DE19620194A1 - Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers - Google Patents

Abstract

The arrangement involves covering the conductive tracks or buses. This covering is arranged in the form of conductive strips and/or flat elements at a spacing of approx. 1.5 mm. The covering covers both sides of the bus. The respective component groups are connected at least at their corner points or their side edges, ti the GND system. Preferably the covering is provided as SMD components using surface mounting technology or using plug assembly the covers have pin type GND terminals. The covers may be formed as bridges made of several rectangular thin metal plates.

Description

The invention relates to the reduction or blocking electromagnetic radiation from printed circuit boards or other carriers of electronic circuits u. a. by measure participated in the layout.

Printed circuit boards or other carriers of electronic circuits conditions due to the switching processes of your digital electronic circuits high frequency electromagnetic Blast waves. The frequency of the radiation lies in MHz to GHz range. Particularly high radiation values generate fast, high frequency (MHz) periodically working digital circuits, in particular circuits, which contain microcomputers.

Furthermore, the function of digital circuits Disturbances threatened by field and line couplings act from outside.

Through regulations on electromagnetic compatibility (EMC) limits are set for devices. To the of Legislators are required to comply with the limit values Device manufacturers determined on the devices or assemblies EMC measures required.

There are a variety of shielding and protection measures Filtering known. Measures taken directly on circuit boards specifically applied to the layout are still on the Beginnings.

One measure that is carried out on printed circuit boards is  the sheet-like formation of mass (M), supply voltage (V) and shield (S) conductors (hereinafter MVS ladder tracks). By using wide conductor strips the resistance and inductance decrease for the switching processes of the nanosecond range digital integrated circuits (IC). With that the high-frequency interference voltages along the MVS system, are the source of the electromagnetic radiation, decreased.

With multilayer printed circuit boards (multilayer), there is no Rules for structuring the MVS lines known are a closed area of M, V or S over the entire circuit board extends (GND / Vcc tarpaulin).

One or two layer circuit boards are closed This situation is not feasible and the widening of MVS lines have practical limits. The available The area of the circuit board must be between signal lines and MVS lines can be divided. In places with high signal levels density, such as microcomputer IC, are usually only narrow Lines for MVS possible.

In practice, this can be achieved through closer internal meshing the MVS conductor tracks with the help of wire jumpers a little improvement can be achieved.

According to which rules the meshing of GND or the Design of the areas must be carried out Not yet known to experts; will be positive results reached by accident. At the moment are in multilayer PCBs closed the entire PCB its ground plane (GND tarpaulin) and supply voltage surfaces (Vcc tarpaulin) arranged. This closed Surfaces do not always offer sufficient protection. At two-layer or single-layer printed circuit boards are assumed  out that the emission and immunity problem cannot be solved by means of the layout alone.

According to the state of the art, further measures can only be taken the interfaces to the circuit board (filter) or outside the circuit board z. B. be performed as a shield.

The object of the invention is therefore to provide effective means Preference to reduce electromagnetic radiation beat that directly on printed circuit boards and especially on Layout are applicable and specific design features contain.

This object is achieved by Basic arrangements that in the claims 1, 2, 5, 10, 12 and 15 are specified. Developments of the invention are contained in the subclaims.

The surface of bus line systems is particularly strong in the emission of electromagnetic waves leap The signal lines of a digital module are if they are with cyclic or periodic signal changes high frequency (MHz) are applied, source for elec tromagnetic interference emissions.

The signal lines (conductor lines) and integrated Circuits (IC) of an assembly are to be separated into:

• 1. inactive lines (tracks) and IC
  These conductor tracks / IC are loaded with low frequencies (KHz) and have no part in the emission.
• 2. active lines (tracks) and IC
  These conductor tracks / IC are loaded with high frequencies (MHz) and thus have a share in the emission of interference. Such lines can be realized by: bus systems of microcomputers, clock lines, etc.

The active lines are referred to below as BUS net, even if it is only a line in special cases acts. Furthermore, two-layer circuit boards went out; a single-ply or a there are more than two-layer printed circuit boards.

The solution according to the invention is below for various designs or arrangements of BUS-GND systems described.

In a first version, the BUS is embedded in GND tet, d. H. it is completely covered with GND areas and limited, see Claim 1.

The following design features apply here: Inactive ladder trains are run separately from the bus.

