DE19754821A1 - Verfahren und Vorrichtung für eine PVD-Beschichtung - Google Patents
Verfahren und Vorrichtung für eine PVD-BeschichtungInfo
- Publication number
- DE19754821A1 DE19754821A1 DE19754821A DE19754821A DE19754821A1 DE 19754821 A1 DE19754821 A1 DE 19754821A1 DE 19754821 A DE19754821 A DE 19754821A DE 19754821 A DE19754821 A DE 19754821A DE 19754821 A1 DE19754821 A1 DE 19754821A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- anode
- voltage
- potential
- target cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 66
- 239000011248 coating agent Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 120
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000889 atomisation Methods 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 abstract description 15
- 239000013077 target material Substances 0.000 abstract description 13
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 210000002381 plasma Anatomy 0.000 description 31
- 239000007789 gas Substances 0.000 description 29
- 150000002500 ions Chemical class 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012071 phase Substances 0.000 description 7
- 239000010406 cathode material Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910010037 TiAlN Inorganic materials 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19754821A DE19754821A1 (de) | 1997-04-14 | 1997-12-10 | Verfahren und Vorrichtung für eine PVD-Beschichtung |
| JP54347198A JP4792571B2 (ja) | 1997-04-14 | 1998-04-09 | Ｐｖｄコーティング装置 |
| AT98924109T ATE224963T1 (de) | 1997-04-14 | 1998-04-09 | Verfahren und vorrichtung für pvd beschichtung |
| EP98924109A EP0975818B1 (en) | 1997-04-14 | 1998-04-09 | Method and device for pvd coating |
| DK98924109T DK0975818T3 (da) | 1997-04-14 | 1998-04-09 | Fremgangsmåde og anordning til PVD belægning |
| PCT/EP1998/002100 WO1998046807A1 (en) | 1997-04-14 | 1998-04-09 | Method and device for pvd coating |
| ES98924109T ES2184265T3 (es) | 1997-04-14 | 1998-04-09 | Procedimiento y dispositivo de revestimiento por pvd. |
| DE69808267T DE69808267T2 (de) | 1997-04-14 | 1998-04-09 | Verfahren und vorrichtung für pvd beschichtung |
| US09/402,961 US6352627B2 (en) | 1997-04-14 | 1998-04-09 | Method and device for PVD coating |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19715535 | 1997-04-14 | ||
| DE19754821A DE19754821A1 (de) | 1997-04-14 | 1997-12-10 | Verfahren und Vorrichtung für eine PVD-Beschichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19754821A1 true DE19754821A1 (de) | 1998-10-15 |
Family
ID=7826463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19754821A Ceased DE19754821A1 (de) | 1997-04-14 | 1997-12-10 | Verfahren und Vorrichtung für eine PVD-Beschichtung |
| DE69808267T Expired - Lifetime DE69808267T2 (de) | 1997-04-14 | 1998-04-09 | Verfahren und vorrichtung für pvd beschichtung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69808267T Expired - Lifetime DE69808267T2 (de) | 1997-04-14 | 1998-04-09 | Verfahren und vorrichtung für pvd beschichtung |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4792571B2 (ja) |
| DE (2) | DE19754821A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008060838A1 (de) | 2008-12-05 | 2010-06-10 | Zounek, Alexis, Dr. | Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens |
| WO2017077106A1 (de) | 2015-11-05 | 2017-05-11 | Bühler Alzenau Gmbh | Vorrichtung und verfahren zur vakuumbeschichtung |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023027480A (ja) * | 2021-08-17 | 2023-03-02 | 株式会社東芝 | プラズマ源及びスイッチ装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0230384B2 (ja) * | 1985-04-05 | 1990-07-05 | Hitachi Ltd | Supatsutahohooyobisochi |
| JPH0834002B2 (ja) * | 1988-07-15 | 1996-03-29 | 三菱化学株式会社 | 磁気記録媒体の製造方法 |
| JPH02225665A (ja) * | 1989-02-27 | 1990-09-07 | Fuji Electric Co Ltd | マグネトロンスパッタ装置 |
| ATE195354T1 (de) * | 1992-02-27 | 2000-08-15 | Hauzer Ind Bv | Verbesserungen von verfahren der physikalischen dampfphasen-abscheidung |
-
1997
- 1997-12-10 DE DE19754821A patent/DE19754821A1/de not_active Ceased
-
1998
- 1998-04-09 JP JP54347198A patent/JP4792571B2/ja not_active Expired - Lifetime
- 1998-04-09 DE DE69808267T patent/DE69808267T2/de not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008060838A1 (de) | 2008-12-05 | 2010-06-10 | Zounek, Alexis, Dr. | Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens |
| WO2017077106A1 (de) | 2015-11-05 | 2017-05-11 | Bühler Alzenau Gmbh | Vorrichtung und verfahren zur vakuumbeschichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69808267D1 (de) | 2002-10-31 |
| JP2001518982A (ja) | 2001-10-16 |
| DE69808267T2 (de) | 2003-03-06 |
| JP4792571B2 (ja) | 2011-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8127 | New person/name/address of the applicant |
Owner name: CEMECON AG, 52146 WUERSELEN, DE |
|
| 8131 | Rejection |