[go: up one dir, main page]

DE19983953T1 - Verfahren und Vorrichtung zum Übereinanderschichten von Oberflächenmontage-IC's - Google Patents

Verfahren und Vorrichtung zum Übereinanderschichten von Oberflächenmontage-IC's

Info

Publication number
DE19983953T1
DE19983953T1 DE19983953T DE19983953T DE19983953T1 DE 19983953 T1 DE19983953 T1 DE 19983953T1 DE 19983953 T DE19983953 T DE 19983953T DE 19983953 T DE19983953 T DE 19983953T DE 19983953 T1 DE19983953 T1 DE 19983953T1
Authority
DE
Germany
Prior art keywords
surface mount
stacking surface
mount ics
ics
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19983953T
Other languages
English (en)
Inventor
Chin Low Chau
Oscar Woo
Michael R Fabry
Terry A Junge
Fee Yin Tiang
An Aw Choon
Jonathan E Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Technology LLC
Original Assignee
Seagate Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology LLC filed Critical Seagate Technology LLC
Publication of DE19983953T1 publication Critical patent/DE19983953T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H10W70/40—
    • H10W70/60—
    • H10W72/5363—
    • H10W90/288—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE19983953T 1999-05-07 1999-10-26 Verfahren und Vorrichtung zum Übereinanderschichten von Oberflächenmontage-IC's Withdrawn DE19983953T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13301999P 1999-05-07 1999-05-07
PCT/US1999/025015 WO2000068996A1 (en) 1999-05-07 1999-10-26 Surface mount ic stacking method and device

Publications (1)

Publication Number Publication Date
DE19983953T1 true DE19983953T1 (de) 2002-06-20

Family

ID=22456645

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983953T Withdrawn DE19983953T1 (de) 1999-05-07 1999-10-26 Verfahren und Vorrichtung zum Übereinanderschichten von Oberflächenmontage-IC's

Country Status (6)

Country Link
JP (1) JP2003521810A (de)
KR (1) KR20020002498A (de)
CN (1) CN1391704A (de)
DE (1) DE19983953T1 (de)
GB (1) GB2364440B (de)
WO (1) WO2000068996A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545868B1 (en) * 2000-03-13 2003-04-08 Legacy Electronics, Inc. Electronic module having canopy-type carriers
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US7337522B2 (en) 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
AU2002250437A1 (en) 2001-03-14 2002-09-24 Legacy Electronics, Inc. A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
CN100481444C (zh) * 2002-02-26 2009-04-22 莱格西电子股份有限公司 模块集成电路芯片载体
AU2003239739A1 (en) * 2002-07-04 2004-01-23 Koninklijke Philips Electronics N.V. Multi electric device package
WO2006076381A2 (en) 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
SG135074A1 (en) 2006-02-28 2007-09-28 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
TWI470749B (zh) 2009-12-23 2015-01-21 財團法人工業技術研究院 導熱絕緣複合膜層及晶片堆疊結構
EP3531806B1 (de) * 2018-02-26 2020-03-25 ZKW Group GmbH Elektronische leiterplattenbaugruppe für hochleistungsbauteile

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
US4956694A (en) * 1988-11-04 1990-09-11 Dense-Pac Microsystems, Inc. Integrated circuit chip stacking
JP2634516B2 (ja) * 1991-10-15 1997-07-30 三菱電機株式会社 反転型ｉｃの製造方法、反転型ｉｃ、ｉｃモジュール
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5380681A (en) * 1994-03-21 1995-01-10 United Microelectronics Corporation Three-dimensional multichip package and methods of fabricating
JPH088389A (ja) * 1994-04-20 1996-01-12 Fujitsu Ltd 半導体装置及び半導体装置ユニット
JPH08167691A (ja) * 1994-12-13 1996-06-25 Toshiba Corp 半導体装置
US5612570A (en) * 1995-04-13 1997-03-18 Dense-Pac Microsystems, Inc. Chip stack and method of making same
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
US5768772A (en) * 1996-05-17 1998-06-23 International Business Machines Corporation Pinstacking process and fixture
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package

Also Published As

Publication number Publication date
CN1391704A (zh) 2003-01-15
JP2003521810A (ja) 2003-07-15
KR20020002498A (ko) 2002-01-09
GB2364440A (en) 2002-01-23
WO2000068996A1 (en) 2000-11-16
GB0125940D0 (en) 2001-12-19
GB2364440B (en) 2004-05-26

Similar Documents

Publication Publication Date Title
DE69800975D1 (de) Verfahren und Vorrichtung zu Oberflächenbehandlung
DE60007883D1 (de) Verfahren und vorrichtung zum durchführen von elektronischen transaktionen
DE69730109D1 (de) Verfahren und Vorrichtung zum Herstellen von Wasserzeichen
DE69834862D1 (de) Verfahren und Vorrichtung zum Ausrichten von Gegenständen
DE59703100D1 (de) Verfahren und Vorrichtung zum Entpalettieren von Artikeln
DE69908226D1 (de) Vorrichtung und Verfahren zum Wiederauffinden von Melodien
DE69927111D1 (de) Verfahren und Vorrichtung zum Polieren von Substraten
DE59700990D1 (de) Verfahren und Vorrichtung zum Ausrichten von flachen Gegenständen
DE69735488D1 (de) Verfahren und vorrichtung zum ausrichten von bildern
DE59508637D1 (de) Verfahren und Vorrichtung zum Stapeln
DE60045379D1 (de) Verfahren und vorrichtung zum drucken von lötpaste
DE69922687D1 (de) Verfahren und vorrichtung zum montieren von bauteilen
DE69516592D1 (de) Verfahren und vorrichtung zum bewegen von behinderten
DE69840298D1 (de) Vorrichtung und verfahren zum einstellen von robotern
DE59601324D1 (de) Verfahren und Vorrichtung zum Depalettieren
DE50004288D1 (de) Verfahren und Vorrichtung zum Bedrucken von Zuschnitten
DE59914798D1 (de) Verfahren und vorrichtung zum abbau von überspannungen
DE59809751D1 (de) Verfahren und Vorrichtung zum Herstellen von Packungen
DE60019414D1 (de) Verfahren und vorrichtung zum stapeln von tortillachips
DE60034527D1 (de) Verfahren und Vorrichtung zum Ausrichten von Gegenständen
DE69835942D1 (de) Verfahren und vorrichtung zum zuführen von bauteilen
DE60034274D1 (de) Verfahren und Vorrichtung zum Ätzen von Silizium
DE60021149D1 (de) Verfahren und Vorrichtung zum Polieren
DE69821416D1 (de) Verfahren und Vorrichtung zum Dispergieren
DE50014563D1 (de) Verfahren und Vorrichtung zum Dekorieren von Einzelobjekten

Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: WOO, OSCAR, SANTA CRUZ, CALIF., US

Inventor name: FABRY, MICHAEL R., APPLE VALLEY, MINN., US

Inventor name: JUNGE, TERRY A., SCOTTS VALLEY, CALIF., US

Inventor name: CHOON, AN AW, SINGAPUR/SINGAPORE, SG

Inventor name: OLSON, JONATHAN E., MINNEAPOLIS, MINN., US

Inventor name: YIN, TIANG FEE, SINGAPUR/SINGAPORE, SG

Inventor name: LOW, CHAU CHIN, FREEMONT, CALIF., US

8139 Disposal/non-payment of the annual fee