DE19835641A1 - Hybrid element for electronic circuit has fixing legs at one end of hybrid board relatively displaced by flexure of hybrid board for insertion in openings in electronic circuit board - Google Patents

Abstract

The hybrid element has a hybrid board (12), mounted on the surface of the electronic circuit board (20) via fixing legs (15,16,17) at one end face of the hybrid board, which are relatively displaced by elastic deformation of the hybrid board, for fitting into corresponding openings (21,22,23) in the electronic circuit board.

Description

The invention relates to a hybrid element for an electrical Circuit arrangement, wherein the hybrid element is a hybrid board has at least one planar inductive Circuit element for the circuit arrangement is worn.

A planar transformer is known from DE 195 00 943 C1, that of two or more, with spirally printed Carrier plates provided primary or secondary windings Plastic is made. The carrier plates are underlay an electrically insulating layer sandwiched and provided with a magnetic core with a central leg protrudes through a central opening of the carrier plates, wherein each carrier plate has a printed winding on both surfaces has, the winding ends by means of a via are electrically connected in series. The carrier plates exist from a thin, flexible between 10 and 100 µm thick Plastic film on which the windings of the planar transformer are printed. For the electrical connection of the Planar transformers are connection lugs made of electrical conductive material provided by the carrier plates protrude and are bent in the manner of spider legs to in lateral distance to the winding surfaces of the Carrier plates to be connected electrically.

A planar transformer is known from DE 41 35 979 A1, which is a printed circuit board with parallel first and second surfaces, each on a spiral  guided windings of the planar transformer in the form of Conductor tracks are printed. The spiral windings are arranged around an opening in the circuit board which serves to accommodate a transformer core. To the arrangement of the planar transformer with the transformer core mechanically to stabilize, the planar transformer is converted into a DIP (dual Inline package) housing used, electrically with Lead frame parts of the housing connected and by filling of flexible epoxy resin material in the housing with this mechanically connected. The housing can then be used with the help conventional soldering techniques as a hybrid element with a Circuit arrangement can be connected. One against Vibrations or other attacks on the housing mechanical connection secured to a carrier of the Circuit arrangement, in particular for a motherboard, achieves the hybrid element through a plurality of electrical Contact feet, each on one of two each other opposite long sides of the housing with the carrier is soldered.

The attachment of hybrid elements for is also known Circuit arrangements, the hybrid element a Has hybrid board that carries a hybrid circuit, and wherein the hybrid board transverse to the course of the surface of a Motherboard of the circuit arrangement in a receiving opening the motherboard is inserted. At that in the receiving opening inserted mounting ends of the hybrid board are in a known manner, solder pads, the electrical connection serve the hybrid circuit and with electrical contacts Circuitry to be soldered to the motherboard. The mechanical strength of the connection between the Hybrid element and the motherboard is replaced by additional Fasteners such as metal brackets, elbows and Screws, guaranteed.

Finally, the arrangement of a hybrid board is also known, which is a planar, inductive circuit element, in particular carries a planar transformer on a motherboard, wherein  the hybrid board is approximately parallel to the mother board extends. The hybrid board is connected to each other opposite fastening ends through elbows and / or in the manner of the DIP housing described above connected to the motherboard. One can Receiving opening may be provided in the motherboard in the order Saving space is a magnetic core of the inductive Circuit element of the hybrid board protrudes. In this case The hybrid board at least covers the opening partially so that the attachment ends of the hybrid board opposite sides of the receiving opening with the Motherboard are connected.

