DE19980819T1 - Plate-shaped heat sink pipe and cooling device using the same - Google Patents

Plate-shaped heat sink pipe and cooling device using the same

Info

Publication number: DE19980819T1
Authority: DE; Germany
Prior art keywords: plate; same; heat sink; cooling device; shaped heat
Prior art date: 1998-04-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

DE19980819T

Other languages

German (de)

Inventor

Masaaki Yamamoto

Masami Ikeda

Tatsuhiko Ueki

Hitoshi Sho

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Furukawa Electric Co Ltd

Original Assignee

Furukawa Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-04-15

Filing date

1999-04-07

Publication date

2000-05-31

1999-04-07 Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd

2000-05-31 Publication of DE19980819T1 publication Critical patent/DE19980819T1/en

Status Withdrawn legal-status Critical Current

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
- H10W40/73—
- H10W72/877—

Landscapes

Engineering & Computer Science (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

DE19980819T 1998-04-15 1999-04-07 Plate-shaped heat sink pipe and cooling device using the same Withdrawn DE19980819T1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP10453098		1998-04-15
PCT/JP1999/001841 WO1999053256A1 (en)	1998-04-15	1999-04-07	Plate type heat pipe and its installation structure

Publications (1)

Publication Number	Publication Date
DE19980819T1 true DE19980819T1 (en)	2000-05-31

Family

ID=14383059

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE19980819T Withdrawn DE19980819T1 (en)	1998-04-15	1999-04-07	Plate-shaped heat sink pipe and cooling device using the same

Country Status (6)

Country	Link
JP (1)	JP4278720B2 (en)
CN (1)	CN1179188C (en)
DE (1)	DE19980819T1 (en)
GB (1)	GB2342152B (en)
TW (1)	TW414854B (en)
WO (1)	WO1999053256A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001183080A (en) *	1999-12-24	2001-07-06	Furukawa Electric Co Ltd:The	Method for producing compressed mesh wick, and flat heat pipe provided with compressed mesh wick
EP1432295B1 (en) *	2002-12-20	2005-04-13	Innowert GmbH	Cooling device for an electric or electronic unit
CN100447989C (en) *	2005-05-18	2008-12-31	新灯源科技有限公司	Integrated circuit package and manufacturing method thereof
CN100424860C (en) *	2005-08-19	2008-10-08	南茂科技股份有限公司	Heat dissipation type flip chip package structure
US7447029B2 (en)	2006-03-14	2008-11-04	Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.	Vapor chamber for dissipation heat generated by electronic component
CN101709929B (en) *	2008-11-03	2012-05-30	赵耀华	A kind of plate heat pipe and its processing technology
CN101403578A (en) *	2008-11-03	2009-04-08	赵耀华	Plate-shaped heat pipe and its processing technique
CN105338784A (en) *	2014-08-08	2016-02-17	联想(北京)有限公司	Cooling device and electronic equipment
JP6513427B2 (en) *	2015-02-27	2019-05-15	昭和電工株式会社	Liquid cooling system
CN204707386U (en) *	2015-04-30	2015-10-14	讯凯国际股份有限公司	Heat dissipation component, water-cooled heat dissipation component and heat dissipation system
CN108458613A (en) *	2017-02-21	2018-08-28	Ibt株式会社	For outdoor template vacuum heat transfer unit (HTU)
US11716808B2 (en) *	2020-12-10	2023-08-01	International Business Machines Corporation	Tamper-respondent assemblies with porous heat transfer element(s)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07208884A (en) *	1994-01-19	1995-08-11	Fujikura Ltd	Flat plate heat pipe
JP3403307B2 (en) *	1997-02-13	2003-05-06	古河電気工業株式会社	Heat spreader and cooler using it
JP3106429B2 (en) *	1997-04-11	2000-11-06	古河電気工業株式会社	Plate type heat pipe and cooling structure using it

1999
- 1999-04-07 DE DE19980819T patent/DE19980819T1/en not_active Withdrawn
- 1999-04-07 WO PCT/JP1999/001841 patent/WO1999053256A1/en not_active Ceased
- 1999-04-07 GB GB9928393A patent/GB2342152B/en not_active Expired - Fee Related
- 1999-04-07 CN CNB998005541A patent/CN1179188C/en not_active Expired - Lifetime
- 1999-04-07 JP JP55147499A patent/JP4278720B2/en not_active Expired - Fee Related
- 1999-04-14 TW TW088105915A patent/TW414854B/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
GB2342152A (en)	2000-04-05
CN1179188C (en)	2004-12-08
JP4278720B2 (en)	2009-06-17
TW414854B (en)	2000-12-11
GB9928393D0 (en)	2000-01-26
GB2342152B (en)	2002-01-09
WO1999053256A1 (en)	1999-10-21
CN1263592A (en)	2000-08-16

Publication	Publication Date	Title
DE19980801T1 (en)	2000-05-31	Plate-shaped heat sink pipe and cooling device using the same
EP0938639A4 (en)	2000-03-01	FLAT THIN HEAT SINKS
DE60011616D1 (en)	2004-07-22	HEAT EXCHANGER WITH MULTI-CHANNEL PIPES
EP1481205A4 (en)	2012-08-15	Thermoelectric transient cooling and heating systems
DE69931350D1 (en)	2006-06-22	COOLING DEVICE
EP0732741A3 (en)	1996-12-11	Heat sinks
DE69936672D1 (en)	2007-09-13	Heat sink and its manufacture
TW450381U (en)	2001-08-11	Heat sink device
DE69924306D1 (en)	2005-04-21	heat exchangers
FR2786858B1 (en)	2001-01-19	HEAT EXCHANGER
DE19980819T1 (en)	2000-05-31	Plate-shaped heat sink pipe and cooling device using the same
NO20014258D0 (en)	2001-09-03	Cooling and heating system
DE59403512D1 (en)	1997-09-04	Heat exchanger, especially cooling device
FR2786557B1 (en)	2003-02-07	HEAT EXCHANGER
DE59702187D1 (en)	2000-09-21	Heat exchangers, especially water coolers
EP1480261A4 (en)	2006-04-19	COOLING DEVICE AND THERMAL PROCESSING DEVICE USING THE SAME
DE69904923D1 (en)	2003-02-20	ELECTROHYDRODYNAMIC HEAT EXCHANGER
DE59908219D1 (en)	2004-02-12	Low-power heater or heat sink swivel device
NO963394D0 (en)	1996-08-14	Heat sink for semiconductor components and the like
FI990576L (en)	2000-09-17	Heat exchanger heat sink
KR960012960U (en)	1996-04-17	Transistor Fixture on Heat Sink
FI961181A0 (en)	1996-03-13	Heat sink
KR960005778U (en)	1996-02-17	Heat dissipation device for cold and water heaters using thermoelectric elements
TW536147U (en)	2003-06-01	Heat dissipating fin set capable of being arranged based on the flowing direction of fluid and heat dissipating device using the same
FR2782379B1 (en)	2000-10-13	HEAT EXCHANGER

Legal Events

Date	Code	Title	Description
2000-09-07	8110	Request for examination paragraph 44
2000-10-05	8127	New person/name/address of the applicant	Owner name: THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP
2005-03-17	8130	Withdrawal