DE19900437B4 - Method and device for ion implantation in solids and / or for coating solid surfaces and the use of methods and apparatus - Google Patents
Method and device for ion implantation in solids and / or for coating solid surfaces and the use of methods and apparatus Download PDFInfo
- Publication number
- DE19900437B4 DE19900437B4 DE19900437A DE19900437A DE19900437B4 DE 19900437 B4 DE19900437 B4 DE 19900437B4 DE 19900437 A DE19900437 A DE 19900437A DE 19900437 A DE19900437 A DE 19900437A DE 19900437 B4 DE19900437 B4 DE 19900437B4
- Authority
- DE
- Germany
- Prior art keywords
- laser
- ion
- ion beam
- coaxial
- substrate
- Prior art date
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- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000000576 coating method Methods 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 title claims abstract description 13
- 239000007787 solid Substances 0.000 title claims abstract description 13
- 238000005468 ion implantation Methods 0.000 title claims abstract description 8
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000002105 nanoparticle Substances 0.000 claims description 4
- 230000001133 acceleration Effects 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 230000005641 tunneling Effects 0.000 claims description 3
- 201000011510 cancer Diseases 0.000 claims description 2
- 239000012857 radioactive material Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 27
- 238000001704 evaporation Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 7
- 238000002513 implantation Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000002285 radioactive effect Effects 0.000 description 3
- 201000010915 Glioblastoma multiforme Diseases 0.000 description 2
- 206010028980 Neoplasm Diseases 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 208000005017 glioblastoma Diseases 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 208000003174 Brain Neoplasms Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229940030602 cardiac therapy drug Drugs 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 210000005260 human cell Anatomy 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000000941 radioactive substance Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
- H01J27/18—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation with an applied axial magnetic field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3142—Ion plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Verfahren zur Ionenimplantation in Festkörpern und/oder zur Beschichtung von Festkörperoberflächen, dadurch gekennzeichnet, dass das Festkörpersubstrat mit mindestens einem Koaxialstrahl bestehend aus mindestens einem Ionenstrahl und mindestens einem Laserstrahl beaufschlagt wird.method for ion implantation in solids and / or for coating solid surfaces, characterized that the solid substrate with at least one coaxial beam consisting of at least one Ion beam and at least one laser beam is applied.
Description
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zur Behandlung von Festkörpersubstraten, bei welchem das Substrat zum Zwecke der Beschichtung und/oder der Ionenimplantation in die Oberfläche und/oder tiefere Schichten mit mindestens einem Koaxialstrahl bestehend aus mindestens einem Ionenstrahl und mindestens einem Laserstrahl beaufschlagt wird. Weiterhin betrifft die Erfindung die Anwendung des Verfahrens im Bereich der Tumorbehandlung und im Bereich der Herstellung von Nanopartikeln, Diamantscheiben und Rastertunnelmikroskop-Tastspitzen.The The invention relates to a method and a device for treatment of solid substrates, in which the substrate for the purpose of coating and / or the Ion implantation in the surface and / or deeper layers with at least one coaxial beam from at least one ion beam and at least one laser beam acted upon becomes. Furthermore, the invention relates to the application of the method in the field of tumor treatment and in the field of production of Nanoparticles, diamond disks and scanning tunneling microscope probe tips.
Es
ist bekannt, dass in der kurativen Herztherapie mit radioaktivem
Phosphor versehene Metallträger
implantiert werden. Der für
die Beschichtung dieser Metallträger
erforderliche Ionenstrom verursacht durch Sputterprozesse eine radioaktive Kontamination
der Beschichtungsanlagen, die aufwändig entsorgt werden muss.
Radioaktive Implantate und Verfahren zu deren Herstellung sind beispielsweise
aus der Patentschrift
Weiterhin ist es bekannt, Wandungen und Keramikteile von Verbrennungskraftmaschinen zur Steigerung des Wirkungsgrades einer Flammbeaufschlagung zu unterwerfen. Die so behandelten Flächen genügen allerdings den Anforderungen im Hinblick auf Temperatur- und Korrosionsverhalten nicht.Farther It is known, walls and ceramic parts of internal combustion engines to subject to increase the efficiency of a Flammbeaufschlagung. The treated areas suffice however, the requirements with regard to temperature and corrosion behavior Not.
Auch ist es bekannt, dass galvanisch aufgebrachte Leitermuster auf Leiterplatten in der Raumfahrttechnik hohe Stör- und Ausfallraten verursachen. Implantierte Leiterspuren auf Festkörpersubstraten bieten hier eine um Größenordnungen höhere Sicherheit.Also It is known that electroplated conductor patterns on printed circuit boards in space technology high levels of interference and cause failure rates. Implanted conductor tracks on solid substrates offer here by orders of magnitude higher security.
Stand
der Technik ist es, eine zu beschichtende Substratoberfläche vor
oder während
des Aufdampfprozesses mittels Ionenstrahl-, Plasma-, Elektronenstrahl-
oder Laser-Verfahren zu modifizieren und/oder anzuregen, wie es
beispielsweise in den Offenlegungsschriften
Die
Aufbringung von Materialschichten auf Festkörperoberflächen mittels Ionenstrahl ist
beispielsweise aus den japanischen Patentschriften
Verfahren
und Vorrichtungen zur Bereitstellung von Ionenstrahlen werden in
den Patentschriften
Generell beherrschen aber Haftungsprobleme alle Sparten der Beschichtungstechnologie und es besteht die Aufgabe, diesbezüglich verbesserte Beschichtungs- und Ionenimplantationsverfahren sowie zugehörige Vorrichtungen zu entwickeln.As a general rule However, liability problems dominate all areas of coating technology and the object is to improve this coating and ion implantation methods and related devices.
Die Aufgabe wird durch das Verfahren zur Behandlung von Festkörpersubstraten nach Anspruch 1 und durch die Vorrichtung zur Durchführung dieses Verfahrens nach Anspruch 12 gelöst. Verwendungen des erfindungsgemäßen Verfahrens werden in den Ansprüchen 8, 9 und 10 angegeben.The The object is achieved by the method for the treatment of solid substrates according to claim 1 and by the device for carrying out this Method according to claim 12 solved. Uses of the method according to the invention be in the claims 8, 9 and 10 indicated.
Die
Erfindung wird im Folgenden anhand der
Bei
dem erfindungsgemäßen Beschichtungs-
und/oder Ionenimplantationsverfahren wird mittels einer Elektronen-Zyklotron-Resonanz-Ionenquelle
(ECR-Ionenquelle) (
Koaxial
zu dem in der ECR-Ionenquelle erzeugten Ionenstrahl (
Ionenstrahl
(
Ein
der ECR-Ionenquelle nachgeschaltetes Ablenk- und Umlenksystem (
Zur
Durchführung
des Beschichtungs- und/oder Ionenimplantationsverfahrens ist es
vorteilhaft, die in den Patentschriften
Die
Ionenbeschleunigungsenergie beträgt vorzugsweise
bis zu 400 keV. Ionenbeschleunigungselemente (
Der
dem Ionenstrahl (
Die
Prozesskammer (
Eine
Ausgestaltung der Erfindung, die Beschichtungen oder Ionenimplantationen
bei ganz unterschiedlichen Bedingungen ermöglicht, ist in
Die
offenen Systeme gemäß den
Es ist bekannt, dass Gehirntumore des Typs glioblastoma multiforme (GBM) nicht heilbar sind. Weiter ist bekannt, dass ein bis zwei Alphateilchen pro Humanzelle ausreichen, um Tumorsequenzen zu zerstören. Durch Ankopplung von Astat-211, einem Alphastrahler, an einen Antikörper ist eine Verdoppelung der Überlebenszeit auf ca. ein Jahr auch vereinzelt erreicht worden. Nachteilig bei dieser Methode ist allerdings, dass der Alphastrahler zusammen mit dem Antikörper den gesamten Organismus passieren muss. Eine Direktimplantation radioaktiver Substanzen in maligne Tumore könnte hier zukunftsweisend sein. Die erfindungsgemäße Prozesskammer wird hierfür als Hochsterilraum ausgestaltet, der sowohl eine Normal- als auch eine Unterdruckeinstellung erlaubt.It It is known that brain tumors of the type glioblastoma multiforme (GBM) are not curable. It is also known that one to two Alpha particles per human cell are sufficient to destroy tumor sequences. By Coupling of Astat-211, an alpha emitter, to an antibody a doubling of the survival time Occasionally reached in about a year. A disadvantage of However, this method is that the alpha emitter together with the antibody the entire organism has to pass. A direct implantation Radioactive substances in malignant tumors could be forward-looking here. The process chamber according to the invention is therefor designed as a high-sterile room, which is both a normal and a vacuum setting allowed.