For hybrid elements that have a planar inductive Circuit element, in particular a planar transformer have, there is a need for a particularly solid mechanical fastening of the hybrid element with a carrier a circuit arrangement to which the hybrid element to be connected. An essential reason for this is that usually a compared to electronic components much heavier magnetic core on the hybrid board of the Hybrid elements is attached. Especially at Shocks caused by the operation of engines and / or Machines can be transferred to circuit arrangements an insufficient mechanical attachment of the Hybrid elements to interrupt the electrical Connections between the circuit arrangement and the Hybrid circuit and / or malfunction of the Hybrid circuit lead. It is also possible that due to vibrations attached to the hybrid board Magnetic core loosens or loosens if no other mechanical Fasteners such as clips or glue are available are. In addition, magnetic cores with large Cross-sectional areas are used, i.e. magnetic cores, over a large area along the Circuit surfaces of the hybrid boards extend. This means that the hybrid board either in one Attachment area of great length with the support of the  Circuitry must be connected, or large Torques around the fastening area can be accepted need if the hybrid board only at one attachment end is connected to the carrier, that is, transverse to Surface extends. Installation across the surface of the Carrier or installation only on one Attachment end of the hybrid board, on the other hand, offers considerable advantages with an effective use of space for the overall circuit arrangement of the available space, because the third room dimension is also used.

Another reason for the need for a solid mechanical fastening of the hybrid element with a carrier a circuit arrangement lies in the mechanical stability, that during the making of the electrical connection between the hybrid board and the carrier, for example one Motherboard, must be present. For example, one such mechanical stability during a soldering process, especially necessary when driving through a solder bath.

The object of the present invention is a hybrid element of the type mentioned at the beginning, in a simple way mechanically connectable to a carrier of the circuit arrangement is. The simple assembly is said to be a stable mechanical Connection can be made, which also the mechanical Loads due to attached to the hybrid board Withstands magnetic cores.

The task is performed by a hybrid element with the characteristics of Claim 1 solved. Further training is the subject of dependent claims.

A key idea of the present invention is to one attachment end of the hybrid board, that of the attachment on a carrier of the circuit arrangement, a recess to provide through which a first and a second end region of the Hybrid board are spaced apart. Here are the first and the second end region under elastic deformation  the hybrid board relative to each other in a relative position bringable.

In particular, the deformation of the width of the recess changed, that is enlarged or reduced. Alternatively or in addition, at least one of the End areas in a direction transverse to the circuit surface the hybrid board moves. In the by elastic deformation achieved relative position of the end areas is the attachment insertable into a receiving opening of the carrier.

According to this key concept of the invention, the hybrid element be inserted into the receiving opening of the carrier and itself at least during the insertion process due to the elastic restoring forces that cause the deformation on the Clamp the edge or the edges of the receiving opening. The In this respect, the use of elastic forces of hybrid boards is surprisingly, as the board material commonly used is very stiff and therefore only slightly elastic Deformations allowed. Usage is common, for example of fiber-reinforced synthetic resin, in particular epoxy resin. The However, the invention is not limited to such materials. Rather, the hybrid board can also, for example, like initially described from the known from DE 195 00 943 C1 multilayer flexible plastic material, in particular Polyamide.

In its final insertion position, that is after the Hybrid board in the desired end position on the carrier has been brought about by bending the Restoring force generated by the hybrid board in various ways be used. One possibility is that the hybrid board itself in the final insertion position due to the elastic restoring forces clamped to the carrier. Alternatively or additionally, the restoring force can also do this be used that the hybrid board is partially or completely mechanically relaxed and thus a snap or snap connection to the carrier created  becomes. For example, a projection on the Snap the hybrid board into a snap-in holder on the carrier.

In a development of the hybrid element according to the invention however, the first end region points at one transverse to Inserting direction of the hybrid board extending board edge a snap-in recess into which the carrier under elastic Relaxation of the hybrid board is clickable. Especially an embodiment is preferred in which the Board edge with the snap-in recess an outer edge of the Hybrid board is. In this case it is sufficient if the Carrier has an uninterrupted receiving opening. The Hybrid board then needs, for example, during the insertion process only be elastically deformed so that the width of the Recess between the first and the second end area is reduced. In the final insertion position, or the position relaxes before reaching this position Hybrid board, with an area of the carrier in the Locking recess snaps into place.

