DE19619771A1 - Ultrasonic bonding method e.g. for mounting wire conductor on substrate surface - Google Patents

Abstract

The method lays the electrical conductor (20) against the surface of a substrate (21) and embeds it with the aid of ultrasound. The tip of an ultrasonic generator operating at around 40 kHz is located over the wire and is pressed against the surface. The tip is moved over the surface to achieve the required layout pattern. The material of the substrate, e.g. PVC, deforms and the conductor becomes partially embedded. A number of application variations are possible.

Description

The present invention relates to a method according to the Preamble of claim 1 and one for carrying out the Method usable device according to claim 14 and claim 18.

DE 44 10 732 A1 describes a method for laying a known wire-shaped conductor on a substrate, in which for Fixing the wire-shaped conductor on the substrate an ul ultrasound connection device is used. The one at the known method used Ultrasonic Verbindungseinrich device contributes to the connection points of the wire conductor a "rubbing" of the wire conductor into the substrate surface Substrate surface. This rub-in sets you through Ultra sound-induced vibration movement of the wire guide paral lel to the laying level, i.e. the substrate surface, ahead, like it from the conventional use of so-called ultrasonic bonders for connecting a bond wire to the pad of a Chip unit is known. It has been described in the benen "rubbing" ge parallel to the substrate surface directed ultrasound-induced movement as beneficial Establishing a cohesive connection between one Wire conductor and the pad of a chip unit proved.

Since the principle of the connection between the wire conductor and the Substrate is based, at least the wire conductor cross section to sink or to partially sink into the substrate surface nestle, it is obvious that one to the substrate top surface essentially parallel, ultrasonic indu graced movement of the wire guide not directly to verse  or clinging. Rather, the be knew methods of sinking due to a temperature increase hung, caused by a static pressure load on the wire guide, overlaid with the reciprocating, ultrasound-induced Transverse movement of the wire guide, ie the "rub-in" mentioned process".

The present invention is based on the object Method for laying a wire-shaped conductor on a To propose substrate and a suitable device for this, by means of the laying of the wire-shaped conductor can be carried out even more effectively in the substrate surface.

This task is accomplished by a process with the characteristics of Claim 1 or a device with the features of the Proverb 14 solved.

In the method according to the invention, the wire conductor is in Ultrasound in a direction transverse to the laying plane strikes, and the induced by the ultrasound graced transverse movement of the laying device is in the Laying layer overlaying laying movement.

The superimposition of the laying movement with the wire conductor cross-section in the substrate surface or this cuddly transverse movement enables a continuous Lichen operation of the laying device, so that the wire conductor not only in the area of certain connection points, but Connect to the substrate surface over any length is bar without doing with the actual laying movement should be suspended. In addition, ul ultrasound-induced transverse movement is particularly effective the at least partial sinking or nestling of the Wire cross-section, since the Be movement is in the lowering direction and not transverse to it as it is is the case with the method described above.

It proves to be particularly advantageous if the ul transversely induced transverse movement along an angle to Axis of the laying movement changeable transverse movement axis  follows. This makes it possible to move the transverse axis set according to special requirements. That's the way it is possible, in the event that depending on the sub stratmaterial an elevated temperature of the to be sunk Wire conductor is desired, the transverse movement axis more in Align the direction of the laying movement axis so as to larger longitudinal force component acting on the wire conductor obtained by rubbing the wire guide leads to heating of the same. Around the largest possible rate of lowering of the wire conductor in the sub To reach the surface of the strat, it can be advantageous Transverse axis of motion at an angle of 45 ° to the laying system alignment axis to achieve the greatest possible thrust effect to achieve in the substrate material.

The depth of penetration of the wire conductor into the substrate surface che can also change the ultrasound frequency and / or the angle between the axis of the laying movement and the Transverse axis can be changed.