Die
in der
Mittels
der Laservorrichtungen (
Ein weiteres Einsatzgebiet zur Verwendung des erfindungsgemäßen Verfahrens und der erfindungsgemäßen Vorrichtung ist die Herstellung von Rastertunnelmikroskop-Tastspitzen, die in der Größenordnung weniger Atome liegt.One Another application for the use of the method according to the invention and the device according to the invention is the fabrication of scanning tunneling microscope probe tips, which in of the order of magnitude less atoms lies.
- 11
- ECR-IonenquelleECR ion source
- 22
- Laser/LeistungslaserLaser / Laser Power
- 33
- Koaxialstrahl (Ionen- und Laserstrahl)Koaxialstrahl (Ion and laser beam)
- 3a3a
- Laserstrahllaser beam
- 3b3b
- Ionenstrahlion beam
- 44
- Ionenstrahl-UmlenksystemIon beam deflection system
- 55
- Ionenstrahl-CupIon Beam Cup
- 66
- vakuumdichte Laseroptikvacuum-tight laser optics
- 77
- Substratsubstratum
- 88th
- IonenoptiksystemIon optics system
- 99
- Prozesskammerprocess chamber
- 1010
- Isolatorinsulator
- 10a10a
- Gelenkisolatorjoint insulator
- 1111
- Laserlaser
- 1212
- Laserstrahllaser beam
- 1313
- KoaxialstrahlKoaxialstrahl
- 13b13b
- Ionenstrahlion beam
- 1515
- ProzessgaseinlassProcess gas inlet
- 1616
- Vakuumpumpensystem 1vacuum pump system 1
- 1717
- Mustertemplate
- 1818
- Vakuumpumpensystem 2vacuum pump system 2
- 1919
- Substrathaltersubstrate holder
- 2020
- Ionenfensterion window
- 2121
- Objekthalterobject holder
- 2222
- Objekthalter in Position 2object holder in position 2
- 2323
- Objekthalter in Position 3object holder in position 3
- 2424
- Plasmagitterplasma grid
- 24a24a
- Beschleunigungsgitteraccelerating grid
- 2525
- Saphir-HohlzylinderSapphire hollow cylinder
- 2626
- Kammer für laserinduzierte Verdampfungchamber for laser-induced evaporation
- 2727
- Trennstelleseparation point
- 2828
- Gaseinlassgas inlet
- 2929
- LaseroptiksystemLaser optical system
- 3030
- Halterungbracket
- 3131
- Vakuumkammervacuum chamber
- 3232
- Laserspiegellaser mirror
- 3333
- StreustrahlschutzScattered ray protection
- 3434
- Materie-BarrenMatter bars
- 3535
- Reaktionszonereaction zone
Claims (18)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19900437A DE19900437B4 (en) | 1999-01-11 | 1999-01-11 | Method and device for ion implantation in solids and / or for coating solid surfaces and the use of methods and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19900437A DE19900437B4 (en) | 1999-01-11 | 1999-01-11 | Method and device for ion implantation in solids and / or for coating solid surfaces and the use of methods and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19900437A1 DE19900437A1 (en) | 2000-10-26 |
| DE19900437B4 true DE19900437B4 (en) | 2009-04-23 |
Family
ID=7893770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19900437A Expired - Fee Related DE19900437B4 (en) | 1999-01-11 | 1999-01-11 | Method and device for ion implantation in solids and / or for coating solid surfaces and the use of methods and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19900437B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109826768A (en) * | 2019-02-27 | 2019-05-31 | 哈尔滨工业大学 | A kind of low-power cylinder hall thruster of diamond wall surface |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2917753B1 (en) * | 2007-06-20 | 2011-05-06 | Quertech Ingenierie | MULTI-SOURCE DEVICE FOR THE TREATMENT OF PIECES BY ION IMPLANTATION AND METHOD IMPLEMENTING IT |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3778656A (en) * | 1971-07-29 | 1973-12-11 | Commissariat Energie Atomique | Ion source employing a microwave resonant cavity |
| GB2112205A (en) * | 1981-05-28 | 1983-07-13 | Haroon Ahmed | A thermal processing system for semiconductors and other materials using two or more electron beams |
| DD231522A1 (en) * | 1984-12-14 | 1986-01-02 | Mittweida Ing Hochschule | METHOD FOR THE LASER-INDUCED MODIFICATION OF CERAMIC MATERIALS |