The inventive design of a hybrid element with a planar inductive circuit element, it is possible a large one with little manufacturing effort Number of hybrid elements to be produced if required a carrier of a circuit arrangement, for example on a Motherboard of the circuit arrangement, are attached. The Hybrid elements can be used universally for different types of Circuit arrangements are designed, whereby the Number of pieces to be manufactured in the same design Circuit elements are increased and unit costs are reduced. It is also advantageous to use planar inductive Arrange circuit elements on hybrid elements because of this How to replace the circuit element easily possible is. Here, the invention offers special advantages because preferably also disassembly of the hybrid element is easily possible by turning under generation elastic restoring forces the hybrid circuit board is deformed to to remove them from the carrier. The disassembly takes place  especially damage and non-destructive, so that the Hybrid board is reusable. Specifically can for example, in the disassembled state of the hybrid board Magnetic core can be replaced or repaired. Still is it is advantageous to be able to disassemble the hybrid board if a hybrid circuit arranged on the hybrid board upgraded additional electronic components, or one such a hybrid circuit should be built later.

A further development of the hybrid element in which the hybrid board on a cross to the direction of insertion extending edge has an insertion recess into which the Carrier at least partially without elastic deformation of the Hybrid board is insertable to the mounting end then with elastic deformation of the hybrid board completely into the receiving opening of the carrier. By engaging the carrier in the insertion recess increased mechanical strength of the connection between the Hybrid board and the carrier created. Preferentially the carrier engages in the final insertion position the insertion recess that the hybrid board there the carrier is clamped or clamped.

In a further development, the insertion recess has one of seen from its open end on the edge, tapering Cross section on, so that the carrier, tilting the Hybrid board in its final insertion position, in the Insertion recess is insertable. For example, the Insertion recess on their front in the direction of insertion Beveled edge.

In one embodiment of the hybrid element according to the invention has the hybrid board at its mounting end in known Show an adjustment recess in which an adjustment element of the Carrier can be used to determine the relative position between the Carrier and the hybrid board to adjust. Such a well-known Adjustment recess, but not in the manner according to the invention bending of the hybrid board allows, in addition to  the recess can be provided, which bends the Hybrid board enables. Alternatively, the recess according to the invention used as the adjustment recess. For example, then in the final insertion position an additional fastener in the recess used to prevent accidental elastic deformation of the Prevent hybrid board and so the adjustment function of the To ensure recess. Additional fasteners but can also be used when the invention Recess is not used as an adjustment recess.

The hybrid board preferably carries at its fastening end at least one solder contact that with the inductive Circuit element is electrically connected and the one Pushing the hybrid board through the opening of the Carrier on the back of the carrier with the Circuit arrangement can be contacted by soldering. Is for example, the carrier a motherboard that the Circuit arrangement can advantageously first brought the hybrid element into its final insertion position and then the entire soldering of components the circuit arrangement and the soldering of the at least one Solder contact of the hybrid board with the circuit arrangement be made. A solder bath can be used in a known manner are used, in which the motherboard or Carrier and assembled hybrid element used respectively through which the motherboard is passed.

The at least one solder contact of the hybrid element is especially a so-called solder pad, which is on one side the one inserted into the receiving opening of the carrier Hybrid board extends in the direction of insertion. The soldering of the Soldering contact with the circuit arrangement causes an increased mechanical strength and thus additionally secures the mechanical connection between the hybrid board and the Carrier.  

An embodiment in which the at least one solder contact is made in such a way Inserting direction extending longitudinal section of the hybrid board that it extends to the front of the wearer, too means on the side from which the hybrid board into the Receiving opening of the carrier is inserted, is solderable. In particular, the receiving opening has one from the front continuous solder path made of solder material to the back of the carrier on so that a continuous solder connection can be achieved causes a particularly high mechanical strength. Moreover is the maximum allowable current over such electrical connection may flow, particularly high. It is particularly in terms of mechanical strength also cheap if both are opposite each other Circuit surfaces of the hybrid board, that is, on the large surfaces of the hybrid board, at least in each case one of the solder contacts is arranged.

