[go: up one dir, main page]

DE19518521A1 - Vehicle brake valve electrical control device housing - Google Patents

Vehicle brake valve electrical control device housing

Info

Publication number
DE19518521A1
DE19518521A1 DE19518521A DE19518521A DE19518521A1 DE 19518521 A1 DE19518521 A1 DE 19518521A1 DE 19518521 A DE19518521 A DE 19518521A DE 19518521 A DE19518521 A DE 19518521A DE 19518521 A1 DE19518521 A1 DE 19518521A1
Authority
DE
Germany
Prior art keywords
circuit board
housing
depression
printed circuit
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19518521A
Other languages
German (de)
Other versions
DE19518521C2 (en
Inventor
Johannes Schoettl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19518521A priority Critical patent/DE19518521C2/en
Publication of DE19518521A1 publication Critical patent/DE19518521A1/en
Application granted granted Critical
Publication of DE19518521C2 publication Critical patent/DE19518521C2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The housing has a cooperating cover (12) and base (11), with depressions (17) in the surface of the cover lying in thermal contact with a printed circuit board (13), or power components (16), contained within the housing, so that the cover acts as a heat sink. Pref the depression in the cover has a trapezoidal shape and contacts the upper surface of the circuit board, which supports the power components on the opposite side.

Description

Die Erfindung betrifft ein Gehäuse eines Steuergeräts gemäß Oberbegriff von Patentanspruch 1. Solche Steuergeräte weisen ein Gehäuse auf, in dem eine Leiterplatte angeordnet ist. Falls auf der Leiterplatte Leistungsbauelemente, die während ihres Betriebs Wärme erzeugen, angeordnet sind, so muß diese Wärme nach außen abgeführt werden.The invention relates to a housing of a control device according to Preamble of claim 1. Such control devices have a housing in which a circuit board is arranged. If on the circuit board power components that during generate heat during their operation, must be arranged Heat can be dissipated to the outside.

Bei einem bekannten Steuergerät (US 5,109,318) liegen die Leistungsbauelemente flach auf der Leiterplatte auf. Gehäuse­ deckel und -boden klemmen die Leiterplatte derart zwischen sich ein, daß die Leistungsbauelemente in direktem thermi­ schen Kontakt mit den Gehäuseteilen stehen. Bei einem solchen Steuergerät ist es doch Voraussetzung, daß alle Leistungsbau­ elemente gleich hoch sind. Andere, höhere Bauelemente dürfen nicht auf der Leiterplatte angeordnet sein.In a known control device (US 5,109,318) are the Power components flat on the circuit board. Housing The lid and base clamp the PCB in this way agree that the power components in direct thermi contact with the housing parts. With such a Control unit it is a prerequisite that all power construction elements are the same height. Other, higher components are allowed not be placed on the circuit board.

Der Erfindung liegt das Problem zugrunde, ein Gehäuse für ein Steuergerät zu schaffen, durch das die von Leistungsbauele­ menten erzeugte Wärme nach außen abgeführt wird und in dem genügend Platz für eine elektronische Schaltung ist.The invention is based on the problem of a housing for To create control unit by which of power components ment generated heat is dissipated to the outside and in the there is enough space for an electronic circuit.

Das Problem wird erfindungsgemäß durch die Merkmale von Pa­ tentanspruch 1 gelöst. Vorteilhafte Ausgestaltungen der Er­ findung sind in den Unteransprüchen gekennzeichnet.The problem is solved according to the invention by the features of Pa Claim 1 solved. Advantageous embodiments of the Er invention are characterized in the subclaims.

Ein Ausführungsbeispiel der Erfindung wird anhand der schema­ tischen Zeichnung näher erläutert. In der Figur ist ein Schnitt durch ein erfindungsgemäßes Gehäuse eines Steuerge­ räts dargestellt.An embodiment of the invention is based on the schematic table drawing explained. In the figure is a Section through an inventive housing of a Steuerge represented by riddles.

Ein Gehäuse eines Steuergeräts 10, insbesondere für ein Kraftfahrzeug, weist einen Gehäuseboden 11 und einen Gehäuse­ deckel 12 auf. Zwischen den beiden ist eine eine Schaltung tragende Leiterplatte 13 angeordnet.A housing of a control device 10 , in particular for a motor vehicle, has a housing base 11 and a housing cover 12 . A circuit board 13 carrying a circuit is arranged between the two.