| JPS6184379A (en) * | 1984-09-29 | 1986-04-28 | Kyocera Corp | Production of high-hardness boron nitride film |
| DE3621045A1 (en) * | 1985-06-24 | 1987-01-02 | Nippon Telegraph & Telephone | RADIANT GENERATING DEVICE |
| JPH01127667A (en) * | 1987-11-09 | 1989-05-19 | Hitachi Ltd | Laser-assisted composite surface modification equipment |
| DE3829338C2 (en) * | 1988-08-30 | 1993-04-29 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
| JPH05263240A (en) * | 1992-03-19 | 1993-10-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing dielectric thin film |
| DE4427215A1 (en) * | 1993-08-02 | 1995-02-23 | Agency Ind Science Techn | Transparent and conductive ultrathin films and process for the production thereof |
| JPH0790581A (en) * | 1993-09-22 | 1995-04-04 | Nippon Steel Corp | Surface layer reforming method by ion implantation and apparatus therefor |
| DE4419970A1 (en) * | 1994-06-08 | 1995-12-21 | Juergen Prof Dr Andrae | Highly charged ion beam generator |
| DE19513345A1 (en) * | 1995-04-08 | 1997-01-02 | Ehret Hans P | Electron cyclotron resonance ion source with cylindrical cavity and hollow conductor |
| DE19641439A1 (en) * | 1995-04-08 | 1998-05-07 | Ehret Hans P | Electron cyclotron resonance ion source |
| EP0500928B1 (en) * | 1990-08-13 | 1999-03-03 | GOOD, Roger R. | Endocurietherapy |
-
1999
- 1999-01-11 DE DE19900437A patent/DE19900437B4/en not_active Expired - Fee Related
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3778656A (en) * | 1971-07-29 | 1973-12-11 | Commissariat Energie Atomique | Ion source employing a microwave resonant cavity |
| GB2112205A (en) * | 1981-05-28 | 1983-07-13 | Haroon Ahmed | A thermal processing system for semiconductors and other materials using two or more electron beams |
| JPS6184379A (en) * | 1984-09-29 | 1986-04-28 | Kyocera Corp | Production of high-hardness boron nitride film |
| DD231522A1 (en) * | 1984-12-14 | 1986-01-02 | Mittweida Ing Hochschule | METHOD FOR THE LASER-INDUCED MODIFICATION OF CERAMIC MATERIALS |
| DE3621045A1 (en) * | 1985-06-24 | 1987-01-02 | Nippon Telegraph & Telephone | RADIANT GENERATING DEVICE |
| JPH01127667A (en) * | 1987-11-09 | 1989-05-19 | Hitachi Ltd | Laser-assisted composite surface modification equipment |
| DE3829338C2 (en) * | 1988-08-30 | 1993-04-29 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
| EP0500928B1 (en) * | 1990-08-13 | 1999-03-03 | GOOD, Roger R. | Endocurietherapy |
| JPH05263240A (en) * | 1992-03-19 | 1993-10-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing dielectric thin film |
| DE4427215A1 (en) * | 1993-08-02 | 1995-02-23 | Agency Ind Science Techn | Transparent and conductive ultrathin films and process for the production thereof |
| JPH0790581A (en) * | 1993-09-22 | 1995-04-04 | Nippon Steel Corp | Surface layer reforming method by ion implantation and apparatus therefor |
| DE4419970A1 (en) * | 1994-06-08 | 1995-12-21 | Juergen Prof Dr Andrae | Highly charged ion beam generator |
| DE19513345A1 (en) * | 1995-04-08 | 1997-01-02 | Ehret Hans P | Electron cyclotron resonance ion source with cylindrical cavity and hollow conductor |
| DE19641439A1 (en) * | 1995-04-08 | 1998-05-07 | Ehret Hans P | Electron cyclotron resonance ion source |
Non-Patent Citations (5)
| Title |
|---|
| JP 01127667 A, Pat. Abst. of Jp. * |
| JP 05263240 A, Pat. Abst. of Jp. * |
| JP 07090581 A, Pat. Abstr. of Jp. * |
| JP 61-084 379 A, Pat. Abstr. of Jp.; Jp 07-090 581 A, Pat. Abstr. of Jp.; JP 01-127 667 A, Pat. Abst r. of Jp.; JP 05-263 240 A, Pat. Abstr. of Jp. |
| JP 61084379 A, Pat. Abstr. of Jp. * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109826768A (en) * | 2019-02-27 | 2019-05-31 | 哈尔滨工业大学 | A kind of low-power cylinder hall thruster of diamond wall surface |
| CN109826768B (en) * | 2019-02-27 | 2020-04-24 | 哈尔滨工业大学 | Cylindrical hall thrustor of low power of diamond wall |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19900437A1 (en) | 2000-10-26 |
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