For example, for contacting several windings Planar transformers, each in one of several Layers of the hybrid board are arranged, it is preferred that all solder contacts one on the outside of the Circuit surface of the hybrid board lying on winding same side of the hybrid board are arranged. A In any case, through-connection through the hybrid board is not required for the external windings. This on known arrangement of solder contacts offers for the However, the invention has the additional advantage that Solder a mechanical fixation of the hybrid board to the Carrier is effected. It is therefore preferable to both first end region and also at the second end region in each case arranged at least one solder contact. So in the soldered Condition of the hybrid board an undesirable elastic Prevents deformation of the hybrid board. Accordingly in the event of any disassembly of the hybrid element from the carrier first the solder connections of the solder contacts to the Circuitry interrupted before the hybrid element of the carrier can be removed.  

The recess according to the invention, the elastic deformation the hybrid board allowed and the at the mounting end of the Hybrid board is arranged, is preferably an elongated, slot extending approximately in the direction of insertion. Here expediently the length of the slot, its width at the attachment end and the width of the first end region of the fastening end dimensioned such that the first end region with elastic deformation of the hybrid board in contact with the second end area can be brought. When pressed together of the two end areas is therefore solely by the appropriate one Choice of dimensions by destruction of the hybrid board any excessive deformation is excluded.

The invention will now be described with reference to exemplary embodiments explained. In doing so, reference is made to the attached drawing taken. However, the invention is not based on this Embodiments limited. The individual figures of the Show drawing:

Fig. 1 shows a preferred embodiment of the hybrid element of the invention,

Fig. 2 shows a second embodiment of the hybrid element, just before the insertion into a receiving opening of a mother board,

Fig. 3 shows the elastic deformation of a hybrid board by deflecting an end region transverse to the circuit surface, and

Fig. 4 shows a magnetic core half for amplifying the magnetic flux through a planar inductive circuit element carried by the hybrid circuit board.

Fig. 1 shows a hybrid element 1 comprising a hybrid circuit board 2 carries the windings of a planar transformer, one of which lying on the surface of the hybrid shown hybrid circuit board 2 on the outside winding 3 is visible. Conductors can also be seen from the illustration, which are used for the electrical connection of the winding 3 , the other windings (not shown) and electronic components (not shown) of a hybrid circuit on the hybrid board 2 . The conductor tracks are led to transformer solder contacts 28 and to hybrid circuit solder contacts 29 , which are used for soldering with corresponding solder contacts on a motherboard, not shown. The conductor tracks leading to the solder contacts 28 , 29 are, with the exception of the two conductor tracks which serve for the electrical connection of the winding 3 , arranged in different layers of the hybrid circuit board than the winding 3 , the individual layers being electrically insulated from one another. The total of eight conductor tracks shown in the right half of the figure, which lead to the solder contacts 28 there, are each plated through a through hole 24 to other layers, not shown, of the hybrid circuit board. The other windings of the planar transformer are located in these layers.

The hybrid board 2 has three transformer core openings 9 a, 9 b, 9 c, which serve to accommodate a transformer core half with an E-shaped cross section, or to accommodate two such transformer core halves. In the former case, the E-shaped transformer core half extends through the transformer core opening 9 a, 9 b, 9 c to the other side of the hybrid board 2 . A second transformer core half is then arranged there, or is arranged there, which has a continuous, flat surface on its side facing the E-shaped half. However, the use of two E-shaped transformer core halves is preferred, so that both halves protrude into the transformer core openings 9 a, 9 b, 9 c and abut there at their abutting surfaces, the halves on each side of the hybrid board 2 , the distances between the transformer core openings 9 a, 9 b, 9 c bridging, rest on the circuit surfaces of the hybrid board 2 . In this way, the hybrid board 2 holds both transformer core halves securely when they are fastened to one another or to the hybrid board 2 , in particular are glued to one another.

At its fastening end, that is to say at the end which carries the solder contacts 28 , 29 , the hybrid circuit board has a total of three spaced-apart end regions. The first end region is formed by an end section of a bracket 5 on the outer edge shown on the right in FIG. 1. The bracket 5 is separated from the second end region by an elongated slot 8 which extends in the insertion direction and which is a first contact region with the right solder contacts 28 . Fig. 1 shows a mechanically relaxed state of the hybrid board 2. Furthermore, a second contact area 7 with the left solder contacts 28 and the hybrid circuit solder contacts 29 is provided, which is separated from the first contact area 6 by an adjustment recess 4 . The second contact area 7 extends to the left outer edge of the hybrid board 7 . An insertion recess 31 is provided there. A snap-in recess 30 is provided on the right outer edge of the hybrid board 2 , that is to say on the bracket 5 .

The hybrid board 2 can be inserted into a receiving opening of a support (not shown), the total receiving opening having a width which is equal to the width of the hybrid board 2 at its fastening end, minus the depth of the latching recess 30 and minus the depth of the insertion recess 31 . The receiving opening of the carrier is interrupted according to the position of the adjustment recess 4 at the fastening end of the hybrid board 2 . For example, there is a web that has approximately the same width as the adjustment recess 4 . The edges of the receiving opening of the carrier have a thickness which is approximately equal to the height of the latching recess 30 and the insertion recess 31 , that is to say their longitudinal extent in the direction of insertion.

When assembling the hybrid board 2 , the left edge of the receiving opening is first partially inserted into the insertion recess 31 , the hybrid board 2 not being inserted into the receiving opening on the right side of its fastening end. The hybrid board is tilted compared to its final insertion position. The bevels on the lower edge of the insertion recess 31 , which is at the front in the insertion direction, and on the left edge of the adjustment recess 4 are used . These bevels enable the hybrid board 2 to be inserted further into the receiving opening, the bracket 5 being pressed against the first contact area 6 by utilizing the elastic deformability of the hybrid board 2 , which is provided by the slot 8 . The bracket 5 also has a bevel at its right end, which is at the front in the insertion direction. Now the hybrid board 2 is gradually inserted further into the receiving opening, being slightly shifted to the left in the illustration of FIG. 1 and at the same time tilted in the direction of its final insertion position, that is to say brought into a position in which the right and the left Edge of the receiving opening lie in a plane parallel to the front edge of the fastening end. If this position is reached, the bracket 5 is released and consequently the hybrid board 2 relaxes in such a way that the right edge of the receiving opening engages in the latching recess 30 . A residual voltage may remain within the hybrid board 2 . In particular if particularly high mechanical loads, for example due to shaking movements, are to be expected, the assembly connection of the hybrid board 2 to the carrier (not shown) is secured by additional mechanical fastening elements. For example, angle elements, wedges and screws can be used. The solder connections of the solder contacts 28 , 29 to the circuit arrangement are then produced.

Fig. 2 shows a second embodiment of the hybrid element of the invention and a mother board 20 having a three-part receiving opening 21, 22, 23 has. The first part of the receiving opening is a bracket opening 21 for receiving a bracket 15 of the hybrid board 12 , the second part is a first contact area opening 22 for receiving the first contact area 16 of the hybrid board 12 , and the third part is a second contact area opening 23 for receiving the second contact area 17 of the hybrid board 12 . The bow opening 21 and the first contact area opening 22 are separated from one another by a first web 26 . The first contact area opening 22 and the second contact area opening 23 are separated from one another by a second web 27 . The second web 27 has approximately the same width as an adjustment recess 14 at the fastening end of the hybrid board 12 in order to precisely adjust the fastening connection between the hybrid board 12 and the mother board 20 with regard to their relative position.