As particularly advantageous in terms of laying of the wire conductor as a wire coil on the substrate surface following connection procedure for connecting the wire conductor with pads of a chip unit, it can be point when the coil end area and the coil start area be led over a recess of the substrate, so that the subsequent connection of the pads one Chip unit with the coil start area and the coil end rich without being affected by the substrate material can.

In order to align the coil start as straight as possible Reichs and the coil end area between opposite It is before to allow recess edges of the recess partial, the ultrasound exposure of the wire conductor in the Suspend the area of the recess.

Exposure to ultrasound of the wire conductor also proves to cross an already laid Wire section in the crossing area as advantageous, wherein  additionally the wire conductor in the crossing area in a ge compared to the laying plane spaced crossing plane leads. This ensures that a crossing of Wire conductors is possible without being damaged by The wire conductors collide, leading to destruction wire conductor insulation could occur.

The use of the before has also proven to be particularly advantageous standing described in various embodiments driving for the production of a card module with a substrate, one coil laid on the substrate and one with the coil connected chip unit proved. This is done in a laying phase by means of the laying device a coil with a spu len start area and a coil end area on the substrate trained and in a subsequent connection phase with means of a connecting device a connection between the Coil start area and the coil end area with connection surface Chen performed the chip unit.

This application of the process is made possible by Integra tion of laying the wire conductor on the substrate in one Process for producing a card module based on egg any substrate that is at least partially indented wire conductor in or nestling the wire conductor the substrate surface allows the training to be handled easily barer card modules, which are semi-finished products from chip cards position. To complete the chip card then the card modules are usually on both sides with a deck provided with laminate layers. Depending on the training and thickness of the Substrate material can be the connection between the wire conductor and the substrate material over a more or less shape conclusive inclusion of the wire conductor cross section in the sub strat surface - for example when the substrate is formed from one thermoplastic material - or by a predominant, at nestling fixation of the wire conductor on the substrate top surface, for example by gluing the wire conductor to the sub strat surface. The latter will then, for example be the case if the substrate material is one fleece-like or fabric-like carrier.  

Especially in the production of paper or card tapes conditions, such as those used for baggage identification the connection of the wire conductor to the sub strat surface over an adhesive layer between the wire ter and the substrate surface proved to be advantageous. Here the wire conductor nestles in a peripheral area over the Adhesive layer on the substrate surface. If the wire is provided with a suitable surface coating, for example baking varnish, the adhesive layer can be from the top surface coating be formed.

As particularly effective in the above process application tion has the application of a thermocompression process for connecting the coil start area and the coil end exposed with the pads of the chip unit.

A further increase in the effectiveness of the above ver driving application can be achieved if the A plurality of card modules are produced in such a way that that in a feed phase of a plurality of laying directions and connecting devices having card mo dulproduction device a plurality of in one benefit summarized arranged substrates is fed, and on closing a plurality of coils in the laying phase out simultaneously on substrates arranged in a row is formed, then a more in the connection phase Number of chip units through their pads with the Spu len and finally in a separation phase a separation of the card modules from the benefit network follows.

Furthermore, there has been a process application for manufacturing tion of a rotationally symmetrical body coil as advantageous proven, the wire-shaped conductor on a Wick lung carrier trained, relative to the laying device ro ting substrate is laid. To train the relative rotation is possible, either with stationary Laying the substrate around its longitudinal axis in rota tion, or in the case of a stationary substrate, the laying  device on a trajectory around the longitudinal axis of the sub to move strats, or the two aforementioned movements overlay types.

The aforementioned method application is particularly suitable to produce a one-piece with a vibrating membrane bound moving coil of a loudspeaker unit.

According to a further method application, the method serves for laying a wire-shaped conductor on a substrate by means of an ultrasound acting on the wire conductor Laying device for the production of a ribbon cable, where with one corresponding to the number of desired cable conductors Number of laying devices transverse to the longitudinal axis of a flat ribbon-shaped substrate is arranged and a Relativbe movement between the substrate and the laying devices in Longitudinal axis direction of the substrate takes place.

The laying device for laying a wire-shaped Lei ters on a substrate by means of ultrasound has a wire guide and an ultrasound transducer, the ultrasound encoder is connected to the wire guide such that the wire Guide to the execution of ultrasonic vibrations in the longitudinal axis direction is stimulated.

As advantageous for the execution of the laying device he it turns out if this with a wire guide capillary is provided, at least in the area of a wire guide mouth runs parallel to the longitudinal axis in the wire guide. To this It is ensured that the area of the wire driver's mouthpiece the axial feed movement of the wire conductor not affected by ultrasound-induced transverse loads is done. Rather, the ultrasound exposure runs in Longitudinal wire direction.

It proves for the introduction of the wire conductor into the wire guide However, it is advantageous if the wire guide is spaced apart to the wire guide mouthpiece at least one at an angle to the wire guide Longitudinal axis extending wire feed channel.  

To avoid ultrasound-induced transverse loads on the Wire conductor in the wire guide mouthpiece area also helps if the ultrasound generator is arranged coaxially to the wire guide is.

According to an alternative solution, the laying device the features of claim 18. An advantageous execution form has the features of claim 19.

Inexpensive production of a larger number of card modules is possible by means of an embodiment of the device which comprises:
a sheet feed station for feeding a plurality of substrates arranged in a sheet,
a laying station with a plurality of laying devices arranged in a row transverse to the production direction,
a loading station with at least one loading device for loading the individual substrates with a chip unit, and
a connecting station with at least one connecting device for connecting the chip units to a coil start area and a coil end area of the coils formed by the laying devices on the substrates.

Variants of the method and the device for performing tion of the method and embodiments of according to the procedure Ren manufactured substrates provided with a wire conductor are explained below with reference to the drawings. It demonstrate:

Figure 1 is a schematic representation of the laying egg nes wire conductor on a substrate by means of ultrasound.

Fig. 2 is an electron micrograph showing a wire conductor embedded in the substrate;

Fig. 3 shows a laying apparatus for laying a wire conductor by means of ultrasound;

Figure 4 is a laid in coil form on a substrate with conductor wire conductor via a recess in the wire guided away ends.

FIG. 5 shows a coil configuration varied with respect to FIG. 4 with wire ends guided over a substrate recess;

FIG. 6 shows the placement of a chip unit in the substrate recess shown in FIG. 5;

Figure 7 shows the connection of the wire ends shown in Figure 5 with pads of the chip unit used in the recess.

Fig. 8 shows a production apparatus for producing card modules;

Fig. 9, the laying of a wire conductor by means of ultrasound in a rotationally symmetrical bobbin;

FIG. 10 is a solution prepared by ultrasonic laying on a zylin-cylindrical winding body moving coil of a loudspeaker unit;

Fig. 11 is a longitudinal section view of a ladders provided with wire ribbon cable;

Fig. 12 shows a further installation apparatus for installing a wire conductor by means of ultrasound.

Fig. 1 shows the installation in a schematic representation of a wire conductor 20 on a substrate 21 by means of an applied ultrasonic laying apparatus 22 with egg nem wire guide 23rd

The laying device 22 shown in FIG. 1 is designed to be movable in three ways and is subjected to ultrasound which excites the wire guide 23 to oscillate transverse movements (arrow 24 ), which in the example shown in FIG. 1 is perpendicular to one through side edges 25 , 26 a sub strat surface 27 spanned laying level 28 are aligned.

For laying, the wire conductor 20 is moved with a continuous feed movement in the direction of arrow 29 out of a wire guide mouthpiece 30 , at the same time the wire guide 23 executes a laying movement 29 running parallel to the laying plane 28 , which in FIG Substrate 21 laid wire conductor section can be traced. The oscillating transverse movement 24 is superimposed on this laying movement, which runs in the area of the front side edge 25 in the direction of the arrow 29 . This results in a repeated succession of hits or strikes of the wire guide mouthpiece 30 on the wire conductor 20 in accordance with the ultrasonic frequency, which leads to a compression and / or displacement of the substrate material in the region of a contact point 32 .

FIG. 2 shows the embedded arrangement of the wire conductor 20 in the substrate 21 in a sectional representation which corresponds approximately to the section line II-II indicated in FIG. 1. The substrate shown here is a PVC film, whereby for embedding the wire conductor 20 of the wire conductor via the laying device 22, for example, an ultrasonic power of 50 W and an ultrasonic frequency of 40 KHz is applied. The contact pressure with which the wire guide mouthpiece 30 is brought into abutment against the substrate surface 27 can be in the range between 100 and 500 N for the aforementioned substrate material. As can be seen from the illustration according to FIG. 2, an embedding of the wire conductor 20 in the substrate 21 was achieved in a test carried out by setting the aforementioned parameters, essentially due to a compression of the substrate material in a compression region 33 of the substrate material which was designed here as a crescent moon.

The laying principle shown in Fig. 1 can be used universally. So the principle can deviate from the use explained in detail below in the manufacture of a card module ( Fig. 4 to 7) can also be used when laying wire spools in plastic housings, for example for training an antenna for a cordless telephone (cell phone), or also to form a measuring coil of a sensor.

Fig. 3 shows the laying device 22 in a single display with an ultrasonic transmitter 34 , which is arranged coaxially to the wire guide 23 and is rigidly connected to the latter in a connecting area 35 . The Verlegevor direction 22 shown in Fig. 3 is formed overall rotationally symmetrical. The wire guide 23 has a central longitudinal bore 36 which 37 passes pillare in the region of the wire guide nozzle 30 in a Drahtka opposite the longitudinal bore 36 has a narrowed, having the diameter of the wire conductor 20 concerted diameter. The wire guide capillary 37 serves primarily to be able to precisely align the wire conductor in the laying plane 28 ( FIG. 1).

Side of the wire guide 23 einmündend two Drahtzuführkanäle 38, 39 are disposed at the dargestell th in Fig. 3 embodiment above the wire guide nozzle in the longitudinal bore 36, extending obliquely downwards in the direction of the wire guide nozzle piece 30. The wire feed channels 38 , 39 NEN for the lateral insertion of the wire conductor 20 into the wire guide 23 , so that the wire conductor 20 , as shown in Fig. 3, laterally obliquely in the wire feed channel 38 , through the longitudinal bore 36 and from the wire guide capillary 37th led out through the wire guide 23 runs ver. The multiple arrangement of the wire feed guide channels 38 , 39 allows the selection of the cheapest wire feed guide side on the wire guide 23 .

As further 3 seen from Fig., The wire guide nozzle 30 in the region of a wire exit opening 40 is det convex ausgebil to a gentle for the wire conductor 20 as possible Umlen the contact point effect in the region 32 (Fig. 1) or the wire exit orifice 40 in the in Fig. 1 illustrated laying process to allow.

Although not shown in Fig. 3, the wire guide 23 can be provided with a wire cutting device and a wire feed device. The wire separation device can be integrated directly into the wire guide mouthpiece 30 . FIG. 4 shows a wire conductor 20 , which is laid on a substrate 42 to form a coil 41 , which in this case is designed as a high-frequency coil. The coil 41 here has an essentially rectangular configuration with a coil start area 43 and a coil end area 44 , which are guided over a window-shaped substrate recess 45 . The coil start area 43 and the coil end area 44 are in parallel alignment with a main coil strand 46 , which they take in the area of the substrate recess 45 between them. In the above, in principle, already described with reference to FIG. 1 Ultrasonic laying of the wire conductor 20, the ultrasonic vibration of the wire conductor 20 is exposed while it is being carried away during the laying operation over the substrate recess, in order for a no impairment of the orientation of the wire conductor 20 in a free-span region To achieve 47 between the mutually opposite recess edges 48 , 49 , and on the other hand to exclude a stress on the connection between the wire conductor 20 and the substrate 42 in the region of the recess edges 48 , 49 due to tensile loads on the wire conductor 20 as a result of ultrasound exposure.

Fig. 5 shows a comparison with FIG. 4 modified Configu ration a coil 50 having an initial coil region 51 and ei nem coil end portion 52, which are angled in an inner region of the coil 50 into it led to a reel main strand 53rd The coil 50 is arranged on a substrate 55 which has a substrate recess 56 in the inner region 53 of the coil 50 . In order to be able to pass both the coil start area 51 and the coil end area 52 over the substrate recess 56 , in the configuration shown in FIG. 5 the coil end area 52 must first be passed over the main coil strand 44 in a crossing area 57 . In order to prevent damage or partial stripping of the wire conductor 20 , the ultrasound exposure of the wire conductor 20 in the crossing region 57 is similar to that in the region of the substrate recess 56 . In addition, the wire guide 23 is raised slightly in the crossing region 57 .

Fig. 6 shows a view of the substrate 55 corresponding to the section line VI-VI in Fig. 5, the placement of a chip unit 58 in the substrate recess 56 , at the connection surfaces 59 of the chip unit 58 against the coil start area 51 and the coil end area 52 are brought to bear.

Fig. 7, the following compound 59 is of the pads of the chip unit 58 with the initial coil region 51 and the coil end portion 52 by means of a thermode 60, the dung under an action of pressure and temperature, an integral Verbin and manages the pads 59 between the wire conductor 20, which makes a total of a card module 64 is formed.

In the chip unit 58 shown in FIGS . 6 and 7, it can also be, as in all other other cases, when one speaks of a chip unit, both a single chip and a chip module which, for example, contacted a substrate on a chip Chip or has a plurality of chips act. In addition, the connection shown in FIGS . 6 and 7 between the coil 50 and the connection surfaces 59 is not limited to the connection to a chip, but applies generally to the connection of connection surfaces 59 having electronic components with the coil 50 . These can also be capacitors, for example.

It is also clear from FIGS . 6 and 7 that the substrate recess 56 is dimensioned so that it essentially receives the chip unit 58 . To simplify the alignment of the pads 59 of the chip unit 58 preceding in the actual contacting placement of the chip unit 58 may be provided 58 on its the connecting areas 59 on facing contact face 61 with a here like a web having formed th alignment aid 62, the chip unit. The alignment aid 62 is dimensioned in accordance with the distance a that the coil starting area 51 and the coil end area 52 have in the area of the substrate recess 56 from one another ( FIG. 5).

Fig. 8 shows a production device 63 , which serves for the produc- tion of card modules 64 , which are used as semi-finished products in the manufacture of smart cards. The card modules 64 produced by means of the production device 63 have, for example, the structure shown in FIGS . 5, 6 and 7, each with a coil 50 and a chip unit 58 , which are arranged on a common substrate 55 .

The production device 63 shown in Fig. 8 has five stations, namely a feed station 65 , a laying station 66 , an assembly station 67 and a connection station 68 and a removal station 69 .

In the feed station, a so-called benefit 70 is fed to the production device 63 , which in a common Ver bund has a plurality - here for reasons of illustration only twenty - via separating points not shown here with interconnected substrates 55 . The benefit 70 is fed by means of a transport device 71 to the laying station 66 , which has four identical laying devices 22 arranged in a row on a portal 73 running transversely to the production direction 72 and movable in the production direction 72 . The laying devices 22 are supplied with the wire conductor 20 via four wire conductor coils 74 . To form the coil configurations shown by way of example in FIG. 5, the laying devices 22 which can be moved along the portal 73 are moved accordingly in the laying plane 28 ( FIG. 1).

After the wire conductors 20 have been laid in accordance with the coil configuration shown in FIG. 5, the panel 70 with the coils 50 formed thereon is advanced further to the assembly station 67 . Combined with the loading station 67 in the present case is the connecting station 68 , such that both a loading device 76 and a connecting device 77 are each arranged to be movable in the longitudinal direction of the portal 75 on a portal 75 which can be moved in the production direction 72 . The placement device 76 is used to remove chip units 58 from a chip unit reservoir 78 and to subsequently place the chip units 58 in the manner shown in FIG. 6. The Verbindungsvor direction 77 is used to contact the pads 59 of the chip units 58 with the coil 50 , as shown in Fig. 7.

After assembly and contacting, the panel 70 is moved further into the removal station 69 . Here, the benefit 70 is removed with subsequent separation of the substrates 55 or also initially a separation of the substrates 55 , that is to say a dissolution of the benefit composite, and then the removal of the individual substrates 55 now formed into card modules 64 .

Fig. 9 shows an application of the example explained with reference to Fig. 1 method for producing a cylindrical body coil 79 , in which the substrate is formed as a cylindrical winding carrier 80 and the laying or embedding device of the wire conductor 20 on the winding carrier 80 at rotation 81st of the winding support 80 with simultaneous superposition ter translation 82 of the laying device 22 .

As shown in Fig. 10, the winding support 80 can also be formed as a cylindrical extension of a plastic vibrating diaphragm 83 of a loudspeaker unit 84 , so that a plunger 85 can be produced in the manner shown in Fig. 9, as in combination with an in Fig. 10 indicated permanent magnet is used to form a loudspeaker unit 84 .

Fig. 11 shows a further application of the method described be a ribbon cable section 85 with a flat ribbon-shaped substrate 86 , the two sides adjacent to separation points 87 with transversely to the longitudinal direction of the substrate 86 in a row arranged substrate recesses 88 is provided. Arranged parallel to one another on the substrate 86 and extending in the longitudinal direction of the substrate 86 are a plurality of wire conductors 20 which are laid on the substrate 86 in the manner shown by way of example in FIG. 1. The wire conductors 20 are in the area of the separation points 87 over the substrate recesses 88 . The separation points serve to define predetermined ribbon cable pieces 89 , in which case the substrate recesses 88 are each arranged at one end of a ribbon cable piece. This results in a particularly favorable way of making contact for connecting plugs or sockets with the wire conductors 20 without the wire conductors having to be uncovered first. The sub stratausnehmungen 88 are made in a stamping process with a suitably designed stamping tool in the substrate 86 , the distance from the punched from the separation points 87 is predetermined. The appropriately prepared endless substrate is then coated with the wire conductors 20 , in which case a number of laying devices corresponding to the number of the wire conductors 20 is arranged above the longitudinally moving substrate.

Fig. 12 shows, as a modification of the laying device 22 shown in FIG. 3, a laying device 91 which, like the laying device 22, has an ultrasonic transmitter 34 . In contrast to the laying device 22 , no wire guide but a vibration stamp 92 is connected to the connecting area 35 of the ultrasound transmitter 34 , which, as shown in FIG. 12, serves to carry the wire conductor 20 guided between a profile end 93 and the surface of the substrate 21 to act in the longitudinal direction of the vibration stamp 92 extending, induced by ultrasound mechanical vibrations. In order to enable safe guiding of the wire conductor 20 , the profile end 93 is provided with a concave recess, not shown in FIG. 12, which enables the wire conductor 20 to be gripped partially.

In contrast to the laying device 22 shown in FIG. 3, a wire guide 94 is provided on the laying device 91 , which in the embodiment shown here is formed from a guide tube 95 arranged laterally on the ultrasound transmitter 34 with a bend mouthpiece 96 formed in the direction of the profile end 93 , which enables a lateral feed of the wire conductor 20 in the direction of the profile end 93 , which is directed obliquely downwards here. Thus, as shown in FIG. 12, the wire conductor 20 can be guided between the profile end 93 of the vibration stamp 92 and the surface of the substrate 21 in order to enable the above-described connection with or laying on or in the surface of the substrate 21 .

Deviating from the illustration in FIG. 12, it is also possible to provide the wire guide decoupled from the ultrasound transmitter 34 on the laying device 91 in order to enable vibration-free feeding of the wire conductor if necessary.

In the illustrated in Fig. 12 embodiment, the installation device rotatable about an axis arranged transversely to the stamp 97 winding axle 98 wire coil 99 which serves for feeding the wire conductor 20 in the wire guide 95th

In order to enable any laying of the wire conductor 20 on the surface of the substrate 21 , the laying device 91 has a pivot axis 100 coaxial with the stamp axis 97 .

The terms denote in the language of the present patent application "Wire-shaped conductor" and "wire conductor" generally conductors for transmission of signals that have a defined longitudinal extent and therefore are wire-shaped in terms of their outer shape. The term "Wire conductor" is not limited to metallic conductors, however also designates conductors made of other materials, e.g. B. light guide Glass fiber, or also conductors, which serve to guide flowing media. Especially in the case that the conductor used with an adhesive The conductor can also be multi-layered Arrange one on top of the other, the lowest layer with the substrato Surface and other layers, each with a conductor layer arranged underneath gen are connected. Liability can be, for example, via a Heat exposure with regard to its adhesive effect activatable baking paint coating of the conductor or a corresponding plastic coating stratification can be achieved.

Claims (20)

1. A method for laying a wire-shaped conductor on a substrate by means of a laying device acting with ultrasound on the wire conductor, characterized in that the wire conductor ( 20 ) is acted upon in a direction transverse to the laying plane ( 28 ) with ultrasound, and by the ultrasound exposure generated transverse movement ( 24 ) of the laying device ( 22 ) of the laying movement ( 29 ) extending in the laying plane ( 28 ) is superimposed. 2. The method according to claim 1, characterized in that the transverse movement ( 24 ) along an angle to the axis of the laying movement ( 29 ) variable transverse movement axis. 3. The method according to claim 1 or 2, characterized in that the ultrasonic frequency and / or the angle between the axis of the laying movement ( 29 ) and the transverse movement axis ( 24 ) is changed depending on the desired penetration depth of the wire conductor ( 20 ). 4. The method according to one or more of the preceding claims, characterized in that a coil end region ( 44 ) and a coil beginning area ( 43 ) of a coil ( 41 ) formed by laying on the substrate ( 21 ) via a substrate recess ( 45 ) be led away. 5. The method according to claim 4, characterized in that the ultrasound exposure of the wire conductor ( 20 ) in the region of the substrate recess ( 45 ) is exposed. 6. The method according to one or more of the preceding claims, characterized in that for crossing an already laid wire section in the crossing area ( 57 ), the ultrasound exposure of the wire conductor ( 20 ) is exposed and the wire conductor ( 20 ) in a position opposite the laying plane ( 28 ) spaced crossing level is performed. 7. Application of the method according to one or more of claims 1 to 6 for producing a card module ( 64 ) with a substrate ( 55 ), a coil ( 50 ) laid on the substrate and a chip unit connected to the coil ( 50 ) ( 58 ), a coil ( 50 ) with a coil start area ( 51 ) and a coil end area ( 52 ) being formed on the substrate ( 55 ) in a laying phase by means of the laying device ( 22 ) and in a subsequent connecting phase by means of a connecting device ( 60 ) a connection between the coil beginning area ( 51 ) and the coil end area ( 52 ) with connection surface ( 59 ) of the chip unit ( 58 ) is carried out. 8. The method according to claim 7, characterized in that the substrate consists of a non-woven material, in particular special paper or cardboard, and the connection is made during the laying by means of an adhesive layer arranged between the wire conductor ( 20 ) and the substrate surface. 9. The method according to claim 7 or 8, characterized in that the connection of the coil start area ( 51 ) and the coil end area ( 52 ) with the connection surfaces ( 59 ) of the chip unit ( 58 ) by means of a Thermokompressionsverfah rens. 10. The method according to any one of claims 7 to 9, characterized in
that at the same time the production of a plurality of card modules ( 64 ) takes place in such a way that in a feed phase of a production device ( 72 ) having a plurality of laying devices ( 22 ) and connecting devices ( 60 ), a plurality of substrates combined in one benefit ( 70 ) ( 55 ) is fed,
then a plurality of coils ( 50 ) is simultaneously formed on substrates ( 55 ) arranged in a row in the laying phase,
a plurality of chip units ( 58 ) is then connected to the coils ( 55 ) via their connection surfaces ( 59 ) in the connection phase, and
finally, in a separation phase, the card modules ( 64 ) are separated from the utility network. 11. Application of the method according to one or more of claims 1 to 6 for producing a rotationally symmetrical body coil, characterized in that the wire conductor ( 20 ) on a winding support ( 80 ) formed, relative to the laying device ( 22 ) rotating substrate . 12. The method according to claim 11, marked by the manufacture of a one-piece with a vibrating membrane connected moving coil of a loudspeaker unit. 13. Application of the method according to one of claims 1 to 6 for the production of a ribbon cable, characterized in that one of the number of desired cable conductors corresponding number of laying devices ( 22 ) is arranged transversely to the longitudinal axis of a ribbon-shaped substrate ( 86 ) and a relative movement between the substrate ( 86 ) and the laying devices ( 22 ) in the longitudinal axis direction of the substrate ( 86 ). 14. Device for laying a wire-shaped conductor on a substrate according to the method according to one or more of claims 1 to 6 with a wire guide ( 23 ) and an ultrasound transmitter ( 34 ), the ultrasound transmitter ( 34 ) in this way with the wire guide ( 23 ) is connected that the wire guide ( 23 ) is excited to perform ultrasonic vibrations in the longitudinal axis direction. 15. The apparatus according to claim 14, characterized in that the wire guide ( 23 ) has a wire guide capillary ( 37 ) which runs at least in the region of a wire guide mouthpiece ( 30 ) along the longitudinal axes parallel in the wire guide ( 23 ). 16. The apparatus according to claim 15, characterized in that the wire guide ( 23 ) spaced apart from the wire guide mouthpiece ( 30 ) has at least one wire feed channel ( 38 , 39 ) extending longitudinally to the wire guide. 17. The device according to one or more of claims 14 to 16, characterized in that the ultrasonic transmitter ( 34 ) is arranged coaxially to the wire guide ( 23 ). 18. Device for laying a wire-shaped conductor on a substrate according to the method according to one or more of claims 1 to 6 with a wire guide ( 94 ) and an ultrasound transmitter ( 34 ), the wire guide ( 94 ) next to one with the ultrasound transmitter ( 34 ) Coupled vibration stamp ( 92 ) for loading the wire conductor ( 20 ) with ultrasound induced, acting in the longitudinal direction of the vibration stamp, mechanical vibrations is arranged. 19. The apparatus according to claim 18, characterized by a with a vibration stamp axis ( 97 ) coaxial pivot axis ( 100 ). 20. Device for carrying out the method for producing a card module according to one or more of claims 7 to 10 using a device according to one or more of claims 14 to 19 comprising:
a panel feed station ( 65 ) for feeding a plurality of substrates ( 55 ) arranged in a panel ( 70 ),
a laying station ( 66 ) with a plurality of laying devices ( 22 ) arranged in a row transverse to the production direction,
a mounting station ( 67 ) with at least one loading device ( 76 ) for mounting the individual substrates ( 55 ) with a chip unit ( 58 ) and
a connecting station ( 68 ) with at least one connecting device ( 77 ) for connecting the chip units with a coil start area ( 51 ) and a coil end area ( 52 ) of the coils ( 50 ) formed by the laying devices ( 22 ) on the substrates ( 55 ).