Die Erfindung wird anhand des Ausführungsbeispiels eines ABS- Steuergeräts 10 dargestellt. Bei einem solchen Steuergerät 10 werden Ventile elektromagnetisch durch Spulen 14 gesteuert. Über einen Steckverbinder 15 wird die die Ventile steuernde Schaltung mit Energie und Steuersignalen versorgt. Die Erfin­ dung kann aber auch für andere Steuergeräte, wie beispiels­ weise Motorsteuergeräte oder Getriebesteuergeräte verwendet werden.The invention is illustrated on the basis of the exemplary embodiment of an ABS control unit 10 . In such a control device 10 , valves are controlled electromagnetically by coils 14 . The circuit controlling the valves is supplied with energy and control signals via a plug connector 15 . The inven tion can also be used for other control units, such as engine control units or transmission control units.

Auf der die Schaltung tragenden Leiterplatte 13 sind unter anderem Leistungsbauelemente 16 angeordnet, die während ihres Betriebs eine hohe Wärme erzeugen, die nach außen abgeführt werden muß. Die Wärme wird erfindungsgemäß über den Gehäuse­ deckel 12 abgeführt. Hierzu weist der Gehäusedeckel 12 eine oder mehrere Senken 17 auf. Der Gehäusedeckel 12, der z. B. aus Blech hergestellt ist, hat also an bestimmten Stellen Vertiefungen.On the circuit board 13 carrying the circuit, power components 16 are arranged, among other things, which generate a high amount of heat during their operation, which must be dissipated to the outside. The heat is removed according to the invention via the housing cover 12 . For this purpose, the housing cover 12 has one or more depressions 17 . The housing cover 12 , the z. B. is made of sheet metal, so has recesses at certain points.

Die Senken 17 können - in der Zeichenebene - einen trapezför­ migen Querschnitt ihrer Wand 18 haben und in einer Ebene quer dazu einen kreisförmigen Querschnitt. Der Querschnitt ist je­ doch für die Erfindung unerheblich. Wesentlich ist nur, daß ein Boden 19 der Senke 17 entweder auf der Leiterplatte 13 oder den Leistungsbauelementen 16 aufliegt und die Wand 18 der Senke 17 die Wärme an den gesamten Gehäusedeckel 12 wei­ tergibt.The depressions 17 can - in the plane of the drawing - have a trapezoidal cross section of their wall 18 and in a plane transverse to it a circular cross section. The cross section is irrelevant to the invention. It is only essential that a bottom 19 of the depression 17 rests either on the printed circuit board 13 or the power components 16 and the wall 18 of the depression 17 transfers the heat to the entire housing cover 12 .

Damit die Wärme besser nach außen abgeführt werden kann, wird der Gehäusedeckel 12 im Bereich der Senke 17 mit einer mecha­ nischen Spannung versehen. Hierzu ist der Gehäusedeckel 12 an seinem Rande durch eine nachgiebige Vergußmasse 20 elastisch gelagert und in den Gehäuseboden 11 mit Hilfe von Rasthaken 21 eingerastet oder eingeschnappt. Wenn der Boden 19 der Senke 17 tiefer ausgebildet ist, d. h. tiefer liegt als die Lagerung des Gehäusedeckels 12 in der Vergußmasse 20, so liegt der Boden 19 im montierten Zustand des Steuergeräts 10 abhängig davon mit einem gewissen Druck auf der Leiterplatte 13 oder dem Leistungsbauelement 16 auf. Der Boden 19 der Senke 17 wird also auf die Leiterplatte 13 oder das Lei­ stungsbauelement 16 gepreßt. Somit weist der Gehäusedeckel 12 eine mechanische Vorspannung auf.So that the heat can be better dissipated to the outside, the housing cover 12 is provided with a mechanical tension in the region of the depression 17 . For this purpose, the housing cover 12 is elastically supported on its edge by a resilient potting compound 20 and snapped or snapped into the housing base 11 with the aid of locking hooks 21 . If the ground is the valley formed 19 17 deeper, is that deeper than the bearing of the housing cover 12 in the potting compound 20, as is the bottom 19 in the assembled state of the control unit 10 depending on a certain pressure on the circuit board 13 or the power component 16 on. The bottom 19 of the sink 17 is thus pressed on the circuit board 13 or the Lei stungsbauelement 16 . The housing cover 12 thus has a mechanical pretension.

Damit die Leiterplatte 13 nicht durch den durch die Senke 17 verursachten Druck bricht, sind Abstützelemente 22 vorgese­ hen, die die Leiterplatte 13 im Bereich um die Senke 17 un­ terstützen. Die Abstützelemente 22 können einstückig mit dem Gehäuseboden 11 hergestellt sein. Es können aber ebensogut separate Abstandhalter dafür verwendet werden. Zwischen dem Boden 19 der Senke 17 und der Leiterplatte 13 oder dem Lei­ stungsbauelement 16 können Isolierfolien 23 angeordnet sein, damit keine elektrische Verbindung zwischen dem Gehäuse und der Leiterplatte 13 oder dem Leistungsbauelement 16 entsteht. Somit wird die Gefahr eines Kurzschlusses verringert.So that the circuit board 13 does not break through the pressure caused by the depression 17 , support elements 22 are hen vorgese that support the printed circuit board 13 in the area around the depression 17 un. The support elements 22 can be made in one piece with the housing base 11 . However, separate spacers can also be used for this. Between the bottom 19 of the depression 17 and the printed circuit board 13 or the power component 16 , insulating foils 23 can be arranged so that no electrical connection between the housing and the printed circuit board 13 or the power component 16 occurs. This reduces the risk of a short circuit.

Der Gehäusedeckel 12 kann auch mehrere Senken 17 aufweisen. Ebenso kann eine einzige Senke 17 die Wärme von mehreren Lei­ stungsbauelementen 16, die im Bereich des Bodens 19 der Senke angeordnet sind, abführen.The housing cover 12 can also have a plurality of depressions 17 . Likewise, a single depression 17 can dissipate the heat from a plurality of performance components 16 which are arranged in the region of the bottom 19 of the depression.

Mit dem erfindungsgemäßen Gehäuse werden separate Kühlkörper zum Abführen von Wärme eingespart. Außerdem wird die Wärme sofort nach außen an die Umgebung abgeführt.With the housing according to the invention separate heat sinks saved for dissipating heat. In addition, the heat immediately dissipated to the outside world.

Claims (4)

1. Gehäuse eines Steuergeräts (10), insbesondere für ein Kraftfahrzeug, mit einem Gehäuseboden (11) und einem Gehäuse­ deckel (12), zwischen denen eine eine Schaltung tragende Lei­ terplatte (13) angeordnet ist, dadurch gekennzeichnet, daß der Gehäusedeckel (12) als Kühlkörper mit zumindest einer Senke (17) ausgebildet ist, wobei die Senke (17) thermisch mit der Leiterplatte (13) oder zumindest einem auf der Lei­ terplatte angeordneten Leistungsbauelement (16) verbunden ist.1. Housing of a control unit ( 10 ), in particular for a motor vehicle, with a housing base ( 11 ) and a housing cover ( 12 ), between which a circuit-carrying Lei terplatte ( 13 ) is arranged, characterized in that the housing cover ( 12 ) is designed as a heat sink with at least one depression ( 17 ), the depression ( 17 ) being thermally connected to the printed circuit board ( 13 ) or at least one power component ( 16 ) arranged on the printed circuit board. 2. Gehäuse nach Anspruch 1, dadurch gekennzeichnet, daß die Senke (17) trapezförmig ausgebildet ist und auf der Ober­ seite einer Leiterplatte (13) aufliegt, wobei ein Leistungs­ bauelement (16) gegenüberliegend auf der Unterseite der Lei­ terplatte (13) angeordnet ist.2. Housing according to claim 1, characterized in that the depression ( 17 ) is trapezoidal and rests on the upper side of a printed circuit board ( 13 ), a power component ( 16 ) being arranged opposite one another on the underside of the circuit board ( 13 ) . 3. Gehäuse nach Anspruch 1, dadurch gekennzeichnet, daß die Senke (17) trapezförmig ausgebildet ist und unmittelbar auf einem Leistungsbauelement (16) aufliegt, das auf der Oberseite der Leiterplatte (13) angeordnet ist.3. Housing according to claim 1, characterized in that the depression ( 17 ) is trapezoidal and rests directly on a power component ( 16 ) which is arranged on the top of the circuit board ( 13 ). 4. Gehäuse nach einem der Ansprüche 2 oder 3, dadurch gekennzeichnet, daß die Senke (17) über eine Isolierfolie (23) mit der Leiter­ platte (13) oder dem Leistungsbauelement (16) thermisch ver­ bunden ist.4. Housing according to one of claims 2 or 3, characterized in that the depression ( 17 ) via an insulating film ( 23 ) with the printed circuit board ( 13 ) or the power component ( 16 ) is thermally connected.
DE19518521A 1995-05-19 1995-05-19 Housing of a control device, in particular for a motor vehicle Expired - Lifetime DE19518521C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19518521A DE19518521C2 (en) 1995-05-19 1995-05-19 Housing of a control device, in particular for a motor vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19518521A DE19518521C2 (en) 1995-05-19 1995-05-19 Housing of a control device, in particular for a motor vehicle

Publications (2)

Publication Number Publication Date
DE19518521A1 true DE19518521A1 (en) 1996-11-21
DE19518521C2 DE19518521C2 (en) 1997-08-28

Family

ID=7762414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19518521A Expired - Lifetime DE19518521C2 (en) 1995-05-19 1995-05-19 Housing of a control device, in particular for a motor vehicle

Country Status (1)

Country Link
DE (1) DE19518521C2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701731A1 (en) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE10206271A1 (en) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Thermal conductor connecting heat sink to substrate carrying electronic components used for engine valve control, has wavy profile and resilience
DE10300175A1 (en) * 2003-01-08 2004-07-22 Hella Kg Hueck & Co. Electronic unit with heat dissipating housing part, has heat-conducting film between platform-like region of housing part and underside of circuit carrier with electronic components on upper side
DE102004040596A1 (en) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Electrical device with a housing and a heat sink
DE102005015749A1 (en) * 2005-04-06 2006-10-12 Conti Temic Microelectronic Gmbh Circuit board cooling apparatus and method of making the same
DE10011807B4 (en) * 2000-03-10 2013-08-01 Continental Teves Ag & Co. Ohg Electronic control unit for electrohydraulic pressure control devices
DE102013001645A1 (en) * 2013-01-31 2014-07-31 Connaught Electronics Ltd. Electronic device for camera system of motor car, has cooling component whose rib-shaped cooling elements are projected from bottom wall out of recess so that cooling component limits side walls in inner space of housing
DE102013210623B4 (en) 2012-09-14 2022-11-10 Hitachi Astemo, Ltd. Electronic control device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10123198A1 (en) * 2001-05-12 2002-12-19 Hella Kg Hueck & Co Arrangement of a housing and a circuit carrier
DE10129511A1 (en) * 2001-06-19 2003-01-16 Hella Kg Hueck & Co Device for cooling electronic circuit, especially for motor vehicles, has cooling arrangement with cooling plate connected to circuit board to carry heat away protruding into hollow volume
DE10315299A1 (en) * 2003-04-04 2004-10-14 Hella Kg Hueck & Co. Housing for circuit board and power components, has deformable thermally-conductive medium arranged between circuit board and base of other half of housing
DE10334147A1 (en) * 2003-07-26 2005-02-17 Hella Kgaa Hueck & Co. Infra-red imaging system for automobile using headlamp with lamp and filter for blocking visible light together with IR sensor coupled to display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3307654A1 (en) * 1983-03-04 1984-09-06 Robert Bosch Gmbh, 7000 Stuttgart Electric switchgear in vehicular engine compartment - has cooling intermediate bottom with notch for electric component to be cooled
DE3627372A1 (en) * 1986-08-12 1988-02-25 Loewe Opta Gmbh Heat sink for electronic components
DE3927755A1 (en) * 1989-08-23 1991-02-28 Standard Elektrik Lorenz Ag Heat sink for solid state components - holds surface of element against adaptor conducting heat to sink plate
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh ASSEMBLY OF SEMICONDUCTOR COMPONENTS ON A PCB

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3307654A1 (en) * 1983-03-04 1984-09-06 Robert Bosch Gmbh, 7000 Stuttgart Electric switchgear in vehicular engine compartment - has cooling intermediate bottom with notch for electric component to be cooled
DE3627372A1 (en) * 1986-08-12 1988-02-25 Loewe Opta Gmbh Heat sink for electronic components
DE3927755A1 (en) * 1989-08-23 1991-02-28 Standard Elektrik Lorenz Ag Heat sink for solid state components - holds surface of element against adaptor conducting heat to sink plate
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh ASSEMBLY OF SEMICONDUCTOR COMPONENTS ON A PCB

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701731A1 (en) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE10011807B4 (en) * 2000-03-10 2013-08-01 Continental Teves Ag & Co. Ohg Electronic control unit for electrohydraulic pressure control devices
DE10206271A1 (en) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Thermal conductor connecting heat sink to substrate carrying electronic components used for engine valve control, has wavy profile and resilience
DE10300175A1 (en) * 2003-01-08 2004-07-22 Hella Kg Hueck & Co. Electronic unit with heat dissipating housing part, has heat-conducting film between platform-like region of housing part and underside of circuit carrier with electronic components on upper side
DE10300175B4 (en) * 2003-01-08 2016-12-29 Hella Kgaa Hueck & Co. Electronic assembly with heat-dissipating housing part
DE102004040596A1 (en) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Electrical device with a housing and a heat sink
DE102005015749A1 (en) * 2005-04-06 2006-10-12 Conti Temic Microelectronic Gmbh Circuit board cooling apparatus and method of making the same
DE102013210623B4 (en) 2012-09-14 2022-11-10 Hitachi Astemo, Ltd. Electronic control device
DE102013001645A1 (en) * 2013-01-31 2014-07-31 Connaught Electronics Ltd. Electronic device for camera system of motor car, has cooling component whose rib-shaped cooling elements are projected from bottom wall out of recess so that cooling component limits side walls in inner space of housing

Also Published As

Publication number Publication date
DE19518521C2 (en) 1997-08-28

Similar Documents

Publication Publication Date Title
EP0873673B1 (en) Control device consisting of at least two housing sections
DE69400254T2 (en) Low force spring mount for a heat sink for an electronic component
DE102008033465B4 (en) POWER SEMICONDUCTOR MODULE SYSTEM AND POWER SUB-LEAD MODULE WITH A HOUSING AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR ASSEMBLY
EP0854666B1 (en) Control device comprising at least two housing parts
DE60007872T2 (en) MANUFACTURING METHOD OF AN ELECTRONIC PCB MODULE WITH HEAT EXTRACTION USING A CONVECTION-COOLED PCB
DE102007014789B3 (en) Arrangement of at least one power semiconductor module and a printed circuit board and power semiconductor module
EP1648744B1 (en) Electronic unit and method for manufacturing an electronic unit
EP1429385B1 (en) Housing for power semiconductor modules
DE10107711A1 (en) Electronic control unit with a connection between two circuit boards
DE112007002446T5 (en) Electronic circuit device and method for its manufacture
WO2010006924A1 (en) Motor control device of a vehicle
DE19518521C2 (en) Housing of a control device, in particular for a motor vehicle
DE19506664A1 (en) Electric control apparatus for vehicle IC engine electromechanical mechanism
EP0881866B1 (en) Control device
DE3627372C3 (en) Arrangement consisting of a printed circuit board, a heat sink and electronic components to be cooled
DE102020128904A1 (en) POWER ELECTRONIC MODULE WITH INTEGRATED COOLING DUCT
WO2002055908A1 (en) Plastic control plate for the gearbox control device of a hydraulic motor vehicle
DE60315469T2 (en) Heat dissipating insert, circuit with such an insert and method of manufacture
EP0652694B1 (en) Control apparatus for vehicle
DE102006056793B4 (en) Electronic device and method for producing the same
WO2008083878A1 (en) Fixing element for printed circuit boards
DE10123198A1 (en) Arrangement of a housing and a circuit carrier
DE102005035378B3 (en) Die-cast metal housing for storing electronic components on printed circuit board, has metallic cover partially resting against electronic components or pressed against heat dissipation surface in housing and secured to housing by screws
WO1996035233A1 (en) Cover for an electronic component
DE202023105368U1 (en) circuit board with hole structure

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CONTINENTAL AUTOMOTIVE GMBH, 30165 HANNOVER, DE

R071 Expiry of right
R071 Expiry of right