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DE19719449A1 - Electrical connection method for circuit boards - Google Patents

Electrical connection method for circuit boards

Info

Publication number
DE19719449A1
DE19719449A1 DE19719449A DE19719449A DE19719449A1 DE 19719449 A1 DE19719449 A1 DE 19719449A1 DE 19719449 A DE19719449 A DE 19719449A DE 19719449 A DE19719449 A DE 19719449A DE 19719449 A1 DE19719449 A1 DE 19719449A1
Authority
DE
Germany
Prior art keywords
circuit boards
circuit board
connecting element
electrical connection
connection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19719449A
Other languages
German (de)
Inventor
Joerg Dipl Ing Nagel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19719449A priority Critical patent/DE19719449A1/en
Publication of DE19719449A1 publication Critical patent/DE19719449A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The connection method is used between two partial printed circuit boards (1b,2b), together providing a complete circuit board and uses a flexible connection element (3) to bridge the separation point between the partial circuit boards, before these are separated from one another. The connection element can be provided by a surface-mounted component attached to the surfaces of both partial circuit boards at spaced points from the separation point and allowing the partial circuit boards to be positioned one above the other after separation.

Description

Die Erfindung betrifft ein Verfahren zur elektrischen Verbindung von Leiterplatten und eine Gesamtleiterplatte, die aus mindestens zwei, voneinander lösbaren Teilleiterplatten besteht.The invention relates to a method for electrical Connection of printed circuit boards and an overall printed circuit board from at least two detachable partial circuit boards consists.

In elektronischen Geräten sind meist Leiterplatten untergebracht, auf denen die elektrischen bzw. elektronischen Schaltungen realisiert sind. Oftmals sind für die Unterbringung der elektronischen Schaltung im zur Verfügung stehenden Gerätevolumen mehrere Leiterplatten erforderlich.Printed circuit boards are usually used in electronic devices housed on which the electrical or electronic Circuits are realized. Often are for Housing the electronic circuit in the available standing device volume several circuit boards required.

Die einzelnen Leiterplatten sind untereinander elektrisch verbunden, beispielsweise durch Federkontakte, starre Stecksysteme, Kabel mit Stecksystemen, angelötete oder geschweißte Kabel. Die Verbindungen können auch durch flexible Leiterplatten realisiert sein.The individual circuit boards are electrical with each other connected, for example by spring contacts, rigid Plug systems, cables with plug systems, soldered or welded cables. The connections can also be made through flexible circuit boards can be realized.

Diese Verbindungstechniken erfordern zunächst die Herstellung der einzelnen Leiterplatten mit Bestückung, Lötung und Zuschnitt. Weiter müssen die Verbindungselemente wie Stecker und Buchsen auf die Leiterplatte aufgebracht und verlötet werden. Danach sind die einzelnen Verbindungselemente der Leiterplatten miteinander elektrisch zu kontaktieren. Diese Technik erfordert viele Arbeitsschritte bei den einzelnen Herstellern der Leiterplatten. Die Kosten und der Aufwand für die Stecker- und Buchsensysteme sind hoch und die Automatisierungsfähigkeit beim nachträglichen Anschluß von Verbindungskabeln gering.These joining techniques first require manufacturing of the individual circuit boards with assembly, soldering and Cutting. Furthermore, the connecting elements such as plugs and sockets applied to the circuit board and soldered will. After that, the individual connecting elements are the To contact circuit boards electrically with each other. This Technology requires many work steps for the individual PCB manufacturers. The cost and effort for the plug and socket systems are high and that Automation capability when connecting Connection cables low.

Der Erfindung liegt die Aufgabe zugrunde, den Aufwand für die Verbindung von Leiterplatten zu reduzieren.The invention has for its object the effort for Reduce connection of circuit boards.

Diese Aufgabe wird erfindungsgemäß für ein Verfahren durch die im Patentanspruch 1 und für eine Gesamtleiterplatte durch die im Patentanspruch 4 angegebenen Merkmale gelöst. This object is achieved according to the invention for a method the in claim 1 and for an overall circuit board solved the features specified in claim 4.  

Die Erfindung ermöglicht die einfache und kostengünstige Herstellung von elektrischen Verbindungen zwischen Leiterplatten, die insbesondere in einem gemeinsamen Gehäuse untergebracht sind.The invention enables simple and inexpensive Establishing electrical connections between Printed circuit boards, in particular in a common housing are accommodated.

Im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels beschrieben.In the following the invention with reference to one in the drawing illustrated embodiment described.