The BUS is on the bottom of the two-layer conductor map (L-side) closely summarized and from possible thin conductor lines formed, which are a short distance to each other; the technological limit be aimed for.

On the second layer of the two-layer circuit board, so on the top (B side), the BUS with GND is behind sets. The GND areas overlap the BUS at the side Mostly so far that vias are arranged can. In the following this deposit is called BUS-GND designated. Of course, the B-side and L-side can also be used the arrangement described above interchanged in an analogous manner be carried out.

A GND conductor line is laid on both sides of the BUS, which limits the BUS with GND. This ladder train is in referred to as GND encapsulation.  

The BUS-GND and the GND enclosure are with through contact tations connected. The contact distance is approx. less than or equal to 20 mm.

Such an arrangement is hereinafter referred to as BUS-GND system.

More complicated ones are built on this arrangement Orders on.

A second version concerns intersections and branches conditions of BUS-GND systems. It arises when there are two above-described BUS-GND systems cross, or if shows a system.

In the intersection or branching zone of the BUS results an opening A-A-A-A, in which the BUS is not on any layer GND is covered. Such openings are sources of Interference emissions.

To supply the opening according to the invention Corner points X of the opening over the GND systems of both layers Vias connected.

The opening must be kept as small as possible, cheap Dimensions are less than or equal to 5 mm x 10 mm, cf. Claims che 2 and 3.

In principle, this circuit measure can also be used for Reduction of interference emissions at intersections of BUS-GND systems with inactive tracks can be used. Thereby are inactive outside the BUS-GND system Ladder train no measures required. Furthermore, widened the GND encirclement in the area of the opening be, s. Claim 4.

A third embodiment of the measures according to the invention  concerns the connection of IC to the BUS-GND system, s. Claims 5 and 6.

The IC range is if not the following GND arrangements be complied with, a source of interference; Features of these GND arrangements are:

• - The IC area is stored with GND and with the BUS-GND system connected.
• - The IC area receives a GND enclosure.
• - The GND deposit and the GND enclosure should Lead at least 1 cm beyond the IC area. This area is called the GND edge (R).
• - Both GND systems (deposit and enclosure) are in Distances of about 20 mm with vias connect. Key points Z and tongues are to be contacted animals.
• - Both connected systems of deposit and enclosure are referred to as the IC-GND system.
• Openings as described in the second embodiment, can be included in the IC GND system. Around openings To keep small, enclosing lines can also under half of the IC.
• - If additional GND systems (IC, BUS) are connected to the IC GND system can connect, the function of the edge (R) through this Areas are taken over.
• - The IC GND system can use the Leave the edge.

A fourth and fifth embodiment of the invention Arrangement and interconnection of GND areas affects the Use of bridges.

Once bridges are used to close the openings to reduce.

The openings described after the second embodiment  that arise at intersections of the BUS, can, if they are too big or a large number small If there are openings, this can lead to interference emissions. With means of the layout there is often no reduction in Dimensions or reduction in the number of openings possible Lich. This can be remedied by covering the openings Bridges.

To do this, place a metal plate (bridge) over the opening arranged that there is at least two against the opening overhanging overlying pages, see Claim 8.

The bridge with the GND system conductively connected. The connection is made e.g. B. after the reflow soldering process. For this purpose, the Have a GND system connection pad.

In this way, the bridge closes the opening A-A-A-A or split them into two openings A-B-B-A and B-A-A-B.

On the other hand, bridges can use the GND system (IC or BUS) complete.

In practice, high conductor density and compli adorned conductor runs no closed GND rear after the first execution and none sufficient small openings after the second version in the BUS area will be realized. In this case the GND system can be used several bridges are added so that they are sufficiently small Openings arise, see Claim 9.

In a 6th embodiment to solve the invention The task will be short-circuit compensation elements with its loop plane perpendicular to the circuit board level arranged. The compensation elements consist of the Compensation ladder and at least two webs with  are connected to the circuit board's GND system. In a The distance from 1 to 5 cm parallel to the circuit board is rod-shaped or flat compensation conductor arranged. The compensation conductor is part of a short-circuit ring.

The short circuit ring is made up of the compensation conductor, at least two conductive bars and the GND system of PCB or another conductive bridge on the Printed circuit board formed. The conductive webs are vertical right on the circuit board and contact on one side GND and on the other hand the compensation conductor. Of the Entire compensation ladder or only a section can can be used as part of the short-circuit ring, s. claim 10th

The part of the short circuit on the circuit board ringes can be formed by GND or a conductor strip will.

