DE19758057C1 - Antenna fabrication method for IC card - Google Patents

Abstract

The method involves applying a thin metal film (2) to a plastics substrate (1) to form contact sections (5) for active electronic components. The components are mounted in an opening (3) in the substrate and tested. The conductive tracks and/or antenna coils are produced and resonant circuits are fine-tuned by laser trimming or mechanical machining of the metal film. An underlay or overlay cover film or layer is applied.

Description

The invention relates to a method for producing a Module for a conductor track arrangement, in particular antennas arrangement, for a contactless or contactless and contact affected IC card.

With contactless or with so-called combination cards becomes the one required for wireless information transmission So far, antenna coil by etching a copper surface on a Carrier material generated. In addition, it is known to be thin Embed copper wires in a plastic carrier film or ver by gluing to the surface of the plastic carrier tie.

The problem in the above cases is the manufacture lungs-side effort, with the card manufacturer itself Possibility of fine tuning the trained coil or Changing the layout is no longer possible. difficulties there are also such prefabricated handling finished semi-finished products.

For matching thin film resistors, for example arranges by depositing resistance materials on one Ceramic carrier, e.g. B. for hybrid circuits, is the application known as laser trimming. Here is under simultaneous Determining the resistance value of a laser beam with the upper surface of the thin film coating in such a way that a change in the  Resistance value through material removal until reaching the Setpoint.

DE 196 09 134 A1 describes a method for the production a data carrier with an electronic module known. According to the solution there, the data carrier includes one integrated circuit a coupling connected to this element, e.g. B. an antenna coil for communication with external Devices. On the procedural side, a carrier is first prepared provides, at least partially with an electrically conductive Layer is provided. This is followed by manufacturing the coupling element from the conductive layer by separation, Removing or converting layer material with touching or non-contact mechanical means. After this Step is the integrated circuit on the carrier arranged and connected conductively to the coupling element. Finally, the integrated circuit is covered circle with a support layer. The conductive layer becomes Working out the coupling element, for example with a Machined laser or with a mechanical cutting tool.

From the above, it is an object of the invention, a Ver drive to manufacture a module with a conductor track arrangement tion, in particular antenna arrangement, for a contactless or contactless and contact IC card to indicate that it allowed to create and close interconnects in a simple manner structure and at the same time a prefabrication allow electronic components, in particular Semiconductor chips or so-called chip modules with one. Plastic carriers can be connected and electrical Connections to a conductor track layer with tested Contact quality is available.

Furthermore, according to the invention on the basis of the specified Process a prefabrication of the components plastic carrier, active electronic components and trace, in particular Antenna arrangement, are created, the final product center the final electrical configuration, in particular  antenna tuning can be done inexpensively can.

The object of the invention is achieved with a Ver drive as it is in each of the independent claims 1 or 2 is described. The subclaims include at least expedient refinements and developments of the in the Claims 1 and 2 specified teaching.

According to a first procedural implementation of the invention is on a known plastic carrier for the Production of an IC card a thin metallic foil, e.g. B. applied by lamination. This film already has Kon clock sections for active electronic components, esp in particular a semiconductor chip or a chip module.

The next step is assembly of the active electronic components so that electrical connections to the contact sections of the metal lische film can be produced. If so the active electronic components on a module are located, the module has contact counter-sections that face at least partially over the contact sections of the film are opaque. A half on the module conductor chip is most preferably in one Opening of the plastic carrier added, so that the overall height of the IC card body can be kept low.

Additionally or alternatively there is the possibility that elek trical connections not only between the contact counter sections and the contact sections, but also between the end faces of the semiconductor chip and the opening sides surfaces of the plastic carrier can be produced.

The assembled electronic components are now one simple function test for checking the Subjected to contact connection and it follows generating the conductor track or antenna coil arrangement and  a necessary tuning of the resonance circuit Laser trimming or by mechanical abrasion parts of the metallic foil. This step will according to the task, preferably at the location of the final producer realized a suitable trimming device.

The product thus obtained is then in the usual way with a Overlay or underlay, d. H. with a cover sheet or a Cover layer or a lower cover layer cohesively mechanically connected, here using known laminating techniques can be used.

In a second embodiment of the invention, the thin metallic foil is not a through hole, but is closed large area on the surface of a plastic Carrier applied, only the plastic carrier openings to accommodate active electronic components, esp includes special semiconductor chips.

