DE19637214C2 - Method for producing an electrical and mechanical connection of a module inserted in a recess of a card holder of a chip card - Google Patents

Description

The invention relates to a method for producing an electrical and mechanical connection of one in a recess of a card carrier a chip card used module using a hot or Melt adhesive.

Chip cards for contact-based but also contactless d. H. inductive Data transmission has a chip connected to the card body card module on the one on a plastic carrier Semiconductor chip includes, which with contact cards with a galvanic contact field is connected. Be in a card reader these contact areas are electrically scanned so that the required commu nication becomes possible.

In contactless, inductive systems, data is transmitted by alternating electromagnetic fields by means of at least one in the chip card or induction coil arranged in the card carrier.

In so-called combination cards, both systems mentioned above are in one Card united. The combination card therefore has both a contact field for contact-based transmission as well as via an inductive coupling close contact. For this it is necessary, in addition to the electrically conductive Connections from the semiconductor chip to the system for the contact-based Data transmission also connections to the system for inductive data to establish transmission.

To solve this problem, it has already been proposed that the electrical conductive connections between the connection points and the means for the Non-contact data transmission using an anisotropically conductive adhesive manufacture. This anisotropically conductive adhesive has electrically conductive Particles that distribute the adhesive evenly during manufacture be added. The amount of conductive particles in the adhesive should be so  be chosen that between the connection points and the means for con tactless data transmission z. B. a corresponding contact field There are enough antenna particles to provide sufficient electrical Establish connection of appropriate contact quality.

In the method described above, the electrically conductive Connection occurs in that the anisotropically conductive adhesive at least in the area of the connection points and under the connection points of the agent applied for contactless data transmission and the adhesive compressed so far under pressure at least in the area of the connection points is that an electrically conductive bridge d. H. a current path between the Connection points and the means for contactless data transmission are formed becomes. In the case of the above-mentioned adhesive with electrically conductive Particles this leads to the particles in the area between the connection provide and quasi compacted the means for contactless data transmission so that the individual particles are mutually and touch joints so that the conductive connection results.

Usually, the module provided with a semiconductor chip is inserted into an in implanted the card holder recess, for this purpose on a Gluing process using a hot or hot melt adhesive (hot melt Procedure) is used.

For the production of combination cards, the module mentioned is with a additional contact level provided with the connection points for the agent for contactless data transmission, e.g. B. electrically connect a coil are. This electrical connection should, if possible, be carried out in one operation the mechanical connection of the module based on the recess in Card carriers can be realized. The existing in the card carrier z. B. Copper wire coil leads to connection points when manufacturing the Recess for the module z. B. partially exposed by milling. With such an arrangement, the assembly and gluing of the Module with the card carrier simultaneously with the manufacture of the electrical conductive connection between the means for contactless data transmission supply and the connection points of the module if the anisotropically conductive adhesive covering essentially the entire surface of the Card carrier recess is applied and for a corresponding Care is taken of temperature and pressure.  

However, it is disadvantageous to apply the anisotropically conductive adhesive over the entire Apply touch surface, because the adhesive is expensive, which makes Cost increases result, on the other hand optimal electrical connection often with insufficient adhesive connection or adhesion between The module and card carrier go hand in hand. In addition, for the Kompri Mieren the conductive components of the anisotropic adhesive higher pressure forces needed to perform a secure hot glue connection in the same dimensions are not necessary.

DE 44 41 931 C1 shows a chip card that has a plastic card body has, in which a semiconductor chip is arranged. The arrangement there focuses on a contact card. Specifically, the semiconductor chip according to DE 44 41 931 C1 initially comprising a contact tab Conductor carrier glued and then electrically bonded to the Contact flags connected. By overmolding the chip including the A protective housing is formed in bond wires. The so ent standing plastic body with contact flags provided there is in known way punched out of a frame and now by means of a Multi-layer adhesive glued into a card pocket on the card. The Multilayer adhesive is said to have a medium flexible layer that is at Bending load of the chip card unwanted power transmission to the actual contact area prevented or absorbs such forces. open beard is also the use of a heated mold stamp as well Forming the adhesive in tape form. It remains open, however, like electrical Contacts are to be formed if a contactless or a combination card is to be manufactured.

DE 28 31 984 A1 is based on electrical connections between two separate circuits applied electrical circuits. Concrete it is about flexible printed circuit boards that are equipped with LSI circuits are contacting. The use of an electrically conductive is disclosed Hot melt adhesive between limited contact areas of a circuit pattern, being in addition to improving physical strength electrically non-conductive hot melt adhesive can be used.

In the method of preparing hot glue connection assemblies according to US 5,041,183 it is a combination of conductive and not conductive adhesive with anisotropic properties for use in a Connection of electrical means.  