The compensation conductor has the function of an antenna, which is fed by two bridges and which the antennas kung the printed circuit board at least partially compensated.

The above compensation elements for printed circuit boards can used in a smaller version for single IC will. Passive IC compensation elements can with GND be connected, active with one from the auxiliary energy supply of the IC tapped electricity, cf. Claim 12. The compensation element can consist of one or several compensation conductors, which are above or are arranged next to the IC. With shared compensation The ends for the IC application are electrical connected; they are at a distance of 0.5 to 10 mm arranged above the circuit board or next to the IC, cf. Claim 13.

The arrangement of short-circuit ring structures can be done with  a 7th version on more than two-layer circuit boards (Multilayer) transfer. Have such circuit boards a closed GND and Vcc tarpaulin. This consists of a metallic, largely closed GND layer (Area A) and Vcc location (area B) by an iso overlap separately.

Effective arrangements result (see claim 14) if the short circuit ring level perpendicular to the circuit board level is placed in the area of the GND and Vcc tarpaulin. Of the Short circuit ring is about 2 to 10 cm on the top and Bottom of the GND / Vcc tarpaulin system using the conductor C and / or D guided and closed with vias sen. The short-circuit ring from GND and Vcc iso or connected to one of the two potentials be built. It is essential that the through contact through holes through the metallic layers become, d. H. not next to the metallic layers A, B. be classified. To guide the short-circuit rings over Areas and lines of different potentials too can realize instead of vias Block capacitors are used. Active areas of the GND / Vcc tarpaulins come with a chain of shorting rings includes. Active areas are those that are above or below the GND / Vcc tarpaulin the Buslei described above lines or bus IC.

The conductor tracks C, D can also be arranged on inner layers will. In this case, the outer layers are made of Metal surfaces A, B. The short-circuit rings are again for areas with the same potential through contact realizations and with different areas Potentials using block capacitors, see Claim 16.  

The starting point for a further advantageous embodiment is the case that a multilayer card one or more GND tarpaulin but not a Vcc tarpaulin, but a Vcc line system owns. The Vcc line system points here at every IC a block capacitor.

According to the invention to reduce the electromagnetic radiation between the Vcc connection of the IC and Block capacitor leads are not located in the GND tarpaulin which was previously the shortest route. The block capacitor current path is in the form of a compensation conductor of a conductor run under the IC. The block condenser Torstromweg runs from the Vcc connection of the IC under the IC to the GND connection of the IC and is there with GND tarpaulin connected, cf. Claim 18.

In another embodiment, the compensation conductor be made flat, the conductor geometry approximately is adapted to the layout of the IC. In a preferred one The IC is a GND version with the Plating to GND tarpaulin already described surrounded at least next to the compensation conductor. The arrangement of the compensation conductor can both under as well as in split form below and / or next to the IC done, see Claim 19.

In a similar way, a bus with a compensation can conductor who is below or above the bus be coupled. The connection of the compensation conductor with GND takes place at the GND connection of the IC driving the bus.

To further explain the invention, reference is made to the patent claims referred.

Details, features and advantages of the invention emerge also from the following description of Ausfüh  examples. Show in the accompanying drawing

Fig. 1 is a two-layer printed circuit board with BUS GND system,

Fig. 2 is a ladder chart with a branch of BUS systems GND,

Fig. 3 is an intersection of a BUS-GND-system with a non-active conductor line,

Fig. 4 shows the connection of an IC to a bus GND system,

Fig. 5 shows a bridge arrangement for reducing the opening,

Fig. 6 shows a bridge arrangement to supplement the GND-system,

Fig. 7 shows the arrangement of compensation elements for printed circuit cards and IC,

Fig. 8 different short circuit ring structures for GND / Vcc plane multilayer and

Fig. 9 shows an arrangement of GND tarpaulin with Vcc line system in a multilayer circuit board.

Fig. 1 shows the principle of a BUS-system GND. On a two-layer circuit board, consisting of L-side 1 , B-side 2 and the insulating layer between the layers 7 , the bus system 3 or lines arranged on the L-side 1 are covered or deposited with a further layer GND 5 with high-frequency digital signals .

The coverage by the BUS-GND 5 on the B-side 2 must reach such an extent that a connection to the GND enclosure 4 on the L-side can be made via vias 6 at intervals of approximately every 20 mm. The GND-Umfas solution 4 represents the lateral limitation of the BUS 3 with GND strips.

In this BUS-GND system, the BUS 3 is completely covered and delimited with GND areas 4 , 5 (which can also have a grid / openings); There must be no openings.

Fig. 2 illustrates a branch point of bus signals.

The BUS 3.1 on the L side and the BUS 3.2 on the B side are shown in FIG. 1 by the associated GND enclosure 4.1 (L side) and 4.2 (B side) and the GND cover 5.1 (L Side) and 5.2 (B side).

In the branching zone AAAA with the bus via Y, however, an opening 8 is created in the GND system of the bus area.

The opening 8 should be kept as small as possible and the dimensions of 10 mm × 5 mm should not be exceeded.

At the corner points X of the opening 8 , both GND systems ( 4 , 5 ) are connected to one another by vias 6 .

In the drawing, GND 4.1 , 5.1 and conductor lines 3.1 on the L side are dotted and the GND 4.2 , 5.2 and conductor lines 3.2 on the B side are hatched.

The application of the measures according to the invention for reducing the noise emissions at the intersection of a BUS-GND-system with a non-active line FIG. 3 shows.

In the intersection zone of the BUS 3 with the inactive conductor line 9 there is an opening 8 AAAA, in which the BUS 3 is covered with GND on a layer 1 , 2 . Such openings are sources of interference. The design of the opening according to the invention must therefore be carried out as follows:

• - Outside the BUS-GND system, no measures are required on the inactive conductor 9 .
• - At the corner points X of the opening 8 , the GND systems 4 , 5 of both layers 1 , 2 are connected to each other via plated-through holes 6 .
• - The opening 8 must be kept small, favorable dimensions are less than or equal to 5 mm × 10 mm.
• - The GND enclosure 4 can be carried out in the area of the opening 8 with a widening 10 .

The basic arrangement with the depositing of the GND cover 5 on the B side 2 as BUS-GND corresponds to the illustration according to FIG. 1.

The arrangement and interconnection of GND areas required when connecting an IC to a BUS-GND system is shown in FIG. 4.

The IC area with the soldering pad 13 is deposited by the continued GND area 4 (GND encapsulation of the BUS-GND system) of the L-side 1 and connected to this BUS-GND system.

On the B side 2 , the IC area has a GND enclosure 11 provided with a sufficient edge R of R = 1.5 cm. The GND deposit 4 also has this edge R. The two GND systems deposit 4 and enclosure 11 are connected via vias 6 , which are present in the corner points of the IC area Z and the tongues 12 , among other things.

Fig. 5 shows the SMD variant for a bridge used with the objective of reducing the opening width and thus the interference.

The opening 8 is spanned by the bridge 14 and is thereby broken down into two substantially smaller openings ABBA and BAAB.

The bridge 14 is contacted with the GND system by means of a solder pad 13 .

With the bridge arrangement on Leiterzugführungen of FIG. 6 is a non-closed GND surface is supplemented so that it is capable of function in terms of the object of the invention.

This solution is used if no closed and also no openings 8 with GND area 4 can not be formed in a circuit board area.

Bridge 14.3 creates opening AAAA and bridges 14.1 through 14.3 create opening CCCC. The areas AAAA and CCCC behave similar to a GND area, the BUS is protected in this area with regard to interference emission and interference coupling.

Various arrangements of compensation elements, FIG. 7, while in Fig. 7.1 Leiterkartenkompensationselemen and te in Fig. 7.2 to Fig. 7.4 IC-compensating elements.

The vertical webs 16 in Fig. 7.1 can be designed as contact springs, which are firmly connected to GND of the circuit board 1 , 2 and contact the compensation conductor 15 with their contact surfaces. The compensation conductor 15 is attached as a sheet metal strip (see also Fig. 7.4) in the surrounding of the housing at a distance of about 2 cm parallel to the circuit board. The contact springs can be connected to the circuit board using a solder, adhesive or plug connection.

In the case of the IC compensation elements according to FIGS. 7.2 and 7.3, the entire supply current of the IC or a current divided by current division with a conductor path leading against GND can be used. In this case, the compensation element 15 , 16 can be switched to GND-leading discharge path of the IC block capacitor 18 against GND, so that part of the GND-side block capacitor current flows through the compensation element ( FIG. 7.2). Furthermore, the compensation element can be connected as an auxiliary power supply 17 in the current path leading to the IC connection and block capacitor 18 ( Fig. 7.3). The side facing away from the block capacitor 18 receives an additional block capacitor 19 .

The webs 16 and the compensation conductor 15 can consist of a bent sheet metal part, see. Fig. 7.4, which has 16 solder connections 20 for SMD or push-through mounting at the lower ends of the webs. The rest of the circuit is located on the circuit board as a trace or GND area. The height of the component can be approximately 0.5 to 2 cm.

Fig. 7.5 and 7.6 show split compensation elements 15, 16 for an IC device. The divided compensation conductor 15 located on the sides of the IC are electrically connected at their ends directly ( FIG. 7.6) or via webs 16 ( FIG. 7.5) and arranged at a distance of 10 mm above the printed circuit board, covering the IC.

Fig. 8 shows different versions of short-circuit ring structures for multilayer made of GND tarpaulin A 22 and Vcc tarpaulin B 23 .

The active area is decided in a layer of the multilayer map above and / or below the areas A 22 and B 23 or surrounded in sections with a conductor C 24.1 and / or D 24.2 . The conductor C 24.1 can be approx. 10 mm wide.

The short-circuit rings according to FIG. 8.1 arise from the position B 23 via a through-connection 25 which leads through the position A 22 in an insulated manner via a bore 26 and is connected to the conductor C 24.1 . The conductor C 24.1 has a further such plated-through hole at a distance of approximately 2 to 10 cm, so that a short-circuit ring is formed in the material of the circuit board in a short-circuit ring plane 21 perpendicular to the circuit card plane. It is crucial that the short-circuit ring is guided through a bore 26 in the position A 22 and thus the position A 22 includes the iso-plated via 25 . Several rings of this type can surround the active area of the circuit board in a continuous or intermittent manner.

Short-circuit rings insulated from the surfaces A 22 and B 23 , see. Fig. 8.2 and 8.5, result when an approximately 1 cm wide conductor D 24.2 is guided below the conductor C 24.1 below the surface B 23 and the conductors C and D with two vias 25 located from 2 to 5 cm be put together to a short-circuit ring. The through contacts are isolated through holes 26 through the metallic layers A and B.

A short-circuit ring according to Fig. 8.3 results if the layers A 22 and B 23 are connected to two capacitors 27 located at a distance of 2 to 10 cm.

Another type of short-circuit ring according to FIG. 8.4 results when the block capacitors 27 are contacted at the position B 23 and insulated by the position A 22 leads to a conductor C. The conductors C and D can be an equipotential bonding conductor or a shield conductor.

Fig. 8.6 contains the similarly interchanged arrangement with metal surfaces 22 , 23 on the outer layers and conductor tracks 24 in the inner layers. At least the active area 30 is covered with metal surfaces 22 , 23 . Furthermore, the active area 30 is delimited by the short-circuit ring structures according to the invention in the form of a chain of short-circuit rings. This chain is created by connecting both metal surfaces 22 , 23 at the edges or at the boundary of the active area 30 at a distance of 2 to 10 cm by means of plated-through holes 25 .

Fig. 9.1 a multi-layer printed circuit card with GND plane 22 and shows Vcc line system 28.

The arrangement in the upper half of the circuit board ( Fig. 9.1.1) illustrates the previously customary design, according to which the leads of the block capacitor 18 run between the Vcc connection of the IC 29 and GND tarpaulin 22 by the shortest route.

The arrangement proposed by the invention is shown in the lower part of the circuit board ( Fig. 9.1.2). Here, the current path of the block capacitor 18 is designed as a compensation conductor 15 , which runs as a conductor path under the IC.

In one embodiment variant, the conductor path of the compensation conductor 15 can have the shape of a surface which roughly corresponds to the contours of an IC ( FIG. 9.2) or a bus ( FIG. 9.4).

In the illustration of Fig. 9.2, the Kompen sationsleiter 15 is in a position as a metallic surface under the IC. On the outside of the IC, a GND enclosure 4 for IC delimitation with vias 25 to the GND tarpaulin 22 is arranged in the corner points and, if necessary, in intermediate positions (20 mm).

The arrangements shown are sectional views, the section extending outside the contacting zone of the compensation conductor 15 .

In the arrangement according to Fig. 9.3, the compensation conductor 15 is made divided; it is located on both sides of the IC. The compensation conductor can also be split between the rows of pads 13 of the IC.