According to the invention, according to the second embodiment Insert the active electronic components with their Contact sides towards the bottom of the film into the opening made of the plastic carrier.

After this insertion or insertion of the active electro African components in the opening of the plastic carrier the goal of a minimum thickness of the ultimately to be manufactured IC card body are electrical connections between corresponding contact sections of the electronic compo with the clear through the opening in the plastic carrier laid base of metallic foil by local limited Soldering or the like generated.

The thin metallic foil that had existed up to that point is only becoming after the introduction of the electronic component (s) and the electrical connection to the foil structured by conductors tracks, isolated sections and the actual antennas  coil structure by laser trimming or mechanical ablation is produced.

Accordingly, a prefabrication of the plastic carrier with elec trically contacted electronic components, wherein the actual conductor track only at the location of the final producer or antenna coil arrangement can be formed. By the up given electrical short circuit of the electronic Components are used especially when using MOS semiconductor Components are destroyed by static influences Top-ups in the manufacturing, transport or storage process locked out.

The procedure according to the second embodiment is especially when using so-called CSP (chip size Package) semiconductor components with relatively large areas Surface contact sections advantageous.

After creating the trace or antenna coil assembly and the manufacture of isolated sections in the area between the electrical connections and a resonance circuit fine tuning by laser trimming or the like is a integral mechanical connection of the semi-finished product with an overlay and / or underlay layer, d. H. with a upper or lower cover film, e.g. B. by lamination performed.

From the above it can be seen that essential to the invention the application of a thin metallic foil to one Plastic carrier is, the latter being part of a card body forms.

At the location of the final or finished producer, the actual Liche coil arrangement in the manner of a laser trim from the Metal foil material are burned out. In contrast to Known are in the described method Antenna arrangements can be generated up to the gigahertz range,  with an antenna fine tuning to achieve optimal Resonance properties at the final producer becomes possible.

The handling of those coated with the metallic foil Plastic backing materials is not critical, especially compared to the known, already finished antenna coils arrangement by thin copper wires the risk of Damage is reduced.

Furthermore, the described method enables the connection the metallic foil with active electronic components, especially semiconductor chips, so that the final producer otherwise complex technology is required Steps can be omitted. Depending on the application, the Final producers only the structuring of the conductor track to form isolated sections and / or the antennas made coil arrangement and it can be a handling of uncut semiconductor chips are eliminated.

The proposed measures can be considered a standard intermediate for the formation of contactless or con tactless contact IC cards are created, the final functionality by means of structuring the Electrical activation made of metal foil becomes. Because the active electronic components, in particular semiconductor chips at least partially in one Opening of the plastic carrier is included desired minimum thickness of the IC card can be achieved.

The invention is based on exemplary embodiments and under Figures are explained in more detail below.

Here show:

Figs. 1a to d are views for explaining the process sequence in a first embodiment and

FIGS. 2a-c guide for a corresponding view illustrating the process sequence in a second corner.

According to Fig. 1 is assumed in the first embodiment, first of a plastic support 1, which is continuously coated with a thin, approximately 20 microns thick metallic film 2, and in particular sondere of copper. As shown in Fig. 1b Darge, openings 3 are introduced into the sandwich structure thus formed, which serve to accommodate electronic components 4 ( Fig. 1c). The metallic foil 2 has contact sections 5 which are electrically connected to contact counter sections 6 .

The electronic components shown in FIG. 1 can comprise, for example, a chip carrier 4.1 with a semiconductor chip 4.2 fastened thereon. When inserting the chip carrier 4.1 , which receives the semiconductor chip 4.2 , quasi facedown into the opening 3 , the contact sections 5 or the contact counter sections 6 come into connection and can be soldered by targeted application of thermal energy or connected by conductive adhesive.

After a functional test of the electrical connections has been carried out, the metallic film 2 is structured at the location of the final producer to form conductor tracks, in particular an antenna coil arrangement and a resonant circuit fine tuning, preferably by laser trimming or other mechanical removal of corresponding parts of the metallic film 2 . the process of trimming, that is the removal of metallic foil is shown in Fig. 1d symbo lisch.

An electron beam can also be used for fine adjustment Find laser light.