Electronic hybrid circuit components 10 of a hybrid circuit, not shown, are arranged on the hybrid board 12 . Furthermore, in a manner similar to the hybrid board shown in FIG. 1, the hybrid board 12 carries a winding which is arranged around a magnetic core opening 19 , the winding, however, being part of a planar inductive circuit element. An electronic component 25 of the circuit arrangement on the motherboard 20 is represented. For the sake of clarity, further circuit elements and conductor tracks are not shown. Also not shown are solder contacts which are arranged on the fastening end of the hybrid board 12 on the first contact area 16 and on the two contact area 17 . Solder contacts are located both on the front circuit surface 13 of the hybrid circuit board 12 , which is visible in FIG. 2, and on the opposite, rear circuit surface 13 . The solder contacts, like the solder contacts 28 , 29 in FIG. 1, extend in the insertion direction over a longitudinal section which is greater than the thickness of the mother board at the receiving opening 21 , 22 , 23 . The solder contacts of the hybrid board 12 can therefore be soldered to both the top of the motherboard 20 and the bottom.

With reference to the illustration of FIG. 2, two variants of the mechanical fastening of the hybrid circuit board 12 will now be described which differ in terms of the width b _B of the first bar 26 of the mother board 20. A third variant is described below with reference to FIG. 3. In the first variant, the width b _{B is} greater than the width b _{S of} the slot 18 of the hybrid board 12 in the mechanically relaxed state. When mounting the hybrid board 12 , the bracket 15 and the first contact area 16 are therefore spread apart. Since no detent is provided in this embodiment, that is, the inserted state will remain in the assembled, the mechanical stress of the hybrid circuit board 12 obtained, that is the hybrid circuit board 12 clings to the edges of the first web 26 on the bracket opening 21 or on the first contact region opening 22 firmly.

In the second variant, the width b _{B of} the first web 26 is smaller than the width b _{S of} the slot 18 in the mechanically relaxed state of the hybrid board 12 . Therefore, the bracket 15 is to be bent during the assembly while reducing the width b _S in the direction of the first contact area 16 in order to be able to insert the hybrid circuit board 12 . Consequently, the hybrid circuit board 12 of the bracket opening clings in the assembled state due to a contact pressure on its right outer edge to the right edge 21 and due to a contact pressure at the right edge of the registration recess 14 on the left edge of the first contact region opening 22 on the mother board 20 fixed.

In a further variant, not shown here, in which the hybrid board 12 shown in FIG. 2 can also be used, the mother board has a receiving opening which is only divided into two. In contrast to the mother board 20 shown in FIG. 2, the angular opening and the first contact area opening form an uninterrupted, continuous area of the receiving opening, so that the first web 26 of the mother board 20 is therefore omitted. Furthermore, the width b _{A of} the continuous part of the receiving opening for receiving the bracket 15 and for receiving the first contact area 16 is smaller than the width b _KB in the relaxed state of the hybrid board 12 , the width b _KB being the sum of the widths of the first contact area 16 , the slot 18 and the bracket 15 . Consequently, in the assembled state, the hybrid board 12 clings in the same way as in the second variant, namely by contact pressure on the right edge of the adjustment recess 14 and by contact pressure on the right outer edge of the hybrid board 12 , on the outer edge of the bracket 15 .

Fig. 3 shows how the hybrid board 12 shown in Fig. 2 can be attached in a different way to a mother board 20 a. For this purpose, the bracket 15 is deflected in a direction transverse to the extent of the circuit surface 13 on which the hybrid circuit components 10 are arranged. Accordingly, the mother board 20 a has receiving openings, not shown, in order to receive the end regions of the hybrid board 12 in the deflected state. For the sake of clarity, however, the deflection of the bracket 15 in FIG. 3 is exaggerated. In practice, in particular when using fiber-reinforced epoxy resin as the circuit board material for the hybrid circuit board 12 , a substantially smaller deflection of the bracket 15 is sufficient to cause the clamps 20 a to be clamped when or after insertion into the receiving openings of the mother board.

In a variant of the type of fastening shown in FIG. 3, the hybrid board, similar to the hybrid board 2 shown in FIG. 1, has a latching recess and / or a projection for latching into a recess in the motherboard.