Fig. 9.4 shows a bus 3 with compensation conductor 15 , the compensation conductor being connected at one end or at both ends to the GND connection of the IC driving the bus. The compensation conductor 15 used here consists of a metallic strip of the width and length of the bus 3 ; it can also be constructed from several parallel conductor lines.

Reference list

1 L side of the circuit board
2 B side of the circuit board
3 BUS
4 GND enclosure
5 GND cover, BUS-GND
6 vias
7 Base material of the circuit board
8 AAAA opening
9 inactive tracks
10 Broadening of the GND coverage
11 GND coverage in the IC area
12 tongues
13 solder pad (of the IC)
14 bridge
15 compensation manager
16 bridges
17 IC power supply
18 block capacitor
19 additional block capacitor
20 Solder connection of the compensation element
21 short-circuit ring level
22 GND tarpaulin A
23 Vcc tarpaulin B
24 heads C, D
25 plated-through holes
26 holes
27 block capacitors
28 Vcc line system
29 Vcc connection of the IC
30 active areas

Claims (20)

1. Arrangement for reducing the electromagnetic radiation from printed circuit boards and IC, characterized in that in the case of a two-layer printed circuit board with the underside (L side) ( 1 ) and the upper side (B side) ( 2 ) of the BUS ( 3 ) or lines with high-frequency digital signals closely summarized on the L-side ( 1 ) (or in an analogous arrangement on the B-side) and delimited by GND = conductor lines ( 4 ), the GND enclosure,
and on the B side ( 2 ) (or in an analogous arrangement on the L side) the BUS ( 3 ) is deposited with a GND cover ( 5 ), BUS-GND, and the GND cover ( 5 ) BUS ( 3 ) overlaps sufficiently on the side to arrange through-holes ( 6 ) from the GND cover ( 5 ) to the GND enclosure ( 4 ) at discrete intervals. 2. Arrangement for reducing the electromagnetic radiation in printed circuit boards and IC, characterized in that at intersections and branches of BUS-GND systems in the crossing or branching zone of the BUS ( 3 ) resulting opening ( 8 ) AAAA, in which the BUS ( 3 ) is not covered with GND ( 5 ) on any layer ( 1 , 2 ), is framed with plated-through holes ( 6 ) which are arranged at the corner points X of the opening ( 8 ) and the GND systems ( 4 , 5 ) connect both layers ( 1 , 2 ). 3. Arrangement according to claim 2, characterized in that the dimensions of the opening ( 8 ) are advantageously 5 × 10 mm. 4. Arrangement according to claim 2 or 3, characterized in that at intersections of BUS-GND systems with inactive conductor lines ( 9 ), the GND enclosure ( 4 ) in the region of the opening ( 8 ) is designed as a widening ( 10 ). 5. Arrangement for reducing the electromagnetic radiation in printed circuit boards and IC, characterized in that for connecting IC to the BUS-GND system

• d) the IC area arranged on the B side ( 2 ) is deposited with GND ( 4 ) on the L side ( 1 ) and is connected to the BUS-GND system,
• b) the IC area has a GND enclosure ( 11 ), wherein
• c) the GND deposit ( 4 ) and the GND enclosure ( 11 ) have an edge R of at least 1 cm beyond the IC range and
• d) the two GND systems deposit ( 4 ) and enclosure ( 11 ) via spaced through-holes ( 6 ), which in particular include the corner points Z of the IC area and the tongues ( 12 ).

6. Arrangement according to claim 5, characterized in that in the event that further Connect GND systems (IC, BUS) to the IC GND system Areas form the border R. 7. Arrangement according to one of claims 1, 2, 5, characterized in that the distance between the vias ( 6 ) is in the range 20 mm. 8. Arrangement according to claim 2 or 3, characterized in that a bridge ( 14 ) in the form of a metal plate over the opening ( 8 ) is arranged so that it projects over this opening ( 8 ) at least on two opposite sides and with the protruding ends are contacted with the GD system. 9. Arrangement according to claim 2 or 3, characterized in that at high conductor density and complicated conductor guides in addition to the GND system consisting only of partial areas, several bridges ( 14 ) are arranged so that sufficiently small openings ( 8 ) are formed and / or bridges ( 14 ) and GND part surfaces ( 4 ) short-circuit rings result. 10. Arrangement for reducing the electromagnetic radiation in printed circuit boards and IC, characterized in that to produce a short-circuit ring with a loop plane perpendicular to the Lei terkartenebene ( 1 , 2 ) compensation elements, consisting of the compensation conductor ( 15 ) and at least two, with the GND system or a conductor strip of the circuit board connected webs ( 16 ) are present, the entire te compensation conductor ( 15 ) or only a portion as part of the short-circuit ring outside the circuit board is used ge. 11. The arrangement according to claim 10, characterized in that the rod-shaped or sheet-shaped compensation conductor ( 15 ) is guided parallel to the circuit board ( 1 , 2 ) at a distance of about 1 to 5 cm. 12. The arrangement according to claim 10, characterized in that the compensation elements ( 15 , 16 ) can be used in a smaller version and in a distance range of 0.5 to 2 cm for individual IC, passive IC compensation elements being connected to GND and active compensation elements are connected directly or via a current divider to the auxiliary power supply ( 17 ) of the IC, and the compensation element is connected to the GND discharge path of the IC block capacitor ( 18 ) to GND or the compensation element as auxiliary power supply ( 17 ) in the current path leading to the IC connection with block capacitor (in the case of current division) or without block capacitor ( 18 ) is connected, the side facing away from the IC connection being connected to an additional block capacitor ( 19 ). 13. An arrangement according to claim 10, characterized in that the compensation elements compensation conductors (15) are performed with or without webs (16) divided and electrically connected at the ends for the IC application, wherein the shared Kompensa tion conductor (15) at a distance from 0.5 to 10 mm above the circuit board and / or next to the IC. 14. Arrangement for reducing the electromagnetic radiation in printed circuit boards and IC, characterized in that for the production of short circuit ring structures in multilayer printed circuit boards a short circuit ring level ( 21 ) perpendicular to the printed circuit board level in the area of the GND tarpaulin A ( 22 ) and Vcc tarpaulin B. ( 23 ) is arranged, and the short-circuit ring is guided using conductor C ( 24.1 ) about 2 to 10 cm on the top and / or by means of conductor D ( 24.2 ) on the underside of the GND / Vcc tarpaulin system and with Vias ( 25 ) is closed, the short-circuit ring ( 24 , 25 ) isolated from GND and Vcc or connected to one of the two potentials ( 22 , 23 ), and the vias ( 25 ) via bores ( 26 ), which depending on the structure of the short-circuit ring structure through the metallic layers A, B ( 22, 23 ) are guided. 15. The arrangement according to claim 14, characterized in that for guiding the short-circuit rings over surfaces ( 22 , 23 ) and lines ( 24 ) under different potentials instead of simple plated-through holes ( 25 ) block capacitors ( 27 ) are provided. 16. The arrangement according to claim 14 or 15, characterized in that in an analogously reversed arrangement of conductor tracks ( 24 ) and metal surfaces ( 22 , 23 ), the conductor tracks ( 24 ) are on the inner layers and the outer layers ( 22 , 23 ) Metal surfaces exist, the short-circuit rings are connected to surfaces with the same potential by vias ( 25 ) and to surfaces with different potentials by means of block capacitors ( 27 ). 17. Arrangement according to one of claims 14 to 16, characterized in that active areas ( 30 ) of the GND / Vcc tarpaulin are surrounded by a chain of short-circuit rings. 18. Arrangement for reducing the electromagnetic radiation in printed circuit boards and IC, characterized in that when executing multi-layer printed circuit boards with GND tarpaulin ( 22 ) and Vcc line system ( 28 ), ie without Vcc tarpaulin ( 23 ), the Leads of the block capacitor ( 18 ) between the Vcc connection of the IC ( 29 ) and GND tarpaulin ( 22 ) as a compensation conductor ( 15 ) is guided under the IC. 19. The arrangement according to claim 18, characterized in that the compensation conductor ( 15 ) is flat, with a conductor geometry adapted to the layout of the IC,
that the IC is delimited with a GND enclosure ( 4 ) which has through-contacts ( 25 ) to the GND tarpaulin ( 22 ) at least in the area next to the compensation conductor ( 15 ) and
that the compensation conductor ( 15 ) is arranged below or in a split version below and / or next to the IC. 20. The arrangement according to claim 19, characterized in that a bus ( 3 ) with a compensation conductor ( 15 ) is connected, which is arranged below or above the bus ( 3 ), the connection of the compensation conductor ( 15 ) with GND on GND connection of the IC driving the bus ( 3 ) is provided.