In addition to the contacting step according to FIG. 1c, there is the possibility of specifically forming an electrical connection between the exposed end faces 2.1 of the metallic foil 2 and corresponding opposite sections of the semiconductor chip 4.2. In particular, with such an electrical contact a higher Kon contact security is achieved when bending and other Ver wind forces in use of the IC card.

Characterized in that with the exception of the covered contact sections 5 by the full-surface formation of the metallic foil 2 after contacting the active electronic components 4, there is an electrical short circuit, the risk of destruction of semiconductor devices based on MOS circuits Static electricity or the like excluded, so that further protective measures can be omitted.

In the embodiment according to FIG. 2, a plastic carrier 1 , which preferably already has openings 3 , is provided with a metallic foil 2 which covers the openings 3 mentioned.

The active electronic components 4 , in the example shown a semiconductor chip with surface contacts, are introduced with these contacts ahead into the openings 3 , the corresponding contacts, for. B. come in the form of so-called contact bumps on the exposed back of the metallic foil 2 to the system. An electrical connection between the contact bumps, which, for. B. are provided with a solder, and corresponding sections of the metallic foil 2 made. The actual electrical structuring of the metallic foil 2 takes place only at the location of the final producer together with the formation of a conductor track or antenna arrangement by laser trimming or mechanical removal of corresponding areas of the metallic foil 2 , as symbolized with FIG. 2c.

Instead of the soldering technique mentioned, a contact can also be made through the metered application of conductive adhesive in the area of ent speaking contact surface can be produced.

As in the first embodiment, the elek remains trically contacted semiconductor device short-circuited, so that sensitive MOS components in the storage and handling process on the way and at the final producer before static Discharges and thus destruction are protected.

The standard product created in the above manner becomes according to the desired functions only with the final product activated and quasi activated by not only the Antenna arrangement for a contactless card is generated, but also insulating sections on the metallic foil out in the area of the surface contacts of the semiconductor chips are formed so that the semiconductor device in question desired electrical functions can perform.

After the structuring of the metal The film was made to the desired extent applying cover foils, d. H. the arrangement of a Overlay and underlay layer so that the final IC Card trains. To protect the active electronic Components are the coating on the top and bottom preferably done by minimal thermal lamination.

Reference list

1

Plastic carrier

2nd

metallic foil

3rd

openings

4th

active electronic components

5

Contact sections

6

Contact counter sections

2.1

End faces

4.1

Chip carrier

4.2

Semiconductor chip

Claims (5)

1. Method for producing a module with a conductor track arrangement, in particular antenna arrangement, for a contactless or contactless and contact-based IC card with the following steps:

• 1. Large-area application of a thin metallic foil on the surface of a plastic carrier which forms part of the IC card body, the metallic foil having contact sections for active electronic components;
• 2. Mounting an active electronic component in an opening of the plastic carrier and the metallic foil and establishing a contact connection with the Kontaktab sections of the metallic foil;
• 3. functional tests of the assembled electronic component and checking of the contact connection;
• 4. Generation of the conductor track and / or antenna coil arrangement and resonant circuit fine tuning by laser trimming or mechanical removal of corresponding parts of the metallic foil, preferably at the location of the final producer and
• 5. Cohesive mechanical application of an underlay and overlay cover film or cover layer.

2. Method for producing a module with a conductor track arrangement, in particular antenna arrangement, for a contactless or contactless and contact-based IC card with the following steps:

• 1. large-area application of a thin metallic foil on the surface of a plastic carrier which forms part of the IC card body;
• 2. Inserting active electronic components, in particular special semiconductor chips, into an opening of the plastic carrier;
• 3. electrical connection of the semiconductor chip with the exposed through the opening in the plastic carrier side of the metallic foil;
• 4. Generating the conductor track and / or antenna coil arrangement and producing isolated sections in the area between the electrical connections and resonance circuit fine tuning by laser trimming or mechanical removal of corresponding parts of the metallic foil, preferably at the location of the final producer and
• 5. Cohesive mechanical application of an underlay and overlay cover film or cover layer.

3. The method according to claim 1 or 2, characterized, that as a metallic foil a self-adhesive thin, in essential 20 µm thick copper foil is used. 4. The method according to claim 1 or 2, characterized, that for fine adjustment an electron beam for structuring the metallic foil or a corresponding metallic Layer is used. 5. The method according to any one of the preceding claims, characterized, that the active electronic components, in particular Semiconductor chips, contact bumps for contacting the thin have metallic foil.