Dabei zeigen:Show:

Fig. 1 eine Gesamtleiterplatte, und Fig. 1 is a total circuit board, and

Fig. 2 die in zwei Teilleiterplatten geteilte Gesamtleiter­ platte. Fig. 2 plate divided into two sub-circuit boards.

Gemäß der Erfindung werden die für ein elektronisches Gerät erforderlichen einzelnen Leiterplatten als Teile einer Gesamtleiterplatte bearbeitet.According to the invention, the for an electronic device required individual circuit boards as parts of a Machined entire circuit board.

In Fig. 1 ist eine solche Gesamtleiterplatte 1a, 2a dargestellt, die aus den noch mechanisch miteinander verbundenen Teilleiterplatten 1a und 2a besteht. Die einzelnen Teilleiterplatten 1a und 2a sind beispielsweise durch eingeritzte Vertiefungen auf der Gesamtleiterplatte 1a, 2a voneinander getrennt, und können beispielsweise voneinander losgebrochen werden. Die Trennung der Teilleiterplatten 1a und 2a geschieht vorzugsweise mechanisch.In FIG. 1, such an overall printed circuit board 1 a, 2 a is shown, which from the still mechanically interconnected conductor plates 1a and 2a consists. The individual sub-circuit boards 1 a and 2 a are separated from one another, for example, by incised depressions on the entire circuit board 1 a, 2 a, and can be broken apart from one another, for example. The separation of the circuit boards 1 a and 2 a is preferably done mechanically.

Zur elektrischen Verbindung der Teilleiterplatten 1a und 2a ist ein Verbindungselement 3 vorgesehen. Das Verbindungselement 3 ist erfindungsgemäß flexibel ausgebildet, und ist durch eine Lötstelle 4 mit der Teilleiterplatte 1a durch eine Lötstelle 5 mit der Teilleiterplatte 2a elektrisch kontaktiert. Erfindungsgemäß werden elektrische Verbindungselemente 3 beispielsweise im Rahmen des Bestückungsvorganges auf die Gesamtleiterplatte 1a, 2a aufgebracht. Die Verbindungselemente 3 können auch als oberflächenmontierbare Bauteile ausgebildet sein. A connecting element 3 is provided for the electrical connection of the circuit boards 1 a and 2 a. The connecting element 3 is flexible according to the invention, and is electrically contacted by a solder joint 4 with the partial circuit board 1 a through a solder joint 5 with the partial circuit board 2 a. According to the invention, electrical connecting elements 3 are applied, for example, to the overall printed circuit board 1 a, 2 a during the assembly process. The connecting elements 3 can also be designed as surface-mountable components.

Das flexible Verbindungselement 3 kann beispielsweise durch eine flexible Leiterplatte, durch ein Koaxialkabel oder durch einzelne Kabel oder Drähte realisiert sein.The flexible connecting element 3 can be realized, for example, by a flexible printed circuit board, by a coaxial cable or by individual cables or wires.

Nach der Bestückung, und insbesondere nach der elektrischen Verbindung der Teilleiterplatten 1a und 2a erfolgt eine Trennung der Teilleiterplatten 1a und 2a. Diese Trennung ist beispielsweise durch Brechen von Sollbruchstellen, Ausstanzen oder Ausschneiden von Teilen aus der Gesamtleiterplatte 1a, 2a möglich. Die flexiblen Verbindungselemente 3 lassen nach der Trennung die gewünschte Positionierung der Teilleiterplatten 1a und 2a zu. Durch dieses erfindungsgemäße Vorgehen können alle bzw. nahezu alle für ein Gerät notwendigen Leiterplatten in einem Schritt bestückt werden. Für das Aufbringen der Verbindungselemente 3 und die Schaffung der elektrischen Verbindung ist kein zusätzlicher Arbeitsgang notwendig.After the assembly, and particularly after the electrical connection of the conductor plates 1 a and 2 a separation takes place of the conductor plates 1a and 2a. This separation is possible, for example, by breaking predetermined breaking points, punching out or cutting out parts from the entire printed circuit board 1 a, 2 a. The flexible connecting elements 3 allow the desired positioning of the partial circuit boards 1 a and 2 a after separation. With this procedure according to the invention, all or almost all of the circuit boards required for a device can be assembled in one step. No additional operation is necessary for the application of the connecting elements 3 and the creation of the electrical connection.

In Fig. 2 sind die jetzt voneinander getrennten Teilleiterplatten 1b und 2b dargestellt, die ihre vorgegebene Position in einem nicht näher dargestellten Gerät eingenommen haben, und über das flexible Verbindungselement 3 miteinander verbunden sind.In FIG. 2, now separated from one another conductor plates 1 b and 2 b are shown, which have assumed their predetermined position in a not-shown device, and are interconnected by the flexible connecting element 3.

Claims (6)

1. Verfahren zur elektrischen Verbindung von Leiterplatten (1b, 2b)
bei dem auf eine, aus mindestens zwei voneinander lösbaren Teilleiterplatten (1b, 2b) bestehende Gesamtleiterplatte (1a, 2a) ein die Teilleiterplatten (1b, 2b) elektrisch verbindendes, flexibles Verbindungselement (3) aufgebracht wird, und
bei dem anschließend die Gesamtleiterplatte (1a, 2a) in die Teilleiterplatten (1b, 2b) aufgeteilt wird.1. Method for the electrical connection of printed circuit boards ( 1 b, 2 b)
wherein on one of at least two from each other detachable conductor plates (1 b, 2 b) existing overall circuit board (1 a, 2 a) the conductor plates (1 b, 2 b) electrically connecting flexible connecting element (3) is applied, and
in which the entire circuit board ( 1 a, 2 a) is then divided into the sub-circuit boards ( 1 b, 2 b). 2. Verfahren nach Anspruch 1, bei dem das Verbindungselement (3) als bestückbares Bauelement aufgebracht wird.2. The method according to claim 1, wherein the connecting element ( 3 ) is applied as a component that can be fitted. 3. Verfahren nach Anspruch 2, bei dem das Verbindungselement (3) als oberflächenmontierbares Bauelement aufgebracht wird.3. The method according to claim 2, wherein the connecting element ( 3 ) is applied as a surface-mountable component. 4. Gesamtleiterplatte (1a, 2a), bestehend aus mindestens zwei voneinander lösbaren oder voneinander gelösten Teilleiterplatten (1b, 2b), gekennzeichnet durch ein die Teilleiterplatten (1b, 2b) elektrisch verbindendes, flexibles Verbindungselement (3).4. Overall circuit board ( 1 a, 2 a), consisting of at least two detachable or detached sub-circuit boards ( 1 b, 2 b), characterized by a flexible connecting element ( 3 ) electrically connecting the sub-circuit boards ( 1 b, 2 b). 5. Gesamtleiterplatte (1a, 2a) nach Anspruch 4, dadurch gekennzeichnet, daß das Verbindungselement (3) als bestückbares Bauelement ausgebildet ist.5. Overall circuit board ( 1 a, 2 a) according to claim 4, characterized in that the connecting element ( 3 ) is designed as a component which can be fitted. 6. Gesamtleiterplatte (1a, 2a) nach Anspruch 5, dadurch gekennzeichnet, daß das Verbindungselement (3) oberflächenmontierbar ausgebildet ist.6. Overall circuit board ( 1 a, 2 a) according to claim 5, characterized in that the connecting element ( 3 ) is surface-mountable.
DE19719449A 1997-05-07 1997-05-07 Electrical connection method for circuit boards Withdrawn DE19719449A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19719449A DE19719449A1 (en) 1997-05-07 1997-05-07 Electrical connection method for circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19719449A DE19719449A1 (en) 1997-05-07 1997-05-07 Electrical connection method for circuit boards

Publications (1)

Publication Number Publication Date
DE19719449A1 true DE19719449A1 (en) 1998-11-12

Family

ID=7828994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19719449A Withdrawn DE19719449A1 (en) 1997-05-07 1997-05-07 Electrical connection method for circuit boards

Country Status (1)

Country Link
DE (1) DE19719449A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1017643C2 (en) * 2001-03-20 2002-09-23 Fci Mechelen N V Electrical device and method for connecting the cable thereto.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1061862B (en) * 1957-04-29 1959-07-23 Fuba Fabrikation Funktechnisch Device for electrically connecting a plurality of parallel electrical connections
DE3105488A1 (en) * 1981-02-14 1982-12-30 Brown, Boveri & Cie Ag, 6800 Mannheim Electrical multiple connection of a circuit arrangement which is constructed on a plurality of printed-circuit boards located at an angle with respect to one another

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1061862B (en) * 1957-04-29 1959-07-23 Fuba Fabrikation Funktechnisch Device for electrically connecting a plurality of parallel electrical connections
DE3105488A1 (en) * 1981-02-14 1982-12-30 Brown, Boveri & Cie Ag, 6800 Mannheim Electrical multiple connection of a circuit arrangement which is constructed on a plurality of printed-circuit boards located at an angle with respect to one another

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1017643C2 (en) * 2001-03-20 2002-09-23 Fci Mechelen N V Electrical device and method for connecting the cable thereto.
EP1244177A1 (en) * 2001-03-20 2002-09-25 Fci Electrical device and method for connecting a cable to the same

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8141 Disposal/no request for examination