Fig. 4 shows a magnetic core half 40, which is used for example as a half of a transformer core, or as a half of a coil core for reinforcing the magnetic flux in the processes shown in Fig. 1 and Fig. 2 Hybrid elements. The magnetic core half 40 is preferably made of ferrite. As can be seen from FIG. 4, the magnetic core half 40 has an E-shaped cross section. A total of three legs 41 protrude from a cuboid area 45 corresponding to the E-shaped cross section. At the free ends of the legs 41 there are abutment surfaces 42 which, when the magnetic core is mounted, abut corresponding abutment surfaces of an opposite second magnetic core half. The circuit board material of the hybrid circuit board, which carries the magnetic core, is located between the legs 41 of the respective magnetic core half 40 . The thickness of the hybrid board and the length of the legs 41 are coordinated with one another in such a way that, in the assembled state, the contact surface 43 divided by the middle leg 41 , which lies on the underside of the cuboid region 45 shown in FIG. 4, rests on the circuit surface of the hybrid board and that the contact surface of the second magnetic core half also bears on the surface of the hybrid board opposite the circuit surface. The opposite surface can also be a circuit surface on which circuit components or circuit elements are arranged.

The magnetic core half 40 has a space-saving, flat configuration in which the cuboid region 45 can be mounted flat and over a large area on the circuit surface. For this purpose, in the assembled state, the distance between the outer surface 44 of the cuboid area 45 , which lies opposite the contact surface 43 , is smaller than the width and considerably smaller than the length of the outer surface 44 .

Exemplary embodiments were described with the aid of the drawing, where the hybrid board each approximately perpendicular to Motherboard is mounted. In special cases, especially with limited space perpendicular to the surface of the Motherboard can also the hybrid board under one angle other than 90 °, for example at an angle of  Mounted 30 to 60 ° across the surface of the motherboard become.

Reference list

1

Hybrid element

2nd

;

12th

Hybrid board

3rd

Winding

4th

;

14

Adjustment recess

5

;

15

hanger

6

;

16

first contact area

7

;

17th

second contact area

8th

;

18th

slot

9

a-

9

c Transformer core opening

10th

Hybrid circuit component

13

Hybrid circuit surface

19th

Magnetic core opening

20th

,

20th

a motherboard

21

Bow opening

22

first contact area opening

23

second contact area opening

24th

Through hole

25th

Main circuit component

26

first footbridge

27

second bridge

28

Transformer solder contact

29

Hybrid circuit solder contact

30th

Snap-in recess

31

Insertion recess
b _A

Width of the opening for the bow and the first contact area
b _B

Width of the first web
b _KB

Total width of the first contact area, slot and bracket
b _p

Slot width

40

Magnetic core half

41

leg

42

Butt surface

43

Contact surface

44

Outside surface

45

cuboid area

Claims (16)

1. Hybrid element ( 1 ) for an electrical circuit arrangement ( 25 ), the hybrid element ( 1 ) having a hybrid circuit board ( 2 ; 12 ) from which at least one planar inductive circuit element for the circuit arrangement ( 25 ) is worn, characterized in that the Hybrid board ( 2 ; 12 ) at a fastening end for fastening to a carrier ( 20 ) of the circuit arrangement ( 25 ) has a recess ( 8 ; 18 ) through which a first ( 5 ; 15 ) and a second ( 6 ; 16 ) end region of the Hybrid board ( 2 ; 12 ) are spaced from each other, and that the first ( 5 ; 15 ) and the second ( 6 ; 16 ) end region can be moved relative to one another with elastic deformation of the hybrid board ( 2 ; 12 ) and can thus be brought into a relative position, in which the fastening end can be inserted into a receiving opening ( 21 , 22 , 23 ) on the carrier ( 20 ). 2. Hybrid element according to claim 1, characterized in that the first end region ( 5 ) on a transverse to the insertion direction of the hybrid board ( 2 ) extending edge of the board has a latching recess ( 30 ) into which the carrier can be latched with elastic relaxation of the hybrid board ( 2 ) is. 3. Hybrid element according to claim 2, characterized in that the edge of the board is an outer edge of the hybrid board ( 2 ). 4. Hybrid element according to one of claims 1 to 3, characterized in that the hybrid element ( 2 ) on an edge extending transversely to the insertion direction has an insertion recess ( 31 ) into which the carrier, at least partially, without elastic deformation of the hybrid board ( 2nd ) can be inserted in order to then insert the fastening end ( 4 ) completely into the receiving opening with elastic deformation. 5. Hybrid element according to claim 4, characterized in that the insertion recess ( 31 ), seen from its open end at the edge, has a tapering cross section, so that the carrier, tilting the hybrid board ( 2 ) into its final insertion position, can be introduced. 6. Hybrid element according to one of claims 1 to 5, characterized in that the recess ( 8 ; 18 ) at the fastening end of the hybrid board ( 2 ; 12 ) is an elongated slot extending approximately in the insertion direction. 7. Hybrid element according to claim 6, characterized in that the length of the slot, its width (b _S ) at the fastening end and the width of the first end region ( 5 ; 15 ) are dimensioned such that the first end region ( 5 ; 15 ) under elastic deformation of the hybrid board ( 2 ; 12 ) can be brought into contact with the second end region ( 6 ; 16 ). 8. Hybrid element according to one of claims 1 to 7, characterized in that the hybrid circuit board ( 2 ; 12 ) has at its fastening end an adjustment recess ( 4 ; 14 ) into which an adjustment element ( 26 ) of the carrier ( 20 ) can be used to adjust the relative position between the carrier ( 20 ) and the hybrid board ( 2 ; 12 ). 9. Hybrid element according to one of claims 1 to 8, characterized in that the hybrid plate (2) carries at least one solder contact (28) on its fastening end which is electrically connected to the planar inductive circuit element and the after passing inserting the hybrid circuit board (2) through the receiving opening of the carrier on the rear side of the carrier is electrically contactable by soldering. 10. Hybrid element according to claim 9, characterized in that the at least one solder contact ( 28 ) extends over an extending in the insertion direction longitudinal section of the hybrid board that it can also be soldered to the front side of the carrier. 11. Hybrid element according to claim 9 or 10, characterized in that at least one of the solder contacts is arranged on both mutually opposite circuit surfaces ( 13 ) of the hybrid circuit board ( 12 ). 12. Hybrid element according to one of claims 1 to 11, characterized in that the hybrid board ( 2 ; 12 ) has at least one core opening ( 9 a, 9 b, 9 c; 19 ) for receiving a magnetic core. 13. Hybrid element according to claim 12, characterized in that the hybrid board carries a magnetic core having two E-shaped magnetic core halves ( 40 ) in cross section, the three legs ( 41 ) of the E-shaped magnetic core halves ( 40 ) at their ends abutting surfaces ( 42 ), on which they are in contact with the abutting surfaces of the other magnetic core half, and in each case at least one leg ( 41 ) of the two magnetic core halves ( 40 ) is received in the at least one core opening of the hybrid board. 14. Hybrid element according to claim 13, characterized in that the magnetic core halves ( 40 ) each have an approximately cuboid area ( 45 ) from which the three legs ( 41 ) protrude, and that the cuboid area ( 45 ) on the circuit surface of the hybrid board or abuts on the opposite side of the hybrid board with a contact surface ( 43 ), the outer surface ( 44 ) of the cuboid area ( 45 ) opposite the contact surface ( 43 ) at a distance from the circuit surface or from the opposite surface of the hybrid board, which is smaller than the width and the length of the outer surface ( 44 ). 15. Hybrid element according to one of claims 1 to 14, characterized in that the first ( 5 ; 15 ) and the second ( 6 ; 16 ) end region can be brought into the relative position relative to one another while changing the recess width (b _S ). 16. Hybrid element according to one of claims 1 to 15, characterized in that the first ( 15 ) and the second ( 16 ) end region relative to each other with movement in a direction transverse to a circuit surface ( 13 ) of the hybrid board ( 12 ) can be brought into the relative position are.