EP 0 671 705 A2 relates to a manufacturing process for the production of contact or contactless cards, where there is a module with a Semiconductor chip pre-assembled and in a recess in a card body is used.

When inserting the module into the recess of the card body opposite contact surfaces are electrically connected in the usual way, without advantages in terms of keeping a solder joint area free of mechanical stresses or forces are present.

From the above, it is therefore an object of the invention to provide a method for Establishment of an electrical and mechanical connection for in chip card modules to be used, which is a sufficient long-term Stability enables, in particular mechanical bending forces in the daily use of the chip card should be recorded without the contact security of the electrical elements in the chip card is pregnant.

The object of the invention is achieved with a method according to the Features of claim 1.

The subclaims include expedient refinements and further formations of the invention.

To establish an electrical and mechanical connection between a a recess of a card carrier of a chip card used module is placed on a non-conductive hot or hot melt adhesive layer, this hot or melt adhesive layer in the area of electrical contacts to be trained between the module and card carrier with an additional conductive layer or with conductive capable particles. This additional conductive layer or the Conductive particles can be created by perforating the hot or hot melt adhesive layer followed by backfilling using conductive material be formed.

The hot or hot melt adhesive layer prepared in this way with conductive Sections are then on the module or in the recess of the card carrier prefixed. This fixing is done so that the additional conductive Layer or the conductive particles provided sections between  the contact surfaces of the module and the recess of the card carrier are located. Following this fixing, a single pressure Temperature exposure step both the mechanical connection between Module and card carrier as well as the electrical contact between the opposing contact surfaces realized.

According to the invention, it is not necessary that, as a rule, based on the mentioned connection area only small contact area sections essential contribute to the adhesive bond, rather optimized electrical should Properties such as low line inductances or a low over gearing resistance can be achieved. By the usual hot or Hot melt adhesive connection is used for sufficient compression and compression tion of the conductive particles, so that the desired Long-term contact stability results.

In the case when according to the invention for the conductive particles on a Solder paste or a solder ball can be used by defined Supply of heat energy in the contact area after or during the Gluing the module in the card carrier is done soldering, which results in a there is a further increase in contact security. The solder joint is in in this case of mechanical stresses, shear or other forces kept clear, as these will stick to the card even when the card is in use connection can be established over a large area.

According to the invention, depending on the material of the card carrier or Module a suitable pre-assembled hot or hot melt adhesive selected and with regard to layer thickness and selection of the conductive particles individually prepared for the respective application and thus optimized become.

The conductive particles or the conductive layer are on the hot or Hot melt adhesive film, for example by means of a dispenser, a roller or a stamp can be applied locally, if necessary on a mask can be used so that the reproducibility at Application of conductive coatings increased. In the case of the surface side application of a conductive layer or conductive particles in one embodiment of the invention, the layer thus applied briefly exposed to thermal treatment, so that a certain Melting of the respective particles and thus sticking and connecting with the  Hot glue or the hot melt adhesive is the result. This measure will ensures that the conductive layer or the conductive material is protected against unwanted removal.

Since the hot or hot melt adhesive layer recesses or Has perforations with conductive particles such as solder balls or solder paste backfilled, customary and proven solder can be used become. The dosage of the amount of particles to be introduced into the recess Holes or perforations are not critical as there is excess material during soldering and / or pressing and simultaneous gluing into the adhesive layer can be displaced without affecting the overall contact security is pregnant.

All in all, the invention succeeds in producing a method an electrical and mechanical connection one in a recess to specify a card carrier of a chip card used module, wherein on the one hand, use known hot or hot melt adhesives can and on the other hand both high quality electrical contacts or electrical connections can be realized and the required mechanical strength of the module is given in the card carrier without operating shear or other forces on the contact act rich.

The method according to the invention is in particular for contactless chip cards or combi cards are suitable, in which both mechanically contact animal contact surfaces as well as inductive components are available. By using the hot or modified according to the invention Hot melt adhesive films can reduce the cost of card making as it is not necessary to conduct expensive anisotropic conduction Fall back on adhesives that are used to glue the modules to the Card carriers are only suitable to a limited extent:

Due to the only partial electrical connection to the respective electrical Contact points have enough space to carry out the fabric conclusive adhesive connection to secure the module in the card carrier Fasten.

The invention will be described below using an exemplary embodiment Figures are explained in more detail.  

Here show:

FIG. 1 is a section through a hot-melt adhesive film;

Fig. 2 is a plan view of a prepared hot melt film;

Fig. 3 shows a section through a hot melt film with conductive particles and inside

Fig. 4 is a basic sectional view of the installation position of the module in the recess of a card carrier using the connecting means according to the embodiment.

