblies or entire assembly units or all of these types placed together and electrically with one another be interconnected. The carrier plate consists of at least one insulation layer provided with beta conductor tracks in at least two levels.

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lierstoffschicht, with at least some of the ladder brackets different Levels through the layer of insulating material are connected to one another in an electrically conductive manner, i.e. they are through-contacted. In particular, are at the Durchkdntaktierungsstellen simultaneously Openings available as contact holes for the connection parts the electrical components to be placed are used.

The so-called through-plating, ie the electrical connection of conductor tracks, which are applied, for example, to both sides of an insulating plate, through the "insulating material plate" represents a particular problem in the technology of printed circuits are to be made, but also at the same time Anschlu ^p parts of electrical components are to be mounted, it must be ensured that the interlayer contact pad is electrically properly.

Ks is known to make this through-hole plating by chemical means to be carried out by special chemical processes one or more layers are introduced into the via opening and at the same time connected to the conductor tracks. Especially This problem becomes difficult if not just one, but if several printed circuits provided with conductor tracks to be layered on top of each other; and to be connected through. Man can also use the chemical process,

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however, there is no guarantee that Iletalleiterlrhnen, that are present inside the layered "backing plate, too electrically properly contacted. Is, both impermissibly high contact resistances as well as any • No contact at all.

This suggests a new way of through-hole plating. The carrier plate of the type described above is in accordance with characterized in that; the metal conductors are connected to one another by welds. In these welds contact holes can be punched or drilled at the same time

It is particularly advantageous if the metal conductor tracks are welded directly to one another. But are one of its layers of insulating material or the insulation layers are too thick overall, so * It is recommended that the metal traces be over one or more Metal auxiliary bodies with each other. weld.

A metal should preferably be used for the conductor tracks. that which can be deformed by means of the welding electrodes, i.e. that this metal has a certain ductility, such as copper, for example shows ο ...

The conductor tracks can be attached to the insulating layer 'preferably * to be concealed. But they can also be applied chemically.,

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if a material is used as the insulating layer that is destroyed during welding in the area of the welds.

The via after the g is especially there of Advantage where at least three layers of insulating material with metal gate strips are provided, are available as layered carrier plates, the thickness of each insulating material layer being about Ö, 1 mm and the thickness of the conductor tracks are less than 0.1 mm. . ■ '-. /.

With the help of the figures, the -: closer explained. ■ - _;. '

Figures 1, 2 and 3 show a single layer of insulating material with metal layers applied on both sides; FIG. 4 shows a carrier plate with three layers of insulating material and four metal conductor layers; FIG. 5 shows a carrier plate in which the insulating material layer is thicker than in FIGS. 1 to 4, an auxiliary carrier being used for welding. FIG. 6 shows a plan view of the carrier plate according to FIG. 3. All figures only indicate the cutout of the carrier plate that is essential for the through-hole plating.

In Figure 1, 1 denotes the insulating layer., This is provided with metal conductors 2 and 3 on both sides. The metal conductor tracks extend over the opening 4 located in the insulating material layer, so that the spot welding electro-

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5 and 6, the metal interconnects are deformed to one another, as this is shown in FIG. 2 after the welding at the welding point 7 has taken place. Figure 3 shows an opening 8 in the weld 7, which serves as a contact hole for the connecting parts of electrical components to be applied.

In Figure 4 are three layers of insulation 9,10 and 11 with the respective thickness d after the metal conductor tracks 13, 14, 15 and 16 have been welded in the holes 12, with in the weld 17 a contact hole 18 is provided. The metal conductor tracks have the strength e. The insulating material layer 10 can also viewed as an intermediate layer between the insulating material layers 9 and 11 provided on both sides with conductor tracks 13 and 14 or 15 and 16, respectively v / earth.

FIG. 5 shows a section from a carrier plate according to which an insulating material layer 19 with a significantly larger one Thickness is present. This layer of insulation is made of metal conductors 20 and 21 and an opening 22, the metal conductor tracks with an auxiliary metal body 23 at the points 24 and 25 are welded. A contact hole 26 is drilled into this connection ο

FIG. 6 shows a plan view of FIG. 3 and represents a section from a carrier plate after the. This plan view could also apply to FIGS. 4 or 5. On the

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Insulating material layer 1 runs a metal conductor track 2 in the area the plated-through hole is widened »The metal conductor track is slightly dented by the spot welding electrodes and at point 7 with the metal conductor track from the next level welded. The contact hole 8 is located in the welding point.

It is surprising that this type of through-hole plating, which is easy to carry out, enables a connection of metal interconnects of different types Levels can be made, which guarantees a perfect electrical connection with certainty. For example, with Help the via hole after the one about 1.1mm strong carrier plate can be produced, which consists of ten insulating material EÜiichten and eleven accordingly. Metal conductor layers is made. For the production of this carrier plate one goes a.B. so before that one in the insulating material layers according to the requirements of the Circuit introduces holes for the through-hole plating and then the layers of insulating material are provided with copper foils the conductor tracks are produced from the copper foils by chemical etching, whereby care must be taken that from the side no etching of the copper foil takes place since the plated-through holes, so that the plated-through holes are at least on one side remain covered by the metal foil. With copper foils laminated insulating material layers or panels already through positive stencils, which are printed on both sides in the form of the conductor tracks, for example, and which are divided under the template protect the foil parts from the etching agent,

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made sure that the etchant does not get into the vias penetrates. In the case of insulating material laminated with copper foil on one side or plates, the back of the plate During the etching process, e.g. provided with a cover plate, so that the etchant does not get into the holes either penetrate and attack the copper foil from below. On the other hand, it is also in the case of panels laminated on one side possible the glue that attaches the copper foil to the insulating material layer keeps, not on the layer or plate provided with bores (through-hole holes) but on the copper foil, so that the back of the copper foil is protected from the etchant by the etch-resistant adhesive over the bores will. The insulating material layers are then covered with other similar, appropriately prepared insulation layers, if necessary glued with the interposition of insulating foils and jointly through-contacted by spot welding. The weld is easiest if all the metal foils to be welded are of the same thickness ο This multi-layer! carrier plate can e.g. with several Aggregates in which individual linear assemblies of the electronics are summarized, are populated because after the Br a through-hole connection that meets all requirements arises »

8 claims
6 figures

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Claims (1)

616 • -2.fi. 65 Ί PA 9/472/69 - 8 - t a n s j ^ r ^ U ^ c h e 1. Carrier plate for electrical components and / or assemblies and / or assembly units of the electronics, which are made up of at least one provided with metal conductor tracks in at least two levels Insulating layer consists in which at least a part of the conductor tracks of different levels through the layer of insulating material are connected to one another in an electrically conductive manner therethrough, in particular through openings which simultaneously act as contact holes serve for connecting parts, characterized in that the metal conductor tracks (2,5,15 to 16,20,21) through each other Welds (7,17,24,25) are connected. Support plate according to claim 1, characterized in that the weld points (7, 17, 24, 25) are provided with contact holes (8, 18, 26) are" 5ο carrier plate according to claim 1 or 2, characterized in that that the metal conductor tracks (2,5,15) to 16) are welded together directly. 4 «carrier plate according to claim 1 or 2, characterized in that that the metal conductor tracks (20, 21) via a metal auxiliary body (23) are welded together. 5 »Carrier plate according to one or more of claims 1 to 4, ¹ - 9 - PA 9/472/69 _ Q characterized in that for the conductor tracks (2,3,13 to 16,20,21) a metal is used which is deformable by means of the welding electrodes (5,6) ο 6 »Carrier plate according to one or more of Claims 1 to 5, characterized in that the conductor tracks (2, 3, 13 to 16, 20, 21) are laminated onto the insulating material layer (1, 19, 11, 19) simd ο 7- carrier plate according to one or more of claims 1 to 5, characterized in that the conductor tracks (2, 3 »13 to 16, 20, 21) are chemically applied to the insulating material layer (1, 9, 10, 11, 19) ο 8ο carrier plate according to one or more of claims 1 to 7, characterized in that it consists of at least three layers of insulating material (19,11), the thickness (d) of each insulating material layer being approx. 0.1 mm and the thickness (e) of the conductor tracks (13 to 16) are smaller than 0.1 mm *