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DE19581661T1 - Ic-Aufnahmeschalen-Lagervorrichtung und Montagevorrichtung für diese - Google Patents

Ic-Aufnahmeschalen-Lagervorrichtung und Montagevorrichtung für diese

Info

Publication number
DE19581661T1
DE19581661T1 DE19581661T DE19581661T DE19581661T1 DE 19581661 T1 DE19581661 T1 DE 19581661T1 DE 19581661 T DE19581661 T DE 19581661T DE 19581661 T DE19581661 T DE 19581661T DE 19581661 T1 DE19581661 T1 DE 19581661T1
Authority
DE
Germany
Prior art keywords
receiving cup
cup storage
storage device
mounting device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19581661T
Other languages
English (en)
Other versions
DE19581661C2 (de
Inventor
Yoshito Kobayashi
Hiroto Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25436294A external-priority patent/JP3497251B2/ja
Priority claimed from JP7082395A external-priority patent/JPH08241921A/ja
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19581661T1 publication Critical patent/DE19581661T1/de
Application granted granted Critical
Publication of DE19581661C2 publication Critical patent/DE19581661C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P72/16
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316Testing of analog circuits
    • H10P72/0618
    • H10P72/17
    • H10P72/18
    • H10P72/3404
    • H10P72/3411
    • H10P72/50
    • H10P72/74
    • H10W46/00
    • H10P72/741
    • H10W46/601
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19581661T 1994-09-22 1995-09-20 Ic-Aufnahmeschalen-Lagervorrichtung und Montagevorrichtung für diese Expired - Fee Related DE19581661C2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP25436294A JP3497251B2 (ja) 1994-09-22 1994-09-22 Ic収納用トレイカセット構造
JP7082395A JPH08241921A (ja) 1995-03-03 1995-03-03 Ic搬送装置用トレイカセット並びにトレイカセット装着台
PCT/JP1995/001868 WO1996009644A1 (en) 1994-09-22 1995-09-20 Container for ic trays, and base plate for mounting the container

Publications (2)

Publication Number Publication Date
DE19581661T1 true DE19581661T1 (de) 1997-07-17
DE19581661C2 DE19581661C2 (de) 1998-11-26

Family

ID=26411954

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581661T Expired - Fee Related DE19581661C2 (de) 1994-09-22 1995-09-20 Ic-Aufnahmeschalen-Lagervorrichtung und Montagevorrichtung für diese

Country Status (5)

Country Link
US (2) US6070731A (de)
KR (1) KR100270137B1 (de)
DE (1) DE19581661C2 (de)
MY (1) MY114198A (de)
WO (1) WO1996009644A1 (de)

