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DE19511300A1 - Method of forming antenna structure for inserting into chip-card - Google Patents

Method of forming antenna structure for inserting into chip-card

Info

Publication number
DE19511300A1
DE19511300A1 DE1995111300 DE19511300A DE19511300A1 DE 19511300 A1 DE19511300 A1 DE 19511300A1 DE 1995111300 DE1995111300 DE 1995111300 DE 19511300 A DE19511300 A DE 19511300A DE 19511300 A1 DE19511300 A1 DE 19511300A1
Authority
DE
Germany
Prior art keywords
antenna structure
structure according
conductor tracks
coil
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1995111300
Other languages
German (de)
Inventor
Michael Dipl Ing Zirngibl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Telefunken Microelectronic GmbH filed Critical Temic Telefunken Microelectronic GmbH
Priority to DE1995111300 priority Critical patent/DE19511300A1/en
Publication of DE19511300A1 publication Critical patent/DE19511300A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Details Of Aerials (AREA)

Abstract

The figure given shows a multi-layer arrangement consisting of four layers or levels (1a to 1d), with the lowest (1a) supported on plastic foil. The conductor path (3a) is formed from conducting silver or some similar material of low resistance by the silk screen printing process and fitted on the plastic foil so that there is a coil (L1) with a first (2a) and a second (2b) terminal. The other conductor paths (3b,3c,3d) and the other coils (L2,L3,L4) are shown. By the same silk screen process, there is formed on the lowest layer a first insulation layer (1b), with cutouts (4a,4b) and, then a conductor path (3b), with a coil (L2) and a first (2c) and a second (2d) terminal.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung einer Antennenstruktur, insbesondere zum Einsatz in Chipkarten.The invention relates to a method for manufacturing an antenna structure, in particular for use in Smart cards.

Derartige Antennenstrukturen werden vielfach in berüh­ rungslosen Identifikationssystemen zum Beispiel in Chipkarten zur Personenidentifikation auf Flughäfen eingesetzt. Bisher werden derartige Antennenstrukturen hergestellt, indem man Leiterbahnen mittels der sog. Feinleitertechnik auf eine Feinstrukturleiterplatte aufgebringt. Bei einer Leiterbahnbreite von 0,1 mm und einem Leiterbahnabstand von ebenfalls 0,1 mm weist diese Technologie zumindest die Nachteile auf, daß sie recht teuer ist und zudem nur von wenigen und darauf spezialisierten Herstellern beherrscht wird.Such antenna structures are often touched easy identification systems, for example in Chip cards for personal identification at airports used. So far, such antenna structures produced by using conductor tracks using the so-called Fine conductor technology on a fine structure printed circuit board applied. With a track width of 0.1 mm and a track spacing of 0.1 mm this technology at least has the disadvantages that it is quite expensive and also only by a few and on it specialized manufacturers is mastered.

Mehrlagenleiterplatten, kurz als "Multilayer" bezeichnet, sind bekannt. Sie bestehen aus mehreren sehr dünnen Leiterplatten, wobei auf jede Leiterplatte mittels galvanischer Herstellungsweise ein- oder beid­ seitig Leiterbahnen aufgebracht werden und Durchkontak­ tierungen für die Verbindung der vorder- und rückseiti­ gen Leiterbahnen oder für die Verbindung der auf verschiedenen Leiterplatten aufgebrachten Leiterbahnen sorgen. Multi-layer circuit boards, short as "multilayer" are known. They consist of several very thin circuit boards, being on each circuit board one or both by means of galvanic production conductor tracks are applied on the side and through contact tations for the connection of the front and back traces or for connecting the different printed circuit boards to care.  

Es ist Aufgabe der Erfindung, eine Antennenstruktur anzugeben, die mittels einer einfachen Technologie hergestellt werden kann, so daß Herstellungskosten ein­ gespart werden können.The object of the invention is an antenna structure specify that using a simple technology can be manufactured so that manufacturing costs can be saved.

Hierzu wird eine Antennenstruktur unter Verwendung einer Mehrlagenleiterplatte dadurch hergestellt, daß auf jede Leiterplatte eine als Spule ausgebildete Leiterbahn aufgebracht wird. Isolationsschichten zwischen den Leiterplatten führen eine galvanische Trennung der einzelnen Leiterbahnen herbei. Freispa­ rungen in diesen Isolationsschichten sorgen dafür, daß die einzelnen Spulen mittels Anschlußpunkten verbunden und in Reihe geschaltet werden und dadurch die gewünschte Länge der Antennenstruktur zustande kommt.An antenna structure is used for this a multilayer printed circuit board manufactured in that one designed as a coil on each circuit board Conductor is applied. Insulation layers a galvanic lead between the circuit boards Separation of the individual tracks. Freespas Stations in these insulation layers ensure that the individual coils connected by means of connection points and be connected in series and thereby the desired length of the antenna structure comes about.

Die Vorteile der Erfindung liegen insbesondere darin, daß auch bei niedrigen Herstellungskosten die qualita­ tiven Eigenschaften der erfindungsgemäßen Antennen­ struktur dem Stand der Technik mindestens ebenbürtig sind und die neuartige Antennenstruktur die gleichen technischen Daten aufweist.The advantages of the invention are in particular that even with low manufacturing costs, the qualita tive properties of the antennas according to the invention structure at least equal to the state of the art and the new antenna structure are the same has technical data.

Ein Ausführungsbeispiel der Erfindung ist nachstehend ausführlich erläutert und anhand der Figuren darge­ stellt.An embodiment of the invention is as follows explained in detail and based on the figures Darge poses.

Es zeigenShow it

Fig. 1 eine perspektivische Darstellung der erfin­ dungsgemäßen Antennenstruktur und Fig. 1 is a perspective view of the inventive antenna structure and

Fig. 2 eine Draufsicht auf eine Antennenstruktur nach dem Stand der Technik. Fig. 2 is a plan view of an antenna structure according to the prior art.

Abb. 1 zeigt einen aus vier Lagen 1a bis 1d bestehenden Multilayer. Jede als "Layer" bezeichnete Lage 1a bis 1d stellt eine Ebene des Multilayers dar. Als Träger für die unterste Lage 1a wird eine Kunststoffolie verwendet und bei der Herstellung im Siebdruckverfahren auf diese Kunststoffolie eine einzige aus Leitsilber oder aus einem ähnlich niederohmigen und siebdruckfähigen Material bestehende Leiterbahn 3a derart aufgebracht, daß daraus eine Spule L1 mit einem ersten Anschlußpunkt 2a und einem zweiten Anschlußpunkt 2b entsteht. Fig. 1 shows a multilayer consisting of four layers 1 a to 1 d. Each layer referred to as "layer" 1 a to 1 d represents a layer of the multilayer. A plastic film is used as the carrier for the lowest layer 1 a and a single film made of conductive silver or a similarly low-resistance and similar material is used for the production by screen printing on this plastic film screen printed material existing conductor track 3 a applied such that a coil L1 with a first connection point 2 a and a second connection point 2 b arises therefrom.

Auf die so entstandene unterste Lage 1a wird anschlie­ ßend ebenfalls mittels Siebdruck eine erste Isolations­ schicht 1b mit Freisparungen 4a und 4b aufgebracht. Danach wird auf diese Isolationsschicht eine Leiterbahn 3b spulenförmig aufgebracht, so daß daraus eine Spule L2 mit Anschlußpunkten 2c und 2d entsteht. Die Freispa­ rung 4b in der Isolationsschicht 1b bewirkt, daß die Spule L2 mittels ihres Anschlußpunktes 2c den Anschluß­ punkt 2b der Spule L1 kontaktiert und dadurch die Spulen L1 und L2 in Reihe geschaltet sind.On the bottom layer 1 a thus created, a first insulation layer 1 b with cutouts 4 a and 4 b is then also applied by screen printing. Thereafter, a conductor track 3 b is applied in the form of a coil to this insulation layer, so that a coil L2 with connection points 2 c and 2 d is formed therefrom. The freespooling 4 b in the insulation layer 1 b causes the coil L2 to contact the connection point 2 b of the coil L1 by means of its connection point 2 c and thereby the coils L1 and L2 are connected in series.

Mittels Siebdruck werden weitere Isolierschichten 1c bzw. 1d mit Freisparungen 4c und 4e bzw. 4d und 4f und weitere Leiterbahnen 3c bzw. 3d aufgebracht, so daß Spulen L3 bzw. L4 mit Anschlußpunkten 2e und 2f bzw. 2g und 2h entstehen. Hierbei kontaktieren sich die Spulen L2 und L3 mit ihren Anschlußpunkten 2d und 2e, die Spulen L3 und L4 mit ihren Anschlußpunkten 2f und 2g.By means of screen printing, further insulating layers 1 c and 1 d with cutouts 4 c and 4 e or 4 d and 4 f and further conductor tracks 3 c and 3 d are applied, so that coils L3 and L4 with connection points 2 e and 2 f or 2 g and 2 h arise. Here, the coils L2 and L3 contact with their connection points 2 d and 2 e, the coils L3 and L4 with their connection points 2 f and 2 g.

Die Freisparungen 4a, 4e und 4f in den Isolierschichten 1b, 1c und 1d bewirken, daß der erste Anschlußpunkt 2a der ersten Spule L1 auch nach Aufbringen aller Isolier­ schichten 1b, 1c und 1d frei zugänglich bleibt und kontaktiert werden kann, so daß sich aus den vier in Reihe geschalteten Spulen L1, L2, L3 und L4 eine durchgehende Antennenspule mit den Anschlüssen 2a und 2h ergibt.The cutouts 4 a, 4 e and 4 f in the insulating layers 1 b, 1 c and 1 d cause the first connection point 2 a of the first coil L1 to remain freely accessible even after application of all the insulating layers 1 b, 1 c and 1 d and can be contacted, so that a continuous antenna coil with the connections 2 a and 2 h results from the four coils L1, L2, L3 and L4 connected in series.

Eine zwar geeignete, aber in der Herstellung recht teure Durchkontaktierung kann durch die Freisparungen 4a bis 4f in den Isolationsschichten 1b, 1c und 1d ver­ mieden werden.A suitable via, but quite expensive to manufacture, can be avoided by the cutouts 4 a to 4 f in the insulation layers 1 b, 1 c and 1 d.

Bei gleicher Länge der Antennenspule gegenüber dem Stand der Technik kann durch Hintereinanderschalten der vier Spulen L1, L2, L3 und L4 die Breite der Leiterbah­ nen 3a, 3b, 3c und 3d und der Abstand zwischen den einzelnen Windungen von 0,1 mm auf 0,3 mm vergrößert werden. Dadurch kann zur Herstellung der erfindungsge­ mäßen Antennenstruktur ein einfacher und günstiger Herstellungsprozeß verwendet werden, den sehr viele Firmen ausführen können.With the same length of the antenna coil compared to the prior art, by connecting the four coils L1, L2, L3 and L4 in series, the width of the conductor tracks 3 a, 3 b, 3 c and 3 d and the distance between the individual turns of 0.1 mm can be increased to 0.3 mm. As a result, a simple and inexpensive manufacturing process can be used to manufacture the antenna structure according to the invention, which a large number of companies can carry out.

In Fig. 2 ist eine nach dem Stand der Technik herge­ stellte Antennenstruktur dargestellt. Hierbei ist auf Vorder- und Rückseite einer Feinstrukturleiterplatte 6 mit Hilfe einer speziellen Galvaniktechnologie jeweils eine Feinstrukturleiterbahn 7V und 7R mit Anschluß­ punkten 8, 9 und 10 aufgebracht. Hierbei muß der Anschlußpunkt 9 durchkontaktiert sein, um die Fein­ strukturleiterbahnen 7V und 7R auf Vorder- und Rück­ seite der Feinstrukturleiterplatte 6 zu verbinden. Die Breite der Feinstrukturleiterbahnen 7V und 7R und der Abstand zwischen den einzelnen Windungen der Antennen­ spule müssen 0,1 mm betragen, um die gesamte Länge der Antennenspule auf Vorder- und Rückseite der Feinstruk­ turleiterplatte 6 unterbringen zu können. Diese Abmes­ sungen erfordern zu ihrer Herstellung den Einsatz einer speziellen und teuren Technologie, die von nur wenigen Herstellerfirmen beherrscht wird.In Fig. 2 a Herge presented antenna structure is shown. Here, a fine structure conductor 7 V and 7 R with connection points 8 , 9 and 10 is applied to the front and back of a fine structure circuit board 6 with the aid of a special electroplating technology. Here, the connection point 9 must be plated through to connect the fine structure tracks 7 V and 7 R on the front and rear side of the fine structure circuit board 6 . The width of the fine structure conductor tracks 7 V and 7 R and the distance between the individual turns of the antenna coil must be 0.1 mm in order to accommodate the entire length of the antenna coil on the front and rear of the fine structure circuit board 6 . These dimensions require the use of a special and expensive technology for their production, which is only mastered by a few manufacturers.

Claims (7)

1. Verfahren zur Herstellung einer Antennenstruktur unter Verwendung einer Mehrlagenleiterplatte, wobei jede auf jeder Leiterplatte (1a, 1b, 1c, 1d) angeord­ nete Leiterbahn (3a, 3b, 3c, 3d) als Spule (L1, L2, L3, L4) ausgebildet ist und diese Spulen (L1, L2, L3, L4) in Serie geschaltet werden.1. A method for producing an antenna structure using a multi-layer circuit board, each on each circuit board ( 1 a, 1 b, 1 c, 1 d) arranged conductor track ( 3 a, 3 b, 3 c, 3 d) as a coil (L1 , L2, L3, L4) and these coils (L1, L2, L3, L4) are connected in series. 2. Antennenstruktur nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Leiterbahnen (3) und die die Leiter­ bahnen (3) trennenden Isolierschichten (1b, 1c, 1d) im Siebdruckverfahren hergestellt werden.2. An antenna structure according to claim 1, characterized in that the conductor tracks (3) and the conductor tracks (3) separating insulating layers (1 b, 1 c, 1 d) are produced by screen printing. 3. Antennenstruktur gemäß Anspruch 1, dadurch gekenn­ zeichnet, daß in die die Leiterbahnen (3) trennenden Isolierschichten (1b, 1c, 1d) Freisparungen (4a bis 4f) eingebracht werden.3. Antenna structure according to claim 1, characterized in that in the insulating layers ( 1 b, 1 c, 1 d) separations ( 4 a to 4 f) are introduced into the conductor tracks ( 3 ). 4. Antennenstruktur nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Leiterbahnen (3a bis 3d) aus einem niederohmigen und siebdruckfähigen Material bestehen.4. Antenna structure according to claim 1, characterized in that the conductor tracks ( 3 a to 3 d) consist of a low-resistance and screen-printable material. 5. Antennenstruktur nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Leiterbahnen (3a bis 3d) aus Leit­ silber bestehen.5. Antenna structure according to claim 1, characterized in that the conductor tracks ( 3 a to 3 d) consist of Leit silver. 6. Antennenstruktur nach Anspruch 1, dadurch gekenn­ zeichnet, daß die unterste Lage (1a) der Mehrlagenlei­ terplatte aus einer Kunststoffolie besteht. 6. Antenna structure according to claim 1, characterized in that the lowermost layer ( 1 a) of the Mehrlagenlei terplatte consists of a plastic film. 7. Verwendung der Antennenstruktur nach einem der vor­ angehenden Ansprüche in scheckkartenartigen Identifika­ tionssystemen.7. Use of the antenna structure according to one of the before prospective claims in credit card-like identifiers tion systems.
DE1995111300 1995-03-28 1995-03-28 Method of forming antenna structure for inserting into chip-card Withdrawn DE19511300A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1995111300 DE19511300A1 (en) 1995-03-28 1995-03-28 Method of forming antenna structure for inserting into chip-card

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Application Number Priority Date Filing Date Title
DE1995111300 DE19511300A1 (en) 1995-03-28 1995-03-28 Method of forming antenna structure for inserting into chip-card

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DE19511300A1 true DE19511300A1 (en) 1996-10-02

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043798A1 (en) * 1996-05-14 1997-11-20 Casio Computer Co., Ltd. Antenna, method of manufacturing antenna, and electronic apparatus equipped with antenna
DE19716612A1 (en) * 1997-04-21 1998-10-22 Raetz Walter Inductive signal transmission element
WO1998053424A1 (en) * 1997-05-20 1998-11-26 Ronald Barend Van Santbrink Method for the production of a smart card, smart card and device for the production thereof
DE19724708A1 (en) * 1997-06-13 1998-12-17 Junghans Uhren Gmbh Watch with transponder
WO1999008245A1 (en) * 1997-08-08 1999-02-18 Ird A/S Polymeric radio frequency resonant tags and method for manufacture
EP0920056A3 (en) * 1997-11-26 1999-12-01 Hitachi, Ltd. IC card, method and apparatus for producing the same
WO2000045353A1 (en) * 1999-01-14 2000-08-03 Rafsec Oy A method for forming a product sensor
EP1128326A3 (en) * 2000-02-24 2001-10-10 The Goodyear Tire & Rubber Company Circuit module
EP1222622A2 (en) * 1999-09-10 2002-07-17 Moore Corporation Limited Radio frequency identification tags and labels
AT410036B (en) * 2000-10-05 2003-01-27 Siemens Ag Oesterreich Codeable chip card
EP1291818A1 (en) * 2001-08-15 2003-03-12 Datamars SA Transponder
US6551449B2 (en) 1997-11-26 2003-04-22 Hitachi, Ltd. Thin electronic circuit component and method and apparatus for producing the same
US6951621B2 (en) 2000-03-31 2005-10-04 Rafsec Oy Method for forming a product sensor, and a product sensor
US7015868B2 (en) 1999-09-20 2006-03-21 Fractus, S.A. Multilevel Antennae
US7066393B2 (en) 2001-05-31 2006-06-27 Rafsec Oy Smart label and a smart label web
US7152803B2 (en) 2001-12-21 2006-12-26 Upm Rafsec Oy Smart label web and a method for its manufacture
US7199456B2 (en) 2001-07-04 2007-04-03 Rafsec Oy Injection moulded product and a method for its manufacture
US7244332B2 (en) 2000-12-11 2007-07-17 Rafsec Oy Smart label web and a method for its manufacture
FR2904453A1 (en) * 2006-07-25 2008-02-01 Oberthur Card Syst Sa ELECTRONIC ANTENNA WITH MICROCIRCUIT.
US20110128195A1 (en) * 2008-08-06 2011-06-02 Byung Hoon Ryou Embedded antenna of wireless device and method of manufacturing thereof
EP2335554A4 (en) * 2008-10-14 2013-08-28 Olympus Medical Systems Corp MEDICAL SYSTEM, DEVICE OF MEDICAL SYSTEM OUTSIDE BODY, MEDICAL DEVICE OF CAPSULE TYPE OF MEDICAL SYSTEM, AND METHOD OF SWITCHING ANTENNA OF MEDICAL DEVICE OF CAPSULE TYPE
WO2022040039A3 (en) * 2020-08-21 2022-04-14 Qualcomm Incorporated Electronic shelf label (esl) antenna design

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002260A (en) * 1961-10-03 shortt etal
US3484731A (en) * 1967-10-05 1969-12-16 Edward L Rich Printed circuit inductor
US4578654A (en) * 1983-11-16 1986-03-25 Minnesota Mining And Manufacturing Company Distributed capacitance lc resonant circuit
DE3722124A1 (en) * 1986-08-21 1988-02-25 Siemens Ag FLAT ASSEMBLY WITH A COIL OR A TRANSMITTER
US4761656A (en) * 1986-05-23 1988-08-02 Minnesota Mining And Manufacturing Company Passive marker device
DD290738A5 (en) * 1989-12-22 1991-06-06 Veb Robotron-Messelektronik,"Otto Schoen",De TRANSMIT AND / OR RECEIVER COIL FROM MULTIVILLATE PLATE
DE4212808A1 (en) * 1991-04-22 1992-10-29 Mitsubishi Electric Corp AERIAL CIRCUIT FOR A CONTACTLESS, PORTABLE STORAGE DEVICE AND METHOD FOR THE PRODUCTION THEREOF
DE9115582U1 (en) * 1991-12-16 1992-12-17 Siemens AG, 80333 München PCB antenna
DE4221739A1 (en) * 1991-07-09 1993-01-14 Fischer Ag LF pulse generator and transmission antenna for proton transport in blood - has coil which induces higher energy in electrolyte fluid than thermal energy, and within cell-specific amplitude window
DE4121333A1 (en) * 1991-06-25 1993-01-14 Hagenuk Telecom Gmbh FILM ANTENNA
DE4205084A1 (en) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Electromagnetic radiation receiver e.g. for antitheft security systems - consists of adjacent pairs of conductors in common planes, each pair wound into octagonal coils with equal numbers of turns and density
DE4317719A1 (en) * 1992-05-28 1993-12-02 Murata Manufacturing Co Prodn. of laminated electronic constructional element - by sintering ceramic layers and inner electrodes in mixed gas contg. carbon di:oxide and mon:oxide
DE4224925A1 (en) * 1992-07-28 1994-02-03 Siemens Ag Multilayer circuit board with printed components

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002260A (en) * 1961-10-03 shortt etal
US3484731A (en) * 1967-10-05 1969-12-16 Edward L Rich Printed circuit inductor
US4578654A (en) * 1983-11-16 1986-03-25 Minnesota Mining And Manufacturing Company Distributed capacitance lc resonant circuit
US4761656A (en) * 1986-05-23 1988-08-02 Minnesota Mining And Manufacturing Company Passive marker device
DE3722124A1 (en) * 1986-08-21 1988-02-25 Siemens Ag FLAT ASSEMBLY WITH A COIL OR A TRANSMITTER
DD290738A5 (en) * 1989-12-22 1991-06-06 Veb Robotron-Messelektronik,"Otto Schoen",De TRANSMIT AND / OR RECEIVER COIL FROM MULTIVILLATE PLATE
DE4212808A1 (en) * 1991-04-22 1992-10-29 Mitsubishi Electric Corp AERIAL CIRCUIT FOR A CONTACTLESS, PORTABLE STORAGE DEVICE AND METHOD FOR THE PRODUCTION THEREOF
DE4121333A1 (en) * 1991-06-25 1993-01-14 Hagenuk Telecom Gmbh FILM ANTENNA
DE4221739A1 (en) * 1991-07-09 1993-01-14 Fischer Ag LF pulse generator and transmission antenna for proton transport in blood - has coil which induces higher energy in electrolyte fluid than thermal energy, and within cell-specific amplitude window
DE9115582U1 (en) * 1991-12-16 1992-12-17 Siemens AG, 80333 München PCB antenna
DE4205084A1 (en) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Electromagnetic radiation receiver e.g. for antitheft security systems - consists of adjacent pairs of conductors in common planes, each pair wound into octagonal coils with equal numbers of turns and density
DE4317719A1 (en) * 1992-05-28 1993-12-02 Murata Manufacturing Co Prodn. of laminated electronic constructional element - by sintering ceramic layers and inner electrodes in mixed gas contg. carbon di:oxide and mon:oxide
DE4224925A1 (en) * 1992-07-28 1994-02-03 Siemens Ag Multilayer circuit board with printed components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 3-34407 A., In: Patents Abstracts of Japan, E-1060, April 23, 1991, Vol.15, No.161 *

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043798A1 (en) * 1996-05-14 1997-11-20 Casio Computer Co., Ltd. Antenna, method of manufacturing antenna, and electronic apparatus equipped with antenna
US5963181A (en) * 1996-05-14 1999-10-05 Casio Computer Co., Ltd. Antenna, method of manufacturing antenna, and electronic apparatus equipped with antenna
DE19716612A1 (en) * 1997-04-21 1998-10-22 Raetz Walter Inductive signal transmission element
WO1998053424A1 (en) * 1997-05-20 1998-11-26 Ronald Barend Van Santbrink Method for the production of a smart card, smart card and device for the production thereof
DE19724708A1 (en) * 1997-06-13 1998-12-17 Junghans Uhren Gmbh Watch with transponder
WO1999008245A1 (en) * 1997-08-08 1999-02-18 Ird A/S Polymeric radio frequency resonant tags and method for manufacture
EP0920056A3 (en) * 1997-11-26 1999-12-01 Hitachi, Ltd. IC card, method and apparatus for producing the same
US6203655B1 (en) 1997-11-26 2001-03-20 Hitachi, Ltd. Thin electronic circuit component and method and apparatus for producing the same
US6551449B2 (en) 1997-11-26 2003-04-22 Hitachi, Ltd. Thin electronic circuit component and method and apparatus for producing the same
WO2000045353A1 (en) * 1999-01-14 2000-08-03 Rafsec Oy A method for forming a product sensor
EP1222622A2 (en) * 1999-09-10 2002-07-17 Moore Corporation Limited Radio frequency identification tags and labels
US9000985B2 (en) 1999-09-20 2015-04-07 Fractus, S.A. Multilevel antennae
US9054421B2 (en) 1999-09-20 2015-06-09 Fractus, S.A. Multilevel antennae
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