The section shown in FIG. 1 through a hot melt film has a carrier film 1 which is coated with a hot or hot melt adhesive 2 . The layer thickness is between 20 and 80 µm, depending on the card material such as ABS, PVC, PC or PET different adhesives are used.

The prepared hot or hot melt adhesive shown in FIG. 2 has perforations 3 for receiving the chip as well as laterally arranged sections 4 which consist of or contain a conductive layer or of conductive particles 16 .

These sections 4 can, for example, be perforations or recesses which have been filled with solder paste. As can be seen from FIG. 2, the hot or hot melt adhesive 2 located on a carrier film 1 is made up. The module 10 ( FIG. 4) provided with a chip 11 can be attached to this blister-like film strip in order to then position the module 10 provided with the carrier film 1 and hot or hot-melt adhesive 2 in this way towards the recess 12 of a card carrier 13 in a next operation ( Fig. 4).

In a further embodiment, solder balls with a through knife of 25 µm selectively applied to the hot or hot melt adhesive layer brings, so that in a subsequent pressure-temperature process both Solder connection between the opposing contact surfaces below Use of the solder ball as well as the adhesive connection between the module and Card carrier can be realized.  

In the case of the hot-melt or hot-melt adhesive 2 shown in FIG. 3, it has a layer 5 of conductive particles located on the inside. In the case when the configuration according to FIG. 3 is used, raised contact surfaces on the module or on the card carrier are able to displace the hot or hot melt adhesive which changes into the semi-liquid state during the pressure-temperature treatment step, and so on to come into active connection with the conductive particles of the inner layer, whereby the desired contact is formed.

Which comprises using the Fig. 4, which shows a schematic sectional view through a card carrier 13 has a recess 12, the method will now be described for compound preparation.

The provided with the prepared hot or hot melt adhesive layer 2 module 10 , which comprises a chip 11 , z. B. positioned by means of a suitable work tool in the recess 12 .

Contact surfaces 14 , which are connected to an induction coil for contactless data transmission, are located on the inner upper surface side of the recess 12 . The hot or hot melt adhesive in layer 2 heats up by exerting a compressive force in the direction of the arrow and by the action of temperature. At the same time, the conductive particles 16 , which are located in the sections 4 or in the layer 5 , establish an electrical connection between the contact surfaces 14 and the opposite contact surfaces 15 of the module. When the adhesive cools and hardens, there is both a secure mechanical connection of the module 10 in the recess 12 of the card carrier 13 and a corresponding electrical connection between the contact surfaces 14 and 15 . In the case when, for example, solder paste is introduced into recesses or holes in the hot or hot melt adhesive 1 , this serves to implement the electrical connection between the opposing contact surfaces 14 and 15 .

In a further exemplary embodiment, when using a solder ball in the adhesive film, during or after the pressure-temperature action step, additional heat can be applied locally in the area of the contact surfaces 14 and / or 15 , so that the desired soldering process is carried out.

From the exemplary embodiments described above it is clear that the conductive particles or the conductive layer both inside the Hot adhesive film can be located, as well as applied on the surface is. A fixing of a layer applied on the surface or of Particles arranged on the surface can be caused by brief heat treatment take place, whereby the corresponding particles on the adhesive adhere. For the heat treatment, for example, a heated one Roller, which is passed over the film, are used, the Roller can also be used to apply the conductive particles.

LIST OF REFERENCE NUMBERS

1

support film
2. Hot or hot melt adhesive

3

Hole for chip

4

sections

5

inner layer

10

module

11

chip

12

recess

13

card Cage

14

Contact areas for card carriers

15

Contact area module

16

conductive particles

Claims (3)

1. A method for producing an electrical and mechanical connection of a module used in a recess of a card body of a chip card using a hot or hot melt adhesive, wherein
recesses or perforations are made in the non-conductive hot or hot-melt adhesive layer on a film-like carrier in the area of the electrical contacts to be formed between the module and the card body, which are filled with conductive solder particles,
the hot or hot melt adhesive layer thus prepared is then fixed to the module or in the recess of the card body, the sections provided with the conductive solder particles being located between the contact surfaces of the module and the recess of the card body and
Furthermore, in a pressure-temperature action step, both the mechanical connection between the module and the card body and the electrical contacting, the latter being realized by soldering. 2. The method according to claim 1, characterized in that suitable depending on the given material of the card body and the module Hot or hot melt adhesive selected and this in terms of their layer thickness and selection of the conductive solder particles for the respective application be individually prepared. 3. The method according to claim 1 or 2, characterized in that the conductive solder particles locally using a dispenser, roller or stamp, optionally applied by means of a mask, whereby simultaneous or subsequent brief heat treatment the solder Particles or the layer components are adhesively bonded to the adhesive layer become.