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JP3689215B2 (ja) * 1997-02-20 2005-08-31 株式会社ルネサステクノロジ 半導体デバイスのテスト用搬送装置
EP0914968B1 (de) * 1997-11-10 2003-06-11 William H. Gunther Verfahren zum Sortieren und Zuführen von gedruckten Dokumenten nach einer Endbearbeitungsmaschine
US5928493A (en) * 1997-11-24 1999-07-27 Kaspar Electroplating Corporation Process and apparatus for electrocoagulative treatment of industrial waste water
JP3809008B2 (ja) * 1998-03-27 2006-08-16 株式会社アドバンテスト カストマトレイストッカ
JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ic試験装置並びにトレイの取り廻し方法
US6417484B1 (en) 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
US6262388B1 (en) 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6287068B1 (en) * 1998-12-21 2001-09-11 Micron Technology, Inc. Self-aligning tray carrier apparatus with tilt feature
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
US6305500B1 (en) 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments
US6990387B1 (en) * 2000-05-18 2006-01-24 Intel Corporation Test system for identification and sorting of integrated circuit devices
US6528760B1 (en) 2000-07-14 2003-03-04 Micron Technology, Inc. Apparatus and method using rotational indexing for laser marking IC packages carried in trays
US6524881B1 (en) 2000-08-25 2003-02-25 Micron Technology, Inc. Method and apparatus for marking a bare semiconductor die
US6334574B1 (en) * 2000-10-04 2002-01-01 Teung-Lin Huang Identification device for IC loading tray
KR20020091902A (ko) * 2001-06-01 2002-12-11 삼성전자 주식회사 물품보관용기
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
JP2004059116A (ja) * 2002-07-31 2004-02-26 Sharp Corp ディスプレイ用基板収納用トレイ及びディスプレイ用基板の取り出し機構並びにディスプレイ用基板の取り出し方法
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US7562923B2 (en) * 2004-02-09 2009-07-21 Mirae Corporation Tray transferring apparatus with gripper mechanism
JP5035761B2 (ja) * 2005-07-08 2012-09-26 村田機械株式会社 ストッカ
CN100501427C (zh) * 2005-10-10 2009-06-17 纬创资通股份有限公司 识别系统与方法
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
CN100592123C (zh) * 2006-06-28 2010-02-24 鸿富锦精密工业(深圳)有限公司 托盘料架和托盘料架装置
WO2008012889A1 (fr) * 2006-07-27 2008-01-31 Advantest Corporation Procédé de transfert de composants électroniques et dispositif de manipulation de composants électroniques
KR100809697B1 (ko) * 2006-08-08 2008-03-06 삼성전자주식회사 트레이 클램핑 장치
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly
ITUD20070202A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Contenitore per lo stoccaggio di piastre per circuiti elettronici e relativo procedimento
US7996174B2 (en) * 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US20090153993A1 (en) * 2007-12-18 2009-06-18 Teradyne, Inc. Disk Drive Testing
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8160739B2 (en) * 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US20110123301A1 (en) * 2008-04-17 2011-05-26 Scott Noble Bulk feeding storage devices to storage device testing systems
US8102173B2 (en) * 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US20090262455A1 (en) * 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8095234B2 (en) * 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8238099B2 (en) * 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US7945424B2 (en) * 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8041449B2 (en) * 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
WO2009148942A2 (en) * 2008-06-03 2009-12-10 Teradyne, Inc. Processing storage devices
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US8687356B2 (en) * 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
US20120273389A1 (en) * 2011-04-27 2012-11-01 Freescale Semiconductor, Inc. Semiconductor tray carrier
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US10161962B2 (en) * 2014-06-06 2018-12-25 Advantest Corporation Universal test cell
US20150118011A1 (en) * 2013-10-30 2015-04-30 Data I/O Corporation Tray stacker system and method of operation thereof
US9638748B2 (en) * 2014-04-10 2017-05-02 Texas Instruments Incorporated Tray loading system for electronic components
US9618570B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9678148B2 (en) 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9618574B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9638749B2 (en) * 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
CN111942841B (zh) * 2020-08-19 2021-11-30 宁波三韩合金材料有限公司 一种料盘自动上料系统及使用方法
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

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EP0166448B1 (de) * 1984-06-29 1991-10-09 Advantest Corporation IC-Testeinrichtung
US4767003A (en) * 1985-10-18 1988-08-30 Hughes Aircraft Company Transparent, electrostatic protective container with readily accessible identification means
JPS62215444A (ja) * 1986-03-14 1987-09-22 Hitachi Ltd Fic充▲てん▼用トレイの供給装置
GB8611792D0 (en) * 1986-05-14 1986-06-25 Xerox Corp Sheet feed apparatus & cartridge
US4832612A (en) * 1986-10-31 1989-05-23 Amp Incorporated Protective carrier and securing means therefor
US4926118A (en) * 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
US5203666A (en) * 1988-05-18 1993-04-20 Fleetwood Systems, Inc. Automatic tray loading, unloading and storage system
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JPH03134982A (ja) * 1989-10-19 1991-06-07 Seikosha Co Ltd Icホルダ
US5073079A (en) * 1990-05-17 1991-12-17 Intelmatec Corporation Modular loading-unloading system for integrated circuits or the like
JP2921937B2 (ja) * 1990-07-18 1999-07-19 東京エレクトロン株式会社 Ic検査装置
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US5588797A (en) * 1994-07-18 1996-12-31 Advantek, Inc. IC tray handling apparatus and method
US5480280A (en) * 1994-10-21 1996-01-02 Conveying Industries, Inc. Method and apparatus for dispensing pallets
JP2709283B2 (ja) * 1995-04-07 1998-02-04 山一電機株式会社 Icキャリア
US5674047A (en) * 1995-07-13 1997-10-07 Chiron Diagnostics Corporation Loading mechanism for probe tip tray
JP3225340B2 (ja) * 1995-07-27 2001-11-05 株式会社新川 リードフレームの吸着保持装置
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Also Published As

Publication number Publication date
DE19581661C2 (de) 1998-11-26
US6070731A (en) 2000-06-06
KR960706190A (ko) 1996-11-08
KR100270137B1 (ko) 2000-11-01
US6354792B1 (en) 2002-03-12
WO1996009644A1 (en) 1996-03-28
MY114198A (en) 2002-08-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: B65G 49/05

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee