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DE19615643A1 - Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage - Google Patents

Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage

Info

Publication number
DE19615643A1
DE19615643A1 DE1996115643 DE19615643A DE19615643A1 DE 19615643 A1 DE19615643 A1 DE 19615643A1 DE 1996115643 DE1996115643 DE 1996115643 DE 19615643 A DE19615643 A DE 19615643A DE 19615643 A1 DE19615643 A1 DE 19615643A1
Authority
DE
Germany
Prior art keywords
temperature
voltage
connection
solder
switching element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1996115643
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOERGENS BECKER GISELA
Original Assignee
DOERGENS BECKER GISELA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DOERGENS BECKER GISELA filed Critical DOERGENS BECKER GISELA
Priority to DE1996115643 priority Critical patent/DE19615643A1/en
Publication of DE19615643A1 publication Critical patent/DE19615643A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T1/00Details of spark gaps
    • H01T1/14Means structurally associated with spark gap for protecting it against overload or for disconnecting it in case of failure
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/042Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage comprising means to limit the absorbed power or indicate damaged over-voltage protection device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H01H2037/762Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
    • H01H2037/763Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H7/00Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
    • H02H7/18Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for batteries; for accumulators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10174Diode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10181Fuse
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/176Removing, replacing or disconnecting component; Easily removable component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304Protecting a component during manufacturing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fuses (AREA)
  • Protection Of Static Devices (AREA)

Abstract

The arrangement has a series circuit of at least one voltage limiting element (1) and a temperature sensitive switch element (2) with at least a first and second terminal. When the operating temperature is normal, the temperature sensitive element (2) forms a current connection. When a predetermined temperature is exceeded the temperature sensitive element (2) forms a current restriction. The electronic circuit to be protected is connected to the connection point between the voltage limiting element (1) and the temperature sensitive element (2). A heat conductive connection is provided between the voltage limiting element and the temperature sensitive switch element. The heat conductive connection (9) is formed such that the connection point (7) of the voltage limiting element forms the first terminal (8) of the temperature sensitive element (2). The second terminal is formed of an electrically conductive spring (2). The current connection between the first and second terminal is formed by a solder bath (10). The melting temperature of this corresponds to the predetermined temperature to trigger the current restriction. The spring (2) has a tensioning force which withdraws the solder side of the second terminal of the temperature sensitive element (2) from the connection point of the voltage limiting element (5,7,8) when the solder bath has reached its melting temperature.

Description

Die Erfindung bezieht sich auf eine Überspannungsschutzanord­ nung (1, 2) für elektronische Baugruppen nach dem Oberbegriff des Anspruchs 1.The invention relates to an overvoltage protection arrangement ( 1 , 2 ) for electronic assemblies according to the preamble of claim 1.

Aus der DE-AS 18 16 553 ist eine Überspannungsschutzeinrich­ tung gemäß dem Oberbegriff des Anspruchs 1 bekannt, bei der sich die Forderung nach einem besonderen Schutz daraus ergibt, daß die Verbraucher oder Meßwertgeber in explosionsgefährdeten Räumen liegen. Die zur Spannungsbegrenzung dienenden Dioden sollen dabei durch vorgeschaltete Feinsicherungen gegen unzulässige Erwärmung geschützt sein.DE-AS 18 16 553 is an overvoltage protection device device known according to the preamble of claim 1, in which the demand for special protection arises from this, that the consumers or sensors in potentially explosive atmospheres Rooms. The diodes used to limit the voltage are to be protected against this by upstream microfuses inadmissible heating.

In der Praxis hat sich jedoch gezeigt, daß der Schutz durch die Sicherung nicht immer ausreicht, wenn die Überlastung in einem weiten Bereich schwanken kann.In practice, however, it has been shown that protection by the fuse is not always sufficient if the overload in can fluctuate over a wide range.

Erwärmt sich das spannungsbegrenzende Element durch eine an­ stehende Überspannung bzw. durch den als Folge der Überspan­ nung hindurchfließenden Strom, so kann dieses Element nach kurzer Zeit, zum Beispiel im Sekunden- oder Minutenbereich, überlastet sein, bevor die vorgeschaltete strombegrenzende Schmelzsicherung zum Ansprechen gebracht wird.The voltage-limiting element heats up by a standing overvoltage or as a result of the overvoltage current flowing through, this element can short time, for example in the seconds or minutes range, be overloaded before the upstream current limiting Fuse is triggered.

Deshalb richtet sich die Erfindung auf einen Schutz gegen eine Zerstörung der Überspannungsschutzeinrichtung, die ihrerseits schwerwiegende Folgen nach sich ziehen kann, wenn die zu schützenden elektronischen Baugruppen sicherheitstechnische Schutzeinrichtungen darstellen.Therefore, the invention is directed to protection against Destruction of the surge protective device, which in turn can have serious consequences if too protective electronic assemblies Represent protective devices.

Gemäß der Erfindung ist vorgesehen, daß dem spannungsbegren­ zenden Element (1) ein temperaturempfindliches Schaltelement (2) unter besonders guter thermischer Kopplung (9) zugeordnet ist. Diese wird erreicht, indem ein Anschluß (7) des span­ nungsbegrenzenden Elements gleichermaßen einen Anschluß (8) des temperaturempfindlichen Schaltelements bildet.According to the invention it is provided that the voltage-limiting element ( 1 ) is assigned a temperature-sensitive switching element ( 2 ) with particularly good thermal coupling ( 9 ). This is achieved in that a connection ( 7 ) of the voltage-limiting element likewise forms a connection ( 8 ) of the temperature-sensitive switching element.

Im Falle einer unzulässigen Erwärmung wird der die Erwärmung hervorrufende Stromfluß unterbrochen, indem das temperaturemp­ findliche Schaltelement öffnet.In the event of inadmissible warming, it becomes warming causing current flow interrupted by the tempemp sensitive switching element opens.

Als Grundlage für einen vereinigenden Aufbau des spannungs­ begrenzenden Elements mit dem temperaturempfindlichen Schalt­ element eignet sich beispielsweise das Tragblech oder ein Lötanschluß in unmittelbarer Nähe des Gehäusekörpers (7) einer bipolaren Begrenzerdiodenanordnung oder eines zur Begrenzung verwendeten Halbleiterschalters, der wiederum ein aktiver Teil einer Schaltungsanordnung zur Spannungsbegrenzung sein kann. Das begrenzende Element führt an seinem Tragblech, seiner Kühlfahne oder an mindestens einer seiner Elektroden die durch die Begrenzungsfunktion hervorgerufene Temperatur. Benutzt man nun die temperaturführende Stelle selbst (7) als Teil des temperaturempfindlichen Schaltelements (8), ist eine optimale thermische Kopplung gegeben.As a basis for a unifying structure of the voltage-limiting element with the temperature-sensitive switching element, for example, the support plate or a solder connection in the immediate vicinity of the housing body ( 7 ) of a bipolar limiter diode arrangement or a semiconductor switch used for limitation, which in turn is an active part of a circuit arrangement for voltage limitation, is suitable can be. The limiting element guides the temperature caused by the limiting function on its support plate, its cooling vane or on at least one of its electrodes. If the temperature-carrying point itself (7) is now used as part of the temperature-sensitive switching element ( 8 ), there is an optimal thermal coupling.

Ein Tragblech oder eine Kühlfahne bietet darüber hinaus die für den Zusammenbau der Einheit geeignete mechanische Festig­ keit. Der Stromfluß unter normalen Betriebsbedingungen erfolgt über einen Metallfinger oder eine elektrisch leitfähige Feder, der bzw. die über einen Lottropfen mit der temperaturführenden Stelle des spannungsbegrenzenden Elements verbunden ist und unter mechanischer Spannung (22) steht. Anstelle der Feder und des Lottropfens kann auch eine Lotbrücke vorgesehen sein, die im Falle ihres Abschmelzens den Stromfluß unterbricht. Die Auslösetemperatur des verwendeten Lots beträgt vorzugsweise etwa 100°C, weil dann noch keine Beschädigung der Bauteile der Schutzeinrichtung und der gegebenenfalls zur Isolierung einge­ setzten Werkstoffe, insbesondere von Kunstharzen, zu erwarten ist.A carrier plate or a cooling vane also offers the mechanical strength suitable for assembling the unit. The current flow under normal operating conditions takes place via a metal finger or an electrically conductive spring which is connected to the temperature-carrying point of the voltage-limiting element via a solder drop and is under mechanical tension ( 22 ). Instead of the spring and the solder drop, a solder bridge can also be provided, which interrupts the current flow when it melts. The trigger temperature of the solder used is preferably about 100 ° C, because then no damage to the components of the protective device and any materials used for insulation, especially synthetic resins, is to be expected.

Zur näheren Erläuterung der Erfindung, die in der Zeichnung Fig. 1 als Schaltplan dargestellt ist, werden anhand der Zeichnungen Fig. 2 und Fig. 3 zwei Ausführungsbeispiele beschrieben.For further explanation of the invention, which is shown as a circuit diagram in the drawing Fig. 1, 3, two embodiments are based on the drawings Fig. 2 and Fig. Described.

Die zu schützende Elektronikbaugruppe (6) ist ein Über­ wachungsstromkreis für eine Batterie, die gegen Unter- und Überladung zu schützen ist, da sie bei Tiefentladung Schaden nehmen und bei Überladung explodieren kann.The electronics module ( 6 ) to be protected is a monitoring circuit for a battery which is to be protected against undercharging and overcharging, since it can be damaged in the event of deep discharge and can explode if overcharged.

Parallel zu der zu schützenden Überwachungselektronik liegt ein spannungsbegrenzendes Element (1), welches seine Begren­ zungsfunktion dann aufnimmt, wenn die Spannung an den Ein­ gangsklemmen (3, 4) einen für dem Überwachungsstromkreis zu hohen Wert überschreitet.Parallel to the monitoring electronics to be protected is a voltage-limiting element ( 1 ), which takes on its limiting function when the voltage at the input terminals ( 3 , 4 ) exceeds a value that is too high for the monitoring circuit.

Das spannungsbegrenzende Element kann beispielsweise eine Transienten-Suppressor-Schutzdiode oder ein Thyristor sein, dessen Zündelektrode mit der Anode einer passend dimensionier­ ten Zenerdiode verbunden ist und deren Kathode an die Anode des Thyristors geschaltet ist. Ersetzt man den Thyristor durch einen Triac, so spricht dieser in einer Richtung gemäß der Zenerspannung und in dazu inverser Richtung gemäß ihrer Fluß­ spannung in Diodenrichtung an, bewirkt also auch einen Schutz gegen eine Falschpolung der Versorgungsspannung. The voltage-limiting element can be, for example Transient suppressor protection diode or a thyristor, whose ignition electrode with the anode of a suitable dimension ten zener diode is connected and its cathode to the anode of the thyristor is switched. If you replace the thyristor a triac, it speaks in one direction according to the Zener voltage and in the opposite direction according to its flow voltage in the direction of the diode, thus also provides protection against incorrect polarity of the supply voltage.  

Im normalen Betriebsfall ist das temperaturempfindliche Schaltelement, in Fig. 1 durch das Schaltersymbol (2) symbolisiert, stets geschlossen. Im Falle einer Überspannung an den Klemmen (3, 4) kommt es aufgrund des Stromflusses zu einer mehr oder weniger starken Erwärmung des spannungsbegren­ zenden Elements. Diese bleibt bei mäßiger Beanspruchung, zum Beispiel bis zu 100°C, ohne Folgen. Wird aber die zulässige Temperaturgrenze überschritten, bringt das spannungsbegren­ zende Element (1) das temperaturempfindliche Schaltelement (2) über die thermische Kopplung (9) zum Ansprechen.In normal operation, the temperature-sensitive switching element, symbolized in FIG. 1 by the switch symbol ( 2 ), is always closed. In the event of an overvoltage at the terminals ( 3 , 4 ), the voltage-limiting element heats up to a greater or lesser extent due to the current flow. With moderate stress, for example up to 100 ° C, this has no consequences. However, if the permissible temperature limit is exceeded, the voltage-limiting element ( 1 ) triggers the temperature-sensitive switching element ( 2 ) via the thermal coupling ( 9 ).

In dem Ausführungsbeispiel nach Fig. 2 schmilzt dann der Lottropfen (10) und gibt die Feder (2) frei, so daß diese sich entsprechend ihrer Vorspannung bewegen kann und damit jeden weiteren Stromfluß unterbricht.In the exemplary embodiment according to FIG. 2, the solder drop ( 10 ) then melts and releases the spring ( 2 ) so that it can move according to its pretension and thus interrupt any further current flow.

In dem Ausführungsbeispiel nach Fig. 3 schmilzt statt dessen die Lotbrücke (16) und zieht sich aufgrund ihrer Oberflächen­ spannung, unterstützt durch das sie umgebende Flußmittel (17), kugelförmig zusammen, wobei die elektrische Brückenverbindung öffnet und somit den Stromfluß unterbricht.In the embodiment of FIG. 3, the solder bridge ( 16 ) melts instead and pulls due to their surface tension, supported by the surrounding flux ( 17 ), spherical together, the electrical bridge connection opens and thus interrupts the flow of current.

Die weiteren Bezeichnungen in Fig. 2 und 3 bedeuten:The further designations in FIGS. 2 and 3 mean:

BezugszeichenlisteReference list

7, 8 = Gemeinsamer Anschluß des spannungsbegrenzenden Elements und des temperaturempfindlichen Schaltelements;
14 = Platine;
11 = Lot zur Fixierung der Bauteile auf der Platine;
12, 13 = Leiterbahnen.
7 , 8 = common connection of the voltage-limiting element and the temperature-sensitive switching element;
14 = circuit board;
11 = solder for fixing the components on the board;
12 , 13 = conductor tracks.

Claims (5)

1. Anordnung zum Schutz einer spannungsbegrenzenden Schal­ tungsanordnung vor Überhitzung sowie zum Schutz der an diese Anordnung angeschlossenen Baugruppe vor Überspannung mit einer Reihenschaltung aus mindestens einem spannungsbegrenzenden Element der spannungsbegrenzenden Schaltungsanordnung und aus einem temperaturempfindlichen Schaltelement mit mindestens einem ersten und einem zweiten Anschluß, wobei das temperatur­ empfindliche Schaltelement bei normaler Betriebstemperatur eine Stromverbindung und bei Überschreiten einer vorgegebenen Temperatur eine Stromhemmung bildet, wobei an die Verbindungs­ stelle des spannungsbegrenzenden Elementes mit dem temperatur­ empfindlichen Schaltelement die zu schützende elektronische Baugruppe angeschlossen ist, und wobei zwischen dem spannungs­ begrenzenden Element und dem temperaturempfindlichen Schalt­ element eine wärmeleitende Verbindung vorgesehen ist, dadurch gekennzeichnet, daß die wärmeleitende Verbindung (9) zwischen dem spannungsbegrenzenden Element (1) und dem temperaturempfindlichen Schaltelement (2) dadurch hergestellt wird, daß die Verbindungsstelle (7) des spannungsbegrenzenden Elements den ersten Anschluß (8) des temperaturempfindlichen Schaltelements bildet,
daß der zweite Anschluß des temperaturempfindlichen Schalt­ elements aus einer elektrisch leitfähigen Feder (2, 22) gebildet wird,
daß die Stromverbindung zwischen dem ersten und dem zweiten Anschluß durch einen Lottropfen (10) erfolgt, wobei die Schmelztemperatur des Lottropfens der vorgegebenen Temperatur zur Auslösung dem Stromhemmung entspricht,
und daß die Feder (2) eine Spannkraft (22) aufweist, die den lottropfenseitigen Teil des zweiten Anschlusses des tempera­ turempfindlichen Schaltelements von der Verbindungsstelle des spannungsbegrenzenden Elements (5, 7, 8) abzieht, wenn der Lottropfen seine Schmelztemperatur erreicht hat.
1. Arrangement for protecting a voltage-limiting circuit arrangement from overheating and for protecting the module connected to this arrangement from overvoltage with a series circuit comprising at least one voltage-limiting element of the voltage-limiting circuit arrangement and a temperature-sensitive switching element with at least a first and a second connection, the temperature sensitive switching element forms a current connection at normal operating temperature and a current inhibition when a predetermined temperature is exceeded, the electronic module to be protected being connected to the connection point of the voltage-limiting element with the temperature-sensitive switching element, and wherein between the voltage-limiting element and the temperature-sensitive switching element a thermally conductive connection is provided, characterized in that the thermally conductive connection ( 9 ) between the voltage limiting element ( 1 ) and the temperature-sensitive switching element ( 2 ) is produced in that the connection point ( 7 ) of the voltage-limiting element forms the first connection ( 8 ) of the temperature-sensitive switching element,
that the second connection of the temperature-sensitive switching element is formed from an electrically conductive spring ( 2 , 22 ),
that the current connection between the first and the second connection is made by a solder drop ( 10 ), the melting temperature of the solder drop corresponding to the predetermined temperature for triggering the current inhibition,
and that the spring ( 2 ) has a tensioning force ( 22 ) which subtracts the solder drop-side part of the second connection of the temperature-sensitive switching element from the connection point of the voltage-limiting element ( 5 , 7 , 8 ) when the solder drop has reached its melting temperature.
2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Bauteile in SMD-Technik auf einer Platine (14) oder auf einem äquivalenten Substrat befestigt sind.2. Arrangement according to claim 1, characterized in that the components are attached in SMD technology on a circuit board ( 14 ) or on an equivalent substrate. 3. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Feder als zweiter Anschluß des tempe­ raturempfindlichen Schaltelements durch ein Leiterbahnstück (12) auf der Platine und der Lottropfen durch eine Lotbrücke (16) zwischen der Verbindungsstelle des spannungsbegrenzenden Elements (7) und dem Leiterbahnstück ersetzt ist, so daß sich die Lotbrücke bei Überschreiten ihrer Schmelztemperatur kugel­ förmig auf die Verbindungsstelle und/oder auf das Leiterbahn­ stück zurückzieht und damit die Stromhemmung auslöst.3. Arrangement according to one of the preceding claims, characterized in that the spring as a second connection of the temperature-sensitive switching element by a conductor track piece ( 12 ) on the circuit board and the solder drops by a solder bridge ( 16 ) between the connection point of the voltage-limiting element ( 7 ) and the conductor track piece is replaced so that the solder bridge retracts in a spherical shape when the melting temperature is exceeded on the connection point and / or on the conductor track and thus triggers the current inhibition. 4. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß in der direkten Umgebung des Lottropfens oder der Lotbrücke ein Flußmittel (17) vorhanden ist, das die Oberflächenspannung des Lotes während des Schmelzvorgangs verstärkt.4. Arrangement according to one of the preceding claims, characterized in that in the immediate vicinity of the solder drop or the solder bridge, a flux ( 17 ) is present which increases the surface tension of the solder during the melting process. 5. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Schmelztemperatur des Lotes unterhalb der Schmelztemperatur der Lötstellen eingestellt ist, durch welche die Bauteile auf der Platine montiert sind.5. Arrangement according to one of the preceding claims, characterized characterized in that the melting temperature of the solder below the melting temperature of the solder joints is set by which the components are mounted on the board.
DE1996115643 1996-04-21 1996-04-21 Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage Withdrawn DE19615643A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1996115643 DE19615643A1 (en) 1996-04-21 1996-04-21 Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996115643 DE19615643A1 (en) 1996-04-21 1996-04-21 Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage

Publications (1)

Publication Number Publication Date
DE19615643A1 true DE19615643A1 (en) 1997-10-23

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752781A1 (en) * 1997-11-28 1999-06-02 Wabco Gmbh Circuit arrangement for protecting an electrical component from an electrical potential
EP1098418A3 (en) * 1999-11-03 2002-12-11 ABB Schweiz AG Surge arrester for low voltage network
WO2008116685A1 (en) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Thermal fuse
DE112004000913B4 (en) * 2003-06-04 2009-10-15 Bel Fuse Inc. Telecom circuit protection device
WO2013017682A1 (en) * 2011-08-03 2013-02-07 Phoenix Contact Gmbh & Co. Kg Thermal overload protection apparatus
DE102017131432B3 (en) 2017-10-12 2018-12-06 Dehn + Söhne Gmbh + Co. Kg Arrangement for the thermal monitoring of electronic components located on a wiring carrier

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752781A1 (en) * 1997-11-28 1999-06-02 Wabco Gmbh Circuit arrangement for protecting an electrical component from an electrical potential
EP1098418A3 (en) * 1999-11-03 2002-12-11 ABB Schweiz AG Surge arrester for low voltage network
DE112004000913B4 (en) * 2003-06-04 2009-10-15 Bel Fuse Inc. Telecom circuit protection device
WO2008116685A1 (en) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Thermal fuse
CN101647081B (en) * 2007-03-26 2013-06-19 罗伯特.博世有限公司 thermal fuse
US8633795B2 (en) 2007-03-26 2014-01-21 Robert Bosch Gmbh Thermal fuse
WO2013017682A1 (en) * 2011-08-03 2013-02-07 Phoenix Contact Gmbh & Co. Kg Thermal overload protection apparatus
CN103733293A (en) * 2011-08-03 2014-04-16 菲尼克斯电气公司 Thermal overload protection apparatus
CN103733293B (en) * 2011-08-03 2015-12-23 菲尼克斯电气公司 thermal overload protection device
DE102017131432B3 (en) 2017-10-12 2018-12-06 Dehn + Söhne Gmbh + Co. Kg Arrangement for the thermal monitoring of electronic components located on a wiring carrier

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