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DE19732433A1 - Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern - Google Patents

Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern

Info

Publication number
DE19732433A1
DE19732433A1 DE19732433A DE19732433A DE19732433A1 DE 19732433 A1 DE19732433 A1 DE 19732433A1 DE 19732433 A DE19732433 A DE 19732433A DE 19732433 A DE19732433 A DE 19732433A DE 19732433 A1 DE19732433 A1 DE 19732433A1
Authority
DE
Germany
Prior art keywords
wafer
edge
cloth
semiconductor wafer
polishing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19732433A
Other languages
English (en)
Inventor
Akira Kawaguchi
Shigeru Kimura
Akihito Yanoo
Masao Takada
Shoji Tsuruta
Shigeo Kumabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Silicon Corp
Original Assignee
Mitsubishi Materials Silicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19909596A external-priority patent/JP3605233B2/ja
Priority claimed from JP20748196A external-priority patent/JP3649531B2/ja
Priority claimed from JP20748396A external-priority patent/JP3618476B2/ja
Priority claimed from JP5661597A external-priority patent/JPH10249690A/ja
Priority claimed from JP11488897A external-priority patent/JP3649550B2/ja
Priority claimed from JP11488797A external-priority patent/JP3685903B2/ja
Application filed by Mitsubishi Materials Silicon Corp filed Critical Mitsubishi Materials Silicon Corp
Publication of DE19732433A1 publication Critical patent/DE19732433A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE19732433A 1996-07-29 1997-07-28 Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern Withdrawn DE19732433A1 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP19909596A JP3605233B2 (ja) 1996-07-29 1996-07-29 半導体ウェーハの面取り面研磨方法および装置
JP20748196A JP3649531B2 (ja) 1996-08-06 1996-08-06 半導体ウェーハの面取り面研磨装置
JP20748396A JP3618476B2 (ja) 1996-08-06 1996-08-06 半導体ウェーハの面取り面研磨装置
JP20748296 1996-08-06
JP20748096 1996-08-06
JP5661597A JPH10249690A (ja) 1997-03-11 1997-03-11 半導体ウェーハの面取り面研磨装置
JP11488897A JP3649550B2 (ja) 1996-08-06 1997-05-02 半導体ウェーハの面取り面研磨装置
JP11488797A JP3685903B2 (ja) 1996-08-06 1997-05-02 半導体ウェーハの面取り面研磨装置

Publications (1)

Publication Number Publication Date
DE19732433A1 true DE19732433A1 (de) 1998-02-12

Family

ID=27572474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732433A Withdrawn DE19732433A1 (de) 1996-07-29 1997-07-28 Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern

Country Status (2)

Country Link
US (1) US5989105A (de)
DE (1) DE19732433A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111906671A (zh) * 2019-05-08 2020-11-10 三星显示有限公司 用于制造显示装置的制造装置和制造显示装置的方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3130000B2 (ja) * 1997-09-04 2001-01-31 松下電子工業株式会社 半導体ウェハ研磨装置及び研磨方法
JP2000040679A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd 半導体集積回路装置の製造方法
IT1303721B1 (it) * 1998-11-09 2001-02-23 Romeo Toniolo Dispositivo automatico di sostituzione delle mole abrasive nellemacchine previste per la profilatura e lucidatura di manufatti
DE10029351C1 (de) * 2000-06-15 2001-09-13 Wacker Siltronic Halbleitermat Poliertrommel
US6638145B2 (en) * 2001-08-31 2003-10-28 Koninklijke Philips Electronics N.V. Constant pH polish and scrub
US6585567B1 (en) 2001-08-31 2003-07-01 Koninklijke Philips Electronics N.V. Short CMP polish method
DE102005034120B4 (de) * 2005-07-21 2013-02-07 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102009011622B4 (de) * 2009-03-04 2018-10-25 Siltronic Ag Epitaxierte Siliciumscheibe und Verfahren zur Herstellung einer epitaxierten Siliciumscheibe
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
DE102009030294B4 (de) 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
DE102009038941B4 (de) 2009-08-26 2013-03-21 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102009051008B4 (de) * 2009-10-28 2013-05-23 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010005904B4 (de) * 2010-01-27 2012-11-22 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010013520B4 (de) 2010-03-31 2013-02-07 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102010014874A1 (de) 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102011005512A1 (de) 2011-03-14 2012-01-19 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
JP6300441B2 (ja) 2012-12-27 2018-03-28 スリーエム イノベイティブ プロパティズ カンパニー 円形支持板、不織布研磨ロール、ロール組立体及び研磨方法
DE102013210057A1 (de) 2013-05-29 2014-12-04 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
DE102013212850A1 (de) 2013-07-02 2013-09-12 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
DE102015215624A1 (de) * 2015-08-17 2017-02-23 Schaeffler Technologies AG & Co. KG Verfahren zur Herstellung von Lagerkomponenten mittels einer Fertigungsstraße, Fertigungsstraße und Fertigungsanlage
US20230321696A1 (en) * 2022-04-07 2023-10-12 Ebara Corporation Substrate processing system and substrate processing method
CN115179136B (zh) * 2022-07-07 2023-08-15 常州顺钿精密科技有限公司 一种晶圆片自动倒角机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094037A (en) * 1989-10-03 1992-03-10 Speedfam Company, Ltd. Edge polisher
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
JP2628424B2 (ja) * 1992-01-24 1997-07-09 信越半導体株式会社 ウエーハ面取部の研磨方法及び装置
JP2598661Y2 (ja) * 1992-07-16 1999-08-16 信越半導体株式会社 回転割出式ウエーハ面取部研磨装置
JP3027882B2 (ja) * 1992-07-31 2000-04-04 信越半導体株式会社 ウエーハ面取部研磨装置
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111906671A (zh) * 2019-05-08 2020-11-10 三星显示有限公司 用于制造显示装置的制造装置和制造显示装置的方法
US12010902B2 (en) 2019-05-08 2024-06-11 Samsung Display Co., Ltd. Manufacturing apparatus and method of manufacturing display apparatus using the same

Also Published As

Publication number Publication date
US5989105A (en) 1